CN215359615U - Die capable of producing photo cell chip plates in batches - Google Patents

Abstract

The utility model discloses a die capable of producing photoelectric cell sheets in batches, which comprises an upper die plate, wherein a hot runner is arranged at the middle position of the upper die plate, and guide holes are arranged at the corner positions of the upper die plate; the shaping recess is provided with a plurality of groups altogether, the fixed plate of chip is at the shaping recess internal cooling shaping, once can the fixed plate of a large amount of chips of batch shaping, be provided with the side cut sword groove around the shaping recess simultaneously, the chip panel of being convenient for is cut edge, the production speed has been improved, the manufacturing cost has been saved, install the air cock, when drawing of patterns to shaping chip panel, the opening-closing plate is opened, air cock blowout is gaseous simultaneously, it is isolated with plastic and die cavity, avoid the plastic to bond the inner wall at the die cavity, the gas of blowout is favorable to chip panel cooling simultaneously, chip panel cooling shrinkage, be convenient for break away from the die cavity with chip panel, thereby the drawing of patterns speed has been improved, be favorable to the quick batch production of chip panel.

Description

Die capable of producing photo cell chip plates in batches

Technical Field

The utility model relates to the technical field of dies, in particular to a die capable of producing photoelectric cell sheets in batches.

Background

The improvement of chip technology and the reduction of price are the key for promoting the reduction of the application cost of LED illumination, and the cost required by a single LED chip is continuously reduced after the LED luminous efficiency is improved along with the improvement of the LED chip technology.

The fixed plate of LED chip is generally produced by the mould, but current mould is not convenient for to the fixed plate mass coproduction of chip, still has the drawback of the separation of being not convenient for of the chip panel of batch production, and simultaneously, current mould drawing of patterns is not convenient enough, and the result of use is relatively poor, influences production efficiency.

Therefore, the die capable of producing the photo cell sheet plates in batches is provided.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a die capable of producing photoelectric cell chip plates in batches, and aims to solve the problems that the existing die is inconvenient to produce chip fixing plates in batches simultaneously, the chip plates produced in batches are inconvenient to separate, and meanwhile, the existing die is inconvenient to demould, poor in using effect and poor in production efficiency.

In order to achieve the purpose, the utility model provides the following technical scheme: a die capable of producing photoelectric cell plates in batches comprises an upper die plate, wherein a hot runner is arranged in the middle of the upper die plate, a guide hole is arranged at the corner of the upper template, a guide post is movably arranged above the guide hole, a water inlet is arranged on the side surface of the upper template, a water outlet is arranged on one side of the water inlet, the bottom of the upper template is fixedly provided with a mold core, a lower template is fixedly arranged below the upper template, a fixed sleeve is fixedly arranged on the outer side of the lower template, an air tap is fixedly arranged on the fixed sleeve, a cavity is arranged in the lower template, a forming groove is arranged in the cavity, an ejection groove is arranged on one side of the forming groove, the bottom of the ejection groove is movably provided with an ejector rod, the mold core is provided with a pouring gate, and the inside of the upper mold plate is provided with a cooling water channel.

By adopting the technical scheme, the S-shaped design of the cooling water channel improves the cooling effect of the die, is beneficial to the rapid cooling and forming of the chip plates and improves the production speed, the forming grooves are provided with a plurality of groups, the chip fixing plates are cooled and formed in the forming grooves, a large number of chip fixing plates can be formed in batch at one time, and meanwhile, the trimming cutter grooves are formed around the forming grooves, so that the trimming of the chip plates is facilitated, and the production speed is improved; the inboard fixed mounting of air cock has the open-close board, and when moulding plastics, the open-close board is closed, avoids the plastic to plug up the air cock, and when the drawing of patterns to the shaping chip panel, the open-close board is opened, and the air cock blowout is gaseous simultaneously, and is isolated plastic and die cavity, avoids the plastic to bond at the inner wall of die cavity, and the gas of blowout is favorable to chip panel cooling simultaneously, and chip panel cooling shrinkage is convenient for break away from the chip panel from the die cavity.

Preferably, the forming grooves are provided with a plurality of groups, and the plurality of groups of forming grooves are uniformly formed in the cavity.

Through adopting above-mentioned technical scheme, the fixed plate of chip is at the shaping recess internal cooling shaping, can once form a large amount of fixed plates of chip in batches, has shortened production period, is favorable to the quick production shaping of chip panel.

Preferably, the fixed sleeve is wound on four sides of the lower template, the air nozzles are provided with a plurality of groups, and the air nozzles are uniformly arranged on the fixed sleeve.

Through adopting above-mentioned technical scheme, fixed cover plays the auxiliary stay effect, provides the protection for the air cock simultaneously, avoids air cock collision to damage.

Preferably, one end of the air nozzle is connected with air injection equipment, and the other end of the air nozzle is arranged on the inner wall of the cavity.

Through adopting above-mentioned technical scheme, the inboard fixed mounting of air cock has the open-close board, and when moulding plastics, the open-close board is closed, avoids the plastic to plug up the air cock, and when the drawing of patterns to the shaping chip panel, the open-close board is opened, and air cock blowout is gaseous simultaneously, and is isolated with plastic and die cavity, avoids the plastic to bond at the inner wall of die cavity, and the gas of blowout is favorable to chip panel cooling down simultaneously, and chip panel cooling shrinkage is convenient for break away from the die cavity with the chip panel.

Preferably, the stripping rods are provided with a plurality of groups, and the stripping rods in the groups are uniformly arranged at the bottom of the ejection groove.

Through adopting above-mentioned technical scheme, the pole of taking off of bottom is ejecting with the shaping chip panel, and the supplementary pole drawing of patterns that takes off of lateral nozzle for the mould drawing of patterns is lighter.

Preferably, the pouring gates are provided with five groups, wherein four groups of pouring gates are respectively arranged at four corners of the mold core, the other group of pouring gates are arranged at the middle position of the mold core, and the five groups of pouring gates are communicated with the hot runner.

Through adopting above-mentioned technical scheme, when moulding plastics to chip fixed plate, the liquid of moulding plastics gets into from the hot runner, by five groups of sprue gates reposition of redundant personnel injection mold cavities for mould plastics more evenly, the effect of moulding plastics is better, guarantees chip plate quality.

Preferably, the cooling water channel is arranged inside the upper template in an S shape, one end of the cooling water channel is connected with the water inlet, and the other end of the cooling water channel is connected with the water outlet.

Through adopting above-mentioned technical scheme, cooling water gets into by the water inlet, through the cooling water course, flows out by the delivery port at last, and the cooling water course S-shaped design has improved the cooling effect of mould, is favorable to the quick cooling shaping of chip panel, improves production speed.

Preferably, the bottom of the release rod is fixedly provided with an ejection device and a reset device, and the release rod stretches up and down under the driving of the ejection device and the reset device.

By adopting the technical scheme, during demoulding, the demoulding rod is driven by the ejecting device to eject the chip plate, and after demoulding is finished, the demoulding rod is driven by the resetting device to retract.

Preferably, the guide holes and the guide pillars are respectively provided with four groups, the four groups of guide holes are respectively arranged at four corner positions of the upper template, and the four groups of guide pillars are respectively arranged in the four groups of guide holes.

Through adopting above-mentioned technical scheme, the die sinking compound die of mould is accomplished by the guide pillar direction for the mould opens and shuts more conveniently, reduces mould friction loss simultaneously.

Preferably, the periphery of the forming groove is provided with a cutting edge cutter groove.

Through adopting above-mentioned technical scheme, the injection moulding shaping is gone into to the chip panel in the shaping recess, is downcut single chip panel by the cutter, and the sword groove of cutting edge is convenient for the chip panel and is cut edge, is favorable to chip panel rapid production.

Compared with the prior art, the utility model has the beneficial effects that:

1. the forming grooves are provided with a plurality of groups, the chip fixing plates are cooled and formed in the forming grooves, a large number of chip fixing plates can be formed in batches at one time, and meanwhile, the edge cutting knife grooves are formed in the periphery of the forming grooves, so that the edge cutting of the chip plates is facilitated, the production speed is improved, and the production cost is saved;

2. install the air cock, when the drawing of patterns to shaping chip panel, the open-close board is opened, and air cock blowout is gaseous simultaneously, and is isolated with plastic and die cavity, avoids the plastic to bond at the inner wall of die cavity, and the gas of blowout is favorable to chip panel cooling down simultaneously, and chip panel cooling shrinkage is convenient for break away from the chip panel from the die cavity to improve drawing of patterns speed, be favorable to the quick batch production of chip panel.

Drawings

FIG. 1 is a schematic view of the main structure of the present invention;

FIG. 2 is an internal structural view of the lower template of the present invention;

FIG. 3 is a schematic cross-sectional view of the lower platen of the present invention;

FIG. 4 is a schematic view of the core bottom structure of the present invention;

fig. 5 is an internal structure view of the upper plate of the present invention.

In the figure: 1. a guide hole; 2. a guide post; 3. a hot runner; 4. mounting a template; 5. a water inlet; 6. a water outlet; 7. fixing a sleeve; 8. an air tap; 9. a lower template; 10. a core; 11. a cavity; 12. forming a groove; 13. ejecting out the groove; 14. removing the rod; 15. a pouring gate; 16. and a cooling water channel.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 5, the present invention provides a technical solution: the utility model provides a but mould of batch production photoelectricity chip board, as shown in fig. 1 to 5, including cope match-plate pattern 4, hot runner 3 has been seted up to cope match-plate pattern 4's intermediate position department, guide hole 1 has been seted up to cope match-plate pattern 4's turning position department, guide pillar 2 has been installed in the top movable mounting of guide hole 1, water inlet 5 has been seted up to cope match-plate pattern 4's side surface, delivery port 6 has been seted up to one side of water inlet 5, the bottom fixed mounting of cope match-plate pattern 4 has core 10, the below fixed mounting of cope match-plate pattern 4 has lower bolster 9, the outside fixed mounting of lower bolster 9 has fixed cover 7, fixed cover 7 is last to be fixed to have air cock 8, die cavity 11 has been seted up to the inside of lower bolster 9, shaping recess 12 has been seted up in the die cavity 11, ejecting recess 13 has been seted up to one side of shaping recess 12, the bottom movable mounting of ejecting recess 13 has knockout pin 14, the sprue 15 has been seted up on core 10, cooling water course 16 has been seted up to the inside of cope match-plate pattern 4.

By adopting the technical scheme, the cooling effect of the die is improved by the aid of the 16S-shaped cooling water channel, chip plates can be rapidly cooled and formed, production speed is improved, the forming grooves 12 are provided with a plurality of groups, the chip fixing plates are cooled and formed in the forming grooves 12, a large number of chip fixing plates can be formed in batch at one time, and trimming cutter grooves are formed in the periphery of the forming grooves 12, so that trimming of the chip plates is facilitated, and production speed is improved; the inboard fixed mounting of air cock 8 has the open-close board, and when moulding plastics, the open-close board is closed, avoids the plastic to plug up air cock 8, and when the drawing of patterns to the shaping chip panel, the open-close board is opened, and 8 blowout gas of air cock simultaneously, isolated with plastic and die cavity 11, avoid the plastic to bond at the inner wall of die cavity 11, and the gas of while spun is favorable to chip panel cooling, and chip panel cooling shrinkage is convenient for break away from the chip panel from die cavity 11.

Specifically, as shown in fig. 2, the forming grooves 12 are arranged in a plurality of groups, and the plurality of groups of forming grooves 12 are uniformly formed in the cavity 11.

By adopting the technical scheme, the chip fixing plates are cooled and formed in the forming grooves 12, a large number of chip fixing plates can be formed in batches at one time, the production period is shortened, and the chip plates are favorable for being rapidly produced and formed.

Specifically, as shown in fig. 1, the fixing sleeve 7 is wound around four sides of the lower mold plate 9, the air nozzles 8 are provided with a plurality of groups, and the plurality of groups of air nozzles 8 are uniformly installed on the fixing sleeve 7.

Through adopting above-mentioned technical scheme, fixed cover 7 plays the auxiliary stay effect, provides the protection for air cock 8 simultaneously, avoids air cock 8 collision damage.

Specifically, as shown in fig. 1 and 3, one end of the air nozzle 8 is connected to the air injection device, and the other end of the air nozzle 8 is disposed on the inner wall of the cavity 11.

Through adopting above-mentioned technical scheme, the inboard fixed mounting of air cock 8 has the open-close board, when moulding plastics, the open-close board is closed, avoids the plastic to plug up air cock 8, when the drawing of patterns to the shaping chip panel, the open-close board is opened, and air cock 8 blowout is gaseous simultaneously, and is isolated with plastic and die cavity 11, avoids the plastic to bond at the inner wall of die cavity 11, and the gas of blowout is favorable to chip panel cooling down simultaneously, and chip panel cooling shrinkage is convenient for break away from chip panel from die cavity 11.

Specifically, as shown in fig. 3, the stripping rods 14 are provided with a plurality of groups, and the stripping rods 14 are uniformly installed at the bottom of the ejection groove 13.

Through adopting above-mentioned technical scheme, the pole 14 will become the shaping chip panel ejecting taking off of bottom, and the supplementary 14 drawing of patterns of pole that take off of lateral nozzle 8 for the mould drawing of patterns is lighter.

Specifically, as shown in fig. 4, the gates 15 are provided with five groups, wherein four groups of gates 15 are respectively provided at four corners of the mold core 10, another group of gates 15 is provided at a middle position of the mold core 10, and all the five groups of gates 15 are communicated with the hot runner 3.

Through adopting above-mentioned technical scheme, when moulding plastics to the fixed panel of chip, the liquid of moulding plastics gets into from hot runner 3, by five groups of pouring gates 15 reposition of redundant personnel injection mold cavity 11 for mould plastics more evenly, the effect of moulding plastics is better, guarantees chip panel quality.

Specifically, as shown in fig. 1, the cooling water channel 16 is formed inside the upper mold plate 4 in an S-shape, one end of the cooling water channel 16 is connected to the water inlet 5, and the other end of the cooling water channel 16 is connected to the water outlet 6.

Through adopting above-mentioned technical scheme, the cooling water gets into by water inlet 5, through cooling water course 16, flows out by delivery port 6 at last, and the 16S-shaped designs of cooling water course have improved the cooling effect of mould, are favorable to the quick cooling shaping of chip panel, improve production speed.

Specifically, as shown in fig. 3, an ejection device and a reset device are fixedly installed at the bottom of the release rod 14, and the release rod 14 is driven by the ejection device and the reset device to extend and retract up and down.

By adopting the technical scheme, during demoulding, the demoulding rod 14 is driven by the ejecting device to eject the chip plate, and after demoulding, the demoulding rod 14 is driven by the resetting device to retract.

Specifically, as shown in fig. 1, four sets of guide holes 1 and guide posts 2 are provided, the four sets of guide holes 1 are respectively provided at four corner positions of the upper die plate 4, and the four sets of guide posts 2 are respectively installed in the four sets of guide holes 1.

Through adopting above-mentioned technical scheme, the die sinking compound die of mould is accomplished by guide pillar 2 direction for the mould opens and shuts more conveniently, reduces mould friction loss simultaneously.

Specifically, as shown in fig. 2, the periphery of the forming groove 12 is provided with a trimming blade groove.

Through adopting above-mentioned technical scheme, the injection moulding shaping is gone into to the chip panel in shaping recess 12, is downcut single chip panel by the cutter, and the sword groove of cutting edge is convenient for the chip panel and is cut edge, is favorable to chip panel rapid production.

The working principle is as follows: the cooling water channel 16S-shaped design improves the cooling effect of the die, is beneficial to fast cooling and forming of the chip plates, improves the production speed, the forming grooves 12 are provided with a plurality of groups, the chip fixing plates are cooled and formed in the forming grooves 12, a large number of chip fixing plates can be formed in batch at one time, and meanwhile, the edge cutting knife grooves are formed in the periphery of the forming grooves 12, so that the edge cutting of the chip plates is facilitated, and the production speed is improved; the inboard fixed mounting of air cock 8 has the open-close board, and when moulding plastics, the open-close board is closed, avoids the plastic to plug up air cock 8, and when the drawing of patterns to the shaping chip panel, the open-close board is opened, and 8 blowout gas of air cock simultaneously, isolated with plastic and die cavity 11, avoid the plastic to bond at the inner wall of die cavity 11, and the gas of while spun is favorable to chip panel cooling, and chip panel cooling shrinkage is convenient for break away from the chip panel from die cavity 11.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.

Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise. Furthermore, the terms "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (10)

1. The utility model provides a but mould of batch production photoelectricity section of thick bamboo board material, includes cope match-plate pattern (4), its characterized in that: the hot runner (3) is arranged at the middle position of the upper template (4), the guide hole (1) is arranged at the corner position of the upper template (4), the guide pillar (2) is movably arranged above the guide hole (1), the water inlet (5) is arranged on the side surface of the upper template (4), the water outlet (6) is arranged on one side of the water inlet (5), the mold core (10) is fixedly arranged at the bottom of the upper template (4), the lower template (9) is fixedly arranged below the upper template (4), the fixing sleeve (7) is fixedly arranged on the outer side of the lower template (9), the air nozzle (8) is fixedly arranged on the fixing sleeve (7), the cavity (11) is arranged inside the lower template (9), the forming groove (12) is formed in the mold cavity (11), and the ejection groove (13) is formed on one side of the forming groove (12), the bottom of the ejection groove (13) is movably provided with an ejection rod (14), the mold core (10) is provided with a pouring gate (15), and the inside of the upper mold plate (4) is provided with a cooling water channel (16).

2. The mold of claim 1, wherein the mold comprises: the forming grooves (12) are provided with a plurality of groups, and the forming grooves (12) are uniformly arranged in the cavity (11).

3. The mold of claim 1, wherein the mold comprises: the fixed sleeve (7) is wound on four sides of the lower template (9), the air nozzles (8) are provided with a plurality of groups, and the air nozzles (8) of the groups are uniformly arranged on the fixed sleeve (7).

4. The mold of claim 1, wherein the mold comprises: one end of the air nozzle (8) is connected with air injection equipment, and the other end of the air nozzle (8) is arranged on the inner wall of the cavity (11).

5. The mold of claim 1, wherein the mold comprises: the stripping rods (14) are provided with a plurality of groups, and the stripping rods (14) are uniformly arranged at the bottom of the ejection groove (13).

6. The mold of claim 1, wherein the mold comprises: the pouring gates (15) are provided with five groups, wherein four groups of pouring gates (15) are respectively arranged at four corners of the mold core (10), the other group of pouring gates (15) are arranged at the middle position of the mold core (10), and the five groups of pouring gates (15) are communicated with the hot runner (3).

7. The mold of claim 1, wherein the mold comprises: the cooling water channel (16) is arranged in the upper template (4) in an S shape, one end of the cooling water channel (16) is connected with the water inlet (5), and the other end of the cooling water channel (16) is connected with the water outlet (6).

8. The mold of claim 1, wherein the mold comprises: the bottom of the stripping rod (14) is fixedly provided with an ejection device and a reset device, and the stripping rod (14) is driven by the ejection device and the reset device to stretch up and down.

9. The mold of claim 1, wherein the mold comprises: the guide holes (1) and the guide posts (2) are respectively provided with four groups, the four groups of guide holes (1) are respectively arranged at the four corner positions of the upper template (4), and the four groups of guide posts (2) are respectively arranged in the four groups of guide holes (1).

10. The mold of claim 1, wherein the mold comprises: and edge cutting knife grooves are formed in the periphery of the forming groove (12).

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