CN215359250U - Guide wheel device for reducing temperature of diamond wire in silicon wafer cutting process - Google Patents

Abstract

The utility model discloses a guide wheel device for reducing the temperature of a diamond wire in the process of cutting a silicon wafer, which comprises a main body, wherein a wire groove is arranged in the main body, a first wear-resisting plate and a second wear-resisting plate, the cross sections of which are in a semicircular structure, are sleeved on the surface of the bottom end of the wire groove, one ends of the first wear-resisting plate and the second wear-resisting plate are rotatably connected through a rotating shaft, and the other end of the first wear-resisting plate is provided with a first limiting groove; through the first antifriction plate and the second antifriction plate of design, can protect the bottom of wire casing, avoid long-time use back main part to receive serious wearing and tearing, reduce the life of main part, through stopper, fixture block, spring, dog, draw-in groove, first spacing groove, second spacing groove, holding tank of design, can be connected the one end of first antifriction plate and second antifriction plate, install both in the inside of wire casing.

Description

Guide wheel device for reducing temperature of diamond wire in silicon wafer cutting process

Technical Field

The utility model belongs to the technical field of guide wheel devices, and particularly relates to a guide wheel device for reducing the temperature of a diamond wire in a silicon wafer cutting process.

Background

Diamond wire cutting is a new cutting mode and widely applied to the field of crystal silicon wafers and the like, and diamond particles are uniformly fixed on a high-strength steel wire in a certain distribution density, and the diamond wire is pulled back and forth at a high speed by a guide wheel to complete the cutting of an object.

The existing diamond wire cutting machine has the advantages that friction occurs between a diamond wire and a guide wheel in the cutting process, the guide wheel is abraded in the long term, the service life is prolonged, the diamond wire continuously rubs with the guide wheel and a silicon wafer, the temperature is increased, the cutting performance of the diamond wire is affected, and therefore the problem needs to be solved by designing a structure.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a guide wheel device for reducing the temperature of a diamond wire in the process of cutting a silicon wafer, so as to solve the problems in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a reduce guide device of silicon chip cutting in-process buddha's warrior attendant line temperature, includes the main part, the inside of main part is provided with the wire casing, the bottom surface cover of wire casing is equipped with first antifriction plate and the second antifriction plate that the cross-section all is semicircular structure, pivot swivelling joint is passed through to the one end of first antifriction plate and second antifriction plate, first spacing groove has been seted up to the other end of first antifriction plate, the inner wall surface of first spacing groove runs through and has seted up the draw-in groove, the other end of second antifriction plate is fixed with the spacing piece, the stopper imbeds to the inside of first spacing groove, the second spacing groove has been seted up to the inside of stopper, the inside embedding of second spacing groove has the fixture block, the one end of fixture block imbeds to the inside of draw-in groove.

Preferably, two holding tanks have been seted up to the inner wall surface symmetry of second spacing groove, the top and the bottom symmetry of fixture block are fixed with two dogs, two the dog is embedded into the inside that corresponds the holding tank respectively.

Preferably, the other end of the clamping block is provided with a fixing groove, and a spring is connected between the bottom end of the fixing groove and the bottom end of the second limiting groove.

Preferably, a plurality of grooves with triangular sections are formed in the inner side surfaces of the first wear-resisting plate and the second wear-resisting plate, a plurality of convex blocks with triangular sections are fixed on the bottom end surface of the wire casing, and each convex block is embedded into the corresponding groove.

Preferably, a plurality of fourth limiting grooves are formed in the main body in a penetrating mode at equal intervals, radiating fins penetrate through the fourth limiting grooves, a plurality of third limiting grooves communicated with the fourth limiting grooves and the wire grooves are symmetrically formed in the two ends of the main body, the cross section of each third limiting groove is of an L-shaped structure, heat conducting blocks with L-shaped cross sections are embedded into the third limiting grooves, and the bottom ends of the heat conducting blocks are fixedly connected with the corresponding radiating fins.

Preferably, a plurality of through holes are symmetrically arranged on the inner wall surface of the wire groove in a penetrating mode at equal intervals, and the aperture of each through hole is 0.4 cm.

Preferably, the main body is a metal component, and a connecting hole is formed in the main body in a penetrating manner.

Compared with the prior art, the utility model has the beneficial effects that:

1. through the first antifriction plate and the second antifriction plate of design, can protect the bottom of wire casing, avoid long-time use back main part to receive serious wearing and tearing, reduce the life of main part, through stopper, fixture block, spring, dog, draw-in groove, first spacing groove, second spacing groove, holding tank of design, can be connected the one end of first antifriction plate and second antifriction plate, install both in the inside of wire casing.

2. Through the radiating fin, the conducting fin, the third limiting groove and the fourth limiting groove, the radiating area of the device is increased, and the radiating efficiency is improved, so that the temperature of the diamond wire is reduced, and the cutting performance of the diamond wire is prevented from being influenced by overhigh temperature.

Drawings

FIG. 1 is a front view of the present invention;

FIG. 2 is a right side view of the present invention;

FIG. 3 is a right side cross-sectional view of the present invention;

FIG. 4 is an enlarged view of area A of FIG. 3 in accordance with the present invention;

fig. 5 is a front sectional view of the area B of fig. 1 according to the present invention.

In the figure: 1. a main body; 2. a first wear plate; 3. a second wear plate; 4. a heat sink; 5. a clamping block; 6. a wire slot; 7. a through hole; 8. a heat conducting block; 9. a bump; 10. accommodating grooves; 11. a groove; 12. a first limit groove; 13. a card slot; 14. a limiting block; 15. a second limit groove; 16. a third limiting groove; 17. and a fourth limit groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Examples

Referring to fig. 1 to 5, the present invention provides a technical solution: a guide wheel device for reducing the temperature of a diamond wire in the cutting process of a silicon wafer comprises a main body 1, a wire groove 6 is arranged in the main body 1, a first wear-resisting plate 2 and a second wear-resisting plate 3 with semicircular cross sections are sleeved on the bottom end surface of the wire groove 6, the bottom end of the wire groove 6 can be protected through the designed first wear-resisting plate 2 and the second wear-resisting plate 3, the main body 1 is prevented from being seriously worn after long-time use, the service life of the main body 1 is shortened, one ends of the first wear-resisting plate 2 and the second wear-resisting plate 3 are rotatably connected through a rotating shaft, a first limiting groove 12 is formed in the other end of the first wear-resisting plate 2, a clamping groove 13 is formed in the inner wall surface of the first limiting groove 12 in a penetrating mode, a limiting block 14 is fixed at the other end of the second wear-resisting plate 3, the limiting block 14 is embedded into the first limiting groove 12, a second limiting groove 15 is formed in the limiting groove 15, and a clamping block 5 is embedded into the second limiting groove 15, one end of the fixture block 5 is embedded into the clamping groove 13, the inner wall surface of the second limiting groove 15 is symmetrically provided with two accommodating grooves 10, the top end and the bottom end of the fixture block 5 are symmetrically fixed with two stop blocks, the two stop blocks are respectively embedded into the corresponding accommodating grooves 10, the other end of the fixture block 5 is provided with a fixing groove, a spring is connected between the bottom end of the fixing groove and the bottom end of the second limiting groove 15, the first wear-resisting plate 2 and the second wear-resisting plate 3 can be connected and arranged inside the wire casing 6 through the designed limit block 14, the fixture block 5, the spring, the stop blocks, the clamping groove 13, the first limiting groove 12, the second limiting groove 15 and the accommodating grooves 10, the first wear-resisting plate 2 and the second wear-resisting plate 3 are arranged on the inner side surfaces of the first wear-resisting plate 2 and the second wear-resisting plate 3, a plurality of grooves 11 with triangular cross sections are arranged on the bottom end surface of the wire casing 6, a plurality of bumps 9 with triangular cross sections are fixed on the bottom end surface of the wire casing 6, the bumps 9 and the grooves 11 can limit the first wear-resisting plate 2 and the second wear-resisting plate 3, each projection 9 is inserted into the corresponding recess 11.

In the embodiment, preferably, a plurality of fourth limiting grooves 17 are formed in the main body 1 in a penetrating manner at equal intervals, a heat dissipation plate 4 penetrates through the inner portion of each fourth limiting groove 17, a plurality of third limiting grooves 16 communicated with the fourth limiting grooves 17 and the wire slot 6 are symmetrically formed in the two ends of the main body 1, the cross section of each third limiting groove 16 is of an L-shaped structure, a heat conduction block 8 with an L-shaped cross section is embedded in each third limiting groove 16, the heat dissipation area of the device is increased through the designed heat dissipation plate 4, the heat conduction plate 8, the third limiting grooves 16 and the fourth limiting grooves 17, the heat dissipation efficiency is improved, so that the temperature of the diamond wire is reduced, the cutting performance of the diamond wire is prevented from being affected due to overhigh temperature, the bottom end of each heat conduction block 8 is fixedly connected with the corresponding heat dissipation plate 4, a plurality of through holes 7 are formed in the inner wall surface of the wire slot 6 in a penetrating manner at equal intervals, the through holes 7 can dissipate heat in the wire slot 6 through the flowing of air, the aperture of each through hole 7 is 0.4 cm.

In this embodiment, preferably, the main body 1 is a metal member, and a connection hole is formed through the inside of the main body 1, so that the main body 1 can be conveniently mounted and connected.

The working principle and the using process of the utility model are as follows: when the wear-resistant groove is used, the first wear-resistant plate 2 and the second wear-resistant plate 3 are firstly installed inside the wire groove 6, the first wear-resistant plate 2 and the second wear-resistant plate 3 are sleeved on the bottom end surface of the wire groove 6, the plurality of lugs 9 on the bottom end surface of the wire groove 6 are respectively embedded into the corresponding grooves 11, the limiting block 14 at one end of the second wear-resistant plate 3 is embedded into the first limiting groove 12, in the embedding process, the inner wall of the first limiting groove 12 extrudes the fixture block 5 to enable one end of the fixture block to slide in the second limiting groove 15, the fixture block 5 also drives the fixture block to slide in the same direction in the accommodating groove 10 while sliding, at the moment, the fixture block 5 extrudes the spring to enable the spring to shrink under stress until the fixture block 5 moves to the position of the clamping groove 13, after the fixture block 5 loses extrusion, the spring reversely pushes the fixture block 5 to enable the other end of the fixture block to be embedded into the clamping groove 13, and then the first wear-resistant plate 2 and the second wear-resistant plate 3 are installed, first antifriction plate 2 can be protected wire casing 6's bottom with second antifriction plate 3, avoid long-time use back main part to receive serious wearing and tearing, reduce the life of main part, the device is at the during operation, main part 1 drives diamond wire and makes a round trip to drag, can produce higher heat, the heat is through heat-conduction transmission to fin 4 and heat conduction piece 8 on, fin 4 and heat conduction piece 8 are in with heat transfer to the air on every side, through the heat radiating area who increases the device, the heat dissipation efficiency is improved, thereby reduce the temperature of diamond wire, avoid its cutting performance of its high temperature influence, main part 1 is in the pivoted while, because the flow of air, the inside heat of wire casing 6 also can give off the outside through-hole 7, further reduce the temperature of diamond wire.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The utility model provides a reduce guide wheel device of silicon chip cutting in-process buddha's warrior attendant line temperature, includes main part (1), its characterized in that: a wire groove (6) is arranged in the main body (1), a first wear-resisting plate (2) and a second wear-resisting plate (3) with semicircular sections are sleeved on the bottom end surface of the wire groove (6), one end of the first wear-resisting plate (2) is rotatably connected with one end of the second wear-resisting plate (3) through a rotating shaft, the other end of the first wear-resisting plate (2) is provided with a first limiting groove (12), the inner wall surface of the first limiting groove (12) is provided with a clamping groove (13) in a penetrating way, a limiting block (14) is fixed at the other end of the second wear-resisting plate (3), the limiting block (14) is embedded into the first limiting groove (12), the inside of stopper (14) has seted up second spacing groove (15), the inside embedding in second spacing groove (15) has fixture block (5), the inside of one end embedding to draw-in groove (13) of fixture block (5).

2. The guide wheel device for reducing the temperature of a diamond wire in the silicon wafer cutting process as claimed in claim 1, wherein: two holding tanks (10) have been seted up to the inner wall surface symmetry of second spacing groove (15), the top and the bottom symmetry of fixture block (5) are fixed with two dogs, two the dog is embedded into the inside that corresponds holding tank (10) respectively.

3. The guide wheel device for reducing the temperature of a diamond wire in the silicon wafer cutting process as claimed in claim 1, wherein: the other end of the clamping block (5) is provided with a fixing groove, and a spring is connected between the bottom end of the fixing groove and the bottom end of the second limiting groove (15).

4. The guide wheel device for reducing the temperature of a diamond wire in the silicon wafer cutting process as claimed in claim 1, wherein: the inner side surfaces of the first wear-resisting plate (2) and the second wear-resisting plate (3) are provided with a plurality of grooves (11) with triangular sections, the bottom end surface of the wire casing (6) is fixed with a plurality of lugs (9) with triangular sections, and each lug (9) is embedded into the corresponding groove (11) respectively.

5. The guide wheel device for reducing the temperature of a diamond wire in the silicon wafer cutting process as claimed in claim 1, wherein: the inside equidistance of main part (1) is run through and has been seted up a plurality of fourth spacing grooves (17), every fin (4) have all been run through to the inside of fourth spacing groove (17), a plurality ofly been seted up with fourth spacing groove (17), third spacing groove (16) that wire casing (6) are linked together to the both ends symmetry of main part (1), the cross-section of third spacing groove (16) is "L" type structure, every heat conduction piece (8) that the cross-section is "L" type structure have all been embedded into to the inside of third spacing groove (16), every the bottom of heat conduction piece (8) all with correspond fin (4) fixed connection.

6. The guide wheel device for reducing the temperature of a diamond wire in the silicon wafer cutting process as claimed in claim 1, wherein: a plurality of through holes (7) are symmetrically arranged on the inner wall surface of the wire groove (6) in a penetrating mode at equal intervals, and the aperture of each through hole (7) is 0.4 cm.

7. The guide wheel device for reducing the temperature of a diamond wire in the silicon wafer cutting process as claimed in claim 1, wherein: the main body (1) is a metal component, and a connecting hole is formed in the main body (1) in a penetrating mode.

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