CN215345204U

CN215345204U - Anti-static circuit board

Info

Publication number: CN215345204U
Application number: CN202120993599.9U
Authority: CN
Inventors: 涂宏俊
Original assignee: Shanghai Simcom Wireless Solutions Co Ltd
Current assignee: Shanghai Simcom Wireless Solutions Co Ltd
Priority date: 2021-05-10
Filing date: 2021-05-10
Publication date: 2021-12-28
Anticipated expiration: 2031-05-10

Abstract

The embodiment of the utility model relates to the field of electronic circuits, and discloses an anti-static circuit board. The anti-static circuit board of the utility model comprises: a circuit board body; the first bonding pad is arranged on the circuit board body and is electrically connected with the signal input end of the circuit board body; wherein the first pad has a first discharge tip; the second bonding pad is arranged on the circuit board body and is electrically connected with the grounding end of the circuit board body; the second pad is provided with a second discharge tip, and the first discharge tip and the second discharge tip are oppositely arranged in a spaced mode. The anti-static circuit board can release static electricity from the grounding end of the circuit board, and electronic components in the circuit board are prevented from being damaged after the static electricity is gushed.

Description

Anti-static circuit board

Technical Field

The embodiment of the utility model relates to the field of electronic circuits, in particular to an anti-static circuit board.

Background

Static electricity is an objective natural phenomenon, and is generated in various ways, such as contact, friction, induction between electrical appliances and the like. Static electricity is characterized by long-time accumulation, high voltage, low electric quantity, small current and short action time, and has irreversible damage to components of electronic equipment. In an electrical device, an interface is one of the most commonly used electronic components, and when an external device is connected to the electrical device through the interface, external static electricity easily enters a circuit board of the electrical device from the interface end to discharge static electricity to the circuit board. Since the electrostatic discharge usually generates a large spike current instantaneously, it is likely to have a destructive influence on the electronic components of the circuit board.

The inventors of the present invention found that: in the existing anti-static method, various protection devices are usually added between an interface end of electrical equipment and an electronic element of a circuit board to release static electricity, so as to protect the electronic element of the circuit board. The external protection device increases the hardware cost and complexity.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide an anti-static circuit board, which has an anti-static effect on the premise of not additionally adding a protection device, simplifies the design and manufacturing difficulty of the circuit board, reduces the material cost and protects the normal operation of electronic components in the circuit board.

In order to solve the above technical problem, an embodiment of the present invention provides an anti-static circuit board, including: a circuit board body; the first bonding pad is arranged on the circuit board body and is electrically connected with the signal input end of the circuit board body; wherein the first pad has a first discharge tip; the second bonding pad is arranged on the circuit board body and is electrically connected with the grounding end of the circuit board body; the second pad is provided with a second discharge tip, and the first discharge tip and the second discharge tip are oppositely arranged in a spaced mode.

Compared with the prior art, the embodiment of the utility model has the advantages that the circuit board is respectively provided with the bonding pads with the discharge tips connected with the grounding end and the signal input end, the tips of the two bonding pads are oppositely arranged at intervals, when pulse signals of static electricity flow from the signal input end, the tip discharge effect is utilized to guide the static electricity from the bonding pad tips connected with the signal input end to the bonding pad tips connected with the grounding end, so that the static electricity is released from the grounding end, the electronic components in the circuit board are prevented from being damaged after the static electricity flows into the circuit board, and the static protection of a protected device is realized on the premise of not increasing the static protection devices on the circuit board.

In addition, in the embodiment of the utility model, the first bonding pad and the second bonding pad are both triangular, and the first discharge tip and the second discharge tip are both one corner of the triangle. Through setting up first pad and second pad into triangle-shaped, the concentration of electric charge when improving tip effect and taking place reduces the technology cost of circuit board simultaneously.

In addition, in the embodiment of the present invention, the first pad and the second discharge pad are both acute isosceles triangles, and the first discharge tip and the second discharge tip are both vertex angles of the acute isosceles triangles. The shapes of the two discharging bonding pads are set to be acute-angle isosceles triangles, and the tips are arranged at the vertex angles of the acute-angle isosceles triangles, so that the concentration ratio of charges when the tip effect occurs is further increased.

In addition, the anti-static circuit board in the embodiment of the present invention further includes: the protected device is electrically connected with the signal input end; the first bonding pad is electrically connected with the signal input end through a first connecting point; the first connecting point is positioned on a connecting line between the protected device and the signal input end; and the signal suppression element is arranged between the first electric connection point and the protected device. The signal suppression element is arranged between the protected device and the signal input end and serves as a safety for the discharge failure of the tip of the bonding pad, the possibility that static electricity damages the protected device is further reduced, and the anti-static effect of the circuit board is improved.

Drawings

One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.

FIG. 1 is a schematic structural diagram of an anti-static circuit board according to a first embodiment of the present invention;

FIG. 2 is a schematic structural diagram of an anti-static circuit board according to a second embodiment of the present invention;

fig. 3 is a schematic structural diagram of an anti-static circuit board according to a third embodiment of the utility model.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that numerous technical details are set forth in order to provide a better understanding of the present application in various embodiments of the present invention. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments. The following embodiments are divided for convenience of description, and should not constitute any limitation to the specific implementation manner of the present invention, and the embodiments may be mutually incorporated and referred to without contradiction.

The first embodiment of the present invention relates to an anti-static circuit board, the specific structure of which is shown in fig. 1, and specifically includes: a circuit board body 100;

a first pad 101 and a second pad 104 disposed on the circuit board body 100. The first pad 103 is connected with the signal input end 102 of the circuit board through a signal line; the second pad 104 is connected to the ground terminal 105 of the circuit board. Wherein the first discharge tip 103 on the first pad 101 is disposed opposite to and spaced apart from the second discharge tip 106 on the second pad 104. Preferably, the two tips are spaced apart by a distance of less than or equal to 0.10mm, at which the accumulated charges on the first discharge tip 103 are more favorably discharged to the second tip 106 under the tip discharge effect.

The anti-static circuit board in this embodiment has a function of static protection, and its main purpose is to prevent the device 107 to be protected from being damaged by the transient high-frequency pulse signal generated by static electricity when the signal input terminal 102 of the circuit board body 100 has static electricity inrush.

Specifically, the main working principle of the anti-static circuit board in this embodiment is as follows: when static electricity enters a circuit in the circuit board body 101 from the signal input end 102, the curvature of the conductor surface is larger and the density of charge distribution is larger due to the point discharge effect, so that a large amount of charges brought by the static electricity in the circuit can be accumulated to the first discharge point 103 at the first time, at this time, the electric field intensity around the first discharge point 103 is sharply increased due to the large amount of charges accumulated by the first discharge point 103, so that the material near the first discharge point 103 is broken down to transfer the charges from the first discharge point 103 to the second discharge point 106 on the second pad 104, and the charges are released from the circuit board to the ground through the grounding end 105 connected with the second pad 104.

In one example, since the dielectric constant of air is lower than that of the substrate material of the circuit board and is more easily broken down by charges, the circuit board at the interval between the first discharge tip 103 and the second discharge tip 106 in this embodiment may be hollowed out, so that both the first discharge tip 103 and the second discharge tip 106 are directly exposed to the air, and charges can be released from the circuit through the ground terminal 105 more quickly during static electricity surge.

In one example, according to the principle of the point discharge, the thicknesses of the copper foils constituting the first and

second pads

101 and 104 may be designed to be small during the circuit board process.

Specifically, the copper foil thickness of the first pad 101 and the second pad 104 may be set to 30% to 50% of the copper foil thickness of other pads or signal lines in the circuit board, so that the electrostatic charges inrush from the signal input terminal 102 can generate a greater charge density at the first discharge tip 103 to increase the electric field strength near the tip, resulting in faster discharge of the electrostatic charges.

In one example, if the circuit board body 100 has a plurality of signal input terminals, that is, the number of the signal input terminals is not unique, a plurality of sets of pads with discharge tips may be disposed in the circuit board for implementing electrostatic protection.

Compared with the prior art, the anti-static circuit board in the embodiment can effectively prevent the damage of components in the circuit board caused by static electricity on the basis of not increasing additional protection devices.

The above examples in the present embodiment are only for convenience of understanding, and do not limit the technical aspects of the present invention.

A second embodiment of the present invention relates to an anti-static circuit board, and the specific structure of the circuit board is shown in fig. 2. The second embodiment is substantially the same as the first embodiment, and the main difference is that the first bonding pad 201 and the second bonding pad 204 in the second embodiment are designed to be triangular, wherein the first discharge tip 203 and the second discharge tip 206 are both one corner of the triangular bonding pad. It should be noted that the same or corresponding portions as those in the first embodiment exist in this embodiment, and are not described herein again to avoid repetition.

Specifically, the first discharge tip 203 and the second discharge tip 206 in the present embodiment are also disposed opposite to each other at intervals, and as shown in fig. 2, the first pad 201 and the second pad 204 have two triangular pads with their vertex angles facing each other.

Preferably, the first and

second pads

201 and 204 are designed as acute isosceles triangles, and the vertex angle at which the acute isosceles triangle has the smallest angle is set as the angle at which the first and

second discharge tips

203 and 206 are located. According to the principle of point discharge, most advanced shape is more sharp, then the intensity of point effect is higher, consequently can minimize the angle size of triangle-shaped apex angle as far as possible, engineering personnel discover according to the experiment, when the angle of apex angle is undersized, because the point of discharging electric charge density reaches the saturation, consequently the electric field of point department can not continue to increase and can reduce on the contrary, so set up the apex angle of acute angle isosceles triangle between 20 degrees to 30 degrees, be favorable to when improving the intensity of point effect, avoid the electric field of point department to reduce.

In one example, the first pad 201 and the second pad 204 may be formed of a triangular copper foil, and the triangular copper foil forming the first pad 201 and the second pad 204 may be designed in the following dimensions. The height H from the top angle to the bottom edge of the triangular copper foil is 0.45mm to 0.55mm, the width W from the bottom edge of the triangular copper foil is 0.45mm to 0.55mm, preferably, the triangular copper foil is an isosceles triangle, the height H from the top angle to the bottom edge of the triangular copper foil is 0.50mm, and the width W from the bottom edge of the triangular copper foil is 0.50 mm. In addition, the distance D between the top corners of the two triangular copper foils is 0.10mm to 0.20mm, and preferably, the distance D is 0.15 mm. Furthermore, the size of the bonding pad formed according to the sizes is close to the size of other components in the circuit board, and the occupation of the anti-static structure on the area space of the circuit board can be reduced.

Compared with the prior art, the anti-static circuit board in the embodiment can design the first bonding pad and the second bonding pad into the triangular shape on the basis of not increasing additional components, so that the discharging effect generated by the tip effect is better, and the damage of the components in the circuit board caused by static electricity is more effectively prevented.

The above examples in the present embodiment are for convenience of understanding, and do not limit the technical aspects of the present invention.

A third embodiment of the present invention relates to an anti-static circuit board, and the specific structure of the circuit board is shown in fig. 3. The third embodiment is substantially the same as the first embodiment except that in this embodiment, the connection point of the first pad 301 and the signal input terminal 302 is located between the protected device 307 and the connection circuit of the signal input terminal 302. It should be noted that the same or corresponding portions as those in the first embodiment exist in this embodiment, and are not described herein again to avoid repetition.

Specifically, the protected device 307 in the present embodiment is electrically connected to the signal input terminal 302; the first pad 301 is electrically connected to the signal input terminal 302 through a first connection point 308; wherein, the first connection point 308 is located on the connection line between the protected device 307 and the signal input terminal 302; and a signal suppression element 309 disposed between the first electrical connection point 308 and the protected device 307. The signal suppressing element 309 is an electronic element having a function of suppressing a signal pulse, when the structures of the first pad 301 and the second pad 304 are damaged, electrostatic charges cannot be discharged from the ground terminal by the tip effect, and at this time, when the electrostatic pulse signal passes through the signal suppressing element 309, since the signal suppressing element 309 consumes electric energy, the possibility of damaging the device 307 to be protected is reduced.

In one example, the signal suppressing element 309 in this embodiment may be any one of an inductor, a magnetic bead, and a resistor. The principles of the inductor, the magnetic bead, and the resistor as the signal suppressing element are substantially the same. When current flows through the inductor, the inductor can block the change of the current, and the voltage of the inductor can be greatly changed in a very short time because static electricity generally surges in the form of a pulse signal, so that the inductor can have a remarkable inhibiting effect on the static electricity surge. The magnetic beads also have the capacity of absorbing electrostatic pulses, have very high resistivity and permeability, and are equivalent to a resistor and an inductor which are connected in series, but the resistance value and the inductance value change along with the frequency. Compared with the common inductor, the inductor has better high-frequency filter characteristics, and is resistive at high frequency, so that the inductor can absorb electrostatic pulses when static electricity is inrush.

In one example, to ensure that the electrostatic charges can be more rapidly discharged from the tip on the first pad 301, the first pad 301 may be directly disposed at the position of the first connection point 308, thereby reducing the line distance between the first pad 301 and the signal input terminal 302.

Further, in order to ensure that the protected device 307 is not damaged by static electricity, the first connection point 308 may be disposed as close to the signal input terminal 302 as possible and far from the protected device 307, that is, the line distance between the protected device 307 and the first connection point 308 is set to be longer than the line distance between the signal input terminal 302 and the first connection point 308, so that the influence of transient pulse signals generated by the surge of static electricity on normal signal transmission in the circuit board is minimized.

In one example, the first pad 301 and the second pad 302 in the present embodiment can be designed as an acute isosceles triangle, and the vertex angle at which the acute isosceles triangle is smallest is set as the angle at which the first discharge tip 303 and the second discharge tip 306 are located. The first bonding pad 301 and the second bonding pad 302 are designed to be acute-angled isosceles triangles, meanwhile, the signal suppression element 309 is added, so that the discharge effect generated by the tip effect is better, and the possibility that a protected device in a circuit board is damaged when the first bonding pad 301 and the second bonding pad 304 are damaged and the tip discharge effect is failed is reduced.

Compared with the prior art, the anti-static circuit board in the embodiment can further realize static protection on the circuit board on the basis of adding simple electronic elements, and can reduce the possibility that a protected device in the circuit board is damaged when the first bonding pad 301 and the second bonding pad 304 are damaged and further the point discharge effect fails.

It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific embodiments for practicing the utility model, and that various changes in form and details may be made therein without departing from the spirit and scope of the utility model in practice.

Claims

1. An antistatic circuit board, comprising:

a circuit board body;

the first welding disc is arranged on the circuit board body and is electrically connected with the signal input end of the circuit board body; wherein the first pad has a first discharge tip;

the second welding disc is arranged on the circuit board body and is electrically connected with the grounding end of the circuit board body; wherein the second pad has a second discharge tip, and the first discharge tip and the second discharge tip are oppositely disposed in a spaced manner.

2. The antistatic circuit board of claim 1,

the first bonding pad and the second bonding pad are both triangular, and the first discharge tip and the second discharge tip are both one corner of the triangle.

3. The antistatic circuit board of claim 2,

the first bonding pad and the second bonding pad are acute-angle isosceles triangles, and the first discharge tip and the second discharge tip are vertex angles of the acute-angle isosceles triangles.

4. The anti-static circuit board according to claim 1, wherein the angle of the first discharge tip ranges from 20 degrees to 60 degrees.

5. The antistatic circuit board of claim 1, further comprising:

the protected device is electrically connected with the signal input end;

the first bonding pad is electrically connected with the signal input end through a first connecting point; the first connecting point is positioned on a connecting line between the protected device and the signal input end;

and the signal suppression element is arranged between the first electric connection point and the protected device.

6. The antistatic circuit board of claim 5, wherein the signal suppression element comprises one of: inductance, magnetic bead, resistance.

7. The anti-static circuit board according to claim 5, wherein a line distance from the protected device to the first connection point is greater than a line distance from the first connection point to the signal input terminal.

8. The antistatic circuit board of claim 5, wherein the first discharge pad is disposed directly on the first connection point.

9. The anti-static circuit board according to any one of claims 1 to 8, wherein a spacing distance between the first discharge tip and the second discharge tip is less than or equal to 0.1 mm.

10. The anti-static circuit board according to claim 9, wherein the circuit board body is hollowed at a position where the first discharge tip is spaced from the second discharge tip.