CN215345107U - PTC semiconductor heating device - Google Patents
PTC semiconductor heating device Download PDFInfo
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- CN215345107U CN215345107U CN202121338242.3U CN202121338242U CN215345107U CN 215345107 U CN215345107 U CN 215345107U CN 202121338242 U CN202121338242 U CN 202121338242U CN 215345107 U CN215345107 U CN 215345107U
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Abstract
The utility model discloses a PTC semiconductor heating device, and relates to the technical field of PTC semiconductors. The heating device comprises a first supporting plate, wherein fixing holes are arranged on two sides of the lower portion of the first supporting plate in a penetrating mode, a plurality of connectors are evenly arranged on the side face of the upper portion of the first supporting plate in a penetrating mode, a first protective sleeve is fixedly connected inside each connector, a connecting hole is arranged inside each first protective sleeve in a penetrating mode, a heating mechanism is fixedly connected inside each connecting hole, a plurality of cooling fins are evenly and fixedly connected to the outer side of the middle of each heating mechanism, a second protective sleeve is symmetrically and fixedly connected to one side, away from the first protective sleeve, of each heating mechanism, and a second supporting plate is fixedly connected to the outer side of the front end of the second protective sleeve. According to the utility model, through the cooperation of each component of the heating mechanism and the U-shaped radiating fins, the device can timely convey the generated heat to the electric appliance, so that the heat exchange efficiency of the device is improved; through the use of the heating rod, the temperature of the device is in a dynamic balance state at any moment when the device heats, and the stability of heat supply of the device is improved.
Description
Technical Field
The utility model belongs to the technical field of PTC semiconductors, and particularly relates to a PTC semiconductor heating device.
Background
PTC is a temperature-sensitive semiconductor resistor made of a semiconductor ceramic material, and its resistance value increases almost stepwise with the increase of temperature once a certain temperature (the curie temperature, which is a temperature critical point for changing the material properties) is exceeded. Therefore, after the PTC passes through the current, the temperature of the PTC rises according to the Joule formula, when the temperature of the PTC rises to the Curie temperature, the current quantity is reduced due to the increase of the resistance, the temperature is reduced accordingly, after the temperature of the PTC drops below the Curie point, the resistance is reduced again, the current is increased again, the temperature rises accordingly, and the process is repeated, so that the temperature of the PTC can be kept at the point of the Curie temperature all the time. According to the characteristic, the PTC can be used as a heating element for electric appliances such as a fan heater, a clothes drying cabinet and the like.
Application number is CN 201821327812.7's patent specification discloses a PTC semiconductor electric heater unit, which comprises a housin, the second closing cap has been cup jointed in the upper end of casing slip, the lower extreme threaded connection of casing has first closing cap, the inside of casing is equipped with first coil pipe, the upper end intercommunication of first coil pipe has the inlet tube, the second closing cap is run through to the upper end of inlet tube, the inside of first coil pipe is equipped with the second coil pipe, the lower extreme intercommunication of first coil pipe has the connecting pipe, the other end of connecting pipe and the lower extreme intercommunication of second coil pipe, be equipped with heating mechanism between first coil pipe and the second coil pipe, the upper end intercommunication of second coil pipe has the outlet pipe, the lower extreme of outlet pipe passes through the middle part of second coil pipe and runs through first closing cap. The PTC heating device has the advantages that the actual use power of the PTC heating element is positively correlated with the heat dissipation effect of the PTC heating element, the core of the PTC heating device, namely the PTC heating mechanism, is structurally in a circular tube shape and is also positioned inside used electric appliances during use, so that the heat exchange area is extremely small, heat cannot be transferred and dissipated timely, and the heat efficiency is extremely low in the actual use process.
To masterAn effective solution to the problems in the related art has not been proposed yet.
SUMMERY OF THE UTILITY MODEL
In view of the problems in the related art, the present invention provides a PTC semiconductor heating device to overcome the above problems in the related art.
In order to solve the technical problems, the utility model is realized by the following technical scheme:
the utility model relates to a PTC semiconductor heating device which comprises a first supporting plate, wherein fixing holes are arranged on two sides of the lower portion of the first supporting plate in a penetrating mode, a plurality of connectors are uniformly arranged on the side face of the upper portion of the first supporting plate in a penetrating mode, a first sheath is fixedly connected inside each connector, a connecting hole is arranged in each sheath in a penetrating mode, a heating mechanism is fixedly connected inside each connecting hole, a plurality of radiating fins are uniformly and fixedly connected to the outer side of the middle of each heating mechanism, one side, far away from the first sheath, of each heating mechanism is symmetrically and fixedly connected with a second sheath, and a second supporting plate is fixedly connected to the outer side of the front end of the second sheath.
Furthermore, the heating mechanism comprises electrode connecting sheets, the middle parts of the front ends of the electrode connecting sheets are provided with inserting ports in a penetrating mode, and heating rods are fixedly connected between the two electrode connecting sheets.
Furthermore, the radiating fin is U-shaped, the middle part of the radiating fin is uniformly provided with through holes in a penetrating mode, and the through holes are matched with the outer side outline of the heating rod.
Furthermore, the first support plate and the second support plate, and the first sheath and the second sheath are the same in shape and material and are symmetrically connected with each other on two sides of the device.
Furthermore, the first supporting plate and the first radiating fin are made of aluminum materials, the first sheath is made of insulating heat-resistant silica gel, the electrode connecting sheet is made of copper sheets, and the heating rod is made of PTC semiconductor ceramics.
The utility model has the following beneficial effects:
in summary, according to the above technical solution of the present invention, the device is connected to a suitable position of the electric appliance by installing the fixing screws in the fixing holes of the first and second support plates at the two sides of the device, and then the positive and negative electrodes of the electric appliance are respectively fixed on the electrode connecting pieces at the two ends of the heating rod to supply power to the device, the current passes through the PTC semiconductor ceramic heating rod, the heating rod starts to generate heat and is dissipated outward by the heat dissipation fins uniformly externally connected to the outer side of the heating rod, the U-shaped structure of the heat dissipation fins enables the device to form a plurality of heat dissipation holes on the vertical surface, the heat exchange area of the device is increased, the heat generated by the device is dissipated in time and absorbed and utilized by the electric appliance, and the heat generated by the device can be timely transmitted to the electric appliance through the cooperation of each component of the heating mechanism and the U-shaped heat dissipation fins, thereby improving the heat exchange efficiency of the device; in the process of heating of the device, the heating rod rapidly rises to the Curie point temperature of the heating rod, heat is transferred to the outside of the device through the radiating fins and used by an electric appliance, meanwhile, the current passing through the heating rod begins to be reduced due to the heat-sensitive characteristic of the semiconductor ceramic of the heating rod, the heating amount of the heating rod is reduced, the temperature of the heating rod begins to be reduced, after the temperature of the heating rod is lower than the Curie point, the resistance value is reduced and the current value is recovered, the temperature of the device is raised again, the temperature of the device is balanced at the Curie point temperature of the heating rod all the time in a circulating reciprocating mode in the process, and the temperature of the device during heating is in a dynamic balance state all the time through the use of the heating rod, so that the stability of heat supply of the device is improved.
Of course, it is not necessary for any product in which the utility model is practiced to achieve all of the above-described advantages at the same time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the description below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive work.
FIG. 1 is an overall schematic view of the present invention;
FIG. 2 is an exploded view of the structure of the present invention;
fig. 3 is a detailed view of the structure of the heat generating mechanism and the heat sink of the present invention.
In the drawings, the components represented by the respective reference numerals are listed below:
1. a first support plate; 2. a fixing hole; 3. a connecting port; 4. a first sheath; 5. connecting holes; 6. a heating mechanism; 61. an electrode connecting sheet; 62. an interface; 63. a heating rod; 7. a heat sink; 8. a second sheath; 9. a second support plate; 10. and a through hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by a person skilled in the art without any inventive work based on the embodiments of the present invention belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "open", "upper", "lower", "top", "middle", "inner", and the like, indicate positional or orientational relationships and are used merely for convenience in describing the utility model and for simplicity in description, and do not indicate or imply that the referenced components or elements must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the utility model.
Referring to fig. 1-3, the utility model relates to a PTC semiconductor heating device, which comprises a supporting plate 1, wherein fixing holes 2 are arranged on two sides of the lower part of the supporting plate 1 in a penetrating manner, a plurality of connectors 3 are uniformly arranged on the side surface of the upper part of the supporting plate 1 in a penetrating manner, a first sheath 4 is fixedly connected inside the connectors 3, a connecting hole 5 is arranged inside the first sheath 4 in a penetrating manner, a heating mechanism 6 is fixedly connected inside the connecting hole 5, a plurality of radiating fins 7 are uniformly and fixedly connected on the outer side of the middle part of the heating mechanism 6, a second sheath 8 is symmetrically and fixedly connected on one side of the heating mechanism 6 far away from the first sheath 4, and a second supporting plate 9 is fixedly connected on the outer side of the front end of the second sheath 8.
In an embodiment, for the heating mechanism 6, the heating mechanism 6 includes electrode connecting sheets 61, a socket 62 is disposed through the middle of the front end of each electrode connecting sheet 61, and a heating rod 63 is fixedly connected between two electrode connecting sheets 61, so that the electrode connecting sheets 61 at two ends of the device are respectively used for connecting the positive and negative electrodes of the electrical appliance to energize the device, the socket 62 is a connection point, and the heating rod 63 is used for generating heat to provide a heating element for the device, and further through the cooperation of the components of the heating mechanism 6, the device can continuously generate heat after being energized. In addition, when the electrode connecting sheet 61 is used specifically, the electrode connecting sheet passes through the connecting hole 5 and is positioned at one side of the first supporting plate 1 and the second supporting plate 9, which is far away from the heating rod 63, so that the heating part of the device is far away from a power supply access point, the use safety of the device is improved, and the two ends of the heating rod 63 are provided with protrusions for limiting the connected radiating fins 7.
In one embodiment, for the heat sink 7, the heat sink 7 is U-shaped, the middle of the heat sink 7 is uniformly provided with through holes 10, and the through holes 10 are matched with the outer contour of the heating rod 63, so that when the heat sink 7 with the U-shaped structure is arranged and connected outside the heating rod 63, a series of rectangular heat dissipation holes which are uniformly distributed are separated on a vertical surface, and meanwhile, the structure with matched contour makes the connection between the heating mechanism 6 and the heat sink 7 more stable, thereby increasing the heat exchange area of the device and indirectly increasing the actual power of the device during use. In addition, when the heat dissipation plate is used specifically, the height of the heat dissipation plate 7 is lower than that of the first support plate 1, so that the heat generation part of the device can be conveniently and fully contacted with the air in the peripheral space after the fixing screws are installed in the fixing holes 2.
In an embodiment, for the supporting plate 1, the supporting plate two 9, the sheath one 4 and the sheath two 8 are made of the same material and are symmetrically connected with respect to two sides of the device, so that the heating mechanism 6 can be conveniently installed and connected in the middle of the device, in addition, in specific application, the supporting plate 1 is in an L shape, the heating mechanism 6 is in an exposed state when being connected between the supporting plate 1 and the supporting plate two 9, the overall heat exchange area of the device is further increased, heat generated by the device is timely dissipated and used, the heat exchange efficiency between the device and an electric appliance is favorably improved, and the actual use power of the device in a working state is ensured.
In one embodiment, for the supporting plate 1, the supporting plate 1 and the heat radiating fins 7 are made of aluminum materials, the sheath 4 is made of insulating heat-resistant silica gel, the electrode connecting sheet 61 is made of copper sheets, and the heat generating rods 63 are made of PTC (positive temperature coefficient) semiconductor ceramics, so that the heat radiating performance of the device is improved by using the aluminum materials, the electricity utilization safety of the device is improved by using the insulating heat-resistant silica gel, the uncontrollable temperature of the traditional heating resistance wire is avoided by using the PTC semiconductor ceramics, the temperature of the device is more stable and safer, and the overall practicability and safety of the device are improved in material selection. In addition, when the PTC semiconductor ceramic is specifically applied, the Curie point of the PTC semiconductor ceramic is about 250 ℃, and due to the heat-sensitive characteristic, when the PTC semiconductor ceramic is used, even if the emitted heat is not absorbed and utilized timely, the PTC temperature is higher than the Curie point, the resistance of the PTC semiconductor ceramic can be increased rapidly, the current quantity is reduced, the heat productivity is reduced automatically, the peripheral temperature is controlled, and the safety of the PTC semiconductor ceramic is greatly improved when the PTC semiconductor ceramic is used.
In summary, according to the above technical solution of the present invention, the device is connected to a suitable position of the electric appliance by installing the fixing screws in the fixing holes 2 of the first support plate 1 and the second support plate 9 on both sides of the device, and then the positive and negative electrodes of the electric appliance are respectively fixed on the electrode connecting sheets 61 at both ends of the heating rod 63 to supply power to the device, the current passes through the PTC semiconductor ceramic heating rod 63, the heating rod 63 starts to generate heat and is radiated outward by the heat radiating fins 7 uniformly externally connected to the outer side of the heating rod, the U-shaped structure of the heat radiating fins 7 forms a plurality of heat radiating holes on the vertical surface of the device, the heat exchange area of the device is increased, and the heat generated by the device is timely radiated and absorbed and utilized by the electric appliance. In the process of heating the device, the heating rod 63 rapidly rises to the Curie point temperature of the heating rod, heat is transferred to the outside of the device from the heat sink 7 and is used by an electric appliance, meanwhile, the resistance of the heating rod 63 begins to rise due to the heat-sensitive property of the semiconductor ceramic, the passing current of the heating rod starts to decrease, the heating value of the heating rod 63 starts to decrease, the resistance value of the heating rod returns to the reduced current value after the temperature of the heating rod 63 is lower than the Curie point, the temperature of the device is raised again, and the process is repeated in a circulating mode, so that the temperature of the device is always balanced at the Curie point temperature of the heating rod 63.
Through the technical scheme, 1, through the cooperation of each component of the heating mechanism 6 and the U-shaped radiating fins 7, the device can timely convey the generated heat to an electric appliance, and the heat exchange efficiency of the device is improved; 2. by using the heating rod 63, the temperature of the device is in a dynamic balance state at any moment when the device heats, and the stability of heat supply of the device is improved.
In the description of the present specification, reference to the description of "one embodiment," "an example," "a specific example" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the utility model disclosed above are intended only to help illustrate the utility model. The preferred embodiments are not intended to be exhaustive or to limit the utility model to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the utility model and its practical application, to thereby enable others skilled in the art to best understand and utilize the utility model. The utility model is limited only by the claims and their full scope and equivalents.
Claims (5)
1. A PTC semiconductor heating device comprising a first support plate (1), characterized in that: the utility model discloses a heating device, including backup pad (1), connecting hole (5), the even connector (3) that runs through in backup pad (1) lower part both sides are provided with fixed orifices (2), the even connector (3) that runs through in backup pad (1) upper portion side is provided with a plurality ofly, the inside fixedly connected with sheath (4) of connector (3), the inside through connection hole (5) of sheath (4), the inside fixedly connected with mechanism (6) that generates heat in connecting hole (5), the even fixedly connected with fin (7) in the mechanism (6) middle part outside that generates heat are a plurality of, the mechanism (6) that generates heat is kept away from one side symmetry fixedly connected with sheath two (8) of sheath (4), sheath two (8) front end outside fixedly connected with backup pad two (9).
2. A PTC semiconductor heating device according to claim 1, wherein the heating mechanism (6) comprises electrode connecting pieces (61), the middle of the front end of the electrode connecting pieces (61) is provided with a socket (62) in a penetrating manner, and a heating rod (63) is fixedly connected between the two electrode connecting pieces (61).
3. A PTC semiconductor heating device according to claim 2, wherein the heat sink (7) is U-shaped, a through hole (10) is uniformly formed through the middle of the heat sink (7), and the through hole (10) is matched with the outer profile of the heating rod (63).
4. A PTC semiconductor heating device according to claim 3, wherein the first support plate (1) and the second support plate (9), and the first sheath (4) and the second sheath (8) are all of the same shape and material and are symmetrically connected with respect to both sides of the device.
5. A PTC semiconductor heating device according to claim 4, wherein the first supporting plate (1) and the heat sink (7) are made of aluminum, the first sheath (4) is made of insulating heat-resistant silica gel, the electrode connecting sheet (61) is made of copper sheet, and the heating rod (63) is made of PTC semiconductor ceramic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121338242.3U CN215345107U (en) | 2021-06-16 | 2021-06-16 | PTC semiconductor heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121338242.3U CN215345107U (en) | 2021-06-16 | 2021-06-16 | PTC semiconductor heating device |
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| CN215345107U true CN215345107U (en) | 2021-12-28 |
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| CN202121338242.3U Active CN215345107U (en) | 2021-06-16 | 2021-06-16 | PTC semiconductor heating device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117153508A (en) * | 2023-10-18 | 2023-12-01 | 深圳市正阳兴电子科技有限公司 | Grid type high-power metal resistor |
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2021
- 2021-06-16 CN CN202121338242.3U patent/CN215345107U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117153508A (en) * | 2023-10-18 | 2023-12-01 | 深圳市正阳兴电子科技有限公司 | Grid type high-power metal resistor |
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