CN215335223U - IC support - Google Patents

IC support Download PDF

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Publication number
CN215335223U
CN215335223U CN202120661512.8U CN202120661512U CN215335223U CN 215335223 U CN215335223 U CN 215335223U CN 202120661512 U CN202120661512 U CN 202120661512U CN 215335223 U CN215335223 U CN 215335223U
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China
Prior art keywords
main body
fixed
sub
lug
bracket main
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CN202120661512.8U
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Chinese (zh)
Inventor
杨溢
黄小霞
杨虎飞
吴易谦
曾国栋
曾乙伦
高亮
张昌
孙浩
王彬
王洋
王永乐
杨恩建
都阿娟
李非凡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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Priority to CN202120661512.8U priority Critical patent/CN215335223U/en
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Abstract

The disclosed embodiment provides an IC support, which comprises a mounting side for mounting a semiconductor element product, and comprises: a stent body; the fixing part is detachably connected with the support main body through at least one connecting structure and is positioned on the mounting side of the support main body, and the surface, far away from the support main body, of the fixing part is used for gluing.

Description

IC support
Technical Field
The present disclosure relates to the field of support technology, and more particularly, to an IC support.
Background
The OLED display module has been widely used in various electronic terminal products, such as mobile phones, as a display component of electronic equipment. When the module factory is shipping the display modules, it is necessary to attach an IC (semiconductor device product) bracket behind each display module in order to protect the display module.
Among the correlation technique, glue on the IC support more to be fixed in the IC support with display module assembly on, but the IC support is after using, glue on the IC support is difficult for getting rid of for there is the cull on the IC support, and the processing cost of cull is higher, and this makes the IC support be not convenient for retrieve, causes the waste in a large number of IC supports, consequently needs an urgent need for an IC support of being convenient for retrieve.
Disclosure of Invention
An object of the embodiment of the present disclosure is to provide an IC bracket to reduce the difficulty of recovering the IC bracket, and to realize the reuse of the IC bracket. The specific technical scheme is as follows:
in one aspect of the disclosed embodiments, there is provided an IC holder including a mounting side for mounting a semiconductor element product, the IC holder including:
a stent body;
the fixing part is detachably connected with the bracket main body through at least one connecting structure and is positioned on the mounting side of the bracket main body, and the surface of the fixing part, which is far away from the bracket main body, is used for gluing.
In some embodiments, each of the connection structures comprises:
the buckle is fixed on the fixed part and comprises a connecting block fixedly connected with the fixed part and a clamping piece fixed on the side surface of the connecting block, an included angle is formed between the clamping piece and the side surface of the connecting block, and the opening direction of the included angle faces towards the fixed part;
set up in the support main part and with buckle assorted draw-in groove, the draw-in groove with the buckle joint.
In some embodiments, the card has a plurality of through holes.
In some embodiments, the at least one connection structure includes three connection structures, and the three connection structures are uniformly distributed along a long side direction of the fixing part.
In some embodiments, the at least one connection structure comprises:
the first projection part is positioned on the fixed part and comprises a first sub projection part fixedly connected with the fixed part and a second sub projection part fixedly connected with one side, far away from the fixed part, of the first sub projection part, and the orthographic projection of the second sub projection part on a first surface covers the orthographic projection of the first sub projection part on the first surface, and the first surface is the surface, close to the bracket main body, of the fixed part;
the sliding groove is arranged on the support main body and matched with the first protruding part, and the first protruding part is connected with the sliding groove in a sliding mode.
In some embodiments, the second sub-protrusion portion is rectangular, and a long side of the second sub-protrusion portion has a first rack structure, and an inner side of the sliding groove has a second rack structure matching the first rack structure.
In some embodiments, each of the connection structures comprises:
the hanging lug is fixed on the long side and/or the short side of the fixing part, and a hanging lug hole is formed in the hanging lug;
and the second lug boss is fixed on the bracket main body and matched with the lug hole, and the lug is hung and connected with the second lug boss through the lug hole.
The embodiment of the disclosure has the following beneficial effects:
the embodiment of the disclosure provides an IC support, which comprises a support main body and a fixing part, wherein the fixing part is detachably connected with the support main body. The fixing part is positioned on the mounting side of the bracket main body, and the surface of the fixing part, which is far away from the bracket main body, can be coated with glue. When the semiconductor element product IC is fixed by the IC holder, the IC is fixed to the IC holder by attaching and fixing the IC to the fixing member. After the IC is disassembled from the IC support, the fixing part with the residual glue can be disassembled from the support main body and discarded, and the support main body can be directly recycled due to the fact that the residual glue does not exist in the support main body, so that the recycling difficulty of the IC support is reduced, and the recycling of the IC support is realized.
Of course, not all advantages described above need to be achieved at the same time to practice any one product or method of the present disclosure.
Drawings
In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and it is obvious for those skilled in the art that other embodiments can be obtained by using the drawings without creative efforts.
FIG. 1 is a schematic diagram of an IC carrier according to some embodiments of the present disclosure;
FIG. 2 is a schematic view of another embodiment of an IC carrier according to the present disclosure;
FIG. 3 is a schematic illustration of at least one attachment structure according to some embodiments of the present disclosure;
FIG. 4 is a schematic view of a partial structure of an IC carrier according to some embodiments of the present disclosure;
FIG. 5 is another schematic illustration of at least one attachment structure according to some embodiments of the present disclosure;
fig. 6 is a schematic view of another partial structure of an IC mount according to some embodiments of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments derived from the present application by a person of ordinary skill in the art based on the embodiments in the present disclosure are within the scope of protection of the present disclosure.
In order to reduce the recycling difficulty of the IC support and realize the recycling of the IC support, the embodiment of the disclosure provides the IC support. The IC bracket is used for mounting and supporting an IC (semiconductor component product), and a side of the IC bracket for mounting the IC is a mounting side, wherein the IC includes, but is not limited to, an OLED (Organic Light Emitting Diode) display module, a semiconductor chip, and the like.
As shown in fig. 1 and 2, an IC holder provided by an embodiment of the present disclosure includes:
a stent body 1;
the fixing component 2 is detachably connected with the bracket main body 1 through at least one connecting structure 3, the fixing component 2 is positioned on the installation side of the bracket main body 1, and the surface, far away from the bracket main body 1, of the fixing component 2 is used for gluing.
In the embodiment of the present disclosure, the mounting side of the bracket body 1 is a side of the bracket body 1 contacting and supporting the IC. The fixing member 2 is located on the mounting side of the bracket body 1 and is used for supporting and mounting the IC, and the surface of the fixing member 2 away from the bracket body 1 is used for gluing so that the IC is bonded with the fixing member 2 and is fixed on the IC bracket.
The shape of the fixing component 2 may be set according to actual requirements, which is not specifically limited in the embodiment of the present disclosure. For example, as shown in fig. 2, the fixing member 2 may be configured to be rectangular plate-shaped, and when the fixing member 2 is rectangular plate-shaped, each corner of the fixing member 2 may be rounded, so as to prevent the worker from being scratched by each corner of the fixing member 2 when the worker detaches the fixing member 2 from the bracket body 1.
The material of the fixing part 2 and the bracket main body 1 may be set according to actual requirements, which is not particularly limited in the embodiments of the present disclosure, and in one example, the material of the fixing part 2 may be a plastic with light weight and low cost, such as PE (Polyethylene), PP (Polypropylene), and the like. The glue coated on the surface of the fixing part 2 can be foam cotton glue, pressure-sensitive adhesive and the like, and the embodiment of the disclosure is not particularly limited to this, and the IC can be firmly adhered to the fixing part 2.
At least one connection structure 3 is used for connecting fixed part 2 and support main part 1, and at least one connection structure 3 can be multiple form, and this disclosed embodiment does not specifically limit the form and the quantity of at least one connection structure 3, only needs to guarantee that when fixed part 2 is fixed in support main part 1 through connection structure 3, fixed part 2 does not remove and fixed part 2 easily dismantles from support main part 1 for support main part 1.
When an IC is supported and fixed by the IC holder provided by the embodiment of the present disclosure, the IC is adhesively fixed to the fixing member 2, so that the IC is fixed to the IC holder. After the IC is disassembled from the IC support, the fixing part 2 with residual glue can be disassembled from the support main body 1 and discarded, and the support main body 1 can be directly recycled due to the fact that the residual glue does not exist on the support main body 1, so that the recycling difficulty of the IC support is reduced, and the recycling of the IC support is realized.
In some embodiments, as shown in fig. 3 and 4, each connection structure 3 comprises:
the buckle 31 is fixed on the fixing part 2, the buckle 31 comprises a connecting block 311 fixedly connected with the fixing part 2, and a clamping piece 312 fixed on the side surface of the connecting block 311, an included angle is formed between the clamping piece 312 and the side surface of the connecting block 311, and the opening direction of the included angle faces the fixing part 2;
the clamping groove 32 is arranged on the bracket main body 1 and matched with the buckle 31, and the clamping groove 32 is clamped with the buckle 31.
In the disclosed embodiment, as shown in fig. 4, the bottom of the card slot 32 has a chamfered groove 321 matching the shape and inclination angle of the card 312. The clamping piece 312 is obliquely fixed on the side surface of the connecting block 311, and the clamping piece 312 has elasticity, so that when the clamping piece 312 is squeezed by an external force, an included angle between the clamping piece 312 and the side surface of the connecting block 311 is reduced. Based on this, in the process of inserting the buckle 31 into the clamping groove 32, under the extrusion of the side wall of the clamping groove 32, the included angle between the card 312 and the side surface of the connecting block 311 is reduced until the card 312 completely fits the surface of the connecting block 311, and when the buckle 31 moves downwards until the top end of the card 312 is lower than the top end of the inclined cutting groove 321, the card 312 is not extruded by the side wall any more, so that the card 312 rebounds into the inclined cutting groove 321, and the buckle 31 is connected with the clamping groove 32 in an inserting manner.
Because the upper surface of oblique grooving 321 and the tank bottom of draw-in groove 32 carry on spacingly to card 312 jointly for card 312 does not have the displacement along vertical direction, and buckle 31 does not have the displacement along vertical direction for draw-in groove 32 promptly, and the lateral wall of draw-in groove 32 carries on spacingly to buckle 31, makes buckle 31 also have no displacement along the horizontal direction for draw-in groove 32, has realized the fixed connection of buckle 31 with draw-in groove 32, thereby makes installing component 2 and support main part 1 fixed connection. When the mounting component 2 needs to be detached from the bracket body 1, the mounting component 2 only needs to be pulled greatly to break the card 312, and the bracket body 1 and the mounting component 2 can be separated.
In some embodiments, as shown in fig. 3, a plurality of through holes 313 are formed in the card 312, and the plurality of through holes 313 are used to increase flexibility of the card 312, so that the buckle 31 is easier to be snapped into the slot 32. In addition, the plurality of through holes 313 reduce the strength of the card 312, reducing the pulling force required when detaching the fixing member 2.
In some embodiments, as shown in fig. 2, the at least one connection structure 3 comprises three connection structures 3, and the three connection structures 3 are uniformly distributed along the long side direction of the fixing part. The fixing member 2 and the holder main body 1 are more stably connected, so that the IC is more smoothly pasted on the fixing member 2.
In some embodiments, as shown in fig. 5 and 6, the at least one connection structure 3 comprises:
the first protrusion part 33 is located on the fixing part 2, the first protrusion part 33 includes a first sub protrusion part 331 fixedly connected with the fixing part 2, and a second sub protrusion part 332 fixedly connected with a side of the first sub protrusion part 331 far away from the fixing part 2, and an orthographic projection of the second sub protrusion part 332 on a first surface covers an orthographic projection of the first sub protrusion part 331 on the first surface, the first surface being a surface of the fixing part 2 close to the bracket main body 1;
the sliding groove 34 is arranged on the bracket main body 1 and matched with the first protruding part 33, and the first protruding part 33 is connected with the sliding groove 34 in a sliding mode.
In the embodiment of the present disclosure, as shown in fig. 5, the first protruding portion 33 includes a first sub-protruding portion 331 and a second sub-protruding portion 332, the first protruding portion 33 is stepped, and an orthogonal projection of the second sub-protruding portion 332 on the first surface covers an orthogonal projection of the first sub-protruding portion 331 on the first surface, that is, a width of the second sub-protruding portion 332 is wider than that of the first sub-protruding portion 331. Based on this, when the first protrusion 332 is slidably connected to the sliding slot 34, the second sub-protrusion 332 contacts with the bottom of the sliding slot 34, as shown in fig. 6, and because the width of the second sub-protrusion 332 is wide, the sliding slot 34 limits the second sub-protrusion 332, so that the second sub-protrusion 332 cannot be displaced in the vertical direction, and thus the first protrusion 33 cannot be displaced in the vertical direction, and the stable connection between the fixing component 2 and the bracket main body 1 is realized.
The size and number of the first protrusions 33 are not particularly limited in the embodiments of the present disclosure. In one example, the number of the first protrusions 33 may be one, and based on this, in order to secure stability of the connection of the fixing member 2 to the stand main body 1, the length of the long side of the first protrusion 33 is made substantially equal to the length of the long side of the fixing member 2. In another example, the number of the first protrusions 33 may be plural, such as two or three, and based on this, in order to ensure the stability of the connection of the fixing member 2 and the bracket body 1, the plural first protrusions 33 are uniformly arranged along the long side of the fixing member 2.
In some embodiments, as shown in fig. 5, the second sub-protrusion 332 has a rectangular parallelepiped shape, and the long side surface of the second sub-protrusion 332 has a first rack structure 333, and the inner side surface of the sliding slot 34 has a second rack structure matching the first rack structure 333.
In the embodiment of the present disclosure, the first rack structure 333 protrudes out of the side surface of the second sub-protrusion 332, and the second rack structure matched with the first rack structure 333 is lower than the inner side surface of the sliding slot 34, so that the first protrusion 33 slides forward into the sliding slot 34 without damping through the cooperation of the first rack structure 333 and the second rack structure, but the first protrusion 33 slides backward without damping, so that the fixing member 2 and the bracket body 1 slide into the sliding slot without being blocked and the engagement is stable when engaging.
In some embodiments, each connection structure 3 comprises:
the hanging lug is fixed on the long side and/or the short side of the fixed part 2, and a hanging lug hole is formed in the hanging lug;
and the second protruding part is fixed on the bracket main body 1 and matched with the hanging lug hole, and the hanging lug is hung with the second protruding part through the hanging lug hole.
In the embodiment of the present disclosure, the hanging lug may be fixed to the long side of the fixing member 2, or may be fixed to the short side of the fixing member 2. The hangers are bent towards the direction close to the support main body 1 and are hung with the bulges on the support main body 1 through the hangers holes, so that the fixing part 2 and the support main body 1 are connected.
Wherein, the hangers can include the kink of being connected with fixed part 2 to and be connected with the kink and set up the connecting portion in hangers hole. The bending part can be made of flexible materials, so that the hanging lug can be bent along the direction towards the support main body 1 and can also be bent along the direction far away from the support main body 1. Therefore, when the fixing part 2 is installed on the bracket main body 1, the hanging lug is bent towards the direction close to the bracket main body 1, so that the hanging lug is hung on the second bulge part; when the fixing part 2 is detached from the bracket main body 1, the hanging lug is peeled off from the second protruding part and is bent along the direction far away from the bracket main body 1, so that the difficulty in mounting and detaching the fixing part 2 is reduced.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above description is only for the preferred embodiment of the present disclosure, and is not intended to limit the scope of the present disclosure. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure are included in the scope of protection of the present disclosure.

Claims (7)

1. An IC holder including a mounting side for mounting a semiconductor element product, comprising:
a stent body;
the fixing part is detachably connected with the bracket main body through at least one connecting structure and is positioned on the mounting side of the bracket main body, and the surface of the fixing part, which is far away from the bracket main body, is used for gluing.
2. The IC holder according to claim 1, wherein each of the connection structures comprises:
the buckle is fixed on the fixed part and comprises a connecting block fixedly connected with the fixed part and a clamping piece fixed on the side surface of the connecting block, an included angle is formed between the clamping piece and the side surface of the connecting block, and the opening direction of the included angle faces towards the fixed part;
set up in the support main part and with buckle assorted draw-in groove, the draw-in groove with the buckle joint.
3. The IC holder according to claim 2, wherein the card has a plurality of through holes formed therein.
4. The IC mount of claim 1, wherein the at least one connection structure comprises three connection structures, and the three connection structures are evenly distributed along a long side direction of the fixing member.
5. The IC mount of claim 1, wherein the at least one connection structure comprises:
the first projection part is positioned on the fixed part and comprises a first sub projection part fixedly connected with the fixed part and a second sub projection part fixedly connected with one side, far away from the fixed part, of the first sub projection part, and the orthographic projection of the second sub projection part on a first surface covers the orthographic projection of the first sub projection part on the first surface, and the first surface is the surface, close to the bracket main body, of the fixed part;
the sliding groove is arranged on the support main body and matched with the first protruding part, and the first protruding part is connected with the sliding groove in a sliding mode.
6. The IC holder according to claim 5, wherein the second sub-protrusion has a rectangular parallelepiped shape, and the long side surface of the second sub-protrusion has a first rack structure, and the inner side surface of the slide groove has a second rack structure matching the first rack structure.
7. The IC holder according to claim 1, wherein each of the connection structures comprises:
the hanging lug is fixed on the long side and/or the short side of the fixing part, and a hanging lug hole is formed in the hanging lug;
and the second lug boss is fixed on the bracket main body and matched with the lug hole, and the lug is hung and connected with the second lug boss through the lug hole.
CN202120661512.8U 2021-03-31 2021-03-31 IC support Active CN215335223U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120661512.8U CN215335223U (en) 2021-03-31 2021-03-31 IC support

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120661512.8U CN215335223U (en) 2021-03-31 2021-03-31 IC support

Publications (1)

Publication Number Publication Date
CN215335223U true CN215335223U (en) 2021-12-28

Family

ID=79592098

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202120661512.8U Active CN215335223U (en) 2021-03-31 2021-03-31 IC support

Country Status (1)

Country Link
CN (1) CN215335223U (en)

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