CN215319962U - Heating device of silica gel mould - Google Patents
Heating device of silica gel mould Download PDFInfo
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- CN215319962U CN215319962U CN202120607760.4U CN202120607760U CN215319962U CN 215319962 U CN215319962 U CN 215319962U CN 202120607760 U CN202120607760 U CN 202120607760U CN 215319962 U CN215319962 U CN 215319962U
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Abstract
The utility model belongs to the technical field of silica gel molds for vehicle lamps, and particularly relates to a heating device of a silica gel mold, which comprises a fixed mold heating plate, a fixed mold core, a movable mold core and a movable mold heating plate which are sequentially arranged, wherein a fixed mold heating wire assembly and a fixed mold temperature sensing wire are arranged on one side of the fixed mold heating plate, which is far away from the fixed mold core, and a movable mold heating wire assembly and a movable mold temperature sensing wire are arranged on one side of the movable mold heating plate, which is far away from the movable mold core; the fixed die heating wire assembly comprises a plurality of first heating wires which are sequentially connected in series, the heating power of the corresponding first heating wires is set according to each heating area of the fixed die core, and the fixed die heating wire assembly is wound on the periphery of a fixed die temperature sensing line; the movable mold heating wire assembly comprises a plurality of second heating wires which are sequentially connected in series, the heating power of the corresponding second heating wires is set according to each heating area of the movable mold core, and the movable mold heating wire assembly is wound on the periphery of the movable mold temperature sensing line. Has the advantages that: the heating device adopts the movable mold heating wire component and the fixed mold heating wire component to heat the materials uniformly and stably.
Description
Technical Field
The utility model belongs to the technical field of silica gel molds for vehicle lamps, and particularly relates to a heating device of a silica gel mold.
Background
Silica gel forming and curing are sensitive to curing temperature, the temperature difference of a forming cavity is large, local curing of silica gel is easy to cause to be uneven, and the appearance of the whole product and the improvement of the qualified rate are influenced. The existing silica gel mold uses a heating rod to heat a molding cavity so as to solidify thermosetting silica gel, if the existing silica gel mold is named as a liquid silica gel cold runner mold with the patent number of 2019104950400, the patent specifically discloses that a first heating plate is arranged above a concave template, a second heating plate is arranged below the convex template, the heating rod is embedded on the first heating plate and the second heating plate, but the silica gel mold is limited by the properties of the heating rod, the temperature floating is large when the silica gel mold is heated, the template is heated unevenly, and the silica gel is locally solidified unevenly. Along with the progress of science and technology, the requirement to the processing that becomes more meticulous constantly improves, and the user is more constantly promoted to the requirement for quality of car light, consequently, overcomes the above-mentioned defect of current silica gel mould, and it is the problem that the improvement silica gel mould is the urgent need to solve to the processing quality of car light product.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem of uneven heating of the silica gel mold in the prior art, the utility model provides a heating device of the silica gel mold.
In order to solve the technical problem, the heating device of the silica gel mold comprises a fixed mold heating plate, a fixed mold core, a movable mold core and a movable mold heating plate which are sequentially arranged, wherein a fixed mold heating wire assembly and a fixed mold temperature sensing wire are arranged on one side, away from the fixed mold core, of the fixed mold heating plate, and a movable mold heating wire assembly and a movable mold temperature sensing wire are arranged on one side, away from the movable mold core, of the movable mold heating plate;
the fixed die heating wire assembly comprises a plurality of first heating wires which are sequentially connected in series, the head end and the tail end of the fixed die heating wire assembly are both positioned outside the silica gel mold, the head end and the tail end of the fixed die heating wire assembly are both connected with binding posts, the number of the fixed die heating wires and the number of the fixed die heating wire assembly are relatively arranged and are at least two, at least two groups of the fixed die heating wire assemblies are sequentially arranged on the outer surface of the fixed die heating plate, the heating power of the corresponding first heating wires is set according to each heating region of a fixed die core, and the fixed die heating wire assembly is wound on the periphery of the fixed die heating wires;
the movable mould heater strip subassembly is including a plurality of second heater strips of establishing ties in proper order, the head end and the tail end of movable mould heater strip subassembly all are located the outside of silica gel mould, movable mould heater strip subassembly's head end and tail end also all are connected with the terminal, the quantity of movable mould heater strip subassembly and the quantity of movable mould temperature sensing line set up relatively and all be two sets of at least, at least two sets of movable mould heater strip subassembly sets gradually at the surface of movable mould heater strip, sets for the heating power of the second heater strip that corresponds according to each heating region of movable mould benevolence, movable mould heater strip subassembly is around establishing the periphery in movable mould temperature sensing line.
As preferred, the mould steel is all selected for use to the material of cover half hot plate, cover half benevolence, movable mould benevolence and movable mould hot plate, all inlay in cover half hot plate and the movable mould hot plate and be equipped with the brass board, the brass board and the laminating of cover half benevolence setting of cover half hot plate, the brass board and the laminating of movable mould benevolence setting of movable mould hot plate. The brass plate has small high-temperature deformation resistance and good heat conduction effect, effectively prevents heat radiation from dissipating and influencing the heating efficiency, ensures the contact between the brass plate and the mold core by the embedded arrangement of the brass plate, effectively prevents the deformation of the brass plate, and improves the reliability and the high efficiency of the heating device.
Preferably, the heating device further comprises a fixed die heat insulation plate and a movable die heat insulation plate, wherein the fixed die heat insulation plate, the fixed die heating plate, the fixed die core, the movable die heating plate and the movable die heat insulation plate are sequentially arranged. The fixed die heat insulation plate and the movable die heat insulation plate bear pressure and resist high temperature, heat loss caused by heat radiation is prevented, heating efficiency is reduced, and reliability and high efficiency of the heating device are further improved.
Furthermore, the bending angles of the bending parts of the fixed die heating wire assembly and the movable die heating wire assembly are both more than or equal to 90 degrees. Effectively prevent cover half heater strip subassembly and movable mould heater strip subassembly from damaging, improve this heating device's life.
Has the advantages that: according to the heating device of the silica gel mold, the heating power of the corresponding first heating wire is firstly set according to each heating area of the fixed mold core, and the heating power of the corresponding second heating wire is set according to each heating area of the movable mold core, so that the heating in different areas is realized, and the heat uniformity of the whole mold core is ensured; when the heating device is used, each first heating wire uniformly heats the fixed mold heating plate, each second heating wire uniformly heats the movable mold heating plate, the fixed mold heating plate uniformly heats the fixed mold core through heat conduction, and the movable mold heating plate uniformly heats the movable mold core through heat conduction until the fixed mold core and the movable mold core are heated to a set temperature and kept; the heating temperature of the movable mold heating wire assembly and the fixed mold heating wire assembly is uniform and stable, and the mold testing temperature standard can be reached in a short time, so that the working time is greatly shortened; the Ansys heat simulation is adopted to obtain that the temperature difference of each heating area of the fixed die core and the movable die core is very small and controllable, and the quality of the silica gel product produced by the heating device is greatly improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic perspective view of a heating apparatus for a silicone mold according to embodiment 1 of the present invention;
FIG. 2 is a schematic side view of a fixed mold heating plate of embodiment 1 of the heating apparatus for a silica gel mold of the present invention;
FIG. 3 is a schematic side view of a movable mold heating plate of embodiment 1 of the heating apparatus for a silicone mold of the present invention;
fig. 4 is a schematic view of a thermal simulation analysis of the cavity insert of embodiment 1 of the heating apparatus of a silicone mold according to the present invention;
FIG. 5 is a schematic sectional view of a fixed mold heating plate of example 2 of the heating apparatus for a silica gel mold of the present invention;
FIG. 6 is a schematic perspective view of embodiment 2 of the heating apparatus for a silicone mold according to the present invention;
in the figure: 1. the heating device comprises a fixed die heating plate, 2 a fixed die core, 3 a movable die core, 4 a movable die heating plate, 5 a fixed die heating wire component, 5-1 a first heating wire, 6 a fixed die temperature sensing wire, 7 a movable die heating wire component, 7-1 a second heating wire, 8 a movable die temperature sensing wire, 9 a brass plate, 10 a fixed die heat insulation plate, 11 a movable die heat insulation plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the utility model, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
As shown in figures 1-4, a heating device of a silica gel mold comprises a fixed mold heating plate 1, a fixed mold core 2, a movable mold core 3 and a movable mold heating plate 4 which are sequentially arranged, wherein the fixed mold heating plate 1, the fixed mold core 2, the movable mold core 3 and the movable mold heating plate 4 are made of corrosion-resistant mold steel, a fixed mold heating wire assembly 5 and a fixed mold temperature sensing wire 6 are arranged on one side, away from the fixed mold core 2, of the fixed mold heating plate 1, a fixed mold wire groove for arranging the fixed mold heating wire assembly 5 and the fixed mold temperature sensing wire 6 is formed in the fixed mold heating plate 1, the bending angles of the bending part of the fixed mold heating wire assembly 5 are all larger than or equal to 90 degrees, the fixed mold heating wire assembly 5 comprises a plurality of first heating wires 5-1 which are sequentially connected in series, the head end and the tail end of the fixed mold heating wire assembly 5 are both located outside the silica gel mold, and the head end and the tail end of the fixed mold heating wire assembly 5 are both connected with binding posts, the number of the fixed die temperature sensing lines 6 and the number of the fixed die heating wire assemblies 5 are opposite and are two groups, the two groups of fixed die heating wire assemblies 5 are sequentially arranged on the outer surface of the fixed die heating plate 1, the heating power of corresponding first heating wires 5-1 is set according to each heating region of the fixed die core 2, and the fixed die heating wire assemblies 5 are wound on the periphery of the fixed die temperature sensing lines 6;
one side of the movable mold heating plate 4, which is far away from the movable mold core 3, is provided with a movable mold heating wire assembly 7 and a movable mold temperature sensing wire 8, the movable mold heating plate 4 is provided with movable mold wire grooves for arranging the movable mold heating wire assembly 7 and the movable mold temperature sensing wire 8, the bending angles of the bending parts of the movable mold heating wire assembly 7 are both more than or equal to 90 degrees, the movable mold heating wire assembly 7 comprises a plurality of second heating wires 7-1 which are sequentially connected in series, the head end and the tail end of the movable mold heating wire assembly 7 are both positioned outside the silica gel mold, the head end and the tail end of the movable mold heating wire assembly 7 are both connected with binding posts, the number of the movable mold heating wire assemblies 7 and the number of the movable mold temperature sensing wires 8 are oppositely arranged and are two groups, the two groups of movable mold heating wire assemblies 7 are sequentially arranged on the outer surface of the movable mold heating plate 4, and the heating power of the corresponding second heating wires 7-1 is set according to each heating region of the movable mold core 3, the movable mold heating wire component 7 is wound on the periphery of the movable mold temperature sensing wire 8.
In this embodiment, the first heating wire 5-1 and the second heating wire 7-1 are both made of MFHTSH66S540 or MFHTSH66S560 provided by lautakawa and suzhou hot runner system limited, the main heating source is a heating wire, and the heating powers of the moving mold heating wire assembly 7 and the fixed mold heating wire assembly 5 are simulated according to Ansys heat to select heating wires with different heating powers in different heating regions, i.e., heating in different regions, so as to ensure the heat uniformity of the entire mold insert (the fixed mold insert 2 and the moving mold insert 3); in the embodiment, the fixed mold temperature sensing line 6 and the movable mold temperature sensing line 8 are both made of FTSJT120151 type temperature sensing lines provided by lautakan and suzhou hot runner system ltd, and are used in cooperation with heating wires.
The working principle is as follows:
firstly, setting the heating power of a corresponding first heating wire 5-1 according to each heating area of the fixed die core 2, and setting the heating power of a corresponding second heating wire 7-1 according to each heating area of the movable die core 3, namely realizing regional heating so as to ensure the heat uniformity of the whole die core (the fixed die core 2 and the movable die core 3); when the heating device is used, the fixed die heating plate 1 is uniformly heated by the first heating wires 5-1, the movable die heating plate 4 is uniformly heated by the second heating wires 7-1, the fixed die heating plate 1 uniformly heats the fixed die core 2 through heat conduction, and the movable die heating plate 4 uniformly heats the movable die core 3 through heat conduction until the fixed die core 2 and the movable die core 3 are heated to a set temperature and kept; the heating temperature of the movable mold heating wire assembly 7 and the fixed mold heating wire assembly 5 is uniform and stable, and the mold testing temperature standard can be reached in a short time, so that the working time is greatly shortened; as shown in fig. 4, the Ansys heat simulation is adopted to obtain that the temperature difference between the heating regions of the cavity block 2 and the cavity block 3 is very small and controllable, so that the quality of the silica gel product produced by the heating device is greatly improved.
Example 2
As shown in fig. 5 and 6, in this embodiment, the difference from embodiment 1 is that the brass plate 9 is embedded in the fixed die heating plate 1 and the movable die heating plate 4, the brass plate 9 of the fixed die heating plate 1 is attached to the fixed die core 2, the brass plate 9 of the movable die heating plate 4 is attached to the movable die core 3, the brass plate 9 has small high temperature deformation resistance and good heat conduction effect, and the heating efficiency is effectively prevented from being affected by the radiation loss of heat, the brass plate 9 is embedded to ensure that the brass plate 9 is in contact with the die core, and the brass plate 9 is effectively prevented from being deformed, so that the reliability and the efficiency of the heating device are improved.
This heating device still includes cover half heat insulating board 10 and movable mould heat insulating board 11, cover half heat insulating board 10, cover half hot plate 1, cover half benevolence 2, movable mould benevolence 3, movable mould hot plate 4 and movable mould heat insulating board 11 set gradually, and cover half heat insulating board 10 and 11 bearing high temperature resistant of movable mould heat insulating board prevent to cause the heat to scatter and disappear because of the thermal radiation, reduce heating efficiency, further improve this heating device's reliability and high efficiency. The fixed mold heat-insulating plate 10 and the movable mold heat-insulating plate 11 of the embodiment both adopt high-strength heat-insulating plates provided by the precision mechanical trade company Limited in Misimo (China), the model number is HIPLA-360-10, the pressure of the heat-insulating plates is more than 200PMPa, and the heat-insulating plates can resist the temperature of more than 350 ℃.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.
Claims (4)
1. The utility model provides a heating device of silica gel mould which characterized in that: the heating device comprises a fixed die heating plate (1), a fixed die core (2), a movable die core (3) and a movable die heating plate (4) which are sequentially arranged, wherein a fixed die heating wire component (5) and a fixed die temperature sensing wire (6) are arranged on one side, away from the fixed die core (2), of the fixed die heating plate (1), and a movable die heating wire component (7) and a movable die temperature sensing wire (8) are arranged on one side, away from the movable die core (3), of the movable die heating plate (4);
the fixed die heating wire assembly (5) comprises a plurality of first heating wires (5-1) which are sequentially connected in series, the head end and the tail end of the fixed die heating wire assembly (5) are located outside the silica gel mold, the head end and the tail end of the fixed die heating wire assembly (5) are connected with binding posts, the number of the fixed die heating wires (6) and the number of the fixed die heating wire assemblies (5) are relatively arranged and are at least two, at least two groups of the fixed die heating wire assemblies (5) are sequentially arranged on the outer surface of the fixed die heating plate (1), the heating power of the corresponding first heating wires (5-1) is set according to each heating region of a fixed die core (2), and the fixed die heating wire assemblies (5) are wound on the periphery of the fixed die heating wires (6);
movable mould heater strip subassembly (7) are including a plurality of second heater strips (7-1) of establishing ties in proper order, the head end and the tail end of movable mould heater strip subassembly (7) all are located the outside of silica gel mould, the head end and the tail end of movable mould heater strip subassembly (7) also all are connected with the terminal, the quantity of movable mould heater strip subassembly (7) and the quantity of movable mould temperature sensing line (8) set up relatively and all be two sets of, at least two sets of movable mould heater strip subassembly (7) set gradually at the surface of movable mould heater strip (4), set for the heating power of the second heater strip (7-1) that corresponds according to each heating region of movable mould benevolence (3), movable mould heater strip subassembly (7) are around establishing the periphery in movable mould temperature sensing line (8).
2. The heating device of a silicone mold according to claim 1, characterized in that: the mould steel is all selected for use to the material of cover half hot plate (1), cover half benevolence (2), movable mould benevolence (3) and movable mould hot plate (4), all inlay in cover half hot plate (1) and movable mould hot plate (4) and be equipped with brass plate (9), brass plate (9) and the laminating setting of cover half benevolence (2) of cover half hot plate (1), brass plate (9) and movable mould benevolence (3) laminating setting of movable mould hot plate (4).
3. The heating device of a silicone mold according to claim 1 or 2, characterized in that: the heating device further comprises a fixed die heat insulation plate (10) and a movable die heat insulation plate (11), wherein the fixed die heat insulation plate (10), the fixed die heating plate (1), the fixed die core (2), the movable die core (3), the movable die heating plate (4) and the movable die heat insulation plate (11) are sequentially arranged.
4. The heating device of a silicone mold according to claim 1 or 2, characterized in that: the bending angles of the bending parts of the fixed die heating wire component (5) and the movable die heating wire component (7) are both more than or equal to 90 degrees.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120607760.4U CN215319962U (en) | 2021-03-25 | 2021-03-25 | Heating device of silica gel mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120607760.4U CN215319962U (en) | 2021-03-25 | 2021-03-25 | Heating device of silica gel mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215319962U true CN215319962U (en) | 2021-12-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120607760.4U Active CN215319962U (en) | 2021-03-25 | 2021-03-25 | Heating device of silica gel mould |
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|---|---|
| CN (1) | CN215319962U (en) |
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2021
- 2021-03-25 CN CN202120607760.4U patent/CN215319962U/en active Active
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