CN215318027U

CN215318027U - Novel wafer adsorption pad

Info

Publication number: CN215318027U
Application number: CN202121507132.5U
Authority: CN
Inventors: 王璇
Original assignee: Tianjin Weike Photoelectric Technology Co ltd
Current assignee: Tianjin Weike Photoelectric Technology Co ltd
Priority date: 2021-07-05
Filing date: 2021-07-05
Publication date: 2021-12-28
Anticipated expiration: 2031-07-05

Abstract

The utility model relates to the technical field of wafer adsorption pads, and discloses a novel wafer adsorption pad, wherein an adsorption pad body is of a double-layer structure, an outer layer is an adsorption pad body, an inner layer is an adsorption foaming layer, the inner layer and the outer layer are closely connected in an attaching manner, a taking and placing notch is formed in the top end of the adsorption pad body, a cover plate is additionally arranged on the taking and placing notch, a limiting hole is formed in the connecting position of the taking and placing notch and the cover plate, a limiting rod is inserted in the limiting hole, a first groove is formed in the surface of the adsorption pad body, a second groove is additionally arranged in the first groove, taking and placing grooves are respectively formed in two sides of the top of an inner cavity of the adsorption pad body, the taking and placing grooves are vertically arranged in the adsorption pad body, the bottom of the taking and placing grooves is of an oval structure and are 3-9 groups, the distance between the adjacent taking and placing grooves is consistent, and a vibration damping connecting rod is transversely additionally arranged between the adjacent taking and placing grooves, and clamping devices are fixedly additionally arranged on the upper parts of the inner walls of the two sides of the auxiliary cushion body.

Description

Novel wafer adsorption pad

Technical Field

The utility model relates to the technical field of wafer adsorption pads, in particular to a novel wafer adsorption pad.

Background

With the development of semiconductor technology, the quality of the substrate surface is required to be higher and higher. Both human and automated operations involve 2 actions for substrate polishing, namely the taking and placing of substrate pieces.

The inside clamping and vibration damping structure that does not generally have of common wafer absorption pad leads to absorbing wafer back poor stability, and the wafer collides mutually under the condition of vibration, can not satisfy the work requirement that the wafer adsorbs the pad, provides a novel wafer and adsorbs the pad for this.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Aiming at the defects of the prior art, the utility model provides a novel wafer adsorption pad which has the advantages of stable clamping and vibration reduction structures and the like, and solves the problems that the stability is poor after wafers are adsorbed and the wafers collide with each other under the vibration condition and the working requirements of the wafer adsorption pad cannot be met because the conventional wafer adsorption pad does not have the clamping and vibration reduction structures inside.

(II) technical scheme

In order to achieve the purposes of clamping and damping, the utility model provides the following technical scheme: the utility model provides a novel wafer adsorption pad including adsorbing the pad body, the top of adsorbing the pad body has been seted up and has been got and put the notch, get the top of putting the notch and have been equipped with the apron, get the junction of putting notch and apron and seted up spacing hole, the inside of spacing hole is pegged graft and is had the gag lever post, first recess has been seted up on the surface of adsorbing the pad body, the inside of first recess adds and is equipped with the second recess, the inner chamber top both sides of adsorbing the pad body have all been seted up and have been got the groove of putting, adjacent getting transversely to add between the groove and be equipped with the damping connecting rod, the both sides inner wall upper portion of adsorbing the pad body is all fixed to be equipped with clamping device

Preferably, the adsorption pad body is of a double-layer structure, the outer layer is the adsorption pad body, the inner layer is an adsorption foaming layer, and the inner layer and the outer layer are attached to each other to form tight connection.

Preferably, the taking and placing grooves are vertically arranged inside the adsorption pad body, the bottom of the absorption pad body is of an oval structure, the number of the taking and placing grooves is 3-9, and the distance between every two adjacent taking and placing grooves is consistent.

Preferably, the vibration reduction connecting rods are 2-8 groups, and vibration reduction springs are additionally arranged inside the vibration reduction connecting rods.

Preferably, the fixed slot is installed in clamping device's the outside, the inner chamber of fixed slot adds and is equipped with the spring, and the one end of spring is connected with the inner wall of fixed slot, the right side inner wall upper portion and the lower part of fixed slot all add and are equipped with the stopper, the other end of spring is connected with the clamp plate, the one end fixedly connected with movable rod of clamp plate, one side of movable rod is fixed to be equipped with the extrusion concave head.

(III) advantageous effects

Compared with the prior art, the utility model provides a novel wafer adsorption pad, which has the following beneficial effects:

1. according to the novel wafer adsorption pad, the wafers can be limited in the taking and placing groove by the installed cover plate, the wafers are prevented from falling out of the taking and placing groove in the movement process, dust foreign matters can be effectively prevented from entering the taking and placing groove after the cover plate covers the opening of the taking and placing groove, the taking and placing groove is vertically installed, the wafers are convenient to place, the wafers are easy to store and take, the time is greatly saved, the working efficiency is improved, the safety and the cleaning degree of the wafers are guaranteed, and the working efficiency is improved for subsequent work;

2. this neotype wafer adsorbs pad, the clamping device of installation can press from both sides the wafer of getting to put inslot portion tightly, prevents that the wafer from because of motion process bumps and vibration, great improvement the security and the stability that the wafer was deposited for can not appear the wafer because of the emergence of collision damage accident appears, the damping connecting rod of installation can effectually prevent to get the vibration of putting groove and inside wafer, damping connecting rod inside adds to be established has damping spring, can fall to the vibration to minimum.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the top end of the absorbent pad of the present invention;

FIG. 3 is a schematic view of the internal structure of the adsorption pad of the present invention;

FIG. 4 is an enlarged schematic view of the structure at A of the present invention.

In the figure: 1. an adsorption pad body; 2. a notch is taken and placed; 3. a cover plate; 4. a limiting hole; 5. a limiting rod; 6. A first groove; 7. a second groove; 8. a taking and placing groove; 9. a vibration damping connecting rod; 10. a clamping device; 11. An adsorption foaming layer; 12. a damping spring; 13. fixing grooves; 14. a spring; 15. a limiting block; 16. pressing a plate; 17. a movable rod; 18. the female head is pressed.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a novel wafer adsorption pad, comprising an adsorption pad body 1, a pick-and-place notch 2, a cover plate 3, a limiting hole 4, a limiting rod 5, a first groove 6, a second groove 7, a pick-and-place groove 8, a vibration damping connecting rod 9, a clamping device 10, an adsorption foam layer 11, a vibration damping spring 12, a fixing groove 13, a spring 14, a limiting block 15, a pressing plate 16, a movable rod 17 and an extrusion concave head 18, wherein the adsorption pad body 1 is a double-layer structure, the outer layer is the adsorption pad body 1, the inner layer is the adsorption foam layer 11, the inner layer and the outer layer are closely connected in an adhering manner, the adsorption foam layer 11 has a buffering elastic effect, the pick-and-place notch 2 is formed at the top end of the adsorption pad body 1, the cover plate 3 is additionally arranged on the pick-and-place notch 2, the connecting position of the pick-and-place notch 2 and the cover plate 3 is provided with the limiting hole 4, the limiting rod 5 is inserted inside the limiting hole 4, the wafer cleaning device has the advantages that the entering of dust and foreign matters can be effectively prevented, the cleanliness of wafers can be kept, the surface of the adsorption pad body 1 is provided with a first groove 6, a second groove 7 is additionally arranged in the first groove 6, the polishing flexibility of the wafers can be reduced by the first groove 6 and the second groove 7, both sides of the top of an inner cavity of the adsorption pad body 1 are provided with taking and placing grooves 8, the taking and placing grooves 8 are vertically arranged in the adsorption pad body 1, the bottom of the inner cavity is of an oval structure, the wafers can be conveniently stored, the taking and placing grooves 8 are 3-9 groups, the distance between every two adjacent taking and placing grooves 8 is consistent, a vibration reduction connecting rod 9 is transversely additionally arranged between every two adjacent taking and placing grooves 8, the vibration of the taking and placing grooves 8 can be effectively reduced, the vibration reduction connecting rod 9 is 2-8 groups, the vibration reduction spring 12 is additionally arranged in the vibration reduction connecting rod 9, the swinging of the wafers inside can be reduced, and the wafers cannot be broken due to swinging, the fixed clamping device 10 that is equipped with that adds in both sides inner wall upper portion of adsorbing pad body 1, fixed slot 13 is installed in clamping device 10's the outside, the inner chamber of fixed slot 13 adds and is equipped with spring 14, and spring 14's one end is connected with the inner wall of fixed slot 13, the right side inner wall upper portion and the lower part of fixed slot 13 all add and are equipped with stopper 15, spring 14's the other end is connected with clamp plate 16, the one end fixedly connected with movable rod 17 of clamp plate 16, one side of movable rod 17 is fixed to be equipped with extrusion concave head 18.

The working principle of the device is as follows: extracting the gag lever post 5 from spacing hole 4 inside, open apron 3 and put into the inside of putting groove 8 with the wafer, close apron 3 and reinsert gag lever post 5, it will get to put between the groove 8 to get damping connecting rod 9 of installation between the groove 8 fixed, damping connecting rod 9 is inside to add damping spring 12 of establishing and to fall to minimum with the vibration of adsorption pad body 1, spring 14 inside clamping device 10 extrudes the back to clamp plate 16, drive movable rod 17 after the motion of clamp plate 16, movable rod 17 drives extrusion concave head forward motion, it is fixed to get groove 8 to put, prevent that the wafer from colliding and vibrating because of the motion process, great improvement the security and the stability that the wafer was deposited, make the emergence that the damage accident appears because of the collision can not appear in the wafer.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a novel wafer adsorption pad, includes adsorption pad body (1), its characterized in that: the top of the adsorption pad body (1) is provided with a pick-and-place notch (2), the pick-and-place notch (2) is provided with a cover plate (3), a connecting part of the pick-and-place notch (2) and the cover plate (3) is provided with a limiting hole (4), the limiting rod (5) is inserted in the limiting hole (4), a first groove (6) is formed in the surface of the adsorption pad body (1), a second groove (7) is formed in the inside of the first groove (6), pick-and-place grooves (8) are formed in both sides of the top of an inner cavity of the adsorption pad body (1), vibration reduction connecting rods (9) are transversely additionally arranged between the adjacent pick-and-place grooves (8), and clamping devices (10) are fixedly additionally arranged on the upper portions of inner walls of the two sides of the adsorption pad body (1).

2. The novel wafer suction pad as set forth in claim 1, wherein: the adsorption pad body (1) is of a double-layer structure, the outer layer is the adsorption pad body (1), the inner layer is an adsorption foaming layer (11), and the inner layer and the outer layer are attached to each other to form tight connection.

3. The novel wafer suction pad as set forth in claim 1, wherein: the picking and placing grooves (8) are vertically arranged inside the adsorption pad body (1), the bottom of the picking and placing groove is of an oval structure, the picking and placing grooves (8) are 3-9 groups, and the distance between every two adjacent picking and placing grooves (8) is consistent.

4. The novel wafer suction pad as set forth in claim 1, wherein: the vibration reduction connecting rods (9) are 2-8 groups, and vibration reduction springs (12) are additionally arranged inside the vibration reduction connecting rods (9).

5. The novel wafer suction pad as set forth in claim 1, wherein: fixed slot (13) are installed in the outside of clamping device (10), the inner chamber of fixed slot (13) adds and is equipped with spring (14), and the one end of spring (14) is connected with the inner wall of fixed slot (13), the right side inner wall upper portion and the lower part of fixed slot (13) all add and are equipped with stopper (15), the other end of spring (14) is connected with clamp plate (16), the one end fixedly connected with movable rod (17) of clamp plate (16), the fixed concave head (18) of extrusion that adds of one end of movable rod (17).