CN215315314U - Bending mechanism of semiconductor triode pin bending machine - Google Patents
Bending mechanism of semiconductor triode pin bending machine Download PDFInfo
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- CN215315314U CN215315314U CN202120566844.8U CN202120566844U CN215315314U CN 215315314 U CN215315314 U CN 215315314U CN 202120566844 U CN202120566844 U CN 202120566844U CN 215315314 U CN215315314 U CN 215315314U
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- 238000005452 bending Methods 0.000 title claims abstract description 63
- 230000007246 mechanism Effects 0.000 title claims abstract description 21
- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 230000009471 action Effects 0.000 claims abstract description 18
- 238000001125 extrusion Methods 0.000 claims description 81
- 238000009434 installation Methods 0.000 claims description 5
- 230000006378 damage Effects 0.000 abstract description 3
- 230000005540 biological transmission Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 208000027418 Wounds and injury Diseases 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 208000014674 injury Diseases 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
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Abstract
The utility model provides a bending mechanism of a semiconductor triode pin bending machine, which comprises: a turntable assembly and an action assembly; the turntable assembly is used for conveying the triode and matching with the action assembly to bend a base B, a collector C and an emitter E of the triode, the turntable assembly comprises a turntable, a plurality of bending grooves are formed in the turntable in an annular array, and the bending grooves are respectively matched with the base B, the collector C and the emitter E of the triode; the action assembly is used for bending a base electrode B, a collector electrode C and an emitter electrode E of the triode. According to the bending mechanism of the semiconductor triode pin bending machine, the turntable assembly and the action mechanism are arranged, so that the transmission of the triode and the bending of the base B, the collector C and the emitter E of the triode are realized, the damage to the triode is reduced, and the yield of the bent triode is improved.
Description
Technical Field
The utility model relates to the technical field of semiconductors, in particular to a bending mechanism of a semiconductor triode pin bending machine.
Background
The triode is a semiconductor device for controlling current, can amplify a weak signal into an electric signal with a larger amplitude, thereby becoming a core element of an electronic circuit, has the advantages of small volume, firm structure, long service life, power saving and the like which are irreplaceable to other electronic devices, is widely applied to various fields at present, from electronic toys for children to large-scale display equipment, plays a great role on a circuit board, and is produced in large scale along with the large-scale application of the triode.
Three pin of triode is base B respectively, collecting electrode C and projecting electrode E, some electronic equipment are inside for convenient installation, the base B that generally all can say the triode, collecting electrode C and projecting electrode E bend, this process need use the bender, there is a problem in present bender most of, be exactly to base B, collecting electrode C and projecting electrode E when bending, extrusion structure is to base B, collecting electrode C and projecting electrode E cause tensile, make base B, collecting electrode C and projecting electrode E and triode have the trend of separation, thereby reduce the yields of the triode after bending.
Therefore, it is necessary to provide a bending mechanism of a semiconductor triode pin bending machine to solve the above technical problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a bending mechanism of a semiconductor triode pin bending machine.
In order to solve the technical problem, the bending mechanism of the semiconductor triode pin bending machine provided by the utility model comprises: a turntable assembly and an action assembly; the turntable assembly is used for conveying the triode and matching with the action assembly to bend a base B, a collector C and an emitter E of the triode, the turntable assembly comprises a turntable, a plurality of bending grooves are formed in the turntable in an annular array, and the bending grooves are respectively matched with the base B, the collector C and the emitter E of the triode; the action assembly is used for bending a base B, a collector C and an emitter E of the triode, the action assembly comprises an air cylinder and an upper extrusion block, three lower extrusion blocks are arranged below the upper extrusion block, the three lower extrusion blocks are all in contact with the upper extrusion block, three elastic structures are arranged on the upper extrusion block, and the three elastic structures are respectively connected with the corresponding lower extrusion blocks.
Preferably, the elastic structure includes a mounting cavity, the mounting cavity is provided on the upper extrusion block, a baffle is slidably mounted in the mounting cavity, a connecting rod is fixedly mounted at the bottom of the baffle, the bottom end of the connecting rod extends to the lower side of the upper extrusion block, a first helical spring is sleeved on the connecting rod, two ends of the first helical spring are respectively in contact with the bottom of the mounting cavity and the bottom of the baffle, a T-shaped groove is provided at the top of the lower extrusion block, a moving block is slidably mounted in the T-shaped groove, and the bottom end of the connecting rod extends to the inside of the T-shaped groove and is fixedly connected with the moving block.
Preferably, a support plate is fixedly mounted on an output shaft of the cylinder, a limiting rod is fixedly mounted on one side of the upper extrusion block, the limiting rod penetrates through the support plate and is in sliding connection with the support plate, a second spiral spring is sleeved on the limiting rod, and two ends of the second spiral spring are fixedly connected with the upper extrusion block and the support plate respectively.
Preferably, one side of each of the three lower extrusion blocks is fixedly provided with the same connecting plate, an output shaft of the air cylinder is rotatably provided with an idler wheel, and the idler wheel is in contact with the connecting plate.
Preferably, an arc-shaped chamfer is arranged on one corner of each of the three lower extrusion blocks.
Preferably, three pressing plates are arranged on one side of the upper extrusion block, and the three pressing plates and the upper extrusion block are of an integrally formed structure.
Compared with the prior art, the bending mechanism of the semiconductor triode pin bending machine provided by the utility model has the following beneficial effects:
(1) through setting up carousel subassembly and actuating mechanism, realized the transport of triode and the bending of base B, collecting electrode C and the projecting pole E of triode, and reduced the injury to the triode, improved the yields of the triode of bending back.
(2) Through setting up elastic structure for horizontal and decurrent displacement can be realized to the extrusion piece down, thereby accomplishes and bends base B, collecting electrode C and the projecting electrode E of triode, can avoid base B, collecting electrode C and the projecting electrode E downstream of triode simultaneously.
(3) Through setting up extrusion piece, gag lever post and second coil spring for three down the extrusion piece is when bending the base B, collecting electrode C and the projecting pole E of triode, and the base B, collecting electrode C and the projecting pole E of triode can reduce the trend of downstream as far as possible, thereby can play further protection to the triode.
(4) Through setting up connecting plate and gyro wheel for three extrusion piece down can realize horizontal and the downward movement trend, can also make three extrusion piece down have enough promotion and bend base B, collecting electrode C and the projecting pole E of triode simultaneously.
(5) And one corner of the lower extrusion block is provided with an arc chamfer, so that the base B, the collector C and the emitter E of the triode have certain buffering when being bent, and the base B, the collector C and the emitter E of the triode are prevented from being broken and damaged or broken.
(6) The three pressing plates and the upper extrusion block are integrally formed, so that the service life of the extrusion die can be longer.
Drawings
Fig. 1 is a schematic front sectional structural view of a bending mechanism of a semiconductor triode pin bending machine according to the present invention;
FIG. 2 is an enlarged view of portion A of FIG. 1;
FIG. 3 is an enlarged view of portion B of FIG. 2;
fig. 4 is a schematic structural diagram of a turntable in the bending mechanism of the semiconductor triode pin bending machine shown in fig. 1;
fig. 5 is a schematic structural diagram of an upper extrusion block, a lower extrusion block and a connection plate in the bending mechanism of the semiconductor triode pin bending machine shown in fig. 1.
Reference numbers in the figures: 1. the device comprises a turntable assembly, 11, a turntable, 12, a bending groove, 2, an action assembly, 201, an air cylinder, 202, an upper extrusion block, 203, a lower extrusion block, 204, a connecting plate, 205, a mounting cavity, 206, a baffle plate, 207, a connecting rod, 208, a first spiral spring, 209, a T-shaped groove, 210, a moving block, 211, a supporting plate, 212, a limiting rod, 213, a second spiral spring, 214 and a roller.
Detailed Description
The utility model is further described with reference to the following figures and embodiments.
As shown in fig. 1, the bending mechanism of the semiconductor triode pin bending machine comprises: a turntable assembly 1 and an action assembly 2.
As shown in fig. 2, the turntable assembly 1 is used for conveying triodes and the matching action assembly 2 to bend the base B, the collector C and the emitter E of the triodes, the turntable assembly comprises a turntable 11, a plurality of bending grooves 12 are formed in the edge of the turntable 11, the bending grooves 12 are respectively matched with the base B, the collector C and the emitter E of the triodes, under the condition that the bending machine normally works, the base B, the collector C and the emitter E of the triodes are respectively located in the corresponding bending grooves 12, and meanwhile, the turntable 11 rotates to convey the triodes.
As shown in fig. 2, the actuating assembly 2 is used for bending a base B, a collector C and an emitter E of a triode, the actuating assembly includes a cylinder 201 and an upper extrusion block 202, three lower extrusion blocks 203 are arranged below the upper extrusion block 202, the three lower extrusion blocks 203 are all in contact with the upper extrusion block 202, three elastic structures are arranged on the upper extrusion block 202, the three elastic structures are respectively connected with the corresponding lower extrusion blocks 203, when the base B, the collector C and the emitter E of the triode are bent, the cylinder 201 can make the upper extrusion block 202 and the three lower extrusion blocks 203 move, the upper extrusion block 202 and the three lower extrusion blocks respectively connect with the base B, the collector C and the emitter E of the triode, at this time, the upper extrusion block 202 can fix the base B, the collector C and the emitter E of the triode first, and the three lower extrusion blocks 203 continue to move, thereby realize bending base B, collecting electrode C and the projecting pole E of triode, simultaneously, under the effect of elastic construction, lower extrusion piece 203 can the downstream at the in-process of the action of accomplishing to bend, just so can avoid pulling base B, collecting electrode C and the projecting pole E of triode downwards to reduce the injury to the triode, improve the yields of the triode of bending back.
As shown in fig. 3, the elastic structure includes a mounting cavity 205, the mounting cavity 205 is opened on the upper extrusion block 202, a baffle 206 is slidably mounted in the mounting cavity 205, a connecting rod 207 is fixedly mounted at the bottom of the baffle 206, the bottom end of the connecting rod 207 extends to the lower side of the upper extrusion block 202, a first coil spring 208 is sleeved on the connecting rod 207, two ends of the first coil spring are respectively contacted with the bottom of the mounting cavity 205 and the bottom of the baffle 206, a T-shaped groove 209 is formed at the top of the lower extrusion block 203, a moving block 210 is slidably mounted in the T-shaped groove 209, the bottom end of the connecting rod 207 extends into the T-shaped groove 209 and is fixedly connected with the moving block 210, when the three lower extrusion blocks 203 are respectively contacted with the base B, the collector C and the emitter E of the triode, the moving direction of the lower extrusion block 203 can be divided into a lateral movement and a downward movement, the actual movement is obliquely downward movement, and the movement process is as follows: three lower extrusion piece 203 removes, under the effect of the base B of triode, collector C and the effect of projecting pole E resistance, make lower extrusion piece 203 remove downwards, lower extrusion piece 203 drives movable block 210 through T-slot 209 and removes downwards, movable block 210 removes downwards and drives connecting rod 207 and remove downwards, connecting rod 207 drives baffle 206 and removes the first coil spring 208 of compression, and simultaneously, lower extrusion piece 203 lateral shifting, make movable block 210 change in the position of T-slot 209, three lower extrusion piece 203 just can be respectively to the base B of triode like this, collector C and projecting pole E bend, can avoid the base B of triode simultaneously, collector C and projecting pole E remove downwards.
As shown in fig. 2, a support plate 211 is fixedly mounted on an output shaft of the cylinder 201, a limit rod 212 is fixedly mounted on one side of the upper extrusion block 202, the limit rod 212 penetrates through the support plate 211 and is slidably connected with the support plate 211, a second coil spring 213 is sleeved on the limit rod 212, two ends of the second coil spring 213 are respectively fixedly connected with the upper extrusion block 202 and the support plate 211, when the upper extrusion block 202 is in contact with a base B, a collector C and an emitter E of the triode, the cylinder 201 is still in a moving state, so that the support plate 211 is moved, the support plate 211 is moved to compress the second coil spring 213, the second coil spring 213 is contracted, the pressure on the upper extrusion block 202 is gradually increased, and thus the extrusion forces of the upper extrusion block 202 on the base B, the collector C and the emitter E of the triode are gradually increased, so that the base B, the collector C and the emitter E of the triode are gradually increased, Collector C and emitter E are fixed more firm, can adapt to three extrusion piece 203 down like this for three extrusion piece 203 is when bending base B, collector C and emitter E to the triode down, and the base B, collector C and the emitter E of triode can reduce the trend of downward movement as far as possible, thereby can play further protection to the triode.
As shown in fig. 2, one side of each of the three lower squeezing blocks 203 is fixedly provided with the same connecting plate 204, an output shaft of the cylinder 201 is rotatably provided with a roller 214, the roller 214 is in contact with the connecting plate 204, the roller 214 can move under the action of the cylinder 201, the roller 214 can push the connecting plate 204 to move, so that the three lower squeezing blocks 203 move, and meanwhile, the three lower squeezing blocks 203 have downward movement displacement when being bent, so that the connecting plate 204 moves downward, at this time, under the action of the roller 214, the three lower squeezing blocks 203 can realize the lateral and downward movement trend, and at the same time, the three lower squeezing blocks 203 can have enough push to bend the base B, the collector C and the emitter E of the triode.
Referring to fig. 5, arc chamfers are arranged at one corner of each of the three lower extrusion blocks 203, and the arrangement of the arc chamfers enables the base B, the collector C, and the emitter E of the triode to have certain buffering when being bent, and if a right-angle bending mode is adopted, the base B, the collector C, and the emitter E of the triode are inevitably damaged, and in severe cases, the base B, the collector C, and the emitter E of the triode may be broken.
As shown in fig. 5, three pressing plates are arranged on one side of the upper extrusion block 202, the three pressing plates and the upper extrusion block 21 are in an integrally formed structure, the three pressing plates are respectively contacted with a base B, a collector C and an emitter E of the triode when the bending operation is completed, so that the base B, the collector C and the emitter E of the triode are fixed, and the three pressing plates and the upper extrusion block 21 are in the integrally formed structure, so that the service life of the triode can be longer.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (6)
1. The utility model provides a mechanism of bending of semiconductor triode pin bender which characterized in that includes:
a turntable assembly and an action assembly;
the turntable assembly is used for conveying the triode and matching with the action assembly to bend a base B, a collector C and an emitter E of the triode, the turntable assembly comprises a turntable, a plurality of bending grooves are formed in the turntable in an annular array, and the bending grooves are respectively matched with the base B, the collector C and the emitter E of the triode;
the action assembly is used for bending a base B, a collector C and an emitter E of the triode, the action assembly comprises an air cylinder and an upper extrusion block, three lower extrusion blocks are arranged below the upper extrusion block, the three lower extrusion blocks are all in contact with the upper extrusion block, three elastic structures are arranged on the upper extrusion block, and the three elastic structures are respectively connected with the corresponding lower extrusion blocks.
2. The bending mechanism of a semiconductor triode pin bending machine according to claim 1, wherein the elastic structure comprises an installation cavity, the installation cavity is formed in the upper extrusion block, a baffle is slidably installed in the installation cavity, a connecting rod is fixedly installed at the bottom of the baffle, the bottom end of the connecting rod extends to the lower portion of the upper extrusion block, a first spiral spring is sleeved on the connecting rod, two ends of the first spiral spring are respectively in contact with the bottom of the installation cavity and the bottom of the baffle, a T-shaped groove is formed in the top of the lower extrusion block, a moving block is slidably installed in the T-shaped groove, and the bottom end of the connecting rod extends into the T-shaped groove and is fixedly connected with the moving block.
3. The bending mechanism of a semiconductor triode pin bending machine according to claim 2, wherein a support plate is fixedly mounted on an output shaft of the cylinder, a limiting rod is fixedly mounted on one side of the upper extrusion block, the limiting rod penetrates through the support plate and is in sliding connection with the support plate, a second spiral spring is sleeved on the limiting rod, and two ends of the second spiral spring are respectively and fixedly connected with the upper extrusion block and the support plate.
4. The bending mechanism of a semiconductor triode pin bending machine according to claim 1, wherein one side of each of the three lower extrusion blocks is fixedly provided with a same connecting plate, an output shaft of the air cylinder is rotatably provided with a roller, and the roller is in contact with the connecting plate.
5. The bending mechanism of a semiconductor triode pin bending machine according to claim 1, wherein an arc-shaped chamfer is arranged on one corner of each of the three lower extrusion blocks.
6. The bending mechanism of a semiconductor triode pin bending machine according to claim 1, wherein three pressing plates are arranged on one side of the upper extrusion block, and the three pressing plates and the upper extrusion block are of an integrally formed structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120566844.8U CN215315314U (en) | 2021-03-19 | 2021-03-19 | Bending mechanism of semiconductor triode pin bending machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120566844.8U CN215315314U (en) | 2021-03-19 | 2021-03-19 | Bending mechanism of semiconductor triode pin bending machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215315314U true CN215315314U (en) | 2021-12-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120566844.8U Expired - Fee Related CN215315314U (en) | 2021-03-19 | 2021-03-19 | Bending mechanism of semiconductor triode pin bending machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215315314U (en) |
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2021
- 2021-03-19 CN CN202120566844.8U patent/CN215315314U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211228 |