CN215291167U

CN215291167U - Heat dissipation floor structure

Info

Publication number: CN215291167U
Application number: CN202022583644.1U
Authority: CN
Inventors: 裴旭; 王献; 朱快; 徐廷博; 陈子豪; 于斌; 李星星
Original assignee: Greentown Decoration Engineering Group Co Ltd
Current assignee: Greentown Decoration Engineering Group Co Ltd
Priority date: 2020-11-10
Filing date: 2020-11-10
Publication date: 2021-12-24
Anticipated expiration: 2030-11-10

Abstract

The utility model discloses a heat dissipation floor structure, which comprises a modular floor main body, wherein the modular floor main body is provided with a plate-type metal strip section structure, and at least one gas flow channel along the length direction of the plate-type metal strip section structure is formed inside the plate-type metal strip section structure; the periphery of modularization floor main part is provided with a plurality of interfaces of assembling. The application provides a heat dissipation floor structure, simple structure is reasonable, installation convenient to use. The hot air in the air outlet of the central air conditioner introduced by the air inlet pipeline can be quickly heated after being received, so that the hot air is accumulated from the lower part indoors, the heating effect is good, the use comfort level is high, the heat conversion efficiency is improved, and the energy conservation and the environmental protection are realized. The modular floor main body has good heat conductivity, improves the heat conversion efficiency, and is firm and durable; the surface of the main body of the modular floor can be pasted with wood skin and is subjected to strengthening treatment, so that the look and feel of the wood floor are kept, and the comfort is improved.

Description

Heat dissipation floor structure

Technical Field

The utility model relates to a geothermal floor technical field especially relates to a heat dissipation floor structure that heat dispersion is good.

Background

As is well known, compared with the heat radiation heating mode, the floor radiation heating mode has the characteristic of meeting the development of the building energy-saving technology, and can be widely applied. Specifically, the whole floor is uniformly heated by a heating medium in the floor, and the heating is realized by conducting from bottom to top by utilizing the rule of ground radiation.

The traditional floor heating adopts water floor heating or electric floor heating, an independent heating system is needed, the construction is complex, the manufacturing cost is high, potential quality hazards such as water leakage are easy to occur, and the maintenance is extremely difficult. In addition, in the conventional floor heating system using hot water, a pipe bank made of metal or synthetic resin material is buried under the ground, and a heat source is generated by a boiler installed indoors or outdoors to heat water and establish circulation of a heat medium. The method is limited by the limitation of concrete construction embedded pipelines, when water leakage faults occur, correct water leakage points are not easy to find out, even if the water leakage points are found out, the repair is convenient, and the construction cost is high.

Adopt the air conditioner to heat can effectually avoid the leakage problem that traditional hot-water heating exists, but because central air conditioning, hanging air conditioner air outlet position are higher, under the heating mode, hot-air blows off from the top air outlet, and the physical property that the heated air rises influences, suspends in indoor top, causes that the interior space top temperature is high, the bottom temperature is low, people's head and hot foot is cold, the use impression is poor, and the extravagant energy consumption of this heating mode, heat conversion are low.

SUMMERY OF THE UTILITY MODEL

The utility model provides a heat dissipation floor structure.

The utility model provides a following scheme:

a heat dissipation floor structure comprises a modular floor main body, wherein the modular floor main body is provided with a plate type metal strip section structure, and at least one gas flow channel along the length direction of the plate type metal strip section structure is formed inside the plate type metal strip section structure;

the periphery of the modular floor main body is provided with a plurality of assembling interfaces, the assembling interfaces at least comprise a first interface and a second interface which are positioned at a first end and a second end opposite to the first end, and at least one side edge of two side edges which are vertical to the first end and the second end is provided with a third interface or a fourth interface; the first interface and the second interface are used for realizing end-to-end connection with the two modular floor main bodies; the third interface and the fourth interface are used for realizing parallel connection with the two modular floor main bodies.

Preferably: and one side edge of two side edges perpendicular to the first end and the second end is provided with a third interface or a fourth interface, and the other side edge forms a sealing structure.

Preferably: and a third interface is formed on one side edge of two side edges perpendicular to the first end and the second end, and a fourth interface is formed on the other side edge.

Preferably: the first interface includes a plug extending outwardly toward the first end along a length of the modular floor body.

Preferably: the second interface comprises a slot which extends inwards towards the second end along the length direction of the modular floor main body and is matched with the plug.

Preferably: the plug is formed with along the outside first arch of extending of broadwise and along the inside sunken first draw-in groove of broadwise respectively in the both ends of broadwise of modularization floor main part.

Preferably: the slot is relative the both ends of modularization floor main part broadside direction are formed with respectively along the broadside outwards extend with the second of first draw-in groove adaptation protruding and along the broadside inwards sunken with the second draw-in groove of first protruding adaptation.

Preferably: the surface of the modular floor main body on the upper part is provided with a decorative layer.

According to the utility model provides a concrete embodiment, the utility model discloses a following technological effect:

through the utility model, a heat dissipation floor structure can be realized, and in an implementation mode, the structure can comprise a modular floor main body, wherein the modular floor main body is provided with a plate-type metal strip section structure, and at least one gas flow channel along the length direction of the plate-type metal strip section structure is formed inside the plate-type metal strip section structure; the periphery of the modular floor main body is provided with a plurality of assembling interfaces, the assembling interfaces at least comprise a first interface and a second interface which are positioned at a first end and a second end opposite to the first end, and at least one side edge of two side edges which are vertical to the first end and the second end is provided with a third interface or a fourth interface; the first interface and the second interface are used for realizing end-to-end connection with the two modular floor main bodies; the third interface and the fourth interface are used for realizing parallel connection with the two modular floor main bodies. The application provides a heat dissipation floor structure, simple structure is reasonable, installation convenient to use. The hot air in the air outlet of the central air conditioner introduced by the air inlet pipeline can be quickly heated after being received, so that the hot air is accumulated from the lower part indoors, the heating effect is good, the use comfort level is high, the heat conversion efficiency is improved, and the energy conservation and the environmental protection are realized. The modular floor main body has good heat conductivity, improves the heat conversion efficiency, and is firm and durable; the surface of the main body of the modular floor can be pasted with wood skin and is subjected to strengthening treatment, so that the look and feel of the wood floor are kept, and the comfort is improved.

Of course, it is not necessary for any particular product to achieve all of the above-described advantages at the same time.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a heat dissipation floor structure according to an embodiment of the present invention;

fig. 2 is an isometric view of a modular floor body provided by an embodiment of the present invention;

fig. 3 is a cross-sectional plan view of a modular floor body provided by an embodiment of the present invention;

fig. 4 is a cross-sectional view of a plane a-a provided by an embodiment of the present invention;

fig. 5 is a schematic structural view of two modular floor main bodies connected end to end according to an embodiment of the present invention;

fig. 6 is a schematic structural view illustrating two modular floor main bodies connected in parallel according to an embodiment of the present invention.

In the figure: the modular floor comprises a modular floor body 1, a gas flow channel 11, a first interface 12, a plug 121, a first protrusion 1211, a first protrusion 1212, a second interface 13, a slot 131, a third interface 14, a fourth interface 15, an air inlet floor 2 and a return air floor 3.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art all belong to the protection scope of the present invention.

Examples

Referring to fig. 1, fig. 2, fig. 3, fig. 4, fig. 5, and fig. 6, in order to provide a heat dissipation floor structure according to an embodiment of the present invention, as shown in fig. 1, fig. 2, fig. 3, fig. 4, fig. 5, and fig. 6, the structure includes a modular floor main body 1, where the modular floor main body 1 has a plate-type metal strip profile structure, and at least one gas flow channel 11 is formed inside the plate-type metal strip profile structure along a length direction of the plate-type metal strip profile structure; the application provides a heat dissipation floor can adopt the metal material preparation to form the major structure, can adopt the aluminum alloy material for example, can reach good radiating effect. The surface of the modular floor main body on the upper part is provided with a decorative layer. The upper portion of the main body structure made of the aluminum alloy material can be provided with the decorative layer, and the good decorative effect is formed on one surface of the upper portion. The decorative layer may comprise a variety of patterns and colors. For example, a veneer to which the color of the raw wood is stuck can be used. It is contemplated that the length of the modular floor body may be manufactured in a variety of different sizes to meet different typesetting requirements to reduce on-site cutting. The cut modular floor bodies can be connected by means of adapter joints which are configured to fit.

The periphery of the modular floor main body is provided with a plurality of assembling interfaces, the assembling interfaces at least comprise a first interface 12 and a second interface 13 which are positioned at a first end and a second end opposite to the first end, and at least one side edge of two side edges which are vertical to the first end and the second end is provided with a third interface 14 or a fourth interface 15; the first interface 12 and the second interface 13 are used for realizing end-to-end connection with two modular floor main bodies 1; the third interface 14 and the fourth interface 15 are used for realizing the parallel connection with two modular floor main bodies 1.

This structure is when using, can lay the space in order will select modular floor main part 1 splice can, the gas flow channel that each modular floor main part 1 that the end to end that forms holistic heat dissipation floor includes contained separately all switches on, the whole heat dissipation floor that the bottom plate structure after the concatenation was accomplished formed can link to each other and switch on rather than the inside gas flow channel that forms with air inlet floor 2 and return air floor 3, the air inlet floor can be with the hot-blast guide to the heat dissipation floor of equipment supply such as air conditioner in, hot-blast runner in the heat dissipation floor that flows in return air heat dissipation floor through the heat dissipation, return air heat dissipation floor can guide the return air to the air conditioner inside.

It is conceivable that the modular floor main body provided by the present application may include two different forms according to the use position, wherein one of the two forms is located at one side perpendicular to the air intake floor and the air return floor and needs to be sealed to prevent the hot air from being discharged, and therefore, in the embodiment of the present application, one of two sides perpendicular to the first end and the second end may be provided with a third joint or a fourth joint, and the other side may form a sealing structure. Because the third interface and the fourth interface have adaptive structures, when the connector is processed and manufactured, a mode that one surface is sealed and the other three surfaces form the interface can be manufactured, the three-surface interface comprises a first interface and a second interface which are necessary for end-to-end connection, and the connector can also comprise the third interface or the fourth interface, and the connector can be selected and configured according to the requirements of site construction positions in actual use. Another type of middle modular floor main body needs two side edges to be connected with another modular floor main body respectively, so that the embodiment of the application can provide that one of the two side edges perpendicular to the first end and the second end is formed with a third interface, and the other side edge is formed with a fourth interface.

In order to ensure the connection strength of the first interface and the second interface and ensure the convenience of connection. The first interface includes a plug 121 extending outwardly toward the first end along the length of the modular floor body. The second interface comprises a slot 131 which extends inwards 121 towards the second end along the length direction of the modular floor body 1 and is matched with the plug 121. The plug 121 is formed with a first protrusion 1211 extending outward in the width direction and a first locking groove 1212 recessed inward in the width direction at two ends in the width direction of the modular floor main body. The slot is formed with along the outside second arch (not shown in the figure) that extends of broadwise and with the first draw-in groove adaptation and along the inside sunken second draw-in groove with first protruding adaptation of broadwise respectively the both ends of main part broadwise of modularization floor. After the plug is inserted into the slot, the first protrusion can be clamped into the second clamping groove, and meanwhile, the second protrusion can be clamped into the first clamping groove, so that four surfaces around the first interface and the second interface after being plugged can be enabled to be stressed and fixed, and connection fastening is guaranteed.

In a word, the heat dissipation floor structure that this application provided, simple structure is reasonable, installation convenient to use. The hot air in the air outlet of the central air conditioner introduced by the air inlet pipeline can be quickly heated after being received, so that the hot air is accumulated from the lower part indoors, the heating effect is good, the use comfort level is high, the heat conversion efficiency is improved, and the energy conservation and the environmental protection are realized. The modular floor main body has good heat conductivity, improves the heat conversion efficiency, and is firm and durable; the surface of the main body of the modular floor can be pasted with wood skin and is subjected to strengthening treatment, so that the look and feel of the wood floor are kept, and the comfort is improved.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.

Claims

1. A heat dissipation floor structure is characterized by comprising a modular floor main body, wherein the modular floor main body is provided with a plate type metal strip profile structure, and at least one gas flow channel along the length direction of the plate type metal strip profile structure is formed inside the plate type metal strip profile structure;

2. The heat dissipation floor structure according to claim 1, wherein one of two sides perpendicular to the first end and the second end is formed with a third joint or a fourth joint, and the other side is formed with a sealing structure.

3. The heat dissipation floor structure according to claim 1, wherein one of two sides perpendicular to the first end and the second end is formed with a third joint, and the other side is formed with a fourth joint.

4. The heat dissipating floor structure of claim 1, wherein the first interface comprises a plug extending outward along a length of the modular floor body toward the first end.

5. The heat dissipating floor structure of claim 4, wherein the second interface comprises a slot that fits the plug extending inward toward the second end along the length of the modular floor body.

6. The heat dissipation floor structure according to claim 5, wherein both ends of the plug in the width direction with respect to the modular floor main body are respectively formed with a first protrusion extending outward in the width direction and a first catching groove recessed inward in the width direction.

7. The heat dissipation floor structure of claim 6, wherein a second protrusion extending outward in the width direction and adapted to the first locking groove and a second locking groove recessed inward in the width direction and adapted to the first protrusion are formed at both ends of the insertion groove in the width direction with respect to the modular floor main body, respectively.

8. The heat dissipation floor structure of claim 1, wherein a surface of the modular floor body on the upper portion is formed with a decorative layer.