CN215288965U - Protective layer structure for chemical nickel plating of aviation electrical appliance accessories - Google Patents
Protective layer structure for chemical nickel plating of aviation electrical appliance accessories Download PDFInfo
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- CN215288965U CN215288965U CN202121730221.6U CN202121730221U CN215288965U CN 215288965 U CN215288965 U CN 215288965U CN 202121730221 U CN202121730221 U CN 202121730221U CN 215288965 U CN215288965 U CN 215288965U
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Abstract
The utility model discloses an inoxidizing coating structure of aviation electrical accessories chemical nickel plating, including the aluminum alloy base member, and sink zinc layer, copper facing in advance, chemical nickel coating and graphite alkene sealing layer from inside to outside the chemistry that prepares gradually on the aluminium metal base member. The utility model has the advantages of, the cladding material structure who prepares has high corrosion resistance.
Description
Technical Field
The utility model relates to a metal surface treatment technical field, concretely relates to inoxidizing coating structure of aviation electrical accessories chemical nickel plating.
Background
At present, some electrical fittings in the aviation field adopt chemical nickel plating to prepare a protective layer, and the coating structure comprises an aluminum alloy matrix and a chemical zinc deposition layer and a chemical nickel plating layer which are sequentially arranged on the matrix from inside to outside.
Compared with an aluminum alloy substrate, the chemical nickel plating layer belongs to a cathode plating layer, and has no electrochemical protection effect on the aluminum alloy substrate. The chemical nickel plating layer has more pores, and corrosive mediums easily penetrate through the pores and permeate into the surface of the aluminum alloy to corrode the base body of the aluminum alloy.
Experiments and applications show that the aluminum alloy electrical equipment fittings prepared by the surface treatment method have poor corrosion resistance and often cannot meet the use requirements of the aviation industry.
Disclosure of Invention
An object of the utility model is to provide an inoxidizing coating structure of aviation electrical accessories chemical nickel plating to solve the problem that chemical nickel plating is low as the inoxidizing coating corrosion resistance for aviation electrical accessories.
In order to achieve the purpose, the utility model adopts the following technical scheme:
the protective layer structure comprises an aluminum alloy substrate, and a chemical zinc deposition layer, a pre-copper plating layer, a chemical nickel plating layer and a graphene sealing layer which are sequentially prepared on the aluminum alloy substrate from inside to outside.
In some embodiments, the electroless nickel layer has a thickness of 8 to 15 μm.
In some embodiments, the thickness of the pre-plated copper layer is 5-12 μm.
In some embodiments, the graphene sealing layer has a thickness of 2.1-2.8 μm.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model adopts the HEDP copper plating process to prepare the pre-plated copper layer on the chemical zinc deposition layer containing two metals, the HEDP copper complex ions can not replace the zinc on the chemical zinc deposition layer, and good bonding force can be formed between the two layers of plating layers;
2. the chemical nickel plating layer belongs to the cathodic coating relative to the aluminum alloy matrix, and the coating does not have the electrochemical protection function to the matrix;
3. and the chemical nickel-plating layer is sealed by the graphene sealing agent, so that the pores in the chemical nickel-plating layer can be effectively sealed, the corrosion resistance of the plating layer is improved, and the graphene sealing layer has conductivity.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, do not constitute a limitation of the invention, and in which:
fig. 1 is a schematic structural diagram of the protective layer according to embodiments 1 and 2 of the present invention.
Detailed Description
The present invention will be described in detail with reference to the drawings and specific embodiments, and the exemplary embodiments and descriptions of the present invention are used to explain the present invention, but not to limit the present invention.
The protective layer structure comprises an aluminum alloy substrate, and a chemical zinc deposition layer, a pre-copper plating layer, a chemical nickel plating layer and a graphene sealing layer which are sequentially prepared on the aluminum alloy substrate from inside to outside.
The aluminum alloy part is subjected to wax removal, oil removal, brightening and activation by adopting the conventional pretreatment process.
After the aluminum alloy part is pretreated, the chemical zinc deposition layer is prepared by adopting the existing chemical zinc deposition process.
Preferably, the chemical zinc deposition layer is prepared by adopting AZIN-113 acidic aluminum zinc deposition agent produced by Guangzhou ultra-Pont chemical Co: 50-250 mL/L of AZIN-113 acidic aluminum zinc deposition agent, working temperature of 15-30 ℃, zinc deposition liquid pH range of 3.4-4.2, and zinc deposition time of 20-80 s. The prepared chemical zinc deposition layer contains two components of zinc and nickel.
Preferably, the chemical zinc deposition layer is prepared by adopting an ALBUME AS-699 cyanide-free aluminum zinc deposition agent produced by ultra-high chemical industry: 160-200 mL/L of ALBUME AS-699 cyanide-free aluminum zinc-plating agent, the working temperature is 20-30 ℃, and the zinc-plating time is 60-120 s. The prepared chemical zinc deposition layer contains two components of zinc and copper.
After the chemical zinc deposition of the aluminum alloy part, an HEDP copper plating process is adopted to prepare the pre-plated copper layer, and the thickness of a plating layer is 5-11 mu m.
The HEDP copper plating process comprises the following steps: 35-45 g/L of copper sulfate, 80-130 g/L of HEDP complexing agent, 40-60 g/L of potassium carbonate, 20-25 mL/L of CuR-1 additive, pH range of 9-10, plating bath temperature of 35-50 ℃, and cathode current density of 1-3A/dm2The cathode is moved for 2-4 m/min.
After the aluminum alloy part is subjected to copper preplating, a chemical nickel plating layer is prepared by adopting the existing chemical nickel plating process, and the thickness of the plating layer is 8-15 microns.
Preferably, the preparation method adopts a GG-169 full-bright high-phosphorus chemical nickel plating process in the ultra-high chemical industry:
GG-169A additive: 50 to 70mL/L of the total amount of the active ingredient,
GG-169B additive: 130 to 170mL/L of the total amount of the active ingredient,
pH value: 4.6 to 5.2 of a polymer,
temperature: 85-96 ℃.
Preferably, the preparation method adopts a GG-155 middle phosphorus bright chemical nickel plating process of the ultra-high chemical industry:
GG-155A additive: 50 to 70mL/L of the total amount of the active ingredient,
GG-155B additive: 130 to 170mL/L of the total amount of the active ingredient,
pH value: 4.8 to 5.4 of a polymer,
temperature: 82-96 ℃.
After the chemical nickel plating of the aluminum alloy part, a graphene sealing layer is prepared by adopting the existing graphene sealing process, and the thickness of the sealing layer is 2.1-2.8 microns.
Preferably, the graphene sealing layer is prepared by PRODICO 460 hydroxyl graphene modified sealing agent in the ultra-high chemical industry.
The PRODICO 460 hydroxyl graphene modified sealing agent comprises the following components in parts by weight: 20-30 parts of silica sol, 20-30 parts of PU 113 water-soluble silane polymer, 8-15 parts of hydroxyl graphene with the mass fraction of 1%, 0.5-0.8 part of TANAOAMS (TaNAFAM) organic silicon defoamer, 0.6-1.0 part of LA13-863 organic silicon flatting agent and 35-45 parts of deionized water.
And diluting the hydroxyl graphene modified sealing agent to 3 times with water to prepare sealing liquid.
The plating piece is prepared into a graphene sealing layer by adopting a dip-coating method, and the prepared sealing layer is dried and cured for 30-60 min at 70-100 ℃.
Example 1:
as shown in fig. 1, the protective layer structure for chemical nickel plating of the aviation electrical appliance fittings comprises an aluminum alloy substrate 1, and a chemical zinc deposition layer 2, a pre-copper plating layer 3, a chemical nickel plating layer 4 and a graphene sealing layer 5 which are sequentially prepared on the aluminum alloy substrate 1 from inside to outside.
The chemical zinc deposition layer 2 is prepared by adopting AZIN-113 acid aluminum zinc deposition agent produced by ultra-high chemical industry: 150mL/L of AZIN-113 acidic aluminum zinc deposition agent, 25 ℃ of working temperature, 3.8 of pH of zinc deposition liquid and 50s of zinc deposition time. The prepared chemical zinc deposition layer contains two components of zinc and nickel.
The pre-plated copper layer 3 is prepared by an HEDP copper plating process, and the thickness of the plating layer is 5-7 mu m.
The HEDP copper plating process comprises the following steps: 38g/L of copper sulfate, 95g/L of HEDP complexing agent, 47g/L of potassium carbonate and 22mL/L of CuR-1 additive, wherein the pH value is 9.3, the temperature of a plating bath is 38 ℃, and the cathode current density is 1.5A/dm2The cathode was moved 3 m/min.
The thickness of the chemical nickel-plating layer 4 is 13-15 μm, and the chemical nickel-plating layer is prepared by adopting GG-169 full-bright high-phosphorus chemical nickel-plating technology in ultra-high-level chemical industry: 60mL/L of GG-119A additive and 150mL/L of GG-169B additive, the operating temperature is 90 ℃, and the pH value is 5.0.
The graphene sealing layer is prepared from PRODICO 460 hydroxyl graphene modified sealing agent in the ultra-high chemical industry, and the thickness of the sealing layer is 2.3-2.5 microns.
The PRODICO 460 hydroxyl graphene modified sealing agent comprises the following components in parts by weight: 24 parts of silica sol, 26 parts of PU 113 water-soluble silane polymer, 10 parts of hydroxyl graphene with the mass fraction of 1%, 0.6 part of TANAOAMS organic silicon defoamer, 0.8 part of LA13-863 organic silicon leveling agent and 40 parts of deionized water.
And diluting the hydroxyl graphene modified sealing agent to 3 times with water to prepare sealing liquid.
The plating piece is prepared into a graphene sealing layer by adopting a dip-coating method, and the prepared sealing layer is dried and cured for 40min at the temperature of 85 ℃.
The operation of the embodiment is divided into the following steps:
1. pretreatment: the aluminum alloy base 1 is subjected to the steps of "chemical wax removal → water washing → ultrasonic wax removal → water washing → chemical degreasing → water washing → nitric acid with a volume fraction of 25% light extraction → water washing → activation → water washing".
2. Chemical zinc deposition: the aluminum alloy substrate 1 after pretreatment is subjected to the processes of "first zinc deposition → water washing → zinc removal → water washing → second zinc deposition → water washing" to prepare the chemical zinc deposition layer 2.
3. Pre-copper plating: and preparing a pre-plated copper layer 3 on the chemical zinc deposition layer 2 according to the HEDP copper plating process.
4. Chemical nickel plating: and preparing a chemical nickel plating layer 4 on the pre-plated copper 3 according to a GG-169 full-bright high-phosphorus chemical nickel plating process.
5. And (3) sealing: and (3) performing 'dipping graphene sealing liquid → discharging from a tank → blowing off the residual liquid drops at the bottom of the plated part by high-pressure air → drying and curing' on the chemical nickel plating layer 4 to prepare the graphene sealing layer 5.
Example 2:
as shown in fig. 1, the protective layer structure for chemical nickel plating of the aviation electrical appliance fittings comprises an aluminum alloy substrate 1, and a chemical zinc deposition layer 2, a pre-copper plating layer 3, a chemical nickel plating layer 4 and a graphene sealing layer 5 which are sequentially prepared on the aluminum alloy substrate 1 from inside to outside.
The chemical zinc deposition layer 2 is prepared by adopting an ALBUME AS-699 cyanide-free aluminum zinc deposition agent produced by ultra-high chemical industry: 180mL/L of ALBUME AS-699 cyanide-free aluminum zinc deposition agent, 25 ℃ of working temperature and 90s of zinc deposition time. The prepared chemical zinc deposition layer contains two components of zinc and copper.
The pre-plated copper layer 3 is prepared by an HEDP copper plating process, and the thickness of the plating layer is 12-14 mu m.
The HEDP copper plating process comprises the following steps: 43g/L copper sulfate, 120g/L HEDP complexing agent, 55g/L potassium carbonate, 24mL/L CuR-1 additive, pH 9.7, plating bath temperature 45 ℃, and cathode current density 2.5A/dm2The cathode is moved for 2-4 m/min.
The thickness of the chemical nickel-plating layer 4 is 11-13 μm, and the chemical nickel-plating layer is prepared by adopting a GG-155 medium-phosphorus bright chemical nickel-plating process in the ultra-high chemical industry: 60mL/L of GG-155A additive and 150mL/L of GG-155B additive, the operating temperature is 88 ℃, and the pH value is 5.2.
The graphene sealing layer is prepared from PRODICO 460 hydroxyl graphene modified sealing agent in the ultra-high chemical industry, and the thickness of the sealing layer is 2.4-2.6 microns.
The PRODICO 460 hydroxyl graphene modified sealing agent comprises the following components in parts by weight: 26 parts of silica sol, 24 parts of PU 113 water-soluble silane polymer, 10 parts of hydroxyl graphene with the mass fraction of 1%, 0.7 part of TANAOAMS organic silicon defoamer, 0.9 part of LA13-863 organic silicon leveling agent and 40 parts of deionized water.
And diluting the hydroxyl graphene modified sealing agent to 3 times with water to prepare sealing liquid.
The plating piece is prepared into a graphene sealing layer by adopting a dip-coating method, and the prepared sealing layer is dried and cured for 30min at 90 ℃.
The operation of the embodiment is divided into the following steps:
1. pretreatment: the aluminum alloy base 1 is subjected to the steps of "chemical wax removal → water washing → ultrasonic wax removal → water washing → chemical degreasing → water washing → nitric acid with a volume fraction of 25% light extraction → water washing → activation → water washing".
2. Chemical zinc deposition: the aluminum alloy substrate 1 after pretreatment is subjected to the processes of "first zinc deposition → water washing → zinc removal → water washing → second zinc deposition → water washing" to prepare the chemical zinc deposition layer 2.
3. Pre-copper plating: and preparing a pre-plated copper layer 3 on the chemical zinc deposition layer 2 according to the HEDP copper plating process.
4. Chemical nickel plating: and preparing a chemical nickel plating layer 4 on the pre-plated copper 3 according to a GG-155 medium-phosphor bright chemical nickel plating process.
5. And (3) sealing: and (3) performing 'dipping graphene sealing liquid → discharging from a tank → blowing off the residual liquid drops at the bottom of the plated part by high-pressure air → drying and curing' on the chemical nickel plating layer 4 to prepare the graphene sealing layer 5.
Test example 1:
the protective layer prepared in the embodiment 1 and the embodiment 2 is subjected to a neutral salt spray test for 168h according to GB/T10125-.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the above embodiments are only applicable to help understand the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there are variations in the specific implementation and application ranges. In general, nothing in this specification should be construed as limiting the invention.
Claims (4)
1. The protective layer structure for chemical nickel plating of the aviation electrical appliance accessory is characterized by comprising an aluminum alloy base body, and a chemical zinc-depositing layer, a pre-copper-plating layer, a chemical nickel-plating layer and a graphene sealing layer which are sequentially prepared on the aluminum alloy base body from inside to outside.
2. The protective layer structure of chemical nickel plating for aviation electrical accessories according to claim 1, wherein the thickness of the chemical nickel plating layer is 8-15 μm.
3. The protective layer structure of electroless nickel plating for aircraft electrical parts according to claim 1, wherein the thickness of the pre-plated copper layer is 5 to 11 μm.
4. The protective layer structure of chemical nickel plating for aviation electrical accessories according to claim 1, wherein the graphene sealing layer has a thickness of 2.1-2.8 μm.
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