CN215282771U - Positioning device for cutting silicon wafer - Google Patents
Positioning device for cutting silicon wafer Download PDFInfo
- Publication number
- CN215282771U CN215282771U CN202120151602.2U CN202120151602U CN215282771U CN 215282771 U CN215282771 U CN 215282771U CN 202120151602 U CN202120151602 U CN 202120151602U CN 215282771 U CN215282771 U CN 215282771U
- Authority
- CN
- China
- Prior art keywords
- ring
- threaded rod
- silicon chip
- fixedly connected
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 51
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 51
- 239000010703 silicon Substances 0.000 title claims abstract description 51
- 238000005520 cutting process Methods 0.000 title claims abstract description 26
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000000741 silica gel Substances 0.000 claims abstract description 12
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 13
- 230000008569 process Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model relates to a silicon chip cutting technical field just discloses a positioner is used in silicon chip cutting, including fixing base and constant head tank, the constant head tank is located the inside of fixing base, the bar groove has been seted up to the inside of constant head tank, the inside swing joint in bar groove has the threaded rod, the middle part fixedly connected with ring of fixing base, the inside swing joint of ring has the driving gear. This positioner is used in silicon chip cutting, place the central point of constant head tank with the silicon chip and put the department, the inside driving gear rotation of fixing base drives driven gear rotatory, make the threaded rod rotate in the inside in bar groove, the effect through the screw thread makes the screw ring remove to the centre of a circle department of constant head tank on the surface of threaded rod, it removes to the centre to drive arc splint, then it is fixed to carry out the centre gripping through arc splint and silica gel pad to the side surface of circular silicon chip, prevent that the silicon chip from appearing the skew at the in-process of cutting, and then the precision of silicon chip when the cutting has been improved.
Description
Technical Field
The utility model relates to a silicon chip cutting technical field specifically is a positioner is used in silicon chip cutting.
Background
The silicon wafer is a main production material in the fields of semiconductors and photovoltaics, and cutting equipment is required to be used for cutting the silicon wafer in the processing process.
When cutting is carried out, if the fixing effect of the silicon wafer is not good, the cutting position of the silicon wafer is easy to deviate, and then the cutting precision of the silicon wafer is influenced, and therefore the positioning device for cutting the silicon wafer is provided.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Not enough to prior art, the utility model provides a positioner is used in silicon chip cutting possesses and is convenient for fix the silicon chip, prevents that the silicon chip from appearing the advantage of skew at the in-process of cutting, has solved the problem that proposes among the above-mentioned background art.
(II) technical scheme
The utility model provides a following technical scheme: a positioning device for cutting silicon wafers comprises a fixed seat and a positioning groove, wherein the positioning groove is positioned inside the fixed seat, a strip-shaped groove is formed inside the positioning groove, a threaded rod is movably connected inside the strip-shaped groove, a circular ring is fixedly connected to the middle of the fixed seat, a driving gear is movably connected inside the circular ring, a driven gear is arranged inside the circular ring and meshed with the side surface of the driving gear, a threaded ring is connected to the side surface of the threaded rod in a threaded manner, an arc-shaped clamping plate is fixedly connected to the front surface of the threaded ring, a limiting ring is fixedly connected to one side of the fixed seat, one end of the threaded rod, far away from the circular ring, is movably connected with the inside of the limiting ring, a limiting disc is fixedly connected to one end of the threaded rod, positioned inside the limiting ring, and is rotatably connected with the inside of the limiting ring, the inside fixedly connected with support column of constant head tank.
Preferably, the positioning groove is a circular groove, and the diameter of the positioning groove is larger than that of the circular silicon wafer.
Preferably, one end of the threaded rod is movably connected with the inner part of the circular ring, and one end of the threaded rod, which is positioned in the inner part of the circular ring, is fixedly connected with the axis of the driven gear.
Preferably, the arc-shaped clamping plate comprises a silica gel pad, and the silica gel pad is fixedly connected with the inner side wall of the arc-shaped clamping plate.
Preferably, the guide way has been seted up to the inside of fixing base, the inside swing joint of guide way has the guide bar, one end and one side fixed connection of arc splint of guide bar, the guide bar is located the inside one end fixedly connected with stopper of guide way, stopper and the inside one end fixed connection of guide way.
Preferably, the inner side wall of the positioning groove is provided with a groove, and the threaded ring is movably connected with the inside of the groove.
Compared with the prior art, the utility model provides a positioner is used in silicon chip cutting possesses following beneficial effect:
1. this positioner is used in silicon chip cutting, place the central point of constant head tank with the silicon chip and put the department, the inside driving gear rotation of fixing base drives driven gear rotatory, make the threaded rod rotate in the inside in bar groove, the effect through the screw thread makes the screw ring remove to the centre of a circle department of constant head tank on the surface of threaded rod, it removes to the centre to drive arc splint, then it is fixed to carry out the centre gripping through arc splint and silica gel pad to the side surface of circular silicon chip, prevent that the silicon chip from appearing the skew at the in-process of cutting, and then the precision of silicon chip when the cutting has been improved.
2. This positioner is used in silicon chip cutting, through being provided with the support column, the silicon chip can support through the support column after placing the inside of constant head tank for the silicon chip is placed and is left certain space between the inner wall of constant head tank after the inside of constant head tank, and then conveniently cuts the silicon chip, through being provided with the silica gel pad, can carry out buffer protection to the side surface of silicon chip, prevents to cause the damage at the fixed in-process arc splint of centre gripping to the edge of silicon chip.
Drawings
FIG. 1 is a sectional view of the present invention;
FIG. 2 is a schematic structural view of the present invention;
fig. 3 is an enlarged view of a structure a in fig. 1 according to the present invention.
Wherein: 1. a fixed seat; 2. positioning a groove; 3. a strip-shaped groove; 4. a threaded rod; 5. a circular ring; 6. a driving gear; 7. a driven gear; 8. a threaded ring; 9. an arc-shaped splint; 10. a silica gel pad; 11. a limiting ring; 12. a limiting disc; 13. a guide groove; 14. a guide bar; 15. a limiting block; 16. a groove; 17. and (4) a support column.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, a positioning device for cutting silicon wafers comprises a fixed base 1 and a positioning groove 2, wherein the positioning groove 2 is located inside the fixed base 1, the positioning groove 2 is a circular groove, the diameter of the positioning groove 2 is larger than that of the circular silicon wafer, so that the circular silicon wafer can be placed inside the positioning groove 2 for storage, and then is clamped and fixed by an arc-shaped clamping plate 9, a strip-shaped groove 3 is formed inside the positioning groove 2, a threaded rod 4 and a threaded rod 4 are movably connected inside the strip-shaped groove 3, a circular ring 5 is fixedly connected to the middle part of the fixed base 1, a driving gear 6 is movably connected inside the circular ring 5, a driven gear 7 is arranged inside the circular ring 5, the driven gear 7 is meshed with the side surface of the driving gear 6, one end of the threaded rod 4 is movably connected with the inside of the circular ring 5, one end of the threaded rod 4 located inside the circular ring 5 is fixedly connected with the axis of the driven gear 7, the side surface of the threaded rod 4 is in threaded connection with a threaded ring 8, the front surface of the threaded ring 8 is fixedly connected with an arc-shaped clamping plate 9, the arc-shaped clamping plate 9 comprises a silica gel pad 10, the silica gel pad 10 is fixedly connected with the inner side wall of the arc-shaped clamping plate 9, the edge of a silicon wafer is convenient to buffer and protect in the fixing process under the action of the silica gel pad 10, one side of the fixing seat 1 is fixedly connected with a limiting ring 11, one end of the threaded rod 4, far away from the circular ring 5, is movably connected with the inside of the limiting ring 11, one end of the threaded rod 4, located inside the limiting ring 11, is fixedly connected with a limiting disc 12, the limiting disc 12 is rotatably connected with the inside of the limiting ring 11, a guide groove 13 is formed in the fixing seat 1, a guide rod 14 is movably connected inside the guide groove 13, one end of the guide rod 14 is fixedly connected with one side of the arc-shaped clamping plate 9, and one end of the guide rod 14, which is located inside the guide groove 13, is fixedly connected with a limiting block 15, stopper 15 and the inside one end fixed connection of guide way 13, arc splint 9 is when removing, guide bar 14 removes in the inside of guide way 13, it is spacing to be convenient for lead arc splint 9 through the effect of guide way 13 and guide bar 14, recess 16 has been seted up to the inside wall of constant head tank 2, the inside swing joint of screw ring 8 and recess 16, the inside fixedly connected with support column 17 of constant head tank 2, effect through support column 17, can support the inside silicon chip of constant head tank 2, make and leave certain space between the interior roof of silicon chip and constant head tank 2, then conveniently cut the operation.
When using, place the central point of constant head tank 2 with the silicon chip and put the department, support the bottom of silicon chip through support column 17, it is rotatory to drive driven gear 7 that the driving gear 6 of fixing base 1 inside is rotatory, make threaded rod 4 rotate in bar groove 3's inside, make screw ring 8 remove to the centre of a circle department of constant head tank 2 on the surface of threaded rod 4 through the effect of screw thread, it removes to the centre to drive arc splint 9, guide bar 14 outwards removes in the inside of guide way 13, then it is fixed to carry out the centre gripping through arc splint 9 and silica gel pad 10 to the side surface of circular silicon chip, prevent that the silicon chip from appearing the skew at the in-process of cutting.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a positioner is used in silicon chip cutting, includes fixing base (1) and constant head tank (2), its characterized in that: the positioning groove (2) is positioned in the fixing seat (1), the positioning groove (2) is internally provided with a strip-shaped groove (3), the strip-shaped groove (3) is internally and movably connected with a threaded rod (4), the threaded rod (4) is fixedly connected with a ring (5) in the middle of the fixing seat (1), the ring (5) is internally and movably connected with a driving gear (6), the ring (5) is internally provided with a driven gear (7), the driven gear (7) is meshed with the side surface of the driving gear (6), the side surface of the threaded rod (4) is in threaded connection with a threaded ring (8), the front of the threaded ring (8) is fixedly connected with an arc-shaped clamping plate (9), one side of the fixing seat (1) is fixedly connected with a limiting ring (11), one end of the threaded rod (4) far away from the ring (5) is in internal and movable connection with the limiting ring (11), threaded rod (4) are located spacing disc (12) of the inside one end fixedly connected with of spacing ring (11), spacing disc (12) are connected with the inside rotation of spacing ring (11), the inside fixedly connected with support column (17) of constant head tank (2).
2. The positioning device for silicon wafer dicing as set forth in claim 1, wherein: the positioning groove (2) is a circular groove, and the diameter of the positioning groove (2) is larger than that of a circular silicon wafer.
3. The positioning device for silicon wafer dicing as set forth in claim 1, wherein: one end of the threaded rod (4) is movably connected with the inside of the circular ring (5), and one end of the threaded rod (4) located inside the circular ring (5) is fixedly connected with the axis of the driven gear (7).
4. The positioning device for silicon wafer dicing as set forth in claim 1, wherein: arc splint (9) are including silica gel pad (10), silica gel pad (10) and the inside wall fixed connection of arc splint (9).
5. The positioning device for silicon wafer dicing as set forth in claim 1, wherein: guide way (13) have been seted up to the inside of fixing base (1), the inside swing joint of guide way (13) has guide bar (14), one end of guide bar (14) and one side fixed connection of arc splint (9), guide bar (14) are located one end fixedly connected with stopper (15) of guide way (13) inside, stopper (15) and the inside one end fixed connection of guide way (13).
6. The positioning device for silicon wafer dicing as set forth in claim 1, wherein: a groove (16) is formed in the inner side wall of the positioning groove (2), and the threaded ring (8) is movably connected with the inner part of the groove (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120151602.2U CN215282771U (en) | 2021-01-20 | 2021-01-20 | Positioning device for cutting silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120151602.2U CN215282771U (en) | 2021-01-20 | 2021-01-20 | Positioning device for cutting silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215282771U true CN215282771U (en) | 2021-12-24 |
Family
ID=79529767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120151602.2U Expired - Fee Related CN215282771U (en) | 2021-01-20 | 2021-01-20 | Positioning device for cutting silicon wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215282771U (en) |
-
2021
- 2021-01-20 CN CN202120151602.2U patent/CN215282771U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211224 |