CN215269203U

CN215269203U - Good heat dissipation's BMS processing apparatus

Info

Publication number: CN215269203U
Application number: CN202120667657.9U
Authority: CN
Inventors: 陈怀林
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-04-01
Filing date: 2021-04-01
Publication date: 2021-12-21
Anticipated expiration: 2031-04-01

Abstract

The utility model relates to the technical field of BMS processing, and discloses a BMS processing device with good heat dissipation, which comprises a body, a heat dissipation mechanism and a protective plate. In the BMS processing device with good heat dissipation, a heat dissipation fan is arranged at the bottom of the body, and the heat dissipation fan can be activated to dissipate heat inside the body. Inside the body, adding heat dissipation fins at the bottom of the heat-conducting plate can improve the heat dissipation of the heat-conducting plate. When the electronic components run for a long time, the temperature rises, and the temperature is transferred to the heat-conducting plate and the heat-dissipating fins, which increases the heat dissipation. The area of the cooling fan is activated to air-cool the bottom of the cooling fins and the heat-conducting plate, which greatly improves its heat dissipation efficiency, makes the BMS processing device run more stably, and also improves its service life.

Description

Good heat dissipation's BMS processing apparatus

Technical Field

The utility model relates to a BMS handles technical field, specifically is a good heat dissipation's BMS processing apparatus.

Background

The BMS battery system is commonly called a battery caregiver or a battery manager, and is mainly used for intelligently managing and maintaining each battery unit, preventing overcharge and overdischarge of the battery, prolonging the service life of the battery, and monitoring the state of the battery. BMS battery management system unit includes BMS battery management system, control module group, display module group, wireless communication module group, electrical equipment, is used for the group battery of electrical equipment power supply and is used for gathering the collection module of the battery information of group battery, BMS battery management system passes through communication interface and is connected with wireless communication module group and display module group respectively, the output of gathering the module is connected with BMS battery management system's input, BMS battery management system's output is connected with the input of control module group, the control module group is connected with group battery and electrical equipment respectively, BMS battery management system passes through wireless communication module and is connected with the Server end.

At present, in the conventional BMS processing device, a large amount of heat is generated from internal electronic components thereof during a long-time use, and the operation stability and the service life of the internal electronic components thereof are affected when the temperature is too high.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a good heat dissipation's BMS processing apparatus to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a good heat dissipation's BMS processing apparatus, includes organism, heat dissipation mechanism and guard plate, and heat dissipation mechanism sets up in the inside of organism, the guard plate sets up in the upper surface of organism.

The heat dissipation mechanism comprises a mounting groove and a heat-conducting plate, a heat dissipation fan is fixedly mounted in the mounting groove, a first metal protective net is fixedly mounted at a lower port in the mounting groove, a dustproof filter screen is fixedly mounted in the mounting groove, a heat dissipation fin is fixedly mounted at the bottom of the heat-conducting plate, and a support column is fixedly mounted at the bottom of the heat-conducting plate.

Preferably, port fixed mounting has the second metal protection network on the inside of mounting groove, the last fixed surface of heat-conducting plate installs electronic component, and the setting of second metal net can prevent that the foreign matter from getting into the inside of mounting groove to guarantee radiator fan's normal operating, the heat-conducting plate has the heat conductivity, can be quick conduct the heat that electronic component produced on the radiating fin, thereby accelerate the radiating efficiency.

Preferably, the inside roof fixed mounting of organism has the fixed column, the inside fixed mounting of fixed column has buffer spring, the jack has been seted up to the upper surface of organism, the inside grafting of jack has the post of inserting, and the guard plate carries out cushioning effect when receiving the impact of top can be guaranteed in its buffer spring's setting to reach the guard action to BMS processing apparatus.

Preferably, the top fixed mounting who inserts the post has the guard plate, the bottom fixed mounting who inserts the post has the briquetting, the upper surface bonding of guard plate has the rubber pad, and the setting of its rubber pad can carry out the guard action to the upper surface of guard plate, and its rubber pad is the rubber material, has elasticity and can reach the cushioning effect.

Preferably, the inside diapire fixed mounting of organism has the support column, the mounting groove has been seted up to the bottom of organism, and the setting of its support column can support the heat-conducting plate, and radiating fin and radiator fan of being convenient for dispel the heat the cooling to it to reach the purpose to the electronic component cooling.

Preferably, the heat dissipation port is formed in the middle of the upper surface of the machine body, the heat dissipation pore plate is fixedly mounted inside the heat dissipation port, the dustproof net is fixedly mounted at the port in the heat dissipation port, and the dust can be prevented from entering the machine body through the heat dissipation holes in the heat dissipation pore plate due to the arrangement of the dustproof net.

Preferably, the front of the machine body is provided with a butt joint groove, a butt joint port is fixedly arranged in the butt joint groove, the left end of the bottom of the machine body is fixedly provided with a mounting plate, the upper surface of the mounting plate is provided with a fastening hole, and the mounting plate and the fastening hole are arranged to facilitate the fixed mounting of the BMS processing device.

Compared with the prior art, the utility model provides a good heat dissipation's BMS processing apparatus. The method has the following beneficial effects:

this BMS processing apparatus that thermal diffusivity is good, bottom through at the organism sets up radiator fan, start radiator fan and can dispel the heat to the inside of organism, inside at the organism sets up the heat-conducting plate and support through the support column, make the heat-conducting plate unsettled inside at the organism, increase radiator fin can improve the thermal diffusivity of heat-conducting plate in the bottom of heat-conducting plate, the temperature risees when electronic component is long-time when moving, and give heat-conducting plate and radiator fin with the temperature transfer, its radiating area has been increased, start radiator fan and carry out the forced air cooling to radiator fin and heat-conducting plate bottom, the flow direction of wind can be through electronic component's surface to its heat dissipation simultaneously, its radiating efficiency has been improved greatly, make BMS processing apparatus more stable of operation, simultaneously also improve its life.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

FIG. 1 is a schematic front view of the present invention;

FIG. 2 is a schematic sectional view of the present invention;

FIG. 3 is a schematic view of the heat dissipation mechanism of the present invention;

fig. 4 is a schematic view of the cross-sectional structure of the fixing column of the present invention.

In the figure: 1 machine body, 2 heat dissipation mechanisms, 201 installation grooves, 202 first metal protection meshes, 203 dustproof filter screens, 204 heat dissipation fans, 205 support columns, 206 heat conduction plates, 207 heat dissipation fins, 208 second metal protection meshes, 3 fixed columns, 4 buffer springs, 5 pressing blocks, 6 jacks, 7 insertion columns, 8 protection plates, 9 rubber pads, 10 installation plates, 11 fastening holes, 12 heat dissipation ports, 13 heat dissipation pore plates, 14 electronic elements and 15 butt-joint ports.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a good heat dissipation's BMS processing apparatus, includes organism 1, heat dissipation mechanism 2 and guard plate 8, and heat dissipation mechanism 2 sets up in the inside of organism 1, and guard plate 8 sets up in the upper surface of organism 1.

Heat dissipation mechanism 2 includes mounting groove 201, heat-conducting plate 206, the inside fixed mounting of mounting groove 201 has radiator fan 204, port fixed mounting has first metal protection network 202 under the inside of mounting groove 201, the inside fixed mounting of mounting groove 201 has dustproof filter screen 203, the bottom fixed mounting of heat-conducting plate 206 has radiating fin 207, the bottom fixed mounting of heat-conducting plate 206 has support column 205, port fixed mounting has second metal protection network 208 on the inside of mounting groove 201, the last fixed surface of heat-conducting plate 206 installs electronic component 14, second metal protection network 208 set up can prevent the inside that the foreign matter from getting into mounting groove 201, thereby guarantee radiator fan 204's normal operating, heat-conducting plate 206 has the heat conductivity, can be quick conduct on radiating fin 207 with the heat that electronic component produced, thereby accelerate radiating efficiency.

The top wall of the inner part of the machine body 1 is fixedly provided with a fixed column 3, the inner part of the fixed column 3 is fixedly provided with a buffer spring 4, the upper surface of the machine body 1 is provided with a jack 6, the jack 6 is internally inserted with an inserted column 7, the arrangement of the buffer spring 4 can ensure that a protection plate 8 can perform a buffer action when receiving an upper impact force, thereby achieving a protection action on the BMS processing device, the top end of the inserted column 7 is fixedly provided with the protection plate 8, the bottom end of the inserted column 7 is fixedly provided with a pressing block 5, the upper surface of the protection plate 8 is bonded with a rubber pad 9, the arrangement of the rubber pad 9 can perform a protection action on the upper surface of the protection plate 8, the rubber pad 9 is made of rubber material, has elasticity and can achieve a buffer action, the inner bottom wall of the machine body 1 is fixedly provided with a support column 205, the bottom of the machine body 1 is provided with a mounting groove 201, and the support column 205 can support a heat conducting plate 206, the middle part of the upper surface of the machine body 1 is provided with a heat dissipation port 12, the inside of the heat dissipation port 12 is fixedly provided with a heat dissipation pore plate 13, the lower port of the inside of the heat dissipation port 12 is fixedly provided with a dust screen, the dust screen can prevent dust from entering the inside of the machine body 1 through a heat dissipation hole on the heat dissipation pore plate 13, the front surface of the machine body 1 is provided with a butt joint groove, the inside of the butt joint groove is fixedly provided with a butt joint port 15, the left end of the bottom of the machine body 1 is fixedly provided with a mounting plate 10, the upper surface of the mounting plate 10 is provided with a fastening hole 11, the mounting plate 10 and the fastening hole 11 can be conveniently and fixedly mounted on a BMS processing device, the heat dissipation fan 204 is arranged at the bottom of the machine body 1, the heat dissipation fan 204 is started to dissipate heat inside the machine body 1, the heat conduction plate 206 is arranged inside the machine body 1 and is supported by a support column 205, make heat-conducting plate 206 unsettled in the inside of organism 1, it can improve the thermal diffusivity of heat-conducting plate 206 to increase radiating fin 207 in the bottom of heat-conducting plate 206, the temperature risees when electronic component 14 moves for a long time, and give heat-conducting plate 206 and radiating fin 207 with the temperature transmission, the radiating area has increased, start radiator fan 204 and carry out the forced air cooling to radiating fin 207 and heat-conducting plate 206 bottom, the flow direction of wind can be through electronic component 14's surface to its heat dissipation simultaneously, its radiating efficiency has been improved greatly, make BMS processing apparatus more stable of operation, and the service life thereof is also prolonged simultaneously.

In the actual operation process, when the device is used, the heat dissipation fan 204 is arranged at the bottom of the machine body 1, the heat dissipation fan 204 is started to dissipate heat inside the machine body 1, the heat conduction plate 206 is arranged inside the machine body 1 and supported by the support columns 205, the heat conduction plate 206 is suspended inside the machine body 1, the heat dissipation performance of the heat conduction plate 206 can be improved by adding the heat dissipation fins 207 at the bottom of the heat conduction plate 206, when the electronic element 14 runs for a long time, the temperature is increased and is transmitted to the heat conduction plate 206 and the heat dissipation fins 207, the heat dissipation area of the electronic element is increased, the heat dissipation fan 204 is started to cool the bottoms of the heat dissipation fins 207 and the heat conduction plate 206, and meanwhile, the flowing direction of air can dissipate heat of the electronic element 14 through the surface of the electronic element, the heat dissipation efficiency of the electronic element is greatly improved, the running of the BMS processing device is more stable, and the service life of the BMS processing device is prolonged.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. The term "comprising", without further limitation, means that the element so defined is not excluded from the group consisting of additional identical elements in the process, method, article, or apparatus that comprises the element.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A BMS processing device with good heat dissipation, comprising a body (1), a heat dissipation mechanism (2) and a protective plate (8), characterized in that the heat dissipation mechanism (2) is arranged inside the body (1), and the The protective plate (8) is arranged on the upper surface of the body (1);

The heat dissipation mechanism (2) comprises an installation groove (201) and a heat conduction plate (206), a cooling fan (204) is fixedly installed in the installation groove (201), and a lower inner port of the installation groove (201) is fixed A first metal protective screen (202) is installed, a dust filter screen (203) is fixedly installed inside the installation groove (201), and a heat dissipation fin (207) is fixedly installed at the bottom of the heat conduction plate (206), A support column (205) is fixedly installed on the bottom of the heat conducting plate (206).

2. A BMS processing device with good heat dissipation according to claim 1, characterized in that: a second metal protective net (208) is fixedly installed on the inner upper port of the installation groove (201), and the heat conduction plate Electronic components (14) are fixedly mounted on the upper surface of (206).

3. A BMS processing device with good heat dissipation according to claim 1, characterized in that: a fixing column (3) is fixedly installed on the inner top wall of the body (1), and the fixing column (3) is A buffer spring (4) is fixedly installed inside, an insertion hole (6) is opened on the upper surface of the body (1), and a post (7) is inserted into the insertion hole (6).

4 . The BMS processing device with good heat dissipation according to claim 3 , wherein a protective plate ( 8 ) is fixedly installed on the top of the plug ( 7 ), and the bottom of the plug ( 7 ) is fixedly installed. 5 . A pressing block (5) is fixedly installed at the end, and a rubber pad (9) is adhered to the upper surface of the protective plate (8).

5. A BMS processing device with good heat dissipation according to claim 1, characterized in that: a support column (205) is fixedly installed on the inner bottom wall of the body (1), and the bottom of the body (1) is fixedly installed with a support column (205). A mounting slot (201) is opened.

6. A BMS processing device with good heat dissipation according to claim 1, characterized in that: a heat dissipation port (12) is opened in the middle of the upper surface of the body (1), and the inside of the heat dissipation port (12) A heat dissipation hole plate (13) is fixedly installed, and a dust filter is fixedly installed at the inner lower port of the heat dissipation port (12).

7. A BMS processing device with good heat dissipation according to claim 1, characterized in that: a docking slot is opened on the front of the body (1), and a docking port (15) is fixedly installed inside the docking slot. A mounting plate (10) is fixedly installed at the bottom left end of the body (1), and a fastening hole (11) is opened on the upper surface of the mounting plate (10).