CN215268991U - Packaging structure of module power supply - Google Patents
Packaging structure of module power supply Download PDFInfo
- Publication number
- CN215268991U CN215268991U CN202120938266.6U CN202120938266U CN215268991U CN 215268991 U CN215268991 U CN 215268991U CN 202120938266 U CN202120938266 U CN 202120938266U CN 215268991 U CN215268991 U CN 215268991U
- Authority
- CN
- China
- Prior art keywords
- groove
- inclined plane
- bonding
- glue
- bottom plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Abstract
The utility model discloses a packaging structure of a module power supply, which comprises a middle frame and a bottom plate, wherein the middle frame is provided with a bonding plate, the bottom plate is provided with a groove, the bottom of the groove is provided with an in-groove convex part and a first glue overflow accommodating groove, the in-groove convex part is provided with a first bonding inclined plane coated with adhesive, the first glue overflow accommodating groove is positioned at one side of the in-groove convex part, the first glue overflow containing groove is connected with the lower end of the first bonding inclined plane, the bottom surface of the bonding plate is provided with an inner concave part for containing the convex part in the groove, the concave part is provided with a second bonding inclined plane which is bonded with the first bonding inclined plane through the adhesive, one end of the second bonding inclined plane is abutted against the high-level end of the first bonding inclined plane, a glue containing gap is arranged between the first bonding inclined plane and the second bonding inclined plane, the gap width of the glue accommodating gap is gradually increased from the high-position end to the low-position end of the first bonding inclined plane. When sticky center and bottom plate, the utility model discloses can avoid appearing overflowing gluing between center and the bottom plate.
Description
Technical Field
The utility model relates to a module power technical field particularly, relates to an encapsulation structure of module power.
Background
Most of the packaging process modes of DC/DC brick type packaging power supply users used in the current market are that firstly, a bottom plate and an internal printed board (circuit board) are placed in a clamping groove of a packaging jig together; then pouring a proper amount of pouring sealant; then, covering the upper shell of the pentahedron, locking screws in the stud holes to enable the upper shell and the bottom plate to be tightly matched together, and detaching the encapsulation jig; then, putting the whole DC/DC module power supply into an oven for baking to cure the potting adhesive; and finally, taking down the screw on the power screw hole of the DC/DC module, and removing the pouring sealant overflowing from the surface.
The present published chinese utility model with the patent name "packaging structure and module power supply of high reliability module power supply", publication number CN211931052U, divides the original upper shell into an upper cover and a middle frame, makes the middle frame and the bottom plate be glued and fixed, then puts the circuit board into the combination of the middle frame and the bottom plate after the above-mentioned connection, installs the upper cover on the above-mentioned combination again, makes above-mentioned bottom plate, middle frame, circuit board and upper cover form a complete module power supply.
However, the middle frame and the bottom plate in the above patent are easy to be glued together, and when the adhesive overflows into the middle frame, the overflow will affect the positioning and installation of the circuit board.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a packaging structure of module power, its packaging structure to the module power designs, when sticky center and bottom plate, can avoid appearing overflowing gluey between center and the bottom plate.
The embodiment of the utility model discloses a realize through following technical scheme:
a packaging structure of a module power supply comprises a middle frame and a bottom plate, wherein the middle frame is provided with a bonding plate, the bottom plate is provided with a groove for accommodating the bonding plate, the bottom of the groove is provided with an in-groove convex part and a first glue overflow containing groove, the in-groove convex part is provided with a first bonding inclined plane coated with adhesive, the first glue overflow containing groove is positioned at one side of the in-groove convex part, the first glue overflow containing groove is connected with the lower end of the first bonding inclined plane, the bottom surface of the bonding plate is provided with an inner concave part for containing the convex part in the groove, the concave part is provided with a second bonding inclined plane which is bonded with the first bonding inclined plane through the adhesive, one end of the second bonding inclined plane is abutted against the high-level end of the first bonding inclined plane, a glue containing gap is arranged between the first bonding inclined plane and the second bonding inclined plane, the gap width of the glue accommodating gap is gradually increased from the high-position end to the low-position end of the first bonding inclined plane.
In an embodiment of the present invention, the glue container further includes a second glue overflow containing groove, the second glue overflow containing groove and the first glue overflow containing groove are symmetrically located on two sides of the protrusion in the groove.
In an embodiment of the present invention, the groove is further configured with a third glue overflow receiving space, the third glue overflow receiving space extends from the side wall of the groove to the center of the bottom plate, the bottom surface of the bonding board is further configured with a plurality of glue overflow channels, and the glue overflow channels are connected to the first glue overflow receiving space and the third glue overflow receiving space.
In an embodiment of the present invention, a cross section of the protrusion in the groove is triangular, and a cross section of the inner recess is also triangular.
In an embodiment of the present invention, the groove has a first positioning slope, the first positioning slope and the connection of the first bonding slope form a triangle vertex, the inner concave portion has a second positioning slope, the connection of the second bonding slope and the second positioning slope also forms a triangle vertex, and the second positioning slope can be attached to the first positioning slope.
In an embodiment of the present invention, the cross section of the first glue overflow containing groove is configured to be an isosceles trapezoid with a large top and a small bottom.
In an embodiment of the present invention, the cross section of the second glue overflow containing groove is configured to be an isosceles trapezoid with a large top and a small bottom.
The utility model discloses technical scheme has following advantage and beneficial effect at least:
the embodiment of the utility model provides a through setting up the groove bottom of the groove at the bottom plate and setting up tank bottom bulge and first excessive glue storage tank, set up the concave part in the bonding board bottom surface of center, the tank bottom bulge is equipped with the first bonding inclined plane that coats the adhesive, the concave part is equipped with the second bonding inclined plane that bonds with first bonding inclined plane, and first bonding inclined plane high-order end and second bonding inclined plane, be provided with between first bonding inclined plane low-order end and the second bonding inclined plane and hold the gluey clearance, when bonding, utilize the bonding of first bonding inclined plane and second bonding inclined plane to realize the effective bonding of center and bottom plate, also utilize the holding gluey clearance between first bonding inclined plane and the second bonding inclined plane to guide the directional flow of unnecessary adhesive to in the first excessive glue storage tank, realize the temporary storage of unnecessary adhesive through first excessive glue adhesive, avoid the adhesive to spill over to the outside the groove, when gluing center and bottom plate, and the glue overflow between the middle frame and the bottom plate is avoided.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged view of a portion of FIG. 1;
FIG. 3 is a schematic structural view of the middle frame and the bottom plate of the present invention;
FIG. 4 is a schematic structural view of a bonding plate according to the present invention;
fig. 5 is a schematic structural view of the glue overflow passage of the present invention.
Icon: 1-middle frame, 11-bonding plate, 2-bottom plate, 21-groove, 3-in-groove projection, 31-first bonding inclined plane, 32-first positioning inclined plane, 4-first glue overflow containing groove, 5-inner concave part, 51-second bonding inclined plane, 52-second positioning inclined plane, 6-glue containing gap, 7-second glue overflow containing groove, 81-third glue overflow containing groove and 82-glue overflow channel.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that if the directions or positional relationships indicated by the terms "inside" and "outside" are based on the directions or positional relationships shown in the drawings, or the directions or positional relationships that the products of the present invention are usually placed when used, the description is only for convenience of description and simplification, but the indication or suggestion that the indicated device or element must have a specific direction, be constructed and operated in a specific direction, and therefore, should not be interpreted as a limitation of the present invention.
In the description of the present invention, it should be further noted that unless otherwise explicitly stated or limited, the terms "disposed," "mounted," "configured," and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1 to 5, a package structure of a module power supply includes a middle frame 1 and a bottom plate 2, the middle frame 1 is provided with a bonding plate 11, the bottom plate 2 is provided with a groove 21 for accommodating the bonding plate 11, a groove bottom of the groove 21 is provided with an in-groove protrusion 3 and a first glue-overflow accommodating groove 4, the in-groove protrusion 3 is provided with a first bonding inclined plane 31 coated with a bonding agent, the first glue-overflow accommodating groove 4 is located at one side of the in-groove protrusion 3, the first glue-overflow accommodating groove 4 is connected with a lower end of the first bonding inclined plane 31, the bottom surface of the bonding plate 11 is provided with an inner recess 5 for accommodating the in-groove protrusion 3, the inner recess 5 is provided with a second bonding inclined plane 51, the second bonding inclined plane 51 is bonded with the first bonding inclined plane 31 by the bonding agent, one end of the second bonding inclined plane 51 is abutted with a higher end of the first bonding inclined plane 31, a glue-accommodating gap 6 is provided between the first bonding inclined plane 31 and the second bonding inclined plane 51, the gap width of the glue containing gap 6 gradually increases from the high end to the low end of the first bonding inclined surface 31.
When the middle frame 1 and the bottom plate 2 are adhered, in order to avoid glue overflow between the middle frame 1 and the bottom plate 2, in the technical scheme, a groove bottom protruding portion and a first glue overflow accommodating groove 4 are arranged at the bottom of a groove 21 of the bottom plate 2, in the embodiment, the cross section of the groove inside protruding portion 3 is in a triangular shape, the cross section of the inner concave portion 5 is in a triangular shape, two inclined surfaces of the groove inside protruding portion 3 are a first bonding inclined surface 31 and a first positioning inclined surface 32 respectively, two inclined surfaces of the inner concave portion 5 are a second bonding inclined surface 51 and a second positioning inclined surface 52 respectively, the first bonding inclined surface 31 is coated with a bonding agent, the first glue overflow accommodating groove 4 is located at the lower end of the first bonding inclined surface 31, and the first glue overflow accommodating groove 4 is connected with the lower end of the first bonding inclined surface 31. A glue containing gap 6 is arranged between the first bonding inclined surface 31 and the second bonding inclined surface 51, and the gap width of the glue containing gap 6 is gradually increased from the high-position end to the low-position end of the first bonding inclined surface 31. When the middle frame 1 and the bottom plate 2 are bonded, the second bonding inclined surface 51 is close to the first bonding inclined surface 31 to extrude the adhesive, when the second bonding inclined surface 51 is abutted against the high-position end of the first bonding inclined surface 31, the relative position between the middle frame 1 and the bottom plate 2 is close to the limit position, at the moment, the gap between the first bonding inclined surface 31 and the second bonding inclined surface 51 is the glue containing gap 6, the glue containing gap 6 is filled with the adhesive, and the first bonding inclined surface 31 and the second glossy inclined surface are effectively bonded through the glue containing gap 6. In the process that the second bonding inclined plane 51 is gradually close to the first bonding inclined plane 31, that is, in the process that the gap value of the glue containing gap 6 is gradually reduced to the minimum, because one end of the glue containing gap 6 is a closed end and the other end is an open end, the redundant adhesive in the glue containing gap 6 flows to the open end of the glue containing gap 6 until the redundant adhesive flows into the first glue overflow containing groove 4 for temporary storage, the adhesive is prevented from overflowing out of the groove 21, and when the middle frame 1 and the bottom plate 2 are adhered, the glue overflow between the middle frame 1 and the bottom plate 2 is avoided.
In addition, the cross sections of the groove inner protrusion 3 and the groove inner protrusion 5 are both triangular, the first positioning inclined surface 32 is provided on the groove inner protrusion 3, the second positioning inclined surface 52 is provided on the groove inner protrusion 5, the joint of the first positioning inclined surface 32 and the first bonding inclined surface 31 forms a vertex of a triangular shape, the joint of the second positioning inclined surface 52 and the second bonding inclined surface 51 forms a vertex of a triangular shape, and the second positioning inclined surface 52 can be bonded to the first positioning inclined surface 32. When the middle frame 1 and the bottom plate 2 are bonded, the coarse positioning of the middle frame 1 and the bottom plate 2 is realized by utilizing the in-groove convex parts 3 and the inner concave parts 5 which are in triangular shapes, the fine positioning of the middle frame 1 and the bottom plate 2 is realized by utilizing the first positioning inclined planes 32 and the second positioning inclined planes 52, and the middle frame 1 is prevented from being displaced relative to the bottom plate 2 along the bottom plane of the groove 21 due to the closed annular structure of the whole groove 21.
In some embodiments, the adhesive container further comprises a second overflow glue containing groove 7, the second overflow glue containing groove 7 and the first overflow glue containing groove 4 are symmetrically disposed at two sides of the in-groove protrusion 3, when a part of the adhesive overflows from between the first positioning inclined plane 32 and the second positioning inclined plane 52, the second overflow glue containing groove 7 can be used to collect and temporarily store the overflowed adhesive, so as to prevent glue overflow between the middle frame 1 and the bottom plate 2.
In some embodiments, the groove 21 is further configured with a third glue overflow receiving groove 81, the third glue overflow receiving groove 81 extends from the sidewall of the groove 21 to the center of the bottom plate 2, the bottom surface of the bonding board 11 is further configured with a plurality of glue overflow channels 82, the glue overflow channels 82 are communicated with the first glue overflow receiving groove 4 and the third glue overflow receiving groove 81, when the first bonding inclined plane 31 is coated with too much glue and the first glue overflow receiving groove 4 is filled with overflowed glue, in order to further expand the space for temporarily storing glue overflow and avoid glue overflow to the outside of the groove 21, the sidewall of the groove 21 is configured with the third glue overflow receiving groove 81 like a cat ear hole, and the bottom surface of the bonding board 11 is configured with a plurality of glue overflow channels 82, the overflowed glue in the first glue overflow receiving groove 4 flows to the third glue overflow receiving groove 81 through the glue overflow channels 82 under the driving of pressure, so as to temporarily store the excessive glue, the glue overflow is avoided from reaching the outside of the groove 21, and the purpose of avoiding the glue overflow between the middle frame 1 and the bottom plate 2 is achieved.
In some embodiments, the cross section of the first flash receiving groove 4 is configured to be an isosceles trapezoid with a large top and a small bottom. In some embodiments, the cross section of the second flash receiving groove 7 is configured to be an isosceles trapezoid with a large top and a small bottom.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A packaging structure of a module power supply comprises a middle frame and a bottom plate, wherein the middle frame is provided with a bonding plate, the bottom plate is provided with a groove for accommodating the bonding plate, the packaging structure is characterized in that,
the bottom of the groove is provided with an in-groove convex part and a first glue overflow containing groove,
the groove inner convex part is provided with a first bonding inclined plane coated with adhesive, the first glue overflow containing groove is positioned at one side of the groove inner convex part and is connected with the lower end of the first bonding inclined plane,
the bottom surface of the bonding plate is provided with an inner concave part for accommodating the convex part in the groove, the inner concave part is provided with a second bonding inclined plane, the second bonding inclined plane is bonded with the first bonding inclined plane through the adhesive, one end of the second bonding inclined plane is abutted against the high-position end of the first bonding inclined plane,
a glue containing gap is arranged between the first bonding inclined plane and the second bonding inclined plane, and the width of the glue containing gap is gradually increased from the high-position end to the low-position end of the first bonding inclined plane.
2. The packaging structure of a modular power supply of claim 1,
also comprises a second glue overflowing containing groove,
the second glue overflow containing groove and the first glue overflow containing groove are symmetrically arranged at two sides of the protruding part in the groove.
3. The packaging structure of a modular power supply of claim 1,
the groove is also provided with a third glue overflow containing groove which extends from the side wall of the groove to the center of the bottom plate,
the bottom surface of the bonding plate is also provided with a plurality of glue overflowing channels which are communicated with the first glue overflowing containing groove and the third glue overflowing containing groove.
4. The packaging structure of a modular power supply of claim 1,
the cross section of the convex part in the groove is triangular,
the cross section of the concave part is also in a triangular shape.
5. The packaging structure of a modular power supply of claim 4,
the groove inner convex part is also provided with a first positioning inclined plane, the joint of the first positioning inclined plane and the first bonding inclined plane forms a triangular peak,
the concave part is also provided with a second positioning inclined plane, the joint of the second positioning inclined plane and the second bonding inclined plane also forms a triangular peak,
the second positioning inclined plane can be attached to the first positioning inclined plane.
6. The packaging structure of a modular power supply of claim 1,
the cross section of the first glue overflow containing groove is configured to be an isosceles trapezoid with a large upper part and a small lower part.
7. The packaging structure of a modular power supply of claim 2,
the cross section of the second glue overflow containing groove is configured to be an isosceles trapezoid with a large upper part and a small lower part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120938266.6U CN215268991U (en) | 2021-04-30 | 2021-04-30 | Packaging structure of module power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120938266.6U CN215268991U (en) | 2021-04-30 | 2021-04-30 | Packaging structure of module power supply |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215268991U true CN215268991U (en) | 2021-12-21 |
Family
ID=79453649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120938266.6U Active CN215268991U (en) | 2021-04-30 | 2021-04-30 | Packaging structure of module power supply |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215268991U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114828500A (en) * | 2022-05-20 | 2022-07-29 | Oppo广东移动通信有限公司 | Electronic equipment, shell assembly and middle frame |
-
2021
- 2021-04-30 CN CN202120938266.6U patent/CN215268991U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114828500A (en) * | 2022-05-20 | 2022-07-29 | Oppo广东移动通信有限公司 | Electronic equipment, shell assembly and middle frame |
| CN114828500B (en) * | 2022-05-20 | 2023-12-29 | Oppo广东移动通信有限公司 | Electronic equipment, shell assembly and middle frame |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN215268991U (en) | Packaging structure of module power supply | |
| CN218449994U (en) | Photovoltaic module frame and photovoltaic module | |
| CN209183611U (en) | Battery modules | |
| JP3780975B2 (en) | Capacitor manufacturing method and capacitor | |
| CN116826274A (en) | Battery assembly structure, battery and assembly method thereof | |
| CN214850934U (en) | Fuel cell DC-DC power module and fuel cell power supply system thereof | |
| KR100915545B1 (en) | Battery pack | |
| CN206799504U (en) | A kind of release paper structure of gum being easy to tool positioning | |
| CN112563635B (en) | Battery module and automobile | |
| CN106097911B (en) | Display module, the display equipment with display module, and preparation method thereof | |
| CN213500952U (en) | Attached frock of bubble cotton | |
| CN211320163U (en) | Battery box | |
| CN221728287U (en) | Junction box | |
| CN219163536U (en) | Cover plate structure of battery cell | |
| CN215819088U (en) | Battery panel fixing structure | |
| CN111430621A (en) | Battery pack | |
| CN217823045U (en) | Square battery cell module utilizing side plate for glue filling | |
| CN116782542B (en) | Shell assembly and terminal equipment | |
| CN217823190U (en) | Battery device | |
| CN221379564U (en) | Battery module and battery pack | |
| CN220527204U (en) | End cover device and base station antenna thereof | |
| CN218830754U (en) | Circuit board assembly and electronic equipment | |
| CN209366439U (en) | Spider integration unmanned plane | |
| CN218039490U (en) | Large aluminum shell battery top cover paster | |
| CN210794282U (en) | Toilet lid buffering packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |