CN215268498U

CN215268498U - Infrared thermal imaging device

Info

Publication number: CN215268498U
Application number: CN202120883684.XU
Authority: CN
Inventors: 孔祥盛; 陈文祥; 王基亭; 段玉超
Original assignee: Iray Technology Co Ltd
Current assignee: Iray Technology Co Ltd
Priority date: 2021-04-27
Filing date: 2021-04-27
Publication date: 2021-12-21
Anticipated expiration: 2031-04-27

Abstract

The application discloses an infrared thermal imaging device, the device comprises a lens cone, an optical window is arranged on the lens cone, the optical window is fixedly connected with the lens cone, a wear-resistant coating is arranged on the outer surface of the optical window, a reflector component and an infrared imaging module are arranged in the lens cone, the reflector component is used for reflecting light rays transmitted through the optical window to the infrared imaging module, the infrared imaging module is used for generating infrared images according to the transmitted light rays, the infrared thermal imaging device is internally provided with a reflector which can reflect incident light rays to the infrared imaging module, so that the light rays are turned, the infrared imaging module can be transversely arranged in the thermal imaging device, the longitudinal thickness of the thermal imaging device is reduced, the thermal imaging device is longitudinally lighter and thinner, and enough space is arranged in the lens cone for placing components, better optical conditions can be provided for the thermal imaging sensor.

Description

Infrared thermal imaging device

Technical Field

The utility model relates to an infrared thermal imaging field especially relates to an infrared thermal imaging device.

Background

In the prior art, in order to meet the requirement of a user for observing the details of a target in a long focus mode, the infrared device is provided with a long focus lens with a large stepping motor for realizing automatic focusing and a zooming function, so that the longitudinal length of the infrared device is large, and the requirement of miniaturization and portability is difficult to realize.

Therefore, a thinner and lighter infrared thermal imaging device structure is needed to meet the portable requirement of the user.

SUMMERY OF THE UTILITY MODEL

In order to solve the defects of the prior art, the main object of the present invention is to provide an infrared thermal imaging device to solve the above problems of the prior art.

In order to achieve the above object, the first aspect of the present invention provides an infrared thermal imaging device, the device includes a lens barrel, be equipped with the optical window on the lens barrel, the optical window with lens barrel fixed connection, be equipped with wear-resistant coating on the surface of optical window, be equipped with speculum assembly and infrared imaging module in the lens barrel, speculum assembly is used for passing through the light reflection that the optical window spreads into extremely the infrared imaging module, the infrared imaging module is used for according to the light that spreads into generates infrared image.

In some embodiments, the apparatus further includes a gyroscope, a driving component is disposed on the mirror assembly, the gyroscope is configured to acquire a posture change of the apparatus, and the driving component is configured to drive the mirror assembly to generate a displacement relative to the apparatus according to the posture change so as to avoid light ray jitter transmitted to the infrared imaging module from causing the generated infrared image jitter.

In some embodiments, the apparatus further includes a processing chip, the driving component includes a first coil and a first magnet, and the processing chip is configured to control the first coil to be energized according to the acquired gesture change, so that an ampere force generated by the energized first coil and the energized second magnet drives the mirror assembly to generate a displacement relative to the apparatus, so as to avoid light jitter transmitted to the infrared imaging module from causing the generated infrared image jitter.

In some embodiments, the inner wall of the lens barrel is provided with an extinction stripe for reducing light reflection.

In some embodiments, a ball is disposed between the lens barrel and the mirror assembly for reducing friction between the lens barrel and the mirror assembly through rolling friction.

In some embodiments, the infrared imaging module comprises a circuit board, a mirror set and a second magnet, the mirror set is provided with a second coil, the circuit board is used for controlling the second coil to be electrified according to the focusing state of the infrared image,

the second coil and the second magnet which are electrified generate ampere force to drive the lens group to move relative to the device so as to adjust the focusing state of the infrared image.

In some embodiments, the inner wall of the lens barrel is provided with a light absorbing coating.

In some embodiments, the reflector of the reflector component is provided with a high reflective dielectric film for improving the intensity of the reflected light.

In some embodiments, a surface of the ball is coated with a lubricating oil.

In some embodiments, the infrared imaging module is generated using wafer level packaging.

The utility model discloses the beneficial effect who realizes does:

the application provides an infrared thermal imaging device, the device includes the lens cone, be equipped with the optical window on the lens cone, the optical window with lens cone fixed connection, be equipped with wear-resistant coating on the surface of optical window, be equipped with speculum subassembly and infrared imaging module in the lens cone, speculum subassembly is used for passing through light that the optical window spreads into reflect extremely infrared imaging module, infrared imaging module is used for the basis infrared image is generated to light that spreads into, this application through set up the speculum in infrared thermal imaging device, the speculum can be with the light reflection of incident to infrared imaging module on to realized turning to of light, infrared module can transversely set up in thermal imaging device, reduced thermal imaging device's vertical thickness, make thermal imaging device's vertical more frivolous, have enough spaces in the lens cone to carry out many lens group design, The automatic focusing module and the infrared shutter assembly are arranged, so that better optical conditions can be provided for the thermal imaging sensor;

further, this application has still provided the device and has still included the gyroscope, be equipped with drive assembly on the reflector assembly, the gyroscope is used for gathering the gesture of device changes, and drive assembly is used for the basis the gesture changes the drive reflector assembly takes place relatively the displacement of device is in order to avoid afferent the light shake of infrared imaging module leads to generating infrared image shake has realized adjusting the gesture of reflector assembly through drive assembly, can produce optics anti-shake effect.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a block diagram of an infrared thermal imaging apparatus provided in an embodiment of the present application;

fig. 2 is an exploded view of a mirror assembly provided in an embodiment of the present application.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the following description will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

An infrared thermal imaging apparatus according to an embodiment of the present application is described in detail below with reference to the drawings.

As shown in fig. 1, the infrared thermal imaging apparatus provided by the present application includes a lens barrel 2, a light-passing opening is formed in the lens barrel 2, and a light window 7 is formed in the light-passing opening.

Preferably, in order to prevent dust from entering the thermal imaging device through the gap between the lens barrel 2 and the optical window 7, the optical window 7 and the lens barrel 2 may be fixedly connected by glue, so as to prevent dust and other small particles from entering the infrared module and affecting the infrared imaging quality.

Preferably, the outer surface of the light window 7 may be coated with a DLC-like diamond film layer to increase the wear and corrosion resistance of the outer surface. The inner wall of the lens cone can be provided with a low-emission high-absorption coating 4 and can be provided with light eliminating lines so as to reduce the propagation of stray light and avoid the imaging ghost image problem caused by multiple reflections.

The lens cone is internally provided with a reflector component and an infrared imaging module, and the infrared imaging module comprises a lens group 5, a shutter component 16, an infrared focal plane chip 3 and a circuit board 10. The lens assembly 5 includes one or more lens sheets for transmitting the light reflected by the mirror assembly onto the lens assembly 5 to the infrared focal plane chip 3. The infrared focal plane chip 3 can convert the incident infrared rays into corresponding electrical signals and transmit the electrical signals to the circuit board 10 through electrical connection, so that the circuit board 10 outputs the corresponding signals. The circuit board 10 is a combination of soft and hard boards, wherein the soft boards can be used for signal extraction and power supply control.

Two sides of the lens group 5 are provided with a coil 11A and a coil 11B which are symmetrical, and two sides of the infrared imaging module are provided with a magnet 10A and a magnet 10B which are symmetrical. The

coils

11A and 11B are connected with the circuit board 10 through symmetrical memory alloy wires 17. When the infrared image output by the infrared imaging module is not focused, the circuit board 10 can supply power to the coil 11A and the coil 11B through the memory alloy wire 17, the memory alloy wire can deform, and the energized coil 11A and the energized coil 11B, the energized magnet 10A and the energized magnet 10B can generate an ampere force to enable the lens group to move along the optical axis direction, so that an automatic focusing effect is generated. When focusing is not required, the memory alloy wire 17 and the

coils

11A and 11B are powered off, so that the memory alloy wire returns to the original shape and the lens assembly 5 returns to the original position.

The mirror assembly comprises a mirror 6 and a structure 8 for supporting the mirror 6. In order to reduce the loss of infrared radiation in the transmission process and improve the radiation intensity reaching the infrared imaging module, a high-reflection dielectric film can be plated on the surface of the reflector 6. Preferably, the structural part 8 can be fixedly connected to the reflector 6. The high-reflection dielectric film can also avoid transmitting the heating of the coil to an imaging plane of the imaging module to cause imaging abnormity. The light 1 can reach the surface of the reflector through the light window 7, then is reflected to the mirror group 5 by the reflector 6, and then is transmitted to the infrared focal plane chip by the mirror group 5.

The structure fixing part 12 is arranged between the lens barrel 2 and the structural part 8, the structure fixing part 12 is fixedly connected with the lens barrel 2, a groove is formed in the structure fixing part 12, a ball 15A and a ball 15B are arranged in the groove, and lubricating oil is coated on the surface of each ball so as to further reduce the friction between the structural part 12 and the structural part 8 when the structural part 8 displaces.

As shown in fig. 2,

magnets

9A and 9B and

coils

18A and 18B are provided on both sides of the structure 8, respectively, and are symmetrically positioned. The bottom of the structure 8 is provided with a magnet 14 and a coil 13. When the thermal imaging device is impacted by the outside to cause picture shaking, the posture of the gyroscope acquisition device preset in the lens cone is changed and transmitted to the processing chip, and the processing chip controls the coil 18A, the coil 18B and the coil 13 to be electrified according to the posture change. The coil 18A, the coil 18B and the coil 13 and the magnet 9A as well as the magnet 9B and the magnet 14 which are electrified generate ampere force to drive the reflector component to generate displacement relative to the device so as to adjust the posture of the reflector component, and the generated infrared image shake caused by the shake of light rays transmitted into the infrared imaging module is avoided.

The infrared imaging module can be generated through wafer level packaging, and has smaller volume and lower cost compared with a traditional thermal imager packaged by metal ceramic and a refrigeration thermal imager.

The application provides an infrared thermal imaging device structure in the time of follow-up improvement optics zoom ability and increase subassembly, can realize through the length that increases its optical axis direction, though device length will lengthen the height of module can not increase to under the condition that can not increase its thickness, match different demands as far as, expand its use scene.

In the description of the present invention, it should be understood that the terms "X axis", "Y axis", "Z axis", "vertical", "parallel", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate the orientation or positional relationship indicated based on the drawings, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims

1. The infrared thermal imaging device is characterized by comprising a lens barrel, wherein an optical window is arranged on the lens barrel and fixedly connected with the lens barrel, a wear-resistant coating is arranged on the outer surface of the optical window, a reflector assembly and an infrared imaging module are arranged in the lens barrel, the reflector assembly is used for reflecting light rays transmitted through the optical window to the infrared imaging module, and the infrared imaging module is used for generating an infrared image according to the transmitted light rays.

2. The apparatus according to claim 1, further comprising a gyroscope, wherein a driving component is disposed on the mirror assembly, the gyroscope is configured to acquire a posture change of the apparatus, and the driving component is configured to drive the mirror assembly to displace relative to the apparatus according to the posture change so as to avoid a shake of the infrared image generated due to a shake of light rays transmitted into the infrared imaging module.

3. The apparatus according to claim 2, further comprising a processing chip, wherein the driving component comprises a first coil and a first magnet, and the processing chip is configured to control the first coil to be energized according to the acquired gesture change, so that an ampere force generated by the energized first coil and the energized second magnet drives the mirror assembly to displace relative to the apparatus to avoid light jitter introduced into the infrared imaging module from causing the generated infrared image jitter.

4. The device according to any one of claims 1 to 3, wherein the inner wall of the lens barrel is provided with an extinction mark for reducing light reflection.

5. The apparatus according to claim 2 or 3, wherein a ball is provided between the lens barrel and the mirror assembly for reducing friction between the lens barrel and the mirror assembly by rolling friction.

6. The device according to any one of claims 1-3, wherein said infrared imaging module comprises a circuit board, a mirror set and a second magnet, said mirror set is provided with a second coil, said circuit board is used for controlling said second coil to be energized according to the focusing status of said infrared image,

7. A device according to any of claims 1 to 3, wherein the inner wall of the barrel is provided with a light absorbing coating.

8. The apparatus according to any one of claims 1 to 3, wherein the mirror of the mirror assembly is provided with a high reflective dielectric film for increasing the intensity of the reflected light.

9. The apparatus of claim 5, wherein a surface of the ball is coated with a lubricating oil.

10. The apparatus of any of claims 1-3, wherein the infrared imaging module is formed using a wafer level package.