CN215266299U - Infrared receiving module - Google Patents

Abstract

The utility model relates to an infrared receiving module, include: the support comprises a die bonding part, a cover folding part and a connecting part, the die bonding part is provided with a first edge extending along a first direction, the cover folding part is provided with a second edge extending along the first direction, the connecting part is connected with the die bonding part through the first edge, the connecting part is connected with the cover folding part through the second edge, the die bonding part, the cover folding part and the connecting part are arranged in a surrounding mode to form an accommodating space, the light sensing unit and the control chip are located in the accommodating space, the die bonding part comprises a light sensing unit die bonding area and a control chip die bonding area, the light sensing unit is arranged in the die bonding area of the control chip, the control chip is arranged in the die bonding area of the control chip, the cover folding part comprises an opening, the opening corresponds to the light sensing unit die bonding area, and the packaging shell covers the die bonding part and the cover folding part and seals the accommodating space. The infrared receiving module has smaller volume while ensuring the performance.

Description

Infrared receiving module

Technical Field

The utility model relates to an electronic component's technical field specifically relates to a less infrared receiving module of volume.

Background

An Infrared Receiver Module (IRM) is an electronic component for converting Infrared signals into electrical signals, and is also commonly referred to as an Infrared receiving head. The infrared receiving module generally includes a diode for receiving an infrared signal and a control chip, and is generally applied to the fields of communication and remote control. The infrared receiving module adopting a Surface Mount Device (SMD) type is suitable for a television or a set top box and used for receiving infrared signals transmitted by a television remote controller.

Fig. 1 is a schematic view of a bracket structure of a two-lens patch-type infrared receiving module. Referring to fig. 1, a support 100 is used to provide two Photodiode (PD) die attach regions 111, 112 and an IC die attach region 120 in an infrared receiving module. The PD die bonding areas 111 and 112 are used for fixing and mounting the PD, and the IC die bonding area 120 is used for fixing and mounting the control chip. With the trend of miniaturization of electronic products, it is desirable to minimize the volume of electronic components while maintaining the performance of the electronic components.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that an infrared receiving module that the volume is less is provided.

The utility model discloses a solve above-mentioned technical problem and the technical scheme who adopts is an infrared receiving module, include: the support comprises a die bonding part, a cover folding part and a connecting part, the die bonding part is provided with a first edge extending along a first direction, the cover folding part is provided with a second edge extending along the first direction, the connecting part is connected with the die bonding part through the first edge, the connecting part is connected with the cover folding part through the second edge, the die bonding part, the cover folding part and the connecting part are surrounded to form an accommodating space, the light sensing unit and the control chip are positioned in the accommodating space, the die bonding part comprises a die bonding area of the light sensing unit and a die bonding area of the control chip, the light sensing unit is arranged in the die bonding area of the light sensing unit, the control chip is arranged in the die bonding area of the control chip, the cover folding part comprises an opening, and the opening corresponds to the die bonding area of the light sensing unit, the packaging shell covers the die bonding part and the cover folding part and seals the accommodating space.

In an embodiment of the present invention, the folding cover further includes a shielding cover, and the shielding cover corresponds to the die bonding area of the control chip and is used for shielding the control chip.

In an embodiment of the present invention, the connecting portion includes a first hollow area, and the first hollow area is communicated with the opening.

In an embodiment of the present invention, the connecting portion includes a second hollow area, and the second hollow area is adjacent to the shielding cover.

In an embodiment of the invention, the connecting portion further includes a third hollow area and a fourth hollow area, the third hollow area is adjacent to the die bonding area of the control chip, and the fourth hollow area is adjacent to the die bonding area of the light sensing unit

In an embodiment of the invention, the opening and the shielding cover are adjacently distributed along the first direction.

In an embodiment of the present invention, the die bonding portion and the lid folding portion are parallel to each other.

In an embodiment of the present invention, the bracket further includes at least one pin, and the pin is connected to the die bonding portion.

In an embodiment of the present invention, the at least one pin extends out of the package housing, the at least one pin includes a first bending section and a second bending section, the first bending section extends along a first side surface of the package housing, the second bending section extends along a second side surface of the package housing, and the first side surface is adjacent to the second side surface.

In an embodiment of the invention, the material of the package housing includes a material blocking visible light.

In an embodiment of the present invention, the light sensing unit is respectively electrically connected to the bracket and the control chip, the control chip is electrically connected to the bracket, the light sensing unit is used for receiving an infrared ray and outputting an electrical signal according to the infrared ray, and the control chip is used for receiving and processing the electrical signal.

In an embodiment of the present invention, the light sensing unit is a photodiode, a phototransistor, or a cmos.

The utility model discloses a solid brilliant portion and the book lid portion that infrared receiving module's support adopted relative setting have reduced the volume of support, adopt shielding lid shielding control chip, have reduced infrared receiving module's volume when guaranteeing infrared receiving module performance, have reduced the manufacturing cost of component to under the finite space, it is regional to strengthen shielding, strengthens anti electromagnetic interference's ability.

Drawings

In order to make the aforementioned objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings, wherein:

FIG. 1 is a schematic view of a bracket structure of a two-lens patch-type infrared receiving module;

fig. 2 is a schematic perspective view of a bracket of an infrared receiving module according to an embodiment of the present invention;

fig. 3 is a schematic view of an internal structure of an infrared receiving module according to an embodiment of the present invention;

fig. 4A and 4B are schematic plan views showing the support of the infrared receiving module according to an embodiment of the present invention;

fig. 5A and 5B are schematic views of the bracket of the infrared receiving module of the embodiment shown in fig. 4A and 4B after being bent once;

fig. 6 is a schematic perspective view of a bracket of the infrared receiving module of the embodiment shown in fig. 2;

fig. 7 is a schematic perspective view of an infrared receiving module according to an embodiment of the present invention.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described herein, and thus the present invention is not limited by the specific embodiments disclosed below.

As used in this application and the appended claims, the terms "a," "an," "the," and/or "the" are not intended to be inclusive in the singular, but rather are intended to be inclusive in the plural unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that steps and elements are included which are explicitly identified, that the steps and elements do not form an exclusive list, and that a method or apparatus may include other steps or elements.

The relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present application unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

In the description of the present application, it is to be understood that the orientation or positional relationship indicated by the directional terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc., are generally based on the orientation or positional relationship shown in the drawings, and are used for convenience of description and simplicity of description only, and in the case of not making a reverse description, these directional terms do not indicate and imply that the device or element being referred to must have a particular orientation or be constructed and operated in a particular orientation, and therefore, should not be considered as limiting the scope of the present application; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of protection of the present application is not to be construed as being limited. Further, although the terms used in the present application are selected from publicly known and used terms, some of the terms mentioned in the specification of the present application may be selected by the applicant at his or her discretion, the detailed meanings of which are described in relevant parts of the description herein. Further, it is required that the present application is understood not only by the actual terms used but also by the meaning of each term lying within.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the following embodiments are illustrative of the infrared receiving module embodying the technical idea of the present invention, and the infrared receiving module of the present invention is not limited to the following. In the present specification, the members shown in the columns of "claims" and "contents of utility" are assigned numbers corresponding to the members shown in the examples in order to make the scope of the claims easier to understand. However, the members shown in the claims are by no means specified as members of the embodiments. In particular, the dimensions, materials, shapes, relative arrangements of the constituent members, and the like described in the embodiments are not intended to limit the scope of the present invention to these, unless otherwise specified, but merely as illustrative examples.

However, the dimensions, positional relationships, and the like of the members shown in the drawings may be exaggerated for clarity of description. In the following description, the same names and symbols indicate the same or similar members, and detailed description thereof will be omitted as appropriate. Further, each element constituting the present invention may be configured such that a plurality of elements are constituted by the same member and one member shares a plurality of elements, or conversely, the function of one member may be shared by a plurality of members. Note that the contents described in some of the examples and embodiments can be applied to other examples and embodiments. In the present specification, the term "upper" is used not only to mean a case where the upper surface is in contact with the upper surface, but also to include a case where the upper surface is formed separately, and also to include a case where a layer is interposed between layers.

The utility model discloses an infrared receiving module includes support, light sensing unit, control chip and encapsulation casing. The bracket is used for fixing the light sensing unit and the control chip and providing a frame for a packaging shell of the infrared receiving module; the light sensing unit and the control chip are respectively electrically connected with the bracket, and the light sensing unit is electrically connected with the control chip; the light sensing unit is used for receiving infrared rays and outputting an electric signal according to the infrared rays; the control chip is electrically connected with the light sensing unit and is used for processing the received electric signals, so that the function of the infrared receiving module is realized.

In one embodiment, the light sensing unit may be a photodiode (Photo Diode), a phototransistor (Photo Transistor), or a complementary metal-Oxide-Semiconductor (CMOS).

The utility model discloses a support of infrared receiving module compares the volume with the support of the infrared receiving module that figure 1 is shown and obviously reduces, and the infrared receiving module has less volume on the whole, is suitable for the product demand that reduces day by day.

Fig. 2 is a schematic perspective view of a bracket of an infrared receiving module according to an embodiment of the present invention. Referring to fig. 2, the bracket 200 includes a die attach portion 210, a lid folding portion 220 and a connecting portion 230, the die attach portion 210 has a first edge 213 extending along a first direction D1, the lid folding portion 220 has a second edge 223 extending along a first direction D1, the connecting portion 230 is connected to the die attach portion 210 through the first edge 213, the connecting portion 230 is connected to the lid folding portion 220 through the second edge 223, the die attach portion 210, the lid folding portion 220 and the connecting portion 230 enclose a receiving space, a photo sensing unit and a control chip are located in the receiving space, the die attach portion 210 includes a photo sensing unit die attach region 211 and a control chip die attach region 212, the photo sensing unit (not shown) is disposed in the photo sensing unit die attach region 211, the control chip (not shown) is disposed in the control chip die attach region 212, the lid folding portion 220 includes an opening 221, the opening 221 corresponds to the die attach region 211, in a formed infrared receiving module, the package housing covers the light sensing unit, the control chip, the die bonding portion 210 and the lid folding portion 220 and encloses the accommodating space.

In one embodiment, the opening 221 and the shielding cover 222 are adjacently distributed along the first direction D1. The support 200 further includes at least one pin 240, and the pin 240 is connected to the die bonding portion 210. It is understood that the leads 240 are conductively connected to the die attach portion 210. In the embodiment shown in fig. 2, the bracket 200 of the infrared receiving module of the present invention may further include other pins, such as the pins 251 and 252, which are not directly connected to the bracket 200, and the pins 251 and 252 may be electrically connected to other components (e.g., a control chip) on the bracket 200 by wires (e.g., through a wire bonding process) in a subsequent assembly process. Together, the pins 240, 251, 252 serve as functional pins for the infrared receiving module. The pins 240, 251, 252 are parallel to each other. The utility model discloses an infrared receiving module group includes 3 pins, and its function is output signal (OUT), power connection (VCC) and ground connection (GND) respectively.

Fig. 2 shows only the bracket 200, in which other components such as the light sensing unit and the control chip in the infrared receiving module of the present invention are not shown. The utility model discloses do not do the restriction to support, light sensing unit and the control chip's that contain among the infrared receiving module shape, structure, size, type, quantity and position etc..

Fig. 3 is a schematic view of an internal structure of an infrared receiving module according to an embodiment of the present invention. Referring to fig. 3, which shows the bracket 200 inside the infrared receiving module, the bracket 200 is the same as the bracket 200 shown in fig. 2, and therefore the same reference numerals are used. As shown in fig. 3, the light sensing unit 201 is disposed in a light sensing unit die bonding area 211 of the die bonding portion 210, and the control chip 202 is disposed in a control chip die bonding area 212 of the die bonding portion 210. Fig. 3 is only an example, and is not intended to limit the specific structures and wiring manners of the light sensing unit 201 and the control chip 202. In an embodiment, the light sensing unit 201 is electrically connected to the bracket 200 and the control chip 202 through wires, and the control chip 202 is electrically connected to the bracket 200 through wires.

In some embodiments, the flap part 220 further includes a shielding cover 222, and the shielding cover 222 corresponds to the control chip die bonding area 212 and is used for shielding the control chip 202.

The utility model discloses a support 200 has the spatial structure who buckles. The die bonding portion 210 and the flap portion 220 are two plate-shaped structures that are disposed opposite to each other, and the connecting portion 230 is connected between the die bonding portion 210 and the flap portion 220. The die bonding part 210, the connecting part 230 and the cover folding part 220 together enclose to form an accommodating space, and the die bonding part 210, the connecting part 230 and the cover folding part 220 can be respectively used as three enclosing surfaces of the accommodating space. Obviously, the light sensing unit 201 and the control chip 202 are located in the accommodating space, and the positions of the light sensing unit 201 and the control chip 202 in the accommodating space are defined by the light sensing unit die bonding area 211 and the control chip die bonding area 212, respectively.

The die bonding portion 210 is located below the flap portion 220. The cover folding portion 220 covers a partial region of the surface of the die bonding portion 210, and as can be understood by those skilled in the art from fig. 2, the lower portion of the opening 221 corresponds to the die bonding region 211 of the photo sensing unit, and the lower portion of the shielding cover 222 corresponds to the die bonding region 212 of the control chip. In one embodiment, the connecting portion 230 is connected between the die attach portion 210 and the lid folding portion 220, the connecting portion 230 is perpendicular to the die attach portion 210 and the lid folding portion 220, and the lid folding portion 220 is parallel to the die attach portion 210. From the perspective of fig. 2, the bracket 200 is seen, and the die bonding portion 210, the connecting portion 230 and the lid folding portion 220 form an Contraband-shaped structure. The connection portion 230 and the flap portion 220 have openings 231 and 232 at their connection portions, the openings 231 and 232 may be hollow areas, and the opening 231 is communicated with the opening 221, so that the die bonding area 211 of the photo sensing unit can be exposed when viewed from the top in fig. 2. In addition, the connection portion 230 and the die bonding portion 210 have openings 233 and 234, and the openings 233 and 234 may be hollow areas. In addition, the opening 233 is adjacent to the opening 232 and the die bonding region 212 of the control chip, and the opening 234 is adjacent to the openings 221 and 231 and the die bonding region 211 of the photo sensing unit.

The opening 221 is substantially rectangular. The utility model discloses do not do the restriction to shape, the size of opening 221. In other embodiments, the opening 221 may be any shape, such as circular, irregular. The size of the opening 221 matches the size of the light sensing unit 201 included in the infrared receiving module, and the position of the opening 221 corresponds to the position of the light sensing unit 201, so that the light sensing unit 201 receives external infrared rays through the opening 221, and accordingly outputs an electrical signal to the control chip 202. The opening 221 may be a hollow area or a non-hollow transparent area.

The shield cover 222 is substantially rectangular. The utility model discloses do not limit to the shape, the size of shield cover 222. In other embodiments, the shield cover 222 may be any shape, such as circular, irregular. The size of the shielding cover 222 matches the size of the control chip 202 included in the infrared receiving module. The shielding cover 222 should cover the control chip 202, thereby shielding electromagnetic interference.

In some embodiments, the material of the shield cover 222 comprises an electromagnetic shielding material, such as a metal, preferably iron.

In some embodiments, the bracket 200 is integrally formed of the same electromagnetic shielding material, such as a metal or metal alloy, and in one embodiment, the bracket 200 may be iron. According to the embodiments, the frame part around the opening 221 is also made of the electromagnetic shielding material, and after the optical sensing unit 201 is installed in the optical sensing unit die bonding area 211, the edge of the optical sensing unit 201 can be shielded, so that the anti-interference performance is better.

The die bonding part 210 and the flap part 220 are parallel to each other, and the distance between the die bonding part and the flap part is set to be h. The utility model discloses do not restrict the distance h between solid brilliant portion 210 and the folding lid portion 220. The distance h can be reduced as much as possible according to the actual sizes of the light sensing unit 201 and the control chip 202 and the size of the wire bonding operation space of the lead, so as to reduce the overall size of the infrared receiving module.

The utility model discloses a support 200 is because the spatial structure who buckles adopts, compares in the shielding structure of the mutual buckle of support plate and lid and has characteristics such as less volume and processing procedure are easy, has not only reduced the volume of infrared receiving module, has also reduced the manufacturing cost of component.

This description uses fig. 4A-5B to describe one exemplary process for forming the stent 200.

Fig. 4A and 4B are schematic plane development views of a bracket of an infrared receiving module according to an embodiment of the present invention. Fig. 4A is a top view, and fig. 4B is a side view corresponding to that shown in fig. 4A.

Referring to fig. 4A, a stent 400 having a planar expanded configuration may be formed prior to forming the stent 200 shown in fig. 2. The bracket 400 includes a die bonding portion 410 and a flap portion 420. As shown in fig. 4B, the die bonding portion 410 and the flap portion 420 are in the same plane and have the same thickness.

The die bonding portion 410 includes a photo sensing unit die bonding area 411 and a control chip die bonding area 412, the cover folding portion 420 includes an opening 421 and a shielding cover 422, the opening 421 corresponds to the photo sensing unit die bonding area 411, and the shielding cover 422 corresponds to the control chip die bonding area 412 and is used for shielding the control chip 202.

The connecting portion 430 is located between the die bonding portion 410 and the flap portion 420, and is used for connecting the die bonding portion 410 and the flap portion 420. The die bonding part 410 has a first side 413 extending in the first direction D1, the flap part 420 has a second side 423 extending in the first direction D1, and the connecting part 430 is connected to the die bonding part 410 via the first side 413 and to the flap part 420 via the second side 423. As shown in fig. 4B, when the support is unfolded, the connecting portion 430 is on the same plane as the die bond portion 410 and the cover folding portion 420, and has the same thickness. A groove 401 is formed between the connecting portion 430 and the die bonding portion 410, and a groove 402 is formed between the connecting portion 430 and the flap portion 420, so that the folding operation can be performed along the grooves 401 and 402 in the subsequent step. As can be appreciated from fig. 4A, both grooves 401, 402 are located on the rim of the connecting portion 430.

In some embodiments, the connection portion 430 includes a first hollow area 431, and the first hollow area 431 is in communication with the opening 421, forming an integral communication opening. With reference to fig. 2, according to such an embodiment, the communication opening not only forms an opening 221 for the light sensing unit 201 to receive light from the outside in the plane of the flap 220, but also has a first hollow area 431 in the plane of the connection portion 230, which can reduce the stress when the flap 420 is bent along the groove 402, increase the exposed area of the light receiving surface of the light sensing unit 201 in the infrared receiving module, and facilitate the light sensing unit 201 to more sensitively receive infrared rays from various angles.

In some embodiments, the connection portion 430 further includes a second hollow area 432 therein, and the second hollow area 432 is adjacent to the shielding cover 422.

In some embodiments, the connection portion 430 further includes a third hollow area 433 and a fourth hollow area 434, the third hollow area 433 is adjacent to the control chip die attach area 412, and the fourth hollow area 434 is adjacent to the light sensing unit die attach area 411.

It is understood that, in order to form the first hollow area 431, the second hollow area 432, the third hollow area 433 and the fourth hollow area 434, the four hollow areas may be formed in the connecting portion 430 which is originally a flat plate, and therefore, the connecting portion 430 has a frame 440. Referring to fig. 4A, the frame 440 surrounds the hollow areas. Grooves 401, 402 in fig. 4B may be formed on bezel 440. The opening 421, the first hollow area 431, the second hollow area 432, the third hollow area 433, and the fourth hollow area 434 are formed by the bracket 400 through a stamping or etching process.

These cutouts are designed into the connecting portion 430 of the bracket 400 to reduce the material required for the bracket 400 and also reduce the stress during bending, which helps to bend the connecting portion 430 to form the bracket 200 shown in fig. 2.

Fig. 4A is not intended to limit the specific structure of the connection portion 430. Those skilled in the art can construct the connecting portion 430 in various structures based on the idea of the present invention.

Fig. 5A and 5B are schematic views of the bracket of the infrared receiving module of the embodiment shown in fig. 4A and 4B after being bent once. Fig. 5A is a top view, and fig. 5B is a side view corresponding to fig. 5A. The stent 400 shown in fig. 5A and 5B is obtained by bending the stent 400 shown in fig. 4A and 4B, and thus the same reference numerals are used therein to designate the same structures.

Referring to fig. 5A and 5B, flap 420 of fig. 4A is folded along groove 402 such that flap 420 is in a generally perpendicular relationship with respect to connecting portion 430.

In the next step, the connecting portion 430 is folded along the groove 401, so that the connecting portion 430 is substantially perpendicular to the die bonding portion 410, and the cover folding portion 420 is parallel to the die bonding portion 410.

Fig. 4A-5B illustrate one step of forming a stent 200 having a bent three-dimensional structure. In other embodiments, other methods may be used to form the stent 200 of the present invention.

Fig. 6 is a schematic perspective view of a bracket of the infrared receiving module in the embodiment shown in fig. 2. The stent 200 shown in fig. 6 is the same as the stent 200 shown in fig. 2, except that the viewing angle is different, and the same reference numerals are used for the same components and structures.

As shown in fig. 2 and 6, in some embodiments, the connecting portion 230 is connected to the die bonding portion 210 via the first edge 213 and is connected to the flap portion 220 via the second edge 223. According to fig. 6, the length of the second edge 223 in the first direction D1 is slightly smaller than the length of the first edge 213 in the first direction D1. If the connecting portion 230 has a length along the first direction D1, the length gradually decreases from the first edge 213 to the second edge 223, that is, the connecting portion 230 has a characteristic of tapering from the die bonding portion 210 to the flap portion 220.

Fig. 7 is a schematic perspective view of an infrared receiving module according to an embodiment of the present invention. Fig. 7 shows an external appearance structure of the infrared receiving module 700. Referring to fig. 7, the infrared receiving module 700 includes a package housing 710, and the package housing 710 is used for covering the die bonding portion and the flip portion and sealing the accommodating space therein. For the infrared receiving module 700 formed by machining, the bracket, the light sensing unit and the control chip (not shown) in the embodiment of the present invention are wrapped inside the package housing 710. The package housing 710 shown in fig. 7 has a substantially cubic shape, and thus has substantially four sides, i.e., a first side 711, a second side 712, a third side 713, and a fourth side (not shown). Wherein the third side 713 is located above the shield cover 222.

The package housing 710 has a lens housing 721 protruding from the third side 713, and the lens housing 721 is used for allowing infrared rays to penetrate into the light receiving surface of the light sensing unit 201, and increasing the light receiving angle of the light sensing unit 201 while filtering visible light.

As shown in fig. 2 and 7, the first side 711 of the package housing 710 corresponds to the connecting portion 230 of the support 200, the second side 712 corresponds to the die bonding portion 210, and the third side 713 corresponds to the flap portion 220. Accordingly, the first side 711 also has a length in the first direction D1, which gradually decreases from the second side 712 to the third side 713.

In some embodiments, at least one pin of the support 200 protrudes out of the package housing 710, and the at least one pin includes a first bent section and a second bent section, the first bent section extends along a direction parallel to the first side 711 of the package housing 710, and the second bent section extends along a direction parallel to the second side 712 of the package housing 710, wherein the first side 711 is adjacent to the second side 712.

The package housing 710 has a first side 711 and a second side 712 adjacent to each other. Since the package housing 710 shown in fig. 7 has a substantially cubic shape, the first side 711 and the second side 712 are substantially perpendicular to each other. In fig. 7, the second side 712 is located at the bottom of the package housing 710.

Taking the lead 740 as an example, the lead 740 includes a first bending portion 741 and a second bending portion 742, the first bending portion 741 extends along the first side 711, and the second bending portion 742 extends along the second side 712.

In addition to the lead 740, the other two leads 751 and 752 have a first bent section and a second bent section, and extend in the same direction as the first bent section 741 and the second bent section 742 of the lead 740, respectively.

In some embodiments, the utility model discloses an infrared receiving module is SMD infrared receiving module.

In some embodiments, the material of the package housing 710 of the infrared receiving module 700 of the present invention includes a material blocking visible light. Visible light blocking material refers to material that is opaque to visible light. As shown in fig. 7, in the package housing 710, at least the lens housing 721 is made of a material blocking visible light, which can be used to eliminate the interference of visible light.

In some embodiments, the package housings 710 are all made of the same visible light blocking material. Wherein, the visible light blocking material may be a black resin.

Having thus described the basic concept, it will be apparent to those skilled in the art that the foregoing disclosure is by way of example only, and is not intended to limit the present application. Various modifications, improvements and adaptations to the present application may occur to those skilled in the art, although not explicitly described herein. Such modifications, improvements and adaptations are proposed in the present application and thus fall within the spirit and scope of the exemplary embodiments of the present application.

Also, this application uses specific language to describe embodiments of the application. Reference throughout this specification to "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic described in connection with at least one embodiment of the present application is included in at least one embodiment of the present application. Therefore, it is emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, some features, structures, or characteristics of one or more embodiments of the present application may be combined as appropriate.

Similarly, it should be noted that in the preceding description of embodiments of the present application, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the embodiments. This method of disclosure, however, is not intended to require more features than are expressly recited in the claims. Indeed, the embodiments may be characterized as having less than all of the features of a single embodiment disclosed above.

Numerals describing the number of components, attributes, etc. are used in some embodiments, it being understood that such numerals used in the description of the embodiments are modified in some instances by the use of the modifier "about", "approximately" or "substantially". Unless otherwise indicated, "about", "approximately" or "substantially" indicates that the number allows a variation of ± 20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximations that may vary depending upon the desired properties of the individual embodiments. In some embodiments, the numerical parameter should take into account the specified significant digits and employ a general digit preserving approach. Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the range are approximations, in the specific examples, such numerical values are set forth as precisely as possible within the scope of the application.

Claims (12)

1. An infrared receiving module, comprising: the support comprises a die bonding part, a cover folding part and a connecting part, the die bonding part is provided with a first edge extending along a first direction, the cover folding part is provided with a second edge extending along the first direction, the connecting part is connected with the die bonding part through the first edge, the connecting part is connected with the cover folding part through the second edge, the die bonding part, the cover folding part and the connecting part are surrounded to form an accommodating space, the light sensing unit and the control chip are positioned in the accommodating space, the die bonding part comprises a die bonding area of the light sensing unit and a die bonding area of the control chip, the light sensing unit is arranged in the die bonding area of the light sensing unit, the control chip is arranged in the die bonding area of the control chip, the cover folding part comprises an opening, and the opening corresponds to the die bonding area of the light sensing unit, the packaging shell covers the die bonding part and the cover folding part and seals the accommodating space.

2. The infrared receiving module as set forth in claim 1, wherein said cover folding portion further comprises a shielding cover corresponding to said control chip die bonding area and for shielding said control chip.

3. The infrared receiving module of claim 2 wherein the connecting portion includes a first hollowed-out area, the first hollowed-out area being in communication with the opening.

4. The infrared receiving module of claim 3 wherein the connecting portion includes a second hollowed-out area, the second hollowed-out area abutting the shield cover.

5. The infrared receiving module of claim 4 wherein the connecting portion further comprises a third hollowed-out area and a fourth hollowed-out area, the third hollowed-out area being adjacent to the control chip die attach area, and the fourth hollowed-out area being adjacent to the photo sensing unit die attach area.

6. The infrared receiving module of claim 2 wherein the opening and the shield cover are distributed adjacent along the first direction.

7. The infrared receiving module of claim 1 wherein said die attach section and said flap section are parallel to each other.

8. The infrared receiving module of claim 1 wherein the frame further comprises at least one pin, the pin being connected to the die attach portion.

9. The infrared receiving module of claim 8 wherein the at least one pin extends out of the package housing, the at least one pin comprising a first bend section and a second bend section, the first bend section extending along a first side of the package housing, the second bend section extending along a second side of the package housing, the first side being adjacent to the second side.

10. The infrared receiving module of claim 9 wherein the material of the package housing comprises a visible light blocking material.

11. The infrared receiving module as set forth in claim 1, wherein the light sensing unit is electrically connected to the bracket and the control chip, respectively, the control chip is electrically connected to the bracket, the light sensing unit is configured to receive an infrared ray and output an electrical signal according to the infrared ray, and the control chip is configured to receive and process the electrical signal.

12. The infrared receiving module of claim 1 wherein the light sensing unit is a photodiode, a phototransistor, or a cmos.

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