CN215263814U - Insulation and voltage resistance sensor - Google Patents

Abstract

The utility model relates to a sensor, which comprises a base, an upper cover, a circuit board, a resonance component, a cable and a cable locking structure; the upper cover is a through hole piece, the resonance assembly is arranged in the through hole of the upper cover and fixed on the base, the resonance assembly is used for converting vibration signals into charge signals, the circuit board is connected with the resonance assembly and the cable, the circuit board is used for converting the charge signals into first analog signals and outputting the first analog signals to the cable, and the cable locking structure is used for fixing the cable; wherein, resonance subassembly includes: the piezoelectric device comprises a mass block, a first insulating pad, a piezoelectric wafer, a second insulating pad and a screw; the mass block, the first insulating pad, the piezoelectric wafer and the second insulating pad are sequentially arranged and are provided with through holes, and the screws sequentially penetrate through the through holes in the mass block, the first insulating pad, the piezoelectric wafer and the second insulating pad. The sensor can increase the withstand voltage of the sensor and does not reduce the reliability of the sensor.

Description

Insulation and voltage resistance sensor

Technical Field

The utility model relates to a sensor technical field especially relates to a withstand voltage sensor.

Background

The rated voltage of electric lines such as high-power traction motors, transformers, converters and the like of electric locomotives and rail transit vehicles is higher than AC2000V in the operation process, a large amount of alternating current or direct current interference voltage is generated on the surfaces of motors, gear boxes, axle boxes and the like, the strong interference voltage can reach kilovolt level or above, a sensor shell which is arranged on the surface of the sensor shell and used for sensitive fault information directly bears the strong interference voltage, the potential difference of kilovolt level between the sensor shell and an internal low-voltage circuit is caused, if the insulation and voltage resistance of the sensor is insufficient, the sensor and even a rear-stage acquisition and processing circuit are easily damaged due to electric flashover breakdown, and the detection function is lost.

However, the improvement of the conventional sensor for increasing the withstand voltage results in a decrease in the reliability of the sensor. For example, the conventional techniques have adopted several methods to improve the pressure resistance of the sensor:

the installation is carried out by adopting insulating bolts, such as non-metal bolts and metal bolts, and insulating layers are plated outside the non-metal bolts and the metal bolts; however, the nonmetal bolt generally has low strength, cannot measure high-frequency signals, is influenced by external environments such as temperature and the like, and cannot be reliably applied for a long time.

The metal bolt is installed by adopting a non-metal plating layer, the outer plating layer can play a role in insulating to a certain degree, but the insulating strength is seriously influenced by a plating process and is usually lower than AC1000V (the thickness is 100 um); in addition, improper protection such as bump, too large tightening force, burrs at the installation position and the like easily causes insulation failure of the plating layer in the assembling process.

The sensor base is made of insulating materials (such as ceramics, plastics and other materials) and is installed, and the sensor shell is insulated from the installation hole (an interference source). Then the method relates to the base material and performance parameters, and has high requirements on the base material; and the insulating base material cannot simultaneously meet high insulating property, high mechanical strength and high rigidity, the ceramic is fragile and has insufficient processing precision, and the hardness of the plastic is soft, so that the transmission attenuation of vibration impact signals is caused. (has high insulating property to meet the insulation requirement, high mechanical strength to meet the reliability requirement of field installation and operation, and high rigidity to meet the transmission of vibration and shock longitudinal waves).

The inner cavity of the sensor is filled with an insulating pouring sealant with the insulating strength of more than 10kV/mm, and a circuit electric circuit is isolated from the shell, but the method can destroy the resonance characteristic of the piezoelectric resonance component and cannot be adopted.

And the bolts forming the internal resonance component of the sensor are insulated bolts. However, the insulating bolt is subject to temperature variation, which easily causes great parameter variation of the resonant assembly, and strict protection is required.

SUMMERY OF THE UTILITY MODEL

In view of the above, it is necessary to provide, in order to solve the problem that the improvement of the pressure resistance value of the sensor in the conventional art may reduce the reliability of the sensor:

an insulation and voltage resistance sensor comprises a base, an upper cover, a circuit board, a resonance assembly, a cable and a cable locking structure; the upper cover is a through hole piece, the resonance assembly is arranged in the through hole of the upper cover and fixed on the base, the resonance assembly is used for converting a vibration signal into an electric charge signal, the circuit board is connected with the resonance assembly and the cable, the circuit board is used for converting the electric charge signal into a first analog signal and outputting the first analog signal to the cable, and the cable locking structure is used for fixing the cable;

wherein the resonance assembly comprises: the piezoelectric device comprises a mass block, a first insulating pad, a piezoelectric wafer, a second insulating pad and a screw; the quality piece the first insulating pad the piezoelectric wafer the second insulating pad sets gradually, and has all seted up the through-hole, the screw passes in proper order the quality piece the first insulating pad the piezoelectric wafer and through-hole in the second insulating pad is fixed in on the base.

In the sensor, the first insulating pad is positioned between the mass block and the piezoelectric wafer to insulate the mass block from the piezoelectric wafer, and the first insulating pad has a certain thickness to increase the creepage distance between the mass block and the piezoelectric wafer; the second insulating pad is located between piezoelectric wafer and the base and makes between base and the piezoelectric wafer insulating to because the second insulating pad possesses certain thickness, make the creepage distance between increase base and the piezoelectric wafer, thereby can increase the withstand voltage of sensor, and the setting of first insulating pad and second insulating pad can not reduce the reliability of sensor.

In one embodiment, the circuit board is a flexible circuit board, the circuit board includes a first connection portion, a second connection portion, a third connection portion and a fourth connection portion, and the third connection portion is connected with the first connection portion, the second connection portion and the fourth connection portion; the first connecting part and the second connecting part are respectively arranged at two ends of the piezoelectric wafer and are in contact with the piezoelectric wafer so as to transmit the charge signal to the third connecting part; a processing circuit is arranged on the third connecting part to convert the charge signal into the first analog signal; the fourth connection portion is further connected with the cable to transmit the first analog signal to the cable.

In one embodiment, a boss is arranged on one side of the base close to the resonance component; the first insulating pad and the second insulating pad extend to two opposite ends respectively to cover the mass block and the outer wall of the boss on the base respectively.

In one embodiment, the first insulating pad extends towards both ends at its through hole and/or the second insulating pad extends towards both ends at its through hole.

In one embodiment, one end of the mass is recessed inwardly to allow the screw to sink into the mass.

In one embodiment, an insulating sheath is arranged between the upper cover and the resonance assembly, and the insulating sheath is positioned on the inner wall of the upper cover.

In one embodiment, the temperature-sensitive element and the bottom cover are further included; the bottom of the base is provided with an opening to accommodate the temperature sensitive element, and an insulating sleeve is arranged between the temperature sensitive element and the inner wall of the base; the bottom cover is fixed at the bottom of the base;

the circuit board further comprises a fifth connecting portion, one end of the fifth connecting portion is connected with the third connecting portion, the other end of the fifth connecting portion is connected with the temperature sensitive element, and the processing circuit is further used for transmitting the temperature signal acquired by the temperature sensitive element to the cable through the fourth connecting portion.

In one embodiment, the cable locking structure includes: the sealing rubber ring, the gland, the copper buckle, the stop ring and the nut; the sealing rubber ring, the gland, the copper buckle, the stop ring and the nut are all provided with wire passing through holes; the gland is connected with the upper cover;

the sealing rubber ring is sleeved outside the cable, the nut is arranged at the lower end of the inner wall of the gland, and the sealing rubber ring and the front end of the cable are sleeved on the inner wall of the nut; the nut presses the sealing rubber ring upwards to hold the cable tightly;

the stop ring is positioned on the inner wall of the gland and is far away from one end of the nut; the upper end of the gland is provided with a limiting part; the copper buckle is located between the end, far away from the nut, of the sealing rubber ring and the stop ring.

In one embodiment, the wire protection sleeve is further included; the wire protecting sleeve is cylindrical and is provided with an outer edge at the bottom; the wire protecting sleeve is positioned at the upper end of the gland and is arranged between the inner wall of the gland and the cable; the outer edge of the bottom of the wire protecting sleeve is positioned between the stop ring and the limiting part of the gland.

In one embodiment, the wire fixing plate is further included; the wire fixing plate is located at the lower end of the sealing rubber ring and located at the top of the inner wall of the upper cover, the cable is located above the wire fixing plate, and a through hole for a lead in the cable to pass through is formed in the wire fixing plate.

In one embodiment, the lower end of the sealing rubber ring is in contact with the upper end of the wire fixing plate.

In one embodiment, the rubber gasket further comprises a first rubber gasket and a second rubber gasket; the wire fixing plate, the first rubber pad and the second rubber pad are all positioned in the through hole of the upper cover and positioned at the end, far away from the base, of the resonance assembly; the first rubber pad is matched with the wire fixing plate to wrap the fourth connecting portion, and the second rubber pad is arranged on one side, away from the wire fixing plate, of the first rubber pad and matched with the first rubber pad to wrap the third connecting portion.

In one embodiment, the device further comprises a clamp; the clamp is located first rubber pad with between the base inner wall.

In one embodiment, the fourth connecting portion is composed of a fourth adapter plate and a fourth base plate; the fourth bottom plate is connected with the third connecting part; and a bonding pad is arranged on the fourth adapter plate and consists of metalized through holes.

In one embodiment, a fixing plate is arranged on the third connecting portion on the side opposite to the processing circuit.

Drawings

Fig. 1 is a sectional view of an withstand voltage sensor in one embodiment;

FIG. 2 is an exploded view of an embodiment of a dielectric withstand voltage sensor;

fig. 3 is a partial sectional view of a dielectric withstand voltage sensor in one embodiment;

FIG. 4 is a schematic diagram of a circuit board in one embodiment;

fig. 5 is a partial sectional view of a withstand voltage sensor in another embodiment;

FIG. 6 is a perspective view of a stop ring in one embodiment;

FIG. 7 is a perspective view of a nut in one embodiment;

FIG. 8 is a perspective view of a wire retaining plate in one embodiment;

FIG. 9 is a perspective view of a second rubber pad in one embodiment;

FIG. 10 is a perspective view of a clip according to one embodiment;

FIG. 11 is a diagram illustrating an embodiment of a circuit board without a fourth interposer bonded thereto;

fig. 12 is a schematic diagram of a fourth interposer according to an embodiment.

Description of reference numerals: 10. a sensor; 11. a cable; 12. a circuit board; 13. a resonant assembly; 14. a temperature sensitive element; 16. a cable locking structure; 121. a first connection portion; 122. a second connecting portion; 123. a third connecting portion; 124. a fourth connecting portion; 1241. a fourth base plate; 1242. a fourth adapter plate; 125. a fifth connecting part; 131. a mass block; 132. a first insulating pad; 133. a piezoelectric wafer; 134. a second insulating pad; 135. a screw; 136. an insulating sheath; 141. an insulating sleeve; 151. a sheath; 152. an upper cover; 1521. A limiting part; 153. a base; 1531. a boss; 154. a bottom cover; 161. a gland; 1611. a limiting part; 162. a wire protecting sleeve; 163. a stopper ring; 164. copper buckle; 165. sealing the rubber ring; 166. a nut; 171. A wire fixing plate; 172. a first rubber pad; 173. a second rubber pad; 174. and (5) clamping a hoop.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Fig. 1 is a sectional view of an withstand voltage sensor in one embodiment. Fig. 2 is an exploded view of the dielectric withstand voltage sensor in one embodiment. Hereinafter, the dielectric withstand voltage sensor is simply referred to as a sensor. As shown in fig. 1 and 2, the sensor 10 includes a base 153, an upper cover 152, a circuit board 12, a resonance assembly 13, a cable 11, and a cable locking structure 16. The upper cover 152 is a through hole member, and the base 153 may be disposed below the upper cover 152 and connected to the upper cover 152. The resonant assembly 13 is disposed in the through hole of the upper cover 152 and fixed on the base 153, and the resonant assembly 13 is configured to convert the vibration signal into an electric charge signal. The circuit board 12 may be disposed in the through hole of the upper cover 152, or may be partially disposed in the through hole of the upper cover 152. The cable 11 and the cable locking structure 16 may be disposed above the upper cover 152. The circuit board 12 is connected to the resonant assembly 13 and the cable 11, and is configured to convert the charge signal output by the resonant assembly 13 into a first analog signal and output the first analog signal to the cable 11, where the first analog signal may include a voltage signal or a current signal, and the magnitude of the vibration measured by the sensor 10 may be obtained by analyzing the first analog signal output by the cable 11. The cable locking structure 16 is used for fixing the cable 11, so as to prevent the cable 11 from shaking to cause the connection part with the circuit board 12 to fall off, prevent the shaking of the cable 11 from causing the influence on the operation of the device to which the sensor 10 is applied, and the like.

Wherein, as shown in fig. 3, the resonance assembly 13 includes: a mass 131, a first insulating pad 132, a piezoelectric wafer 133, a second insulating pad 134, and a screw 135. The mass block 131, the first insulating pad 132, the piezoelectric wafer 133, and the second insulating pad 134 are sequentially disposed, and all have through holes, the screw 135 sequentially passes through the through holes in the mass block 131, the first insulating pad 132, the piezoelectric wafer 133, and the second insulating pad 134, and the screw 135 may further pass through the inside of the base 153, so as to fix the entire resonant assembly 13 on the base 153. Illustratively, the material of the first insulating pad 132 and the second insulating pad 134 may be ceramic or polyoxymethylene, so that the frequency response requirement of the resonant assembly 13 may be satisfied.

It should be noted that the screw 135 has a certain movement margin in the through hole through which it passes, so as to ensure that the mass 131 can move at least to a small extent. When the sensor 10 detects the vibration signal, the mass 131 is activated by the pressure, so that the pressure applied to the piezoelectric wafer 133 changes and the charge signal output by the piezoelectric wafer 133 changes accordingly. However, it should be noted that the "movement" is limited to microscopic and tightening is performed during assembly. The circuit board 12 may be in contact with the piezoelectric wafer 133 to convert the charge signal output from the piezoelectric wafer 133 into a first analog signal to detect the magnitude of the vibration.

The first insulating pad 132 in the sensor 10 is located between the mass 131 and the piezoelectric wafer 133 to insulate the mass 131 from the piezoelectric wafer 133, and the first insulating pad 132 has a certain thickness to increase the creepage distance between the mass 131 and the piezoelectric wafer 133; the second insulating pad 134 is located between the piezoelectric wafer 133 and the base 153 to insulate the base 153 from the piezoelectric wafer 133, and the second insulating pad 134 has a certain thickness to increase a creepage distance between the base 153 and the piezoelectric wafer 133, so that a withstand voltage of the sensor 10 can be increased, and the reliability of the sensor 10 is not reduced by the arrangement of the first insulating pad 132 and the second insulating pad 134.

In one embodiment, referring to fig. 1 and 4, the circuit board 12 is a flexible circuit board 12. The circuit board 12 includes a first connection portion 121, a second connection portion 122, a third connection portion 123, and a fourth connection portion 124. The third connection portion 123 is connected to the first connection portion 121, the second connection portion 122, and the fourth connection portion 124. The first connection portion 121 and the second connection portion 122 are respectively disposed at two ends of the piezoelectric wafer 133 and are both in contact with the piezoelectric wafer 133 to transmit the charge signal output by the piezoelectric wafer 133 to the third connection portion 123, and a processing circuit is disposed on the third connection portion 123 to convert the charge signal into a first analog signal, which may include a voltage signal or a current signal, and the like. The fourth connection portion 124 is also connected to the cable 11 to transmit the first analog signal to the cable 11.

In an embodiment, still referring to fig. 3, a boss 1531 is disposed on a side of the base 153 close to the resonant assembly 13, the boss 1531 may be shaped and sized as required, and the screw 135 in the resonant assembly 13 may penetrate into the boss 1531 after passing through the through holes in the mass 131, the first insulating pad 132, the piezoelectric wafer 133 and the second insulating pad 134 in sequence, so as to fix the entire resonant assembly 13 on the base 153. The first insulating pad 132 and the second insulating pad 134 extend to opposite ends to cover the outer wall of the mass 131 and the outer wall of the boss 1531 on the base 153, respectively. Specifically, the first insulating pad 132 extends toward the direction of the mass block 131 to cover the outer wall of the mass block 131, and the first insulating pad 132 may completely cover the bottom and the side of the mass block 131, or may cover a part of the side of the mass block 131; the second insulating pad 134 extends toward the base 153 to cover the outer wall of the boss 1531, and the second insulating pad 134 may cover the top and the side of the boss 1531 completely or cover a part of the side of the boss 1531. In this embodiment, the thickness of the first insulating pad 132 between the piezoelectric wafer 133 and the mass 131, the thickness and the length of the first insulating pad 132 covering the outer wall of the mass 131, the thickness of the second insulating pad 134 between the piezoelectric wafer 133 and the base 153, and the thickness and the length of the second insulating pad 134 covering the outer wall of the boss 1531 may be set as required, so as to use the required increased voltage withstanding value as a reference.

In one embodiment, the first insulating pad 132 extends toward both ends at a through hole thereof, which refers to a through hole of the first insulating pad 132 through which the screw 135 passes. The first connection portion 121 of the circuit board 12 is located between the first insulating pad 132 and the piezoelectric wafer 133, and the first insulating pad 132 is disposed to extend towards both ends at the through hole thereof to space the screw 135 from the piezoelectric wafer 133 and the first connection portion 121, so that the screw 135 is insulated from the piezoelectric wafer 133 and the first connection portion 121 and the creepage distance therebetween is increased, thereby improving the withstand voltage of the sensor 10. In other embodiments, the second insulating pad 134 extends toward both ends at a through hole thereof, which refers to a through hole of the second insulating pad 134 through which the screw 135 passes. The second connection portion 122 of the circuit board 12 is located between the second insulating pad 134 and the piezoelectric wafer 133, and the second insulating pad 134 is disposed at the through hole and extends towards two ends to separate the screw 135 from the piezoelectric wafer 133 and the second connection portion 122, so that the screw 135 is insulated from the piezoelectric wafer 133 and the second connection portion 122 and the creepage distance therebetween is increased, thereby improving the withstand voltage of the sensor 10.

In one embodiment, one end of the mass 131 is recessed inward to allow a screw to sink into the mass 131 such that the height of the screw 135 is reduced, thereby increasing the stability of the resonant assembly 13. Specifically, the end of the mass 131 away from the piezoelectric wafer 133 is recessed inward, and the shape and size of the recess may be set according to the shape and size of the head of the screw 135.

In an embodiment, an insulating sheath 136 is disposed between the upper cover 152 and the resonant assembly 13, and the insulating sheath 136 is located on an inner wall of the upper cover 152 and has a cylindrical thin-walled structure, so that the upper cover 152 is insulated from the first connection portion 121 and the second connection portion 122 and the creepage distance therebetween is increased.

In one embodiment, the sensor 10 further includes a temperature sensitive element 14 and a bottom cover 154. The bottom of the base 153 is provided with an opening to accommodate the temperature sensitive element 14, and an insulating sleeve 141 is arranged between the inner wall of the base 153 and the temperature sensitive element 14; the bottom cover 154 is fixed to the bottom of the base 153.

For example, the base 153 may be formed from a single piece of material, and the bottom of the base may be threaded (not shown) for mounting the sensor 10 to a given device, and the temperature sensing element 14 may be used for collecting a temperature signal of the given device. The opening of the bottom of the base 153 may be opened at the bottom of the screw and the size of the opening is larger than that of the temperature sensitive element 14 so that the temperature sensitive element 14 and the insulating sleeve 141 between the inner wall of the base 153 and the temperature sensitive element 14 can be accommodated. The insulating sleeve 141 can insulate the inner wall of the base 153 from the temperature sensitive element 14 and increase the creepage distance therebetween, thereby increasing the withstand voltage value of the sensor 10.

In this embodiment, with reference to fig. 1 and 4, the circuit board 12 further includes a fifth connection portion 125. One end of the fifth connection part 125 is connected to the third connection part 123, and the other end of the fifth connection part 125 is connected to the temperature sensitive element 14. The processing circuit on the third connecting portion 123 is further configured to transmit the temperature signal collected by the temperature sensitive element 14 to the cable 11 through the fourth connecting portion 124. The fifth connection portion 125 may be disposed in an opening at the bottom of the base 153 and located above the temperature sensitive element 14, and a through hole for a lead of the fifth connection portion 125 to pass through may be further disposed in the base 153, and the through hole is communicated with the through hole at the bottom of the base 153, so that one end of the fifth connection portion 125 is connected to the third connection portion 123 through the lead. One or more tail pads may be disposed on the fifth connection portion 125, and the tail pads may be soldered to the leads of the temperature sensitive device 14 to connect the other end of the fifth connection portion 125 to the temperature sensitive device 14.

In one embodiment, with reference to fig. 2 and fig. 5 to 7, the cable locking structure 16 includes: sealing rubber ring 165, gland 161, copper button 164, stop ring 163 and nut 166. The sealing rubber ring 165, the gland 161, the copper button 164, the stop ring 163 and the nut 166 are all provided with wire through holes so as to allow the cable 11 to pass through. The pressing cover 161 is connected to the upper cover 152, and may be engaged with the top end of the inner wall of the upper cover 152. The sensor 10 may further include a sheath 151, the sheath 151 is a through hole and is disposed above the upper cover 152 to be connected with the upper cover 152, and the portion of the cable 11 and the cable locking structure 16 are disposed in the through hole of the sheath 151.

The sealing rubber ring 165 is sleeved outside the cable 11, the nut 166 is arranged at the lower end of the inner wall of the gland 161, and the sealing rubber ring 165 and the front end of the cable 11 are sleeved on the inner wall of the nut 166. The nut 166 presses the rubber sealing ring 165 upwards, and the rubber sealing ring 165 is pressed to deform to fill the cavity, so that the effect of sealing and tightly holding the cable 11 is achieved.

A stop ring 163 is located on the inner wall of gland 161 and away from the end of nut 166. The upper end of the gland 161 is provided with a limiting part 1611, and the stop ring 163 and the gland 161 can be connected by welding. The copper button 164 is located between the end of the sealing rubber ring 165 remote from the nut 166 and the stop ring 163. The copper button 164 and the stop ring 163 cooperate to achieve rotation stop of the cable 11.

In one embodiment, the cable locking structure 16 further includes a wire jacket 162. The wire sheath 162 is cylindrical and has an outer edge at the bottom. A grommet 162 is provided between the inner wall of the gland 161 and the cable 11 at the upper end of the gland 161. The bottom outer edge of the wire sheath 162 is located between the stop ring 163 and the position-limiting portion 1611 of the gland 161, so as to prevent the position-limiting portion 1611 of the gland 161 from directly contacting the cable 11 to protect the cable 11 from being crushed.

The installation of the cable locking structure 16 may be performed in the following order:

the wire protecting sleeve 162 is firstly installed in the gland 161, the stop ring 163 is rotated into the gland 161 and is welded and fixed, the cable 11 passes through the wire protecting sleeve 162 and the stop ring 163, and the copper button 164 is pressed at a proper position. The stop ring 163 may be a metal member and have two notches, the copper button 164 may be square after being pressed, and the notches of the stop ring 163 cooperate with the copper button 164 to prevent the cable 11 from rotating. Thereafter, a sealing rubber ring 165 is placed over the cable 11 and the sealing rubber ring 165 is pushed down, and the sealing rubber ring 165 is tightened by tightening the nut 166 with a special tool. The nut 166 may be notched to facilitate removal and installation with a special tool.

In one embodiment, with reference to fig. 1, 2, and 8, sensor 10 further includes a wire retention plate 171. The wire fixing plate 171 is located at the lower end of the sealing rubber ring 165 and on the top of the inner wall of the upper cover 152. The cable 11 is located above the wire fixing plate 171, and a through hole for a wire in the cable 11 to pass through is formed in the wire fixing plate 171. A notch may be provided on the wire fixing plate 171 for positioning to distinguish the angle of torsion of the cable 11.

In one embodiment, the lower end of the sealing rubber ring 165 contacts the upper end of the wire fixing plate 171. In this embodiment, the shape of the sealing rubber ring 165 may be changed from a hollow cylindrical shape to a convex cylindrical shape, and after the nut 166 is tightened, the lower end of the sealing rubber ring 165 passes through the screw hole of the nut 166 to contact the upper end of the wire fixing plate 171, so as to isolate the cable 11 from the nut 166, thereby insulating the cable 11 from the nut 166 and increasing the creepage distance between the cable 11 and the nut 166.

In one embodiment, with reference to fig. 1, 2 and 9, the sensor 10 further includes a first rubber pad 172 and a second rubber pad 173. The wire fixing plate 171, the first rubber pad 172 and the second rubber pad 173 are all located in the through hole of the upper cover 152 and at the end of the resonant assembly 13 far from the base 153. The first rubber pad 172 is matched with the wire fixing plate 171 to wrap the fourth connecting portion 124 of the circuit board 12. The second rubber pad 173 is disposed on a side of the first rubber pad 172 away from the wire fixing plate 171, and is matched with the first rubber pad 172 to wrap the third connecting portion 123 of the circuit board 12.

Specifically, one end of the wire fixing plate 171, which faces away from the cable 11, is provided with a groove to accommodate the fourth connecting portion 124. For example, the wire fixing plate 171 may be bowl-shaped. The first rubber pad 172 is disposed on the top of the groove of the wire fixing plate 171, and the wire fixing plate 171 and the first rubber pad 172 are fixed in a matching manner and wrap the fourth connecting portion 124, so as to increase the creepage distance between the welding points of the upper cover 152 and the fourth connecting portion 124. A through hole may be formed in the center of the wire fixing plate 171, through which a stripped wire of the cable 11 passes through the wire fixing plate 171 and is soldered to a pad in the fourth connecting portion 124, so as to connect the cable 11 to the fourth connecting portion 124 of the circuit board 12.

The inner wall of the upper cover 152 may be provided with a limiting portion 1521, the limiting portion 1521 and the upper cover 152 may be integrated, and the second rubber pad 173 is located on the limiting portion 1521, so as to provide support for the layout area of the circuit board 12. Notches may be formed in the second rubber pad 173 for the leads on the third connecting portion 123 and the fourth connecting portion 124 of the circuit board 12 to pass through, and three holes on the second rubber pad 173 may be used for being held by tweezers during installation.

One side of the second rubber pad 173 close to the first rubber pad 172 may be recessed to accommodate the third connecting portion 123, the first rubber pad 172 is disposed on the top of the recessed groove of the second rubber pad 173, and the first rubber pad 172 and the second rubber pad 173 are fixed in a matching manner and wrap the third connecting portion 123, so as to increase a creepage distance between the upper cover 152 and the third connecting portion 123.

In one embodiment, with reference to fig. 1, 2, and 10, the sensor 10 further includes a collar 174. The clip 174 is located between the first rubber pad 172 and the inner wall of the base 153. The clip 174 may be a metal member, and the clip 174 may be provided with an opening for providing elasticity when deformed, and the clip 174 is inserted into the upper cover 152 after being deformed to press the first rubber pad 172, thereby fixing the first rubber pad 172 and the second rubber pad 173, and thus pressing the third connecting portion 123 and the fourth connecting portion 124 of the circuit board 12.

In an embodiment, referring to fig. 4, 11 and 12, the fourth connecting portion 124 is composed of a fourth adaptor plate 1242 and a fourth base plate 1241. The fourth bottom plate 1241 is connected to the third connection part 123. The fourth interposer 1242 is provided with pads, which are composed of metalized vias. The bonding pads on the fourth adapter plate 1242 are soldered to the wires passing through the wire fixing plate 171 after being stripped from the cables 11, and the bonding pads on the fourth adapter plate 1242 can also be electrically connected to the processing circuit on the third connecting portion 123, so that the first analog signals processed by the processing circuit and the temperature signals measured by the temperature sensitive element 14 are transmitted to the cables 11 through the fourth connecting portion 124. In this embodiment, the fourth interposer 1242 may be made of FR4 grade material, and is soldered on the fourth board 1241 by surface mounting, and the soldering process between the pads on the fourth interposer 1242 and the wires in the cable 11 is simple and has better reliability.

In an embodiment, a fixing plate (not shown) is disposed on the third connecting portion 123 opposite to the processing circuit, so as to increase the strength of the third connecting portion 123, thereby improving the reliability of the processing circuit on the third connecting portion 123. In other embodiments, a fixing plate may be further disposed on the fourth bottom plate 1241 at a side opposite to the fourth adaptor plate 1242 to increase the strength of the fourth connecting portion 124.

The sensor 10 in the above embodiment can increase the creepage distance between the housing (including the sheath 151, the upper cover 152, the base 153 and the bottom cover 154), the internal conductive mechanical parts and the electrical traces of the circuit board 12 by optimizing the structure inside the sensor 10, so as to increase the withstand voltage of the sensor 10 without reducing the reliability of the sensor 10, for example, the withstand voltage of the sensor 10 can be increased from AC500V to AC 2500V.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (13)

1. An insulation and voltage resistance sensor is characterized by comprising a base, an upper cover, a circuit board, a resonance assembly, a cable and a cable locking structure; the upper cover is a through hole piece, the resonance assembly is arranged in the through hole of the upper cover and fixed on the base, the resonance assembly is used for converting a vibration signal into an electric charge signal, the circuit board is connected with the resonance assembly and the cable, the circuit board is used for converting the electric charge signal into a first analog signal and outputting the first analog signal to the cable, and the cable locking structure is used for fixing the cable;

wherein the resonance assembly comprises: the piezoelectric device comprises a mass block, a first insulating pad, a piezoelectric wafer, a second insulating pad and a screw; the mass block, the first insulating pad, the piezoelectric wafer and the second insulating pad are sequentially arranged and are provided with through holes, and the screws sequentially penetrate through the through holes in the mass block, the first insulating pad, the piezoelectric wafer and the second insulating pad and are fixed on the base;

a boss is arranged on one side of the base close to the resonance component; the first insulating pad and the second insulating pad extend to two opposite ends respectively so as to cover the mass block and the outer wall of the boss on the base respectively;

the first insulating pad extends to both ends at the through hole thereof and/or the second insulating pad extends to both ends at the through hole thereof to separate the screw from the piezoelectric wafer.

2. The dielectric withstand voltage sensor according to claim 1, wherein the circuit board is a flexible circuit board, the circuit board including a first connection portion, a second connection portion, a third connection portion, and a fourth connection portion, the third connection portion being connected to the first connection portion, the second connection portion, and the fourth connection portion; the first connecting part and the second connecting part are respectively arranged at two ends of the piezoelectric wafer and are in contact with the piezoelectric wafer so as to transmit the charge signal to the third connecting part; a processing circuit is arranged on the third connecting part to convert the charge signal into the first analog signal; the fourth connection portion is further connected with the cable to transmit the first analog signal to the cable.

3. A dielectric withstand voltage sensor according to claim 1, wherein one end of the mass is recessed inward to allow the screw to sink into the mass.

4. The dielectric withstand voltage sensor according to claim 1, wherein an insulating sheath is provided between the upper cover and the resonance assembly, the insulating sheath being located on an inner wall of the upper cover.

5. The dielectric withstand voltage sensor according to claim 2, further comprising a temperature sensitive element and a bottom cover; the bottom of the base is provided with an opening to accommodate the temperature sensitive element, and an insulating sleeve is arranged between the temperature sensitive element and the inner wall of the base; the bottom cover is fixed at the bottom of the base;

the circuit board further comprises a fifth connecting portion, one end of the fifth connecting portion is connected with the third connecting portion, the other end of the fifth connecting portion is connected with the temperature sensitive element, and the processing circuit is further used for transmitting the temperature signal acquired by the temperature sensitive element to the cable through the fourth connecting portion.

6. The dielectric withstand voltage sensor according to claim 2, wherein the cable locking structure comprises: the sealing rubber ring, the gland, the copper buckle, the stop ring and the nut; the sealing rubber ring, the gland, the copper buckle, the stop ring and the nut are all provided with wire passing through holes; the gland is connected with the upper cover;

the sealing rubber ring is sleeved outside the cable, the nut is arranged at the lower end of the inner wall of the gland, and the sealing rubber ring and the front end of the cable are sleeved on the inner wall of the nut; the nut presses the sealing rubber ring upwards to hold the cable tightly;

the stop ring is positioned on the inner wall of the gland and is far away from one end of the nut; the upper end of the gland is provided with a limiting part; the copper buckle is located between the end, far away from the nut, of the sealing rubber ring and the stop ring.

7. The dielectric withstand voltage sensor according to claim 6, further comprising a wire sheath; the wire protecting sleeve is cylindrical and is provided with an outer edge at the bottom; the wire protecting sleeve is positioned at the upper end of the gland and is arranged between the inner wall of the gland and the cable; the outer edge of the bottom of the wire protecting sleeve is positioned between the stop ring and the limiting part of the gland.

8. The dielectric withstand voltage sensor according to claim 6, further comprising a wire fixing plate; the wire fixing plate is located at the lower end of the sealing rubber ring and located at the top of the inner wall of the upper cover, the cable is located above the wire fixing plate, and a through hole for a lead in the cable to pass through is formed in the wire fixing plate.

9. The dielectric withstand voltage sensor according to claim 8, wherein a lower end of the seal rubber ring is in contact with an upper end of the wire fixing plate.

10. The dielectric withstand voltage sensor according to claim 8, further comprising a first rubber pad and a second rubber pad; the wire fixing plate, the first rubber pad and the second rubber pad are all positioned in the through hole of the upper cover and positioned at the end, far away from the base, of the resonance assembly; the first rubber pad is matched with the wire fixing plate to wrap the fourth connecting portion, and the second rubber pad is arranged on one side, away from the wire fixing plate, of the first rubber pad and matched with the first rubber pad to wrap the third connecting portion.

11. The dielectric withstand voltage sensor according to claim 10, further comprising a yoke; the clamp is located first rubber pad with between the base inner wall.

12. The dielectric withstand voltage sensor according to claim 2, wherein the fourth connecting portion is composed of a fourth interposer and a fourth base plate; the fourth bottom plate is connected with the third connecting part; and a bonding pad is arranged on the fourth adapter plate and consists of metalized through holes.

13. The dielectric withstand voltage sensor according to claim 2, wherein a fixing plate is provided on the third connecting portion on a side opposite to the processing circuit.

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