CN215258764U - A damping support, motion sensor module and unmanned aerial vehicle for motion sensor module - Google Patents

A damping support, motion sensor module and unmanned aerial vehicle for motion sensor module Download PDF

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Publication number
CN215258764U
CN215258764U CN202121421607.9U CN202121421607U CN215258764U CN 215258764 U CN215258764 U CN 215258764U CN 202121421607 U CN202121421607 U CN 202121421607U CN 215258764 U CN215258764 U CN 215258764U
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China
Prior art keywords
vibration damping
circuit board
sensor module
motion sensor
vibration
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Expired - Fee Related
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CN202121421607.9U
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Chinese (zh)
Inventor
高斌
陈凯
桑晓庆
孙笑轩
吴利鑫
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SZ DJI Technology Co Ltd
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SZ DJI Technology Co Ltd
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Abstract

The utility model discloses a damping support, motion sensor module and unmanned aerial vehicle for motion sensor module, the motion sensor module includes the base and has the sensor subassembly of circuit board, the damping support includes annular elasticity portion, installation department and damping portion, the inside wall of annular elasticity portion is equipped with the draw-in groove, the draw-in groove is used for the edge of power supply circuit board to inlay to establish and form fixedly to sensor subassembly, the installation department is used for installing to the base, damping portion connects between annular elasticity portion and installation department for carry out the damping to sensor subassembly. The utility model discloses a damping support includes annular elasticity portion through setting up the damping support to set up the draw-in groove at annular elasticity portion's inside wall, the edge of circuit board inlays in the draw-in groove, this fixed mode, the region that the circuit board edge was left can design less, need not to leave great invalid region, thereby can be with the compacter of whole sensor unit design, reduce the size, save occupation space.

Description

A damping support, motion sensor module and unmanned aerial vehicle for motion sensor module
Technical Field
The utility model relates to a motion sensor field especially relates to a damping support, motion sensor module and unmanned aerial vehicle for motion sensor module.
Background
Motion sensors are a common detection instrument and have certain applications in a number of industries. With the continuous development of the technology, the types of motion sensors have become more and more, and the commonly used motion sensors mainly include an acceleration sensor, a gyroscope, a geomagnetic sensor, an Inertial Measurement Unit (IMU), and the like, wherein the IMU internally includes an accelerometer and a gyroscope; the gyroscope is used for detecting angle information of the object; typically, the IMU is mounted at the center of gravity of the object. Due to the function of measuring the three-axis attitude angle (or angular velocity) and acceleration of an object, the IMU is generally used as a core component for navigation and guidance, and is widely applied to equipment such as vehicles, ships, robots, aircrafts and the like which need to be subjected to motion control.
In unmanned aerial vehicle, the IMU is used for feeding back the fuselage gesture of aircraft, however, because in unmanned aerial vehicle's high-speed motion process, excitation such as aerodynamic load and paddle dynamic unbalance load can cause the fuselage to contain the composition of a lot of high frequency vibration, and these high frequency vibration compositions can be gathered by the IMU, and these high frequency vibration compositions do not have any help to control system, can bring two problems on the contrary, and one of them is that the IMU easily overrange, and its second is the aliasing of signal. Therefore, during installation of the IMU, a vibration damping process is typically performed.
The conventional IMU vibration reduction treatment is that a plurality of hole sites are additionally arranged on a circuit board of an IMU module to install vibration reduction balls, and meanwhile, a safe distance flows out in a certain range from the hole sites, so that electronic components cannot be arranged in the part of the area to form an invalid area, and the IMU module is not compact in structure and large in occupied space.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a damping support, motion sensor module and unmanned aerial vehicle for motion sensor module.
The utility model discloses damping support that first aspect provided for the motion sensor module, the motion sensor module includes the base and has the sensor module of circuit board, damping support includes:
the inner side wall of the annular elastic part is provided with a clamping groove, and the clamping groove is used for embedding the edge of the circuit board to fix the sensor assembly;
a mounting portion for mounting to the base;
and the vibration damping part is connected between the annular elastic part and the mounting part and used for damping the sensor assembly.
The utility model discloses the motion sensor module that the second aspect provided, include:
a base;
the sensor assembly comprises a circuit board and a sensor, wherein the circuit board comprises a packaging area and an edge area positioned around the packaging area, and the sensor is packaged in the packaging area;
in the vibration damping support, the edge region is embedded in the clamping groove of the annular elastic part, and the mounting part is mounted on the base.
The utility model discloses unmanned aerial vehicle that third aspect provided, include:
a body;
a horn mechanically coupled to the fuselage;
the propeller mechanism is arranged on the horn and used for providing flight power;
the motion sensor module is arranged on the machine body.
According to the above technical scheme, the utility model discloses the damping support that the first aspect provided includes annular elasticity portion through setting up the damping support to set up the draw-in groove at the inside wall of annular elasticity portion, the edge of circuit board inlays in the draw-in groove, and this fixed mode, the region that the circuit board edge was left can design less, need not to leave great invalid region, thereby can be with the compacter of whole sensor unit design, reduce the size, save occupation space.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without any creative effort.
Fig. 1 is a schematic structural diagram of a motion sensor module according to an embodiment of the present invention;
fig. 2 is an exploded schematic view of a motion sensor module according to an embodiment of the present invention;
FIG. 3 is a schematic structural view of the shock mount shown in FIG. 2;
fig. 4 is a schematic view of the annular elastic portion and the circuit board according to another embodiment of the present invention;
FIGS. 5(a) -5(e) are schematic cross-sectional views of several straight plate-shaped vibration damping portions;
FIGS. 6(a) -6(d) are schematic cross-sectional views of several kinds of bent plate-shaped vibration damper portions;
FIG. 7 is an exploded schematic view of the sensor assembly shown in FIG. 2;
FIG. 8 is a schematic cross-sectional view A-A of FIG. 1;
FIG. 9 is an enlarged partial schematic view at B of FIG. 8;
fig. 10 is a schematic structural diagram of the unmanned aerial vehicle according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, of the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Some embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
As shown in fig. 1 to 3, the embodiment of the present invention provides a damping support 10 for a motion sensor module 100, the motion sensor module 100 includes a base 20 and a sensor assembly 30 having a circuit board 31, the proposed damping support 10 includes an annular elastic portion 11, an installation portion 12 and a damping portion 13, an inner side wall of the annular elastic portion 11 is provided with a clamping groove 111, the clamping groove 111 is used for embedding the edge of the circuit board 31 to fix the sensor assembly 30, the installation portion 12 is used for installing to the base 20, the damping portion 13 is connected between the annular elastic portion 11 and the installation portion 12, and is used for damping the sensor assembly 30.
The damping support 10 that this embodiment provided includes annular elastic part 11 through setting up damping support 10 to set up draw-in groove 111 at the inside wall of annular elastic part 11, inlay in draw-in groove 111 at the edge of circuit board 31, this fixed mode, the regional comparison that can design that the circuit board 31 edge was left is less, need not to leave great invalid area, thereby can be with the compacter of whole sensor assembly 30 design, reduces the size, saves occupation space.
For example, when the number and arrangement of the electronic components are the same, the length, width and height of the conventional motion sensor module 100 formed by fixing the vibration damping balls are 32.2mm, 22.0mm and 4.8mm, respectively. After the fixing mode of the vibration damping bracket 10 of the embodiment is adopted, the length, width and height of the formed motion sensor module 100 are respectively 22.0mm, 22.0mm and 4.1mm, that is, the space occupied by the whole motion sensor module 100 is reduced by 41.64%.
Optionally, an interference fit is adopted between the circuit board 31 and the annular elastic portion 11, that is, the width of the card slot 111 is designed to be properly smaller than the thickness of the circuit board 31, the card slot 111 is widened when the edge of the circuit board 31 is embedded in the card slot 111, and the annular elastic portion 11 hoops the edge of the circuit board 31 by the action of its own elastic force, so as to fix the circuit board 31. By means of the interference fit between the circuit board 31 and the annular elastic part 11, the circuit board 31 and the annular elastic part 11 are connected stably, and the circuit board 31 and the annular elastic part 11 are prevented from shaking relatively to affect a measurement result.
Alternatively, the locking groove 111 is a ring-shaped locking groove, that is, the locking groove 111 surrounds the ring-shaped elastic portion 11 along the inner sidewall thereof. In this embodiment, the edge of the circuit board 31 is completely embedded in the slot 111, i.e. the annular elastic portion 11 wraps the circuit board 31 for a complete circle. In this design, the circuit board 31 can be firmly fixed to the inside of the annular elastic portion 11.
Of course, the locking grooves 111 are not limited to be annular locking grooves, for example, in other embodiments, as shown in fig. 4, the number of the locking grooves 111 is set to be plural, and the plural locking grooves 111 are spaced along the inner side wall of the annular elastic portion 11. That is, the card slots 111 are discontinuous, in this embodiment, the edge of the circuit board 31 is provided with a plurality of protrusions 311, and the plurality of protrusions 311 are embedded in the plurality of card slots 111 in a one-to-one correspondence.
In some embodiments, the vibration attenuating portion 13 has a straight plate shape.
Alternatively, as shown in fig. 5(a), the sectional width of the vibration attenuating portion 13 is constant.
Alternatively, as shown in fig. 5(b), the cross section of the vibration attenuating portion 13 has a shape that is narrow at the top and wide at the bottom. The upper portion refers to an end of the vibration attenuating portion 13 connected to the annular elastic portion 11, and the lower portion refers to an end of the vibration attenuating portion 13 connected to the mounting portion 12, which will be defined hereinafter.
Alternatively, as shown in fig. 5(c), the cross section of the vibration attenuating portion 13 has a shape that is wide at the top and narrow at the bottom.
Alternatively, as shown in fig. 5(d), the vibration attenuating portion 13 may have a cross section that is wider at both ends and narrower at the center.
Alternatively, as shown in fig. 5(e), the cross section of the vibration attenuating portion 13 has a shape that is narrow at both ends and wide at the middle.
The above-described embodiments are examples in which the vibration attenuating portion 13 has a straight plate shape.
In some embodiments, the vibration mitigation part 13 is in the shape of a bent plate.
Alternatively, as shown in fig. 6(a), the section of the vibration attenuating portion 13 is "C" shaped.
Alternatively, as shown in fig. 6(b) and 6(c), the cross-section of the vibration damping portion 13 is "S" shaped.
Alternatively, as shown in fig. 6(d), the section of the vibration attenuating portion 13 is in a shape of a letter "go".
The above-described several embodiments are examples in which the vibration attenuating portion 13 has a bent plate shape.
In the traditional scheme of damping by adopting damping balls, the configuration of the damping balls is basically determined no matter the damping balls are single balls or double balls, the relative proportion of damping frequencies in the X/Y/Z directions is difficult to change greatly by adjusting the size so as to meet different requirements in practical application, and the design flexibility is not high. In the above embodiment, by setting the vibration damping portion 13 to be in the shape of a straight plate or a curved plate, the relative proportion of the vibration damping frequencies in the three directions X/Y/Z can be changed by adjusting the cross-sectional shape of the vibration damping portion 13 conveniently to flexibly meet various vibration damping design requirements, and the design flexibility is high.
For example, when the vibration attenuating portion 13 has an S-shaped cross-section as shown in fig. 6(c), the vibration attenuating frequency in the Z direction is about 1.0 to 1.8 times the vibration attenuating frequency in the X/Y direction. When the sectional shape of the vibration damping portion 13 is adjusted to the "C" shape shown in fig. 6(a), the vibration damping frequency in the Z direction is about 2.0 to 3.5 times the vibration damping frequency in the X/Y direction. When the cross section of the vibration damping portion 13 is adjusted to a straight plate shape as shown in fig. 5(d), the vibration damping frequency in the Z direction can be 4.0 times or more the vibration damping frequency in the X/Y direction. That is, by adjusting the sectional shape of the vibration damping portion 13, the relative ratio of the vibration damping frequencies in the three X/Y/Z directions can be greatly changed, which is difficult to be achieved by the conventional vibration damping ball vibration damping scheme.
In some embodiments, the number of the vibration attenuating portions 13 is plural, and a plurality of vibration attenuating portions 13 are arranged at intervals along the annular elastic portion 11. Alternatively, the plurality of vibration attenuating portions 13 are symmetrically disposed with respect to the center of the annular elastic portion 11. Illustratively, the number of the vibration attenuating portions 13 is four, and the four vibration attenuating portions 13 are symmetrically arranged with respect to the center of the annular elastic portion 11. Through setting up a plurality of damping portions 13 and being the symmetry setting for the center of annular elastic part 11, make things convenient for sensor assembly 30's damping design, reduce the design degree of difficulty. Of course, the vibration damping portion 13 may be provided in one and annular shape, and the vibration damping portion 13 extends along the annular elastic portion 11.
In some embodiments, the number of mounting portions 12 corresponds to the number of damping portions 13, and each damping portion 13 is connected to a corresponding mounting portion 12.
As shown in fig. 1, fig. 2, and fig. 7 to fig. 9, an embodiment of the present invention further provides a motion sensor module 100, where the motion sensor module 100 includes a base 20, a sensor assembly 30, and the vibration damping support 10, the sensor assembly 30 includes a circuit board 31 and a sensor 32, the circuit board 31 includes a packaging region 311 and a rim region 312 located around the packaging region 311, the sensor 32 is packaged in the packaging region 311, the rim region 312 is embedded in the card slot 111 of the annular elastic portion 11, and the mounting portion 12 is mounted on the base 20.
Alternatively, the mounting portion 12 may snap or be adhesively bonded or screwed to the base 20.
In some embodiments, the mounting portion 12 is connected to the base 20 in a snap-fit manner, wherein the base 20 is provided with a through hole 21, the mounting portion 12 includes a first latch 121, a second latch 122 and a connecting portion 123, a width of the first latch 121 is greater than a width of the through hole 21, a width of the second latch 122 is greater than a width of the through hole 21, the connecting portion 123 is connected between the first latch 121 and the second latch 122, a width of the connecting portion 123 is less than or equal to a width of the through hole 21, the connecting portion 123 is inserted into the through hole 21, the first latch 121 abuts against an upper surface of the base 20, the second latch 122 abuts against a lower surface of the base 20, and the vibration damping portion 13 is connected to the first latch 121.
Alternatively, one end of the connecting portion 123 is connected to the middle of the first latch 121, the other end of the connecting portion 123 is connected to the middle of the second latch 122, and the cross-section of the mounting portion 12 is in an "i" shape.
When the mounting portion 12 and the base 20 are mounted, the second latch 122 passes through the through hole 21 from one side of the through hole 21 to the other side of the through hole 21, so that the first latch 121 and the second latch 122 are clamped and fixed on the base 20 from two sides of the base 20.
In some embodiments, the damping bracket 10 further includes a pulling ear portion 14, the pulling ear portion 14 is connected to an end of the mounting portion 12 opposite to the damping portion 13, and the width of the pulling ear portion 14 is smaller than the width of the through hole 21. As can be seen from the above description, when the mounting portion 12 and the base 20 are mounted, the second latch 122 needs to pass through the through hole 21 from one side of the through hole 21 to the other side of the through hole 21, but the width of the second latch 122 is greater than the width of the through hole 21, so that a large force is required to overcome the deformation of the second latch 122 during mounting, and the mounting is very inconvenient. In this embodiment, by providing the pull tab, when the mounting portion 12 and the base 20 are mounted, the pull tab can firstly pass through the through hole 21, and then the pull tab is pulled to enable the second fixture block 122 to pass through the through hole 21 to the other side of the base 20, so that the mounting difficulty of the mounting portion 12 is greatly reduced. The attachment portion 12 may be cut away from the tab portion 14 after installation.
In some embodiments, the annular elastic portion 11, the mounting portion 12, the damping portion 13 and the tab portion 14 are integrally formed by injection molding of an elastic material, so that the molding process is simple and the manufacturing cost is reduced. For example, the annular elastic portion 11, the mounting portion 12, the vibration attenuating portion 13, and the tab portion 14 are integrally injection-molded using silicone rubber or rubber.
In some embodiments, the circuit board 31 has a rectangular shape, the number of the vibration reduction portions 13 is four, and four vibration reduction portions 13 are disposed at four corners of the circuit board 31 in a one-to-one correspondence. With this design, do benefit to the damping design of sensor subassembly 30, reduce the design degree of difficulty.
Of course, the vibration damping portions 13 are not limited to being disposed at four corners, for example, in other embodiments, four vibration damping portions 13 are disposed at the midpoints of four sides of the circuit board 31 in a one-to-one correspondence. In a similar way, the design mode is favorable for the vibration reduction design of the sensor assembly 30, and the design difficulty is reduced.
Optionally, the sensor includes a combination of one or more of an acceleration sensor, a gyroscope, a geomagnetic sensor, and an IMU (Inertial measurement unit) and a GPS (Global Positioning System) sensor.
As shown in fig. 10, the embodiment of the present invention further provides an unmanned aerial vehicle 200, where the proposed unmanned aerial vehicle 200 includes a fuselage 201, a horn 202, a propeller mechanism 203 and the motion sensor module 100, the horn 202 is mechanically coupled to the fuselage 201, the propeller mechanism 203 is installed in the horn 202 for providing flight power, and the motion sensor module 100 is installed in the fuselage 201. Optionally, the motion sensor module 100 is mounted at the center of gravity of the fuselage 201.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected. Either mechanically or electrically. Either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The above disclosure provides many different embodiments or examples for implementing different features of the invention. In order to simplify the disclosure of the present invention, the components and arrangements of the specific examples are described above. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or reference letters in the various examples, which have been repeated for purposes of simplicity and clarity and do not in themselves dictate a relationship between the various embodiments and/or arrangements discussed. In addition, the present disclosure provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
In the description of the present specification, reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "example", "specific example", or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims (14)

1. A vibration dampening bracket for a motion sensor module, the motion sensor module including a base and a sensor assembly having a circuit board, the vibration dampening bracket comprising:
the inner side wall of the annular elastic part is provided with a clamping groove, and the clamping groove is used for embedding the edge of the circuit board to fix the sensor assembly;
a mounting portion for mounting to the base;
and the vibration damping part is connected between the annular elastic part and the mounting part and used for damping the sensor assembly.
2. The vibration reducing mount of claim 1 wherein the snap groove is an annular snap groove; or the number of the clamping grooves is multiple, and the clamping grooves are arranged at intervals along the inner side wall of the annular elastic part.
3. The vibration damping mount according to claim 1 wherein the vibration damping portion is in the shape of a straight plate; alternatively, the vibration damping portion has a bent plate shape.
4. The vibration damping mount according to claim 3 wherein the vibration damping portion is "C" shaped or "S" shaped or "go back" shaped.
5. The vibration damping mount according to claim 1 wherein the vibration damping portion is plural in number, and the plural vibration damping portions are provided at intervals along the annular elastic portion.
6. The vibration damping mount according to claim 5 wherein the plurality of vibration damping portions are disposed symmetrically with respect to a center of the annular elastic portion.
7. The vibration damping mount according to claim 5 wherein the number of mounting portions corresponds to the number of vibration damping portions, one mounting portion being associated with each vibration damping portion.
8. The vibration damping mount of claim 1 further comprising a pull ear portion, the pull ear portion being connected to the mounting portion opposite an end of the vibration damping portion.
9. The vibration damping mount according to claim 8 wherein the annular elastic portion, the mounting portion, the vibration damping portion and the tab portion are integrally injection molded from an elastic material.
10. A motion sensor module, comprising:
a base;
the sensor assembly comprises a circuit board and a sensor, wherein the circuit board comprises a packaging area and an edge area positioned around the packaging area, and the sensor is packaged in the packaging area;
the vibration damping mount according to any one of claims 1 to 9, wherein the edge portion is fitted into a locking groove of the annular elastic portion, and the mounting portion is mounted to the base.
11. The motion sensor module of claim 10, wherein the mounting portion is snap-fit or bonded or bolted to the base.
12. The motion sensor module of claim 11, wherein the mounting portion is in clamping engagement with the base, wherein the base is provided with a through hole therethrough, the mounting portion comprising:
the width of the first fixture block is larger than that of the through hole;
the width of the second fixture block is larger than that of the through hole;
the connecting part is connected between the first fixture block and the second fixture block, and the width of the connecting part is smaller than or equal to that of the through hole;
the connecting portion penetrates through the through hole, the first clamping block abuts against the upper surface of the base, the second clamping block abuts against the lower surface of the base, and the vibration reduction portion is connected with the first clamping block.
13. The motion sensor module according to claim 10, wherein the circuit board is rectangular, the number of the vibration reduction parts is four, and the four vibration reduction parts are arranged at four corners of the circuit board in a one-to-one correspondence manner; alternatively, the first and second electrodes may be,
the circuit board is rectangular, the number of the vibration reduction parts is four, and the four vibration reduction parts are correspondingly arranged at the middle points of four edges of the circuit board one by one.
14. An unmanned aerial vehicle, comprising:
a body;
a horn mechanically coupled to the fuselage;
the propeller mechanism is arranged on the horn and used for providing flight power;
the motion sensor module of any of claims 10-13, mounted to the body.
CN202121421607.9U 2021-06-24 2021-06-24 A damping support, motion sensor module and unmanned aerial vehicle for motion sensor module Expired - Fee Related CN215258764U (en)

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CN202121421607.9U CN215258764U (en) 2021-06-24 2021-06-24 A damping support, motion sensor module and unmanned aerial vehicle for motion sensor module

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Application Number Priority Date Filing Date Title
CN202121421607.9U CN215258764U (en) 2021-06-24 2021-06-24 A damping support, motion sensor module and unmanned aerial vehicle for motion sensor module

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Granted publication date: 20211221