CN215222863U - Servo driver heat radiation structure and servo driver - Google Patents
Servo driver heat radiation structure and servo driver Download PDFInfo
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- CN215222863U CN215222863U CN202121418529.7U CN202121418529U CN215222863U CN 215222863 U CN215222863 U CN 215222863U CN 202121418529 U CN202121418529 U CN 202121418529U CN 215222863 U CN215222863 U CN 215222863U
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- heat dissipation
- servo driver
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- ventilation opening
- gas
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Abstract
The utility model discloses a servo driver heat radiation structure, wherein, servo driver heat radiation structure includes PCB subassembly, PCB subassembly includes base plate, fan and heat dissipation channel, the fan with the heat dissipation channel locates the base plate, the fan locates in the heat dissipation channel; the shell is provided with a containing cavity, the PCB assembly is arranged in the containing cavity, the shell wall of the shell corresponds to the fan and is provided with a fan hole, the two sides of the shell are respectively provided with a first ventilation opening and a second ventilation opening, and the heat dissipation channel is communicated with the first ventilation opening and the second ventilation opening. The utility model discloses technical scheme improves servo driver's heat dispersion.
Description
Technical Field
The utility model relates to an industrial control field, in particular to servo driver heat radiation structure and servo driver.
Background
Servo driver is control servo motor's equipment, wide application in the industrial manufacturing field, servo motor realizes the rotation of motor shaft through converting the electrical signal into angular momentum, can realize different rotational speeds according to control servo motor's power difference, when converting the electrical signal into angular momentum, not only electronic components, if resistance, diode etc. have the electrothermal, the rotation of motor, the friction also can give off the heat, if control servo motor's servo driver does not dispel the heat, then can lead to self and servo motor's harm, produce danger even.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a servo driver heat radiation structure and servo driver aims at dispelling the heat to servo driver.
In order to achieve the above object, the present invention provides a heat dissipation structure for a servo driver, the heat dissipation structure for the servo driver includes a PCB assembly, the PCB assembly includes a substrate, a fan and a heat dissipation channel, the fan and the heat dissipation channel are disposed on the substrate, and the fan is disposed in the heat dissipation channel; the shell is provided with a containing cavity, the PCB assembly is arranged in the containing cavity, the shell wall of the shell corresponds to the fan and is provided with a fan hole, the two sides of the shell are respectively provided with a first ventilation opening and a second ventilation opening, and the heat dissipation channel is communicated with the first ventilation opening and the second ventilation opening.
Furthermore, the PCB assembly structure also comprises a plurality of radiating fins, and the plurality of radiating fins are arranged close to the fan to form the radiating channel.
Furthermore, the plurality of heat dissipation fins are arranged on two sides of the fan at intervals in parallel, and the plurality of heat dissipation fins are arranged towards the first ventilation opening or the second ventilation opening.
Furthermore, the two side ends of the radiating fins are chamfered; and/or the heat radiating fins are provided with top columns, and the diameter or the equivalent diameter of each top column is larger than the thickness of each heat radiating fin.
Furthermore, the shell wall of the shell is also provided with heat dissipation holes.
Furthermore, a plurality of heat dissipation holes are formed, a plurality of ventilation areas are formed by the heat dissipation holes, and the ventilation areas are respectively arranged on the shell wall; and/or the heat dissipation holes are rectangular or circular.
Furthermore, one end of the shell is open, the first ventilation opening and the second ventilation opening are respectively arranged close to the open, the plurality of ventilation areas comprise a first area and a second area which are arranged on two side walls of the shell, and the first area and the second area are respectively opposite to the second ventilation opening and the first ventilation opening.
Further, a plurality of the heat dissipation holes are arranged at equal intervals.
Further, the fan hole is circular or approximately circular; and/or the fan is provided with a plurality of fans.
Further, servo drive heat radiation structure still includes heat dissipation silica gel, heat dissipation silica gel is located the PCB subassembly.
The utility model discloses still provide a servo driver, servo driver includes above-mentioned servo driver heat radiation structure.
The utility model discloses servo driver heat radiation structure realizes holding the air flow of intracavity through the fan, and the fan hole can be ensured to hold chamber and external world and realize gas exchange under the drive of fan, and heat dissipation channel ensures that the air flows according to the certain direction, and wherein, the first vent and the second vent intercommunication of heat dissipation channel and shell both sides make the air flow who holds the intracavity outside to dispel the heat to PCB subassembly and hold the chamber.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of a heat dissipation structure of a servo driver according to the present invention;
fig. 2 is a schematic structural diagram of a PCB assembly in the heat dissipation structure of the servo driver of the present invention;
fig. 3 is a schematic structural diagram of another embodiment of the heat dissipation structure of the servo driver of the present invention;
FIG. 4 is a bottom view of FIG. 3;
FIG. 5 is a right side view of FIG. 3;
FIG. 6 is a left side view of FIG. 3;
FIG. 7 is a rear view of FIG. 3;
fig. 8 is a top view of fig. 3.
The reference numbers illustrate:
the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a servo driver heat radiation structure.
In the embodiment of the present invention, as shown in fig. 1, the heat dissipation structure 100 of the servo driver includes a PCB assembly 10, the PCB assembly 10 includes a substrate 11, a fan 12 and a heat dissipation channel 13, the fan 12 and the heat dissipation channel 13 are disposed on the substrate 11, and the fan 12 is disposed in the heat dissipation channel 13; and a housing 20, the housing 20 having a receiving cavity, the PCB assembly 10 being disposed in the receiving cavity, a wall of the housing 20 being provided with a fan hole 21 corresponding to the fan 12, two sides of the housing 20 having a first vent 22 and a second vent 23, respectively, and the heat dissipation channel 13 being communicated with the first vent 22 and the second vent 23.
It should be noted that the PCB assembly 10 further includes a circuit board, the circuit board can be a PCB board that can realize driving the servo motor and other debugging and displaying functions, and components that can realize related functions, such as a switch, a transformer, an NTC temperature sensor, a braking field tube, a rectifier bridge, a module high-power device, a braking resistor, a key, an LED display screen, etc., are assembled on the circuit board.
Specifically, the servo driver heat dissipation structure 100 realizes the air flow in the accommodating cavity through the fan 12, the fan hole 21 can ensure that the accommodating cavity and the outside realize the gas exchange under the driving of the fan 12, and ensure that the fan 12 rotates normally, and the heat dissipation channel 13 ensures that the air flows according to a certain direction, wherein, the heat dissipation channel 13 is communicated with the first ventilation opening 22 and the second ventilation opening 23 at the two sides of the housing 20, that is, the heat dissipation channel 13 has a trend extending towards the second ventilation opening 23 or the first ventilation opening 22, so that the two sides of the heat dissipation channel 13 are directly exposed in the air, and the air in the accommodating cavity flows to the outside, thereby dissipating heat to the PCB assembly 10 and the accommodating cavity.
Optionally, the direction and the channel width of the heat dissipation channel 13 may be set according to the air output of the fan 12 or according to actual production requirements, and if the first ventilation opening 22 and the second ventilation opening 23 are respectively disposed at the top and the mixed bottom of the housing 20, the direction of the heat dissipation channel 13 and the first ventilation opening 22 and the second ventilation opening 23 may be further synchronously adjusted.
It can be understood that the first ventilation opening 22 and the second ventilation opening 23 in this embodiment are used for exchanging air, and the air flows out through the heat dissipation channel 13 to take away the hot air in the heat dissipation channel 13, so as to achieve the heat dissipation effect.
Further, the structure of the PCB assembly 10 further includes a plurality of heat dissipation fins 14, the plurality of heat dissipation fins 14 are disposed near the fan 12, and the heat dissipation channel 13 is formed to guide the air flow.
Further, the plurality of heat dissipation fins 14 are disposed at two sides of the fan 12 at intervals, and the plurality of heat dissipation fins 14 are disposed toward the first ventilation opening 22 or the second ventilation opening 23, so as to send air inside the accommodating cavity out of the accommodating cavity and exchange air with the outside.
Further, since the installation manner in this embodiment is to install the servo driver through the installation pieces on the two sides of the housing 20 or the base, in order to facilitate the user to install the servo driver on other equipment, for example, in order to facilitate the screwing action, the two sides of the heat dissipation fins 14 are chamfered to avoid the user, and meanwhile, it can be understood that since the thickness of the heat dissipation fins 14 is thinner, the hand holding portion of the heat dissipation fins 14 is chamfered to prevent accidental injury during installation.
Further, the heat dissipation fins 14 have the top pillars 141, and the diameter or equivalent diameter of the top pillars 141 is larger than the thickness of the heat dissipation fins 14, so that the heat dissipation fins 14 can be taken out through a thimble or the like after injection molding during manufacturing, and of course, the top pillars 141 can also stabilize the heat dissipation fins 14, so that the heat dissipation fins are not easy to shake or tilt to change the direction of the heat dissipation channel 13 during heat dissipation.
Alternatively, the heat dissipation fins 14 may be integrally disposed with the base, or the heat dissipation fins 14 may first form the heat dissipation channels 13 and then be connected to the base by other fixing methods, such as bonding with a heat conductive adhesive, or screw-nut connection.
Further, in this embodiment, the wall of the housing 20 is further provided with heat dissipation holes, and the accommodating cavity further forms natural circulation with the outside through the heat dissipation holes to release heat, in other embodiments, the heat dissipation holes may be used for gas exchange, for example, when a plurality of fans 12 are provided, the plurality of fans 12 are disposed in the accommodating cavity and connected to the housing 20 or the PCB assembly, so as to promote the circulation of air in the accommodating cavity under the effect of the plurality of fans 12, thereby realizing the air exchange between the heat dissipation holes and the outside, and further improving the heat dissipation performance of the heat dissipation structure 100 of the servo driver.
Further, the louvre is equipped with a plurality ofly, and is a plurality of louvre forms a plurality of ventilation zone 24, and is a plurality of ventilation zone 24 locates respectively 20 walls of shell to increase air-out area, improve the radiating efficiency.
Optionally, the heat dissipation holes are rectangular or circular, wherein the circular heat dissipation holes enable the housing 20 to have better stability, and the heat dissipation holes in the embodiment are rectangular, so that the production and the manufacturing are convenient.
Further, one end of the housing 20 is open, the first ventilation opening 22 and the second ventilation opening 23 are respectively disposed near the open end, the plurality of ventilation areas 24 include a first area 251 and a second area 252 disposed on two side walls of the housing 20, the first area 251 and the second area 252 are respectively opposite to the second ventilation opening 23 and the first ventilation opening 22, that is, the first area 251 and the second area 252 are disposed near the fan 12, so as to further assist the fan 12 in dissipating heat.
Further, the heat dissipation holes are arranged at equal intervals, and certainly, in other embodiments, other arrangement manners of the heat dissipation holes may be further provided, such as increasing or decreasing width of the heat dissipation holes, and a plurality of heat dissipation holes cooperate to form a characteristic pattern.
Further, the fan hole 21 is circular or approximately circular, and similarly, the fan 12 in this embodiment is circular, so that the two cooperate to enhance the air flow.
Further, the servo drive heat radiation structure further comprises heat radiation silica gel, and the heat radiation silica gel is arranged on the PCB assembly 10.
Specifically, the heat-dissipating silica gel realizes the functions of heat conduction and connection. In the manufacturing process of the circuit board, elements such as a transformer, an NTC temperature sensor, a brake field tube and the like on the circuit board are connected with the base through the heat dissipation silicone sheet for heat conduction, the rectifier bridge and the module high-power device are directly locked and attached to the base after being coated with heat dissipation silicone grease, and the heat dissipation elements such as the fan 12 and the like are matched to dissipate heat of the circuit board, the electronic component or the accommodating cavity and simultaneously connect the electronic component to the base or the circuit board.
Optionally, in this embodiment, a braking resistor mounting position is further provided near the heat dissipation fins 14 or the heat dissipation channel 13, and two specifications of braking resistors can be optionally mounted.
The application further provides a servo driver, which includes a servo driver heat dissipation structure 100, and the specific structure of the servo driver heat dissipation structure 100 refers to the above embodiments, and since the servo driver heat dissipation structure 100 adopts all technical solutions of all the above embodiments, all beneficial effects brought by the technical solutions of the above embodiments are at least achieved, and are not repeated herein.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims (10)
1. A servo driver heat radiation structure, characterized in that, servo driver heat radiation structure includes:
the PCB assembly comprises a substrate, a fan and a heat dissipation channel, wherein the fan and the heat dissipation channel are arranged on the substrate, and the fan is arranged in the heat dissipation channel;
the shell, the shell has and holds the chamber, the PCB subassembly is located hold the intracavity, the conch wall of shell corresponds the fan is equipped with fan hole, the both sides of shell have first vent and second vent respectively, heat dissipation channel with first vent with second vent intercommunication.
2. The servo driver heat dissipation structure as recited in claim 1, wherein the PCB assembly structure further comprises a plurality of heat dissipation fins, the plurality of heat dissipation fins being disposed adjacent to the fan to form the heat dissipation channel.
3. The servo driver heat dissipation structure as recited in claim 2, wherein a plurality of the heat dissipation fins are disposed at two sides of the fan in parallel at intervals, and the plurality of the heat dissipation fins are disposed toward the first ventilation opening or the second ventilation opening.
4. The servo driver heat dissipation structure of claim 2, wherein both side ends of the heat dissipation fins are chamfered; and/or the presence of a gas in the gas,
the heat dissipation fins are provided with top columns, and the diameter or the equivalent diameter of each top column is larger than the thickness of each heat dissipation fin.
5. The servo driver heat dissipation structure as recited in any one of claims 1 to 4, wherein the housing wall of the housing is further provided with heat dissipation holes.
6. The servo driver heat dissipation structure as recited in claim 5, wherein the heat dissipation holes are plural, the plural heat dissipation holes form plural ventilation areas, and the plural ventilation areas are respectively disposed on the housing wall; and/or the presence of a gas in the gas,
the heat dissipation holes are rectangular or circular.
7. The servo driver heat dissipation structure as recited in claim 6, wherein one end of the housing is open, the first ventilation opening and the second ventilation opening are respectively disposed near the open end, the plurality of ventilation areas include a first area and a second area disposed on both sidewalls of the housing, and the first area and the second area are respectively opposite to the second ventilation opening and the first ventilation opening.
8. The servo driver heat dissipation structure of claim 6, wherein a plurality of the heat dissipation holes are equidistantly spaced.
9. The servo driver heat dissipation structure of any one of claims 1 to 4, wherein the fan hole is circular; and/or the presence of a gas in the gas,
the servo drive heat dissipation structure further comprises heat dissipation silica gel, and the heat dissipation silica gel is arranged on the PCB assembly; and/or the presence of a gas in the gas,
the fan is provided with a plurality of.
10. A servo driver, characterized in that the servo driver comprises the servo driver heat dissipation structure according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121418529.7U CN215222863U (en) | 2021-06-24 | 2021-06-24 | Servo driver heat radiation structure and servo driver |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121418529.7U CN215222863U (en) | 2021-06-24 | 2021-06-24 | Servo driver heat radiation structure and servo driver |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215222863U true CN215222863U (en) | 2021-12-17 |
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ID=79434732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121418529.7U Active CN215222863U (en) | 2021-06-24 | 2021-06-24 | Servo driver heat radiation structure and servo driver |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215222863U (en) |
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2021
- 2021-06-24 CN CN202121418529.7U patent/CN215222863U/en active Active
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| GR01 | Patent grant | ||
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Address after: 518000 1607-1611, block B, building 6, Shenzhen International Innovation Valley, Dashi Road, Xili community, Xili street, Nanshan District, Shenzhen, Guangdong Patentee after: Shenzhen Yankong Automation Technology Co.,Ltd. Address before: 518000 1607-1611, block B, building 6, Shenzhen International Innovation Valley, Dashi Road, Xili community, Xili street, Nanshan District, Shenzhen, Guangdong Patentee before: SHENZHEN YAKO AUTOMATION TECHNOLOGY Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |