CN215209684U - Radionuclide electroplating device - Google Patents
Radionuclide electroplating device Download PDFInfo
- Publication number
- CN215209684U CN215209684U CN202120975672.XU CN202120975672U CN215209684U CN 215209684 U CN215209684 U CN 215209684U CN 202120975672 U CN202120975672 U CN 202120975672U CN 215209684 U CN215209684 U CN 215209684U
- Authority
- CN
- China
- Prior art keywords
- electroplating
- electroplating bath
- power supply
- radionuclide
- voltage power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model relates to a radionuclide electroplating device, which comprises an electroplating bath unit and a power supply assembly connected with the electroplating bath unit, wherein the electroplating bath unit comprises two electroplating baths, a platinum wire arranged in the electroplating bath, an electroplating bath cover arranged at the bottom of the electroplating bath and an electroplating steel sheet; the power supply assembly comprises a stabilized voltage power supply and an electric wire connected with a current output port of the stabilized voltage power supply, a sample solution to be electroplated is filled in the electroplating bath, and the electroplating bath unit is connected with the stabilized voltage power supply through the electric wire to form a loop. The device has low overall cost, reduces the detection cost, is beneficial to popularization, is simple and easy to disassemble, can replace the plating bath at any time, avoids cross contamination among samples to the maximum extent, and improves the quality of analysis results; the device can electroplate more than 4 samples simultaneously at least, has realized batch processing, has improved work efficiency.
Description
Technical Field
The utility model relates to a radiation environment monitoring field especially relates to a radionuclide electroplates device.
Background
Radionuclides, particularly alpha radionuclides, are commonly measured using an alpha spectrometer. The radionuclide to be detected needs to be prepared into a measurement source, and the electroplating method is the most common source preparation method.
Currently, commercially available electroplating devices are commonly used, and such devices have the following disadvantages: 1. the existing electroplating device is basically a single electroplating tank, only one sample can be electroplated each time, batch processing cannot be realized, and time and labor are consumed; 2. the plating bath is expensive to replace and difficult to clean, cross contamination is easy to cause, and the accuracy of a sample analysis result is influenced; 3. the cooling system has small effect, and the temperature is high during electroplating, so that a better cooling effect cannot be achieved; 4. the operation is complex, which is not beneficial to rapid detection; 5. the whole cost of the electroplating device is high, and the electroplating device is difficult to popularize and use in a large range.
In recent years, our country has paid more attention to environmental protection and radioactivity detection work, and accordingly, the detection demand for alpha radionuclide is higher and higher. At present, the domestic laboratory still uses the alpha spectrometer as the main detecting instrument of alpha radionuclide, and the electroplating method is also main system source means, consequently, in order to improve detection efficiency, reduce the detection cost, this patent designs a radionuclide electroplates device in order to solve current technical problem.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the defects in the prior art and provide a radionuclide electroplating device.
In order to realize the purpose, the utility model discloses a technical scheme as follows:
a radionuclide electroplating device comprises an electroplating bath unit and a power supply assembly connected with the electroplating bath unit, wherein the electroplating bath unit comprises two electroplating baths, a platinum wire arranged in the electroplating bath, an electroplating bath cover arranged at the bottom of the electroplating bath and an electroplating steel sheet;
the power supply assembly comprises a stabilized voltage power supply and an electric wire connected with a current output port of the stabilized voltage power supply, one current output port of the stabilized voltage power supply is connected with a platinum wire in one electroplating bath of the electroplating bath unit through the electric wire, the other current output port of the stabilized voltage power supply is connected with an electroplating steel sheet in the other electroplating bath of the electroplating bath unit through the electric wire, a to-be-electroplated sample solution is filled in the electroplating bath, and the electroplating bath unit is connected with the stabilized voltage power supply through the electric wire to form a loop.
Furthermore, the electroplating device also comprises a cooling system, wherein the cooling system comprises water-cooling containers arranged outside each electroplating bath, a cooling water inlet and a cooling water outlet which are arranged on the water-cooling containers, the cooling water inlet and the cooling water outlet between the adjacent water-cooling containers are connected in series through rubber hoses, and the free ends of the rubber hoses are connected with a cooling water source.
Furthermore, a current adjusting knob is arranged on the voltage-stabilized power supply.
Further, the electroplating steel sheet is made of a stainless steel mirror surface material, the mirror surface of the electroplating steel sheet faces the platinum wire, and the non-mirror surface of the electroplating steel sheet is connected with the wire.
Further, a gap is formed between the electroplated steel sheet and the end part of the platinum wire.
Furthermore, the electroplating bath is made of plastic.
The utility model has the advantages that: 1. the overall cost is low, the detection cost is reduced, and the popularization is facilitated; 2. the electroplating bath can be replaced at any time, so that cross contamination among samples is avoided to the maximum extent, and the quality of an analysis result is improved; 3. at least more than 4 samples can be electroplated simultaneously, batch processing is realized, and the working efficiency is improved.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic top view of the present invention.
Detailed Description
As shown in fig. 1 and 2, a radionuclide electroplating apparatus includes a plating tank unit and a power supply assembly connected to the plating tank unit, wherein the plating tank unit includes two plating tanks 3, an gold platinum wire 4 disposed in the plating tank 3, a plating tank cover 5 and a plated steel sheet 6 mounted at the bottom of the plating tank 3;
the power supply assembly comprises a stabilized voltage power supply 1 and an electric wire 11 connected with a current output port of the stabilized voltage power supply 1, one current output port of the stabilized voltage power supply 1 is connected with a platinum wire 4 in one electroplating bath 3 of the electroplating bath unit through the electric wire 11, the other current output port of the stabilized voltage power supply 1 is connected with an electroplating steel sheet 6 in the other electroplating bath 3 of the electroplating bath unit through the electric wire 11, an electroplating sample solution to be electroplated is filled in the electroplating bath 3, and the electroplating bath unit is connected with the stabilized voltage power supply through the electric wire to form a loop.
The electroplating device further comprises a cooling system, wherein the cooling system comprises water-cooling containers 7 arranged on the outer sides of the electroplating baths 3, cooling water inlets 8 and cooling water outlets 9 arranged on the water-cooling containers 7, the cooling water inlets 8 and the cooling water outlets 9 between the adjacent water-cooling containers 7 are connected in series through rubber hoses 10, and the free ends of the rubber hoses 10 are connected with a cooling water source.
Further, a current adjusting knob 2 is arranged on the stabilized voltage power supply 1. The electroplated steel sheet 6 is made of a stainless steel mirror surface material, the mirror surface of the electroplated steel sheet 6 faces the platinum wire 4, and the non-mirror surface of the electroplated steel sheet 6 is connected with the electric wire 11. The electroplated steel sheet 6 and the end part of the platinum wire 4 are provided with a gap, and the interval is preferably 5 mm.
The material of the plating tank 3 is plastic, and a 20mL plastic bottle is preferable for the purpose of insulation.
When the device is used for electroplating operation, the electroplating tank cover 5 is opened and the electroplated steel sheet 6 is installed, so that the non-mirror surface faces downwards. The plating bath units are placed into a water-cooled container 7, 1 group of 2 plating baths 3 are connected into 2 loops by using an electric wire 11 and a stabilized voltage power supply 1. The sample solution to be electroplated is transferred to the electroplating bath 3 and the tightness is checked, and after no leakage is confirmed, the cooling water source is opened. The cooling water flows into the water-cooling container 7 from the cooling water inlet 8 through the rubber hose 10 and flows into the next electroplating unit through the cooling water outlet 9 to be changed into cooling inlet water, and the cooling water of all the electroplating units is connected in series. After the circuit connection is confirmed to be correct again, the stabilized voltage power supply 1 is turned on, the current is adjusted to a required value by using the current adjusting knob 2 and is kept stable, and electroplating is started. And (4) disconnecting the stabilized voltage power supply 1 after the electroplating is finished, stopping cooling water, disassembling the circuit, taking out the electroplated sheet according to the program, and measuring.
The electroplating device can be realized in a common chemical laboratory. The electroplating device can realize decontamination to a certain degree through electroplating blank solution, and can directly replace the electroplating bath 3 if the pollution is serious.
The device has low overall cost, reduces the detection cost, is beneficial to popularization, is simple and easy to disassemble, can replace the plating bath at any time, avoids cross contamination among samples to the maximum extent, and improves the quality of analysis results; the device can electroplate more than 4 samples simultaneously at least, has realized batch processing, has improved work efficiency.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the principles of the present invention may be applied to any other embodiment without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A radionuclide electroplating device comprises an electroplating bath unit and a power supply assembly connected with the electroplating bath unit, and is characterized in that the electroplating bath unit comprises two electroplating baths, a platinum wire arranged in the electroplating bath, an electroplating bath cover arranged at the bottom of the electroplating bath and an electroplating steel sheet;
the power supply assembly comprises a stabilized voltage power supply and an electric wire connected with a current output port of the stabilized voltage power supply, one current output port of the stabilized voltage power supply is connected with a platinum wire in one electroplating bath of the electroplating bath unit through the electric wire, the other current output port of the stabilized voltage power supply is connected with an electroplating steel sheet in the other electroplating bath of the electroplating bath unit through the electric wire, a to-be-electroplated sample solution is filled in the electroplating bath, and the electroplating bath unit is connected with the stabilized voltage power supply through the electric wire to form a loop.
2. The radionuclide electroplating apparatus according to claim 1, further comprising a cooling system, wherein the cooling system comprises water-cooled containers disposed outside the respective electroplating baths, and a cooling water inlet and a cooling water outlet provided on the water-cooled containers, the cooling water inlet and the cooling water outlet between the adjacent water-cooled containers are connected in series through a rubber hose, and a free end of the rubber hose is connected to a cooling water source.
3. The radionuclide plating apparatus according to claim 1 or 2, wherein the regulated power supply is provided with a current adjusting knob.
4. The radionuclide plating apparatus according to claim 3, wherein the plated steel sheet is a stainless steel mirror surface material, a mirror surface of the plated steel sheet faces the platinum wire, and a non-mirror surface of the plated steel sheet is connected to the wire.
5. The radionuclide plating apparatus according to claim 4, wherein a gap is provided between the plated steel sheet and an end of the platinum wire.
6. The radionuclide plating apparatus according to claim 4, wherein the plating tank is made of plastic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120975672.XU CN215209684U (en) | 2021-05-08 | 2021-05-08 | Radionuclide electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120975672.XU CN215209684U (en) | 2021-05-08 | 2021-05-08 | Radionuclide electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215209684U true CN215209684U (en) | 2021-12-17 |
Family
ID=79448878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120975672.XU Active CN215209684U (en) | 2021-05-08 | 2021-05-08 | Radionuclide electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215209684U (en) |
-
2021
- 2021-05-08 CN CN202120975672.XU patent/CN215209684U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113311177B (en) | Full-automatic chemical oxygen demand analyzer based on different liquid transfer flow paths | |
| CN105866448B (en) | A kind of water quality heavy metal monitors instrument on-line | |
| CN103173842B (en) | The device of electroplating technology and electroplate liquid development experiments is carried out under hyperbaric environment | |
| CN212609706U (en) | Sliding type electrocatalysis reaction device capable of adjusting electrode spacing | |
| CN106950094B (en) | Mini-type multifunctional dyeing workstation and dyeing method | |
| CN215209684U (en) | Radionuclide electroplating device | |
| CN109239168A (en) | A kind of electrochemical depositer | |
| CN110954586A (en) | In-situ hydrogen display detection device and detection method | |
| CN112147086A (en) | Water quality on-line monitoring system capable of configuring measurement process at will | |
| CN202041585U (en) | On-line conductivity monitoring device for charged filed bath solution | |
| CN207908333U (en) | A kind of experimental rig of the resistance to cathodic disbonding performance of testing coating | |
| CN110286036A (en) | A kind of original position stretching and microcell electrochemistry synchronous testing device | |
| CN109468665A (en) | A kind of electric deposition device and method suitable in glove box | |
| CN111650112B (en) | Controllable water chemistry research and test device and method for material corrosion | |
| CN111257214B (en) | In-situ electrochemical cell device capable of measuring electrochemical corrosion performance under electromagnetic field | |
| CN219861635U (en) | Automatic control system for electrophoresis and automatic control complete machine | |
| CN209745975U (en) | Efficient full-automatic urine detector | |
| CN213148958U (en) | Full-automatic biochemical analyzer with stirring function | |
| CN101603198B (en) | Electrolysis apparatus and electrolysis method used in aluminum substrate performance detection | |
| CN108385156A (en) | The flexibly coating or passivation layer preparation facilities and application method of control environmental parameter | |
| CN201319070Y (en) | Electroplating sampling device used for radioactivity measurement | |
| CN217664910U (en) | Cleaning device for probe of sewage online detection instrument | |
| CN216816535U (en) | Portable online pH meter calibrating device | |
| JPH06300887A (en) | Failed fuel detector | |
| CN218297753U (en) | Water sample pretreatment system applied in front of online instrument |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |