CN215201154U

CN215201154U - Disk chamfering device

Info

Publication number: CN215201154U
Application number: CN202121842638.1U
Authority: CN
Inventors: 李文强; 吕宁
Original assignee: Tianjin Yuandong Hengjia New Material Co ltd
Current assignee: Tianjin Yuandong Hengjia New Material Co ltd
Priority date: 2021-08-07
Filing date: 2021-08-07
Publication date: 2021-12-17
Anticipated expiration: 2031-08-07

Abstract

The utility model discloses a wafer chamfering device, which relates to the technical field of chamfering equipment and comprises a mounting seat, wherein one side of the mounting seat is fixedly provided with a cylinder, the end of a piston rod of the cylinder is rotationally provided with a propping block, the other side of the mounting seat is fixedly provided with a first motor, the end of the first motor is fixedly provided with a rotating disk, and the rotating disk is rotationally matched with the mounting seat; be provided with positioning mechanism on the mount pad, positioning mechanism sets up the change on the mount pad including rotating, fixedly connected with spring between change and the mount pad, and the articulated a plurality of connecting rods that are provided with on the change, and the one end that the change was kept away from to the connecting rod is all articulated to be provided with the slider, has seted up a plurality of spouts on the mount pad, and the slider slides the cooperation with corresponding spout, rotates on the slider to be provided with the gyro wheel, still is provided with the grinding mechanism that is used for the chamfer on the mount pad. The utility model provides a use convenient, commonality high and chamfer effectual a disk chamfer device.

Description

Disk chamfering device

Technical Field

The utility model relates to a chamfer equipment technical field especially relates to a disk chamfer device.

Background

Various wafers including composite sheets and metal sheets need to be chamfered at the edges in the production process, the conventional chamfering mode is manual chamfering, the labor intensity of the manual chamfering is high, and the uniformity of the chamfering is difficult to ensure.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a disk chamfer device utilizes the gyro wheel of synchronous shrink to fix a position the disk between two parties, then utilizes the block of supporting and the rotary disk is pressed from both sides the disk tightly, and later the disk rotates under the drive of first motor to the chamfer is accomplished to cooperation grinding mechanism, reduces workman's intensity of labour, and positioning mechanism is high to the positioning accuracy of disk, effectively guarantees the homogeneity of chamfer.

The above technical purpose of the present invention can be achieved by the following technical solutions:

a wafer chamfering device comprises an installation seat, wherein an air cylinder is fixedly arranged on one side of the installation seat, a propping block is rotatably arranged at the end of a piston rod of the air cylinder, a first motor is fixedly arranged on the other side of the installation seat, a rotating disc is fixedly arranged at the shaft end of the first motor, and the rotating disc is in rotating fit with the installation seat; the improved chamfering machine is characterized in that a positioning mechanism is arranged on the mounting seat and comprises a rotating ring which is rotatably arranged on the mounting seat, a spring is fixedly connected between the rotating ring and the mounting seat, a plurality of connecting rods are hinged to the rotating ring, a sliding block is hinged to one end, far away from the rotating ring, of each connecting rod, a plurality of sliding grooves are formed in the mounting seat, the sliding block is in sliding fit with the corresponding sliding groove, rolling wheels are rotatably arranged on the sliding block, and a grinding mechanism for chamfering is further arranged on the mounting seat.

By adopting the technical scheme, when the rotating ring rotates, all the sliding blocks under the transmission action of the connecting rod synchronously slide in the sliding groove, so that all the rollers synchronously contract or expand. When the disk chamfering machine is used, workers place the disks among the rollers, and the rollers can contract synchronously to center the disks, so that the centers of the disks, the centers of the abutting blocks and the centers of the rotating disks are located on the same line, and the uniformity of chamfering is guaranteed. And the positioning mechanism can adapt to the positioning of wafers with different sizes, and has strong universality. Then the cylinder drives the abutting block to abut against the wafer and clamp the wafer together with the rotating disk, then the first motor drives the rotating disk, the wafer and the abutting block to rotate, and the edge of the wafer is chamfered by the grinding mechanism in the wafer rotating process so as to reduce the labor intensity of workers.

The utility model discloses further set up to: the grinding mechanism comprises a feeding seat, an abrasive machine is arranged on the feeding seat in a sliding mode, and a driving mechanism for driving the abrasive machine to feed is arranged on the feeding seat.

Through adopting above-mentioned technical scheme, at the chamfer in-process, actuating mechanism will drive the abrasive machine and be close to the disk or keep away from the disk to control the degree of depth of chamfer, and utilize the abrasive machine to carry out the grinding chamfer to the edge of disk, because the abrasive wheel dish of abrasive machine also can rotate, thereby effectively improve the efficiency of chamfer.

The utility model discloses further set up to: the feeding seat is in running fit with the mounting seat, a regulating mechanism for driving the feeding seat to rotate is arranged on the mounting seat, a supporting seat is arranged at one end, far away from the mounting seat, of the feeding seat, and the feeding seat is in running fit with the supporting seat.

Through adopting above-mentioned technical scheme, when utilizing adjustment mechanism to rotate the feed seat, the contained angle between the abrasive wheel dish of abrasive machine and the disk will change to change the angle of chamfer, guarantee this chamfer device's regulation convenience.

The utility model discloses further set up to: the adjusting mechanism comprises a worm wheel fixed on the feeding seat, a worm meshed with the worm wheel is rotatably arranged on the mounting seat, and an adjusting wheel is fixedly arranged at the end part of the worm.

Through adopting above-mentioned technical scheme, when needs adjust the chamfer angle, the workman can the rotation adjustment wheel, through the transmission of worm and worm wheel after turning into the rotation of feeding the seat with the rotation of adjustment wheel to worm wheel and worm can realize the auto-lock, and it is convenient and adjust the precision height to use.

The utility model discloses further set up to: the installation seat is provided with a torsion scale, and the feeding seat is provided with an angle mark matched with the torsion scale for use.

Through adopting above-mentioned technical scheme, the workman can utilize the position of angle sign on the twist reverse scale to judge the rotation degree that feeds the seat to carry out the accurate adjustment to the chamfer angle.

The utility model discloses further set up to: the grinding mechanism is characterized in that one side of the mounting seat, which is far away from the grinding mechanism, is provided with a taking groove, one side of the mounting seat, which is far away from the feeding seat, is also hinged with a turnover cover, and the turnover cover can be tightly buckled with the taking groove.

Through adopting above-mentioned technical scheme, the workman can be through taking the groove wafer of taking, and it is convenient to use, places the wafer back in the mount pad as the workman, can close the flip lid lock to reduce the dust of chamfer in-process and scatter.

The utility model discloses further set up to: the lower extreme and the mount pad of upset lid are articulated, the upper end of upset lid is fixed and is provided with first magnet, fixed second magnet that is provided with on the mount pad and uses with first magnet cooperation.

Through adopting above-mentioned technical scheme, the workman will overturn the lid and open the back, and the upset lid will keep the state of opening under the effect of self gravity to the disk of being convenient for take, the workman will overturn the lid and close the back, thereby first magnet and second magnet will attract each other and make the upset lid keep closed state, use convenient and stability height.

The utility model discloses further set up to: one side of the mounting seat close to the grinding mechanism is fixedly provided with a negative pressure suction port, a filtering material is arranged in the negative pressure suction port, and the negative pressure suction port is also communicated with a suction interface.

Through adopting above-mentioned technical scheme, negative pressure suction inlet can be sucked by the position of grinding chamfer to the disk after will sucking interface and negative pressure fan intercommunication to with the dust impurity suction of grinding to the negative pressure suction inlet in, filter by filtering material, avoid causing the pollution to the surrounding environment, and open negative pressure fan back, the disk will be to reinforcing greatly by the air mobility of the position of grinding, effectively improves the heat-sinking capability of disk, improves grinding effect.

To sum up, the utility model discloses a beneficial technological effect does:

(1) the utility model utilizes the roller capable of synchronously contracting or expanding to clamp and position the wafer, and ensures the higher concentricity of the rotating center and the circle center thereof in the rotating process of the wafer, thereby ensuring the higher uniformity of the chamfer;

(2) the utility model discloses well feeding seat can take place relative rotation with the mount pad under adjustment mechanism's drive to the angle of adjustment chamfer, it is strong to use convenient adjustability.

Drawings

FIG. 1 is a schematic axial view of an overall structure of an embodiment of the present invention with a flip cover in an open position;

fig. 2 is a schematic view of a rear view of an embodiment of the present invention with the flip cover in a closed position;

fig. 3 is a cross-sectional view along the center line of the present invention, which mainly shows the connection relationship between the feeding seat and the mounting seat.

Reference numerals: 1. a mounting seat; 2. rotating the ring; 3. a spring; 4. a connecting rod; 5. a slider; 6. a chute; 7. a roller; 8. a cylinder; 9. a propping block; 10. a first motor; 11. rotating the disc; 12. taking the groove; 13. turning over the cover; 14. a first magnet; 15. a second magnet; 16. a feeding seat; 17. a supporting seat; 18. a worm gear; 19. a worm; 20. an adjustment wheel; 21. turning scales; 22. identifying an angle; 23. a grinder; 24. a second motor; 25. a threaded rod; 26. a negative pressure suction port; 27. a filter material; 28. a suction interface.

Detailed Description

The present invention will now be described more fully hereinafter with reference to the accompanying examples.

Referring to fig. 1, a disk chamfer device, including mount pad 1, mount pad 1 is sandwich structure, be provided with positioning mechanism on the mount pad 1, positioning mechanism sets up in swivel 2 of mount pad 1 one side including rotating, fixedly connected with spring 3 between swivel 2 and the mount pad 1, the articulated three connecting rod 4 that is provided with on swivel 2, three connecting rod 4 is along swivel 2's circumference equipartition, connecting rod 4 keeps away from that the one end of swivel 2 all articulates and is provided with slider 5, three spout 6 has been seted up on the mount pad 1, the extending direction of three spout 6 is collected in a bit, slider 5 with correspond the cooperation of sliding of spout 6, it is provided with gyro wheel 7 to rotate on the slider 5. When the wafer clamping device is used, a worker pushes the wafer into the space between the three rollers 7, the rotating ring 2 rotates under the action of the spring 3, and the three rollers 7 are synchronously gathered to clamp the wafer and center the wafer under the transmission action of the connecting rod 4.

The mounting base 1 is still fixed in the one side that is provided with the change 2 and is provided with the cylinder 8, and 8 piston rod ends of the cylinder rotate and are provided with the tight piece 9 of support of cylinder structure, and the butt piece is worn to locate among the change 2. One side of the mounting seat 1 far away from the cylinder 8 is fixedly provided with a first motor 10, the shaft end of the first motor 10 is fixedly provided with a rotating disk 11, and the rotating disk 11 is in running fit with the mounting seat 1. The cylinder 8 drives the contact block to move in a direction to approach the rotating disk 11, and the contact block can clamp the wafer together with the rotating disk 11. The mounting base 1 is provided with a taking groove 12, the taking groove 12 is provided with a turning cover 13 which can be tightly buckled with the taking groove 12, the lower end of the turning cover 13 is hinged with the mounting base 1 when the turning cover 13 is buckled on the taking groove 12, the upper end of the turning cover 13 is fixedly provided with a first magnet 14 when the turning cover 13 is buckled on the taking groove 12, and the mounting base 1 is fixedly provided with a second magnet 15 which is matched with the first magnet 14 for use.

Referring to fig. 2, a grinding mechanism for chamfering is further arranged on one side of the mounting base 1 away from the flip cover 13, the grinding mechanism comprises a feeding base 16 which is in running fit with the mounting base 1, a supporting base 17 is arranged at one end of the feeding base 16 away from the mounting base 1, and the feeding base 16 is in running fit with the supporting base 17. The mounting base 1 is provided with an adjusting mechanism for driving the feeding base 16 to rotate, and with reference to fig. 3, the adjusting mechanism includes a worm wheel 18 fixed on the feeding base 16, a worm 19 meshed with the worm wheel 18 is rotatably arranged on the mounting base 1, and an adjusting wheel 20 is fixedly arranged at an end of the worm 19. The mounting base 1 is provided with a torsion scale 21, and the feeding base 16 is provided with an angle mark 22 matched with the torsion scale 21.

The feed base 16 is provided with a grinder 23 in a sliding manner, and the feed base 16 is provided with a driving mechanism for driving the grinder 23 to feed. The driving mechanism comprises a second motor 24 fixed on the feeding seat 16, a threaded rod 25 in running fit with the feeding seat 16 is fixedly arranged at the shaft end of the second motor 24, and the threaded rod 25 is in threaded fit with the grinding machine 23.

Referring to fig. 3, a negative pressure suction port 26 is formed on one side of the mounting base 1 close to the grinding mechanism, a filter material 27 is arranged in the negative pressure suction port 26, a suction port 28 is further communicated with the negative pressure suction port 26, and the suction port 28 is communicated with a negative pressure fan when in use.

The working principle of the embodiment is as follows: when in use, a worker inserts the wafer into the interlayer of the mounting seat 1 from the taking groove 12, the three rollers 7 clamp and position the wafer, and then the air cylinder 8 drives the abutting block 9 to move towards the rotating disk 11 and clamp the wafer together with the rotating disk 11. Then the first motor 10 drives the wafer to rotate, and the driving mechanism drives the grinding wheel machine 23 to feed towards the wafer so as to grind and chamfer the wafer. The embodiment can automatically chamfer the wafer, reduces the labor intensity of workers and has good chamfering uniformity. The depth of chamfer and the angle of chamfer can also be adjusted according to the production demand to this embodiment, and it is convenient, the commonality is high to use.

The above, only do the preferred embodiment of the present invention, not limit the protection scope of the present invention according to this, so: all equivalent changes made according to the structure, shape and principle of the utility model are covered within the protection scope of the utility model.

Claims

1. The utility model provides a disk chamfer device, includes mount pad (1), its characterized in that: an air cylinder (8) is fixedly arranged on one side of the mounting seat (1), a piston rod end of the air cylinder (8) is rotatably provided with a propping block (9), a first motor (10) is fixedly arranged on the other side of the mounting seat (1), a rotating disc (11) is fixedly arranged at the shaft end of the first motor (10), and the rotating disc (11) is in rotating fit with the mounting seat (1); be provided with positioning mechanism on mount pad (1), positioning mechanism sets up swivel (2) on mount pad (1) including rotating, fixedly connected with spring (3) between swivel (2) and mount pad (1), the articulated a plurality of connecting rods (4) that are provided with on swivel (2), the one end that swivel (2) were kept away from in connecting rod (4) is all articulated to be provided with slider (5), a plurality of spouts (6) have been seted up on mount pad (1), slider (5) and corresponding spout (6) cooperation of sliding, it is provided with gyro wheel (7) to rotate on slider (5), still be provided with the grinding mechanism that is used for the chamfer on mount pad (1).

2. The wafer chamfering apparatus as claimed in claim 1, wherein: the grinding mechanism comprises a feeding seat (16), a grinding wheel machine (23) is arranged on the feeding seat (16) in a sliding mode, and a driving mechanism for driving the grinding wheel machine (23) to feed is arranged on the feeding seat (16).

3. The wafer chamfering apparatus as claimed in claim 2, wherein: feed seat (16) and mount pad (1) normal running fit, be provided with the drive on mount pad (1) and feed seat (16) pivoted adjustment mechanism, the one end of keeping away from mount pad (1) of feeding seat (16) is provided with supporting seat (17), feed seat (16) and supporting seat (17) normal running fit.

4. The wafer chamfering apparatus as claimed in claim 3, wherein: the adjusting mechanism comprises a worm wheel (18) fixed on the feeding seat (16), a worm (19) meshed with the worm wheel (18) is rotatably arranged on the mounting seat (1), and an adjusting wheel (20) is fixedly arranged at the end part of the worm (19).

5. The wafer chamfering apparatus as claimed in claim 3, wherein: the mounting seat (1) is provided with a torsion scale (21), and the feeding seat (16) is provided with an angle mark (22) matched with the torsion scale (21) for use.

6. The wafer chamfering apparatus as claimed in claim 1, wherein: the grinding mechanism is characterized in that a taking groove (12) is formed in one side, away from the grinding mechanism, of the mounting seat (1), a turnover cover (13) is hinged to one side, away from the feeding seat (16), of the mounting seat (1), and the turnover cover (13) can be tightly buckled with the taking groove (12).

7. The wafer chamfering apparatus as claimed in claim 6, wherein: the lower extreme and the mount pad (1) of upset lid (13) are articulated, the upper end of upset lid (13) is fixed and is provided with first magnet (14), fixed second magnet (15) that are used with first magnet (14) cooperation that are provided with on mount pad (1).

8. The wafer chamfering apparatus as claimed in claim 1, wherein: one side of the mounting seat (1) close to the grinding mechanism is fixedly provided with a negative pressure suction port (26), a filtering material (27) is arranged in the negative pressure suction port (26), and the negative pressure suction port (26) is further communicated with a suction interface (28).