CN215198581U - Automatic adding and recycling device for semiconductor immersion curing agent - Google Patents

Automatic adding and recycling device for semiconductor immersion curing agent Download PDF

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Publication number
CN215198581U
CN215198581U CN202121323997.6U CN202121323997U CN215198581U CN 215198581 U CN215198581 U CN 215198581U CN 202121323997 U CN202121323997 U CN 202121323997U CN 215198581 U CN215198581 U CN 215198581U
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tank
chemical
agent
draining
chemical agent
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CN202121323997.6U
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Chinese (zh)
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郭宏波
魏忠亮
张洪江
吴令钱
王健
魏冬
朱立海
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Ningbo Tairuisi Microelectronics Co ltd
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Ningbo Tairuisi Microelectronics Co ltd
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Abstract

The utility model discloses an automatic adding and recovering device for semiconductor immersion curing agents, which comprises an immersion tank (1), a draining tank (2), a curing agent recovering tank (3) and a curing agent circulating pump (4); the soaking tank (1) is arranged beside the draining tank (2), the chemical agent recovery tank (3) is arranged beside the draining tank (2), and the bottom of the chemical agent recovery tank (3) is communicated with the top of the draining tank (2) through a pipeline; the liquid inlet end of the chemical agent circulating pump (4) is communicated with the chemical agent recovery tank (3) through a pipeline, and the liquid outlet end of the chemical agent circulating pump (4) is communicated with the soaking tank (1) through a pipeline; the top of the draining groove (2) is provided with a movable cover (21) to seal the top opening of the draining groove (2). The utility model discloses can accelerate the drop-off agent when the drop-off of semiconductor chip's drop-off and collection drop-off, the recycle of the agent of being convenient for has also reduced the pollution of agent to the environment simultaneously.

Description

Automatic adding and recycling device for semiconductor immersion curing agent
Technical Field
The utility model relates to a semiconductor package equipment especially relates to an automatic interpolation of semiconductor soaking line agent and recovery unit.
Background
In the packaging process of the semiconductor chip, a plurality of washing procedures are involved, the chip is placed in a soaking groove and soaked in a soaking line chemical agent for a long time during washing, and after soaking, the chip needs to be drained in a chemical agent draining groove, and then the next procedure is carried out. The draining tank in the prior art has no effective management measure for the chemical agent, and the dropped chemical agent is usually directly discharged through a pipeline at the bottom of the draining tank, so that the waste amount of the chemical agent is large, and the pollution discharge cost of enterprises is increased. In addition, the chip is soaked in the agent for a long time, the draining time is also long, the efficiency of a natural draining mode is low, and chemical components in the agent volatilize in the draining process, so that the environmental pollution is caused, and the health of workers is not facilitated.
Disclosure of Invention
An object of the utility model is to provide an automatic interpolation of semiconductor soaking line agent and recovery unit can accelerate the drop agent when the drop of semiconductor chip's drop dry and collect the drop dry, and the recovery cyclic utilization of the agent of being convenient for has also reduced the pollution of agent to the environment simultaneously.
The utility model discloses a realize like this:
an automatic adding and recovering device for semiconductor immersion curing agents comprises an immersion tank, a draining tank, a curing agent recovering tank and a curing agent circulating pump; the soaking groove is arranged beside the draining groove, the chemical agent recovery groove is arranged beside the draining groove, and the upper part of the chemical agent recovery groove is communicated with the bottom of the draining groove through a pipeline; the liquid inlet end of the chemical agent circulating pump is communicated with the chemical agent recovery tank through a pipeline, and the liquid outlet end of the chemical agent circulating pump is communicated with the soaking tank through a pipeline; the top of the draining groove is provided with a movable cover to seal the top opening of the draining groove.
The draining groove is internally provided with an air blowing pipeline which is positioned below the movable cover, a plurality of air blowing nozzles are arranged on the air blowing pipeline at intervals and face the semiconductor chip, and the air blowing pipeline is externally connected with an air supply source through an air path.
The movable cover is arranged on the top of the draining groove through an automatic hinge shaft, and the automatic hinge shaft is in linkage control with the air supply source.
And a liquid level meter is arranged in the chemical agent recovery tank and is in linkage control with the chemical agent circulating pump.
The draining groove is arranged by being elevated by a bracket, so that the bottom of the draining groove and the top of the chemical agent recovery groove are positioned at the same horizontal height.
Still including setting up soak the chemical agent holding tank of groove side, the chemical agent has been held in the chemical agent holding tank, chemical agent holding tank department is provided with chemical agent liquid feeding pump, the feed liquor end of chemical agent liquid feeding pump pass through the pipeline with chemical agent holding tank intercommunication, the play liquid end of chemical agent liquid feeding pump pass through the pipeline with soak the groove intercommunication.
Still including installing the level sensor in the soaking groove, level sensor with it connects to change agent filling pump.
Compared with the prior art, the utility model, following beneficial effect has:
1. the utility model discloses owing to be equipped with chemical agent accumulator and chemical agent circulating pump, the chemical agent is automatic under the action of gravity, effectual flows in the chemical agent accumulator, can collect the chemical agent that drips when drippings through the chemical agent accumulator, reduces the chemical agent waste and the blowdown cost that leads to of outer row, realizes the recycle of chemical agent through the chemical agent circulating pump, reduction in production cost increases economic benefits.
2. The utility model discloses owing to be equipped with the movable cover and blow the structure, can improve drop dry efficiency and effect through the drop dry process of blowing structure acceleration semiconductor chip, avoid drop dry in-process agent outwards to splash and the chemical composition volatilizees the environmental pollution who leads to in the agent simultaneously through the movable cover, the maximum reduction production environment is to operating personnel's health injury.
3. The utility model discloses can realize production automation through controlgear interlocking control, be favorable to improving production efficiency and quality, increase the income.
Drawings
FIG. 1 is a sectional view of the automatic adding and recycling device for semiconductor immersion curing agent of the present invention;
fig. 2 is a plan view of the automatic adding and recovering device for semiconductor immersion curing agent of the present invention.
Fig. 3 is a cross-sectional view of the soaking tank and the chemical agent storage tank in the automatic adding and recovering device of the semiconductor soaking linearizing agent of the present invention.
In the figure, a soaking tank 1, a draining tank 2, a movable cover 21, a blowing pipeline 22, a blowing nozzle 23, an air supply source 24, an automatic hinge 25, a bracket 26, a 3-agent recovery tank 31, a liquid level meter 4, an agent storage tank 5, an agent adding pump 51 and a liquid level sensor 52 are arranged.
Detailed Description
The invention will be further explained with reference to the drawings and the specific embodiments.
Referring to fig. 1 and 2, an automatic adding and recycling device for semiconductor immersion curing agents comprises an immersion tank 1, a draining tank 2, a curing agent recycling tank 3 and a curing agent circulating pump 4; the soaking tank 1 is arranged beside the draining tank 2, the chemical agent recovery tank 3 is arranged beside the draining tank 2, and the upper part of the chemical agent recovery tank 3 is communicated with the bottom of the draining tank 2 through a pipeline; the liquid inlet end of the chemical agent circulating pump 4 is communicated with the chemical agent recovery tank 3 through a pipeline, and the liquid outlet end of the chemical agent circulating pump 4 is communicated with the soaking tank 1 through a pipeline; the top of the draining groove 2 is provided with a movable cover 21, so that the top opening of the draining groove 2 is closed. The chemical agent collected in the chemical agent recovery tank 3 can be pumped into the soaking tank 1 for cyclic utilization through the chemical agent circulating pump 4, so that the waste of the chemical agent and the pollution discharge cost are reduced. The opening of the draining groove 2 is sealed by the movable cover 21, so that the environmental pollution caused by splashing of the agent and volatilization of chemical components in the draining process can be prevented, and the good production environment is ensured.
The draining groove 2 is internally provided with an air blowing pipeline 22 which is positioned below the movable cover 21, a plurality of air blowing nozzles 23 are arranged on the air blowing pipeline 22 at intervals and face the semiconductor chip, and the air blowing pipeline 22 is externally connected with an air supply source 24 through an air path. The air supply source 24 is used for supplying compressed air, and a compressed air pump and other devices in the prior art can be adopted, the compressed air is blown out through the blowing nozzle 23 through the blowing pipeline 22, and the compressed air is blown on the surface of the semiconductor chip, so that the effect of accelerating draining can be achieved.
The movable cover 21 is installed on the top of the draining groove 2 through an automatic hinge shaft 25, and the automatic hinge shaft 25 is interlocked with the air supply source 24. Preferably, a PLC (programmable logic controller) device in the prior art can be used for controlling the rotation motor (not shown in the figure) of the automatic hinge shaft 25 and the air supply source 22 in an interlocking manner, when the air supply source 24 supplies air to enable the air blowing nozzle 23 to blow air, the rotation motor drives the automatic hinge shaft 25 to rotate, and the movable cover 21 closes the top opening of the draining groove 2, so that a chemical in the blowing and draining process can be prevented from splashing out of the draining groove 2, chemical components in the chemical can be prevented from volatilizing outwards, and the problem of environmental pollution is effectively controlled.
And a liquid level meter 31 is arranged in the chemical agent recovery tank 3, and the liquid level meter 31 and the chemical agent circulating pump 4 are controlled in a linkage manner. Preferably, can adopt prior art's PLC equipment to carry out chain control to level gauge 31 and chemical agent circulating pump 4, when level gauge 31 detects that chemical agent 3 internalizes the agent and reaches a take the altitude in, trigger chemical agent circulating pump 4 work, with the chemical agent pump income soaking tank 1 of chemical agent recovery inslot 3, reach the purpose that the chemical agent was retrieved. The liquid level meter 31 can adopt the measurement equipment such as a flap type liquid level meter and a floating ball type liquid level meter in the prior art, and is used for realizing the measurement of the liquid level height in the chemical recycling tank 3 and the triggering function of the warning liquid level and the safety liquid level, thereby realizing the automatic control of the switch of the chemical circulating pump 4.
The draining tank 2 is erected by the bracket 26, so that the bottom of the draining tank 2 and the top of the chemical agent recovery tank 3 are at the same horizontal height or approximately equal to each other, the arrangement of a pipeline between the bottom of the draining tank 2 and the top of the chemical agent recovery tank 3 is facilitated, the chemical agent can directly flow into the chemical agent recovery tank 3 under the action of gravity, and the effective recovery of the chemical agent is ensured.
The chemical agent in the soaking tank is manually added in the prior art, and the chemical agent in the soaking tank needs to be heated for use, so that the volatilization of the liquid medicine seriously affects the body health of operators when the chemical agent is manually added. In order to solve the technical problem, the utility model discloses an automatic adding of semiconductor soaks line agent and recovery unit still provides the function of automatic adding agent. Specifically, as shown in fig. 2 and 3, the automatic adding and recycling device for semiconductor immersion line agents further comprises a chemical agent storage tank 5 arranged beside the immersion tank 1, a chemical agent is contained in the chemical agent storage tank 5, a chemical agent charging pump 51 is arranged at the chemical agent storage tank 5, a liquid inlet end of the chemical agent charging pump 51 is communicated with the chemical agent storage tank 5 through a pipeline, a liquid outlet end of the chemical agent charging pump 51 is communicated with the immersion tank 1 through a pipeline, so that the chemical agent in the chemical agent storage tank 5 can be pumped into the immersion tank 1 through the chemical agent charging pump 51, automatic additive adding is achieved, the workload of operators is saved, and the safety risk is reduced. Although the chemical in the chemical storage tank 5 needs to be manually added, since the chemical in the chemical storage tank 5 does not need to be heated, the volatilization of the chemical at normal temperature is small, the odor is less likely to overflow, and the influence on the health of the worker can be reduced.
Furthermore, a liquid level sensor 52 is arranged in the soaking tank 1, the liquid level sensor 52 is connected with a chemical agent charging pump 51, the liquid level sensor 52 is used for detecting the liquid level of the chemical agent in the soaking tank 1, when the liquid level of the chemical agent is lower than a set low value, the chemical agent charging pump 51 is triggered to work, the chemical agent in the chemical agent storage tank 5 is pumped into the soaking tank 1, and when the liquid level of the chemical agent reaches a set high value, the chemical agent charging pump 5 is triggered to stop working. The liquid level sensor 52 may adopt a prior art measuring device such as a flap type liquid level meter, a floating ball type liquid level meter, etc. Preferably, the level sensor 52 and the reagent pump 51 are controlled in a chain using a PLC device of the prior art. The utility model discloses can be applied to the soaking machine on the prior art semiconductor soaks the line, the utility model discloses a work flow is:
the semiconductor chip which finishes the procedures of washing, soaking and the like in the soaking tank 1 is placed into the draining tank 2 for draining, and in the draining process, the output shaft of the rotating motor can be controlled by control equipment such as a PLC (programmable logic controller) and the like to rotate in the forward direction, so that the automatic hinge shaft 25 connected to the output shaft of the rotating motor synchronously rotates, and the movable cover 21 is made to seal the top opening of the draining tank 2, thereby preventing chemical components in the chemical from volatilizing to pollute the environment. Meanwhile, the PLC and other control equipment can control the air supply source 24 to blow air to the semiconductor chip through the air pipeline 22 through the air blowing nozzles 23, so that the draining efficiency and the draining effect are improved, the movable cover 21 can be controlled in a linkage mode during air blowing, and the phenomenon that the agent splashes out of the draining groove 2 due to compression air blowing is avoided.
The chemical agent on the semiconductor chip drops to the bottom of the draining tank 2 and flows into the chemical agent recovery tank 3 through a pipeline. When the chemical in the chemical recycling tank 3 reaches the set height, the liquid level meter 31 is triggered to send a liquid level alarm signal to control equipment such as a PLC (programmable logic controller), the control equipment such as the PLC controls the operation of the chemical circulating pump 4 in a linkage manner, the chemical in the chemical recycling tank 3 is pumped into the soaking tank 1 through a pipeline, the recycling of the chemical is realized, the waste and pollution discharge cost of the chemical is reduced, and the chemical in the chemical recycling tank 3 is also prevented from overflowing. After the liquid level of the chemical in the chemical recovery tank 3 is lowered, the liquid level meter 31 sends a liquid level safety signal to a control device such as a PLC, and the control device such as the PLC turns off the chemical circulation pump 4.
When the agent in the soaking tank 1 is less, trigger level sensor 52 and send the liquid feeding signal to controlgear such as PLC, controlgear such as PLC chain control agent liquid feeding pump 51 operation in will take turns to the agent pump in the agent holding tank 5 through the pipeline and go into the soaking tank 1, when the agent in the soaking tank 1 reaches the settlement height, trigger level sensor 52 and take place to stop the liquid feeding signal to controlgear such as PLC, controlgear such as PLC closes agent liquid feeding pump 51.
The utility model discloses an operation control method can adopt controlgear such as prior art PLC and the mode realization of inside software thereof, and here is no longer repeated. The utility model discloses an operation control method also can adopt manual control switch's mode to realize.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and should not be taken as limiting the scope of the present invention, therefore, any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention should be included in the scope of the present invention.

Claims (7)

1. An automatic adding and recovering device for a semiconductor immersion curing agent is characterized in that: comprises a soaking tank (1), a draining tank (2), a chemical agent recovery tank (3) and a chemical agent circulating pump (4); the soaking tank (1) is arranged beside the draining tank (2), the chemical agent recovery tank (3) is arranged beside the draining tank (2), and the upper part of the chemical agent recovery tank (3) is communicated with the bottom of the draining tank (2) through a pipeline; the liquid inlet end of the chemical agent circulating pump (4) is communicated with the chemical agent recovery tank (3) through a pipeline, and the liquid outlet end of the chemical agent circulating pump (4) is communicated with the soaking tank (1) through a pipeline; the top of the draining groove (2) is provided with a movable cover (21) to seal the top opening of the draining groove (2).
2. The automatic adding and recovering apparatus of a semiconductor immersion agent as claimed in claim 1, wherein: the drying tank (2) is internally provided with an air blowing pipeline (22) which is positioned below the movable cover (21), the air blowing pipeline (22) is provided with a plurality of air blowing nozzles (23) at intervals and faces the semiconductor chip, and the air blowing pipeline (22) is externally connected with an air supply source (24) through an air path.
3. The automatic adding and recovering apparatus of a semiconductor immersion agent as claimed in claim 2, wherein: the movable cover (21) is arranged at the top of the draining groove (2) through an automatic hinge shaft (25), and the automatic hinge shaft (25) is interlocked and controlled with the air supply source (24).
4. The automatic adding and recovering apparatus of a semiconductor immersion agent as claimed in claim 1, wherein: and a liquid level meter (31) is arranged in the chemical agent recovery tank (3), and the liquid level meter (31) and the chemical agent circulating pump (4) are controlled in a linkage manner.
5. The automatic adding and recovering apparatus of a semiconductor immersion agent as claimed in claim 1, wherein: the draining groove (2) is arranged by being elevated through a bracket (26), so that the bottom of the draining groove (2) and the top of the chemical agent recovery groove (3) are positioned at the same horizontal height.
6. The automatic adding and recovering apparatus of a semiconductor immersion agent as claimed in claim 1, wherein: still including setting up soak chemical holding tank (5) of groove (1) side, the chemical has been held in chemical holding tank (5), chemical holding tank (5) department is provided with chemical liquid feeding pump (51), the feed liquor end of chemical liquid feeding pump (51) pass through the pipeline with chemical holding tank (5) intercommunication, the play liquid end of chemical liquid feeding pump (51) pass through the pipeline with soak groove (1) intercommunication.
7. The apparatus for automatically adding and recovering a semiconductor immersion agent as set forth in claim 6, wherein: still including installing liquid level sensor (52) in soaking groove (1), liquid level sensor (52) with make up agent liquid feeding pump (51) are connected.
CN202121323997.6U 2021-06-15 2021-06-15 Automatic adding and recycling device for semiconductor immersion curing agent Active CN215198581U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121323997.6U CN215198581U (en) 2021-06-15 2021-06-15 Automatic adding and recycling device for semiconductor immersion curing agent

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121323997.6U CN215198581U (en) 2021-06-15 2021-06-15 Automatic adding and recycling device for semiconductor immersion curing agent

Publications (1)

Publication Number Publication Date
CN215198581U true CN215198581U (en) 2021-12-17

Family

ID=79425379

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202121323997.6U Active CN215198581U (en) 2021-06-15 2021-06-15 Automatic adding and recycling device for semiconductor immersion curing agent

Country Status (1)

Country Link
CN (1) CN215198581U (en)

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