CN215191725U - Magnetic suction ultrasonic head - Google Patents
Magnetic suction ultrasonic head Download PDFInfo
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- CN215191725U CN215191725U CN202120204013.6U CN202120204013U CN215191725U CN 215191725 U CN215191725 U CN 215191725U CN 202120204013 U CN202120204013 U CN 202120204013U CN 215191725 U CN215191725 U CN 215191725U
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- ring
- piezoelectric wafer
- ultrasonic head
- piezoelectric
- housing
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Abstract
The utility model relates to a magnetic ultrasonic head, which comprises a shell, a piezoelectric wafer, an adhesive ring and an insulating ring; the shell is internally provided with a cavity; the upper surface and the lower surface of the piezoelectric wafer are provided with metal electrode layers, and the piezoelectric wafer is hermetically arranged on the insulating ring through an adhesive ring; the bonding ring is made of magnetic materials, a conducting strip is arranged on the upper surface of the bonding ring, a metal electrode layer on the upper surface of the piezoelectric wafer is in contact with and conducted with the conducting strip, and the bonding ring can adsorb the electrode slice. The magnet can adsorb iron in the electrode slice, thereby achieving the purpose of fixing the electrode slice and the ultrasonic head and improving the treatment effect.
Description
Technical Field
The utility model relates to an ultrasonic transducer field, concretely relates to ultrasonic head is inhaled to magnetism.
Background
The ultrasonic therapy is an important component of ultrasonic medicine, and mainly acts a certain dose of ultrasonic waves on human tissues to generate certain biological effects, such as thermal effect, mechanical effect, cavitation effect and the like, so that certain medical purpose is achieved by utilizing the effects, and the ultrasonic therapy is formed. Among them, the treatment of some diseases by using the thermal effect and mechanical effect of ultrasonic waves with lower intensity and by using focused or unfocused acoustic beams to perform 'heating' and mechanical stimulation on the disease parts is called ultrasonic physiotherapy.
The ultrasonic physiotherapy is mainly completed by an ultrasonic therapy apparatus, and the general ultrasonic therapy apparatus consists of a high-frequency power ultrasonic generator and an ultrasonic transducer (namely an ultrasonic probe): the high-frequency electric energy provided by the high-frequency ultrasonic power generator excites the piezoelectric wafer in the ultrasonic transducer through resonance to generate vibration in the thickness direction and radiate ultrasonic waves outwards. An ultrasonic transducer, as a device for energy conversion, mainly comprises a piezoelectric wafer, a matching layer, a backing, a housing, etc., and can convert an excitation electrical signal into an ultrasonic signal into a patient.
The use of supersound physiotherapy equipment cooperation electrode piece more is favorable to the patient to be recovered, but present ultrasonic head generally adopts bandage and electrode piece fixed, and the operation is complicated, especially to the truck position, when extravagant bandage, the effect of fixed ultrasonic head is also not good, so utility model one kind can be effectively with the fixed ultrasonic head of electrode piece be urgent to wait the problem of solving.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a magnetic suction ultrasonic head, which is convenient to fix with an electrode plate.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a magnetic ultrasonic head comprises a shell, a piezoelectric wafer, an adhesive ring and an insulating ring; the housing has a cavity therein; the upper surface and the lower surface of the piezoelectric wafer are provided with metal electrode layers, and the piezoelectric wafer is hermetically arranged on the insulating ring through the bonding ring; the piezoelectric chip comprises a piezoelectric chip, a bonding ring and a base, wherein the bonding ring is made of a magnetic material, a conducting strip is arranged on the upper surface of the bonding ring, a metal electrode layer on the upper surface of the piezoelectric chip is in contact with and conducted with the conducting strip, and the bonding ring can adsorb an electrode slice.
Furthermore, the bonding ring is a powerful magnet, the surface of the bonding ring is provided with an insulating layer, and the upper surface of the insulating layer is provided with a conducting strip.
Further, the housing is a metal housing; the conducting strip is contacted with the shell and conducted, and the metal electrode layer on the lower surface of the piezoelectric wafer is insulated from the shell through the insulating ring;
furthermore, the lower surface metal electrode layer of the piezoelectric wafer is connected with the positive electrode, and the upper surface metal electrode layer of the piezoelectric wafer is connected with the ground electrode through the shell.
Furthermore, the shell is an insulating shell, the lower surface metal electrode layer of the pressure point wafer is connected with the positive electrode, and the upper surface metal electrode layer of the piezoelectric wafer is connected with the ground electrode through a lead.
Furthermore, one end of the wire is fixedly connected with the conducting strip, and the wire is tightly attached to the inner wall of the shell.
Further, the inner diameter of the bonding ring is equal to the outer diameter of the piezoelectric wafer, the outer diameter of the bonding ring is equal to the inner diameter of the shell, the inner side of the bonding ring is fixedly connected with the piezoelectric wafer, and the outer side of the bonding ring is fixedly connected with the shell.
Further, the adhesive ring is magnetically connected with the electrode plate.
Furthermore, the piezoelectric wafer is made of piezoelectric ceramics, single crystals or piezoelectric composite materials, the conducting strip is made of soldering tin, conducting resin or silver foil materials, and epoxy resin materials are adopted on the inner side and the outer side of the bonding ring.
The utility model has the advantages that:
the utility model discloses a magnetic material can adsorb the iron in the electrode slice through magnet as the bonding ring to reach the fixed purpose of electrode slice and ultrasonic head, improve treatment simultaneously.
Drawings
FIG. 1 is a cross-sectional view of a magnetically attractable ultrasonic head;
figure 2 is a top view of a magnetically attracted ultrasonic head.
Names corresponding to the marks in the figure:
1-a metal housing; 11-circular holes;
2-a piezoelectric wafer;
3-a binding ring; 31-a conductive sheet;
4-insulating ring.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art all belong to the protection scope of the present invention.
The embodiment of the utility model provides a:
a magnetic ultrasonic head comprises a metal shell 1, a piezoelectric wafer 2, an adhesive ring 3 and an insulating ring 4; the metal shell 1 is of a barrel-shaped structure, a circular hole 11 is formed in the side wall, close to the bottom surface, of the metal shell 1, and a lead extends out of the metal shell through the circular hole 11; the metal shell 1 is made of stainless steel.
The upper surface and the lower surface of the piezoelectric wafer 2 are provided with metal electrode layers, and the piezoelectric wafer 2 is hermetically arranged on the insulating ring 4 through a bonding ring; the piezoelectric wafer 2 is made of piezoelectric ceramics, single crystals or piezoelectric composite materials, a metal electrode layer on the lower surface of the piezoelectric wafer 2 is connected with the positive electrode, a metal electrode layer on the upper surface of the piezoelectric wafer 2 is connected with the ground electrode through the metal shell 1, and the two surfaces of the piezoelectric wafer 2 are respectively connected with the positive electrode and the ground electrode to generate ultrasound.
The adhesive ring 3 is made of magnetic materials, and the adhesive materials on the inner side and the outer side of the adhesive ring 3 are made of epoxy resin materials; the bonding ring 3 is a strong magnet, an insulating layer is arranged on the surface of the bonding ring 3, a conducting strip 31 is arranged on the upper surface of the insulating layer, the conducting strip 31 is made of soldering tin, conducting adhesive or silver foil materials, a metal electrode layer on the upper surface of the piezoelectric wafer 2 is in contact with and conducted with the conducting strip 31, the conducting strip 31 is in contact with and conducted with the metal shell 1, and the metal electrode layer on the lower surface of the piezoelectric wafer 2 is insulated from the metal shell 1 through an insulating ring 4; the adhesive ring 3 is magnetically connected with the electrode slice.
The inner diameter of the bonding ring 3 is equal to the outer diameter of the piezoelectric wafer 2, the outer diameter of the bonding ring 3 is equal to the inner diameter of the metal shell 1, the inner side of the bonding ring 3 is fixedly connected with the piezoelectric wafer 2, and the bonding ring 3 is fixedly connected with the outer side of the metal shell 1.
The utility model discloses a use method:
the ultrasonic head is connected with corresponding equipment to generate ultrasonic, and the ultrasonic head is adsorbed on the electrode plate through the adhesive ring, so that the electrode plate is matched with the ultrasonic head for use.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. A magnetic ultrasonic head is characterized by comprising a shell, a piezoelectric wafer, an adhesive ring and an insulating ring;
the housing has a cavity therein;
the upper surface and the lower surface of the piezoelectric wafer are provided with metal electrode layers, and the piezoelectric wafer is hermetically arranged on the insulating ring through the bonding ring;
the piezoelectric chip comprises a piezoelectric chip, a bonding ring and a base, wherein the bonding ring is made of a magnetic material, a conducting strip is arranged on the upper surface of the bonding ring, a metal electrode layer on the upper surface of the piezoelectric chip is in contact with and conducted with the conducting strip, and the bonding ring can adsorb an electrode slice.
2. The magnetic ultrasonic head of claim 1, wherein the adhesive ring is a strong magnet, an insulating layer is disposed on the surface of the adhesive ring, and a conductive sheet is disposed on the upper surface of the insulating layer.
3. A magnetically attractable ultrasonic head according to claim 1, wherein the housing is a metal housing; the conducting strip is contacted with the shell and conducted, and the metal electrode layer on the lower surface of the piezoelectric wafer is insulated from the shell through the insulating ring.
4. The magnetic ultrasonic head of claim 3, wherein the lower surface metal electrode layer of the piezoelectric wafer is connected to the positive electrode, and the upper surface metal electrode layer of the piezoelectric wafer is connected to the ground electrode through the housing.
5. The magnetic ultrasonic head of claim 1, wherein the housing is an insulating housing, the lower surface metal electrode layer of the piezoelectric wafer is connected to the positive electrode, and the upper surface metal electrode layer of the piezoelectric wafer is connected to the ground electrode through a wire.
6. A magnetically-attracted ultrasonic head according to claim 5 wherein one end of the wire is fixedly connected to the conducting strip, the wire abutting against the inner wall of the housing.
7. A magnetically attractive ultrasonic head according to any one of claims 1 to 6 wherein the inner diameter of the adhesive ring is equal to the outer diameter of the piezoelectric wafer, the outer diameter of the adhesive ring is equal to the inner diameter of the housing, the inner side of the adhesive ring is fixedly connected to the piezoelectric wafer and the outer side of the adhesive ring is fixedly connected to the housing.
8. A magnetically attractable ultrasonic head according to any one of claims 1 to 6, wherein the adhesive ring is magnetically connected to the electrode plate.
9. A magnetically attracted ultrasonic head according to any one of claims 1 to 6, wherein the piezoelectric wafer is made of piezoelectric ceramic, single crystal or piezoelectric composite material, the conductive sheet is made of solder, conductive adhesive or silver foil, and the inner and outer sides of the adhesive ring are made of epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120204013.6U CN215191725U (en) | 2021-01-25 | 2021-01-25 | Magnetic suction ultrasonic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120204013.6U CN215191725U (en) | 2021-01-25 | 2021-01-25 | Magnetic suction ultrasonic head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215191725U true CN215191725U (en) | 2021-12-17 |
Family
ID=79438479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120204013.6U Active CN215191725U (en) | 2021-01-25 | 2021-01-25 | Magnetic suction ultrasonic head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215191725U (en) |
-
2021
- 2021-01-25 CN CN202120204013.6U patent/CN215191725U/en active Active
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