CN215187644U - Copper adding device for electroplating PCB through hole - Google Patents

Abstract

The utility model discloses a copper adding device for electroplating PCB through holes, which relates to the technical field of PCB copper plating equipment and comprises a processing main body movably connected at the upper end of a connecting block and a workbench arranged at the lower end of the connecting block, one end of an adjusting disc is fixedly connected with a threaded rod, the outer surface of the threaded rod is connected with a first clamping plate and a second clamping plate by screw threads, one end of a positioning groove is provided with a chute, the first clamping plate and the second clamping plate are movably connected with the chute, the inner sides of the first clamping plate and the second clamping plate are both provided with a limiting groove, when the copper plating work is carried out, the adjusting disc is firstly rotated to drive the threaded rod to rotate, because the first clamping plate and the second clamping plate are of a reverse-thread structure, the first clamping plate and the second clamping plate are driven to move along the chute and draw close to each other, so that the first clamping plate and the second clamping plate clamp the PCB, and simultaneously clamp the PCB into the limiting groove, even when the workbench generates larger vibration, the position of the PCB on the workbench is not easy to move, and the copper plating uniformity of the PCB is guaranteed.

Description

Copper adding device for electroplating PCB through hole

Technical Field

The utility model relates to a PCB copper facing equipment technical field specifically is a PCB through-hole is electroplated with adding copper device.

Background

The PCB is a printed circuit board, also called printed circuit board, and is an important electronic component, a support for electronic components, and a carrier for electrical interconnection of electronic components. It is called a "printed" circuit board because it is made using electronic printing.

Need utilize in PCB production process to add the copper device and carry out the copper-plating to it, however, current add the copper device when carrying out the copper-plating, the processing main part needs round trip movement for the workstation produces great vibrations, and during the vibrations, the position of PCB on the workstation takes place just to move very easily, leads to PCB copper-plating inhomogeneous, and copper-plating failure even, the practicality is poor.

In order to solve the problems, the utility model provides a PCB through-hole is electroplated with adding copper device.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a PCB through-hole is electroplated and is used with adding copper device, the one end fixedly connected with threaded rod of adjusting disk, the surface threaded connection of threaded rod has first splint and second splint, the spout has been seted up to the one end of constant head tank, first splint and second splint all with spout swing joint, the inboard of first splint and second splint all is provided with the spacing groove, first splint and second splint are reverse-thread structure, and all run through the surface of threaded rod, the lower extreme overlap joint of constant head tank has the rubber pad, the lower extreme laminating of rubber pad has the shock pad, the lower extreme fixedly connected with briquetting of shock pad, the lower extreme fixedly connected with buffer block of briquetting, the lower extreme of buffer block is provided with the lower connector block, the upper end of lower connector block is seted up the buffer slot, buffer block swing joint is at the inner chamber of buffer slot, the shape of buffer block is trapezoidal, its upper end diameter is greater than the diameter of buffer slot, the lower connecting block is a component made of rubber materials, thereby solving the problems in the background technology.

In order to achieve the above object, the utility model provides a following technical scheme: a copper adding device for electroplating a PCB through hole comprises a processing main body movably connected to the upper end of a connecting block and a workbench arranged at the lower end of the connecting block, wherein a positioning groove is formed in the upper end of the workbench, and a clamping mechanism is arranged in the inner cavity of the positioning groove;

clamping mechanism includes the adjustment disk, adjustment disk swing joint in the one end of workstation, the one end fixedly connected with threaded rod of adjustment disk, and the surface threaded connection of threaded rod has first splint and second splint, and the spout has been seted up to the one end of constant head tank, and first splint and second splint all with spout swing joint.

Preferably, the inner sides of the first clamping plate and the second clamping plate are both provided with limiting grooves.

Preferably, the first clamping plate and the second clamping plate are of reverse thread structures and penetrate through the outer surface of the threaded rod.

Preferably, the lower extreme overlap joint of constant head tank has the rubber pad, and the lower extreme laminating of rubber pad has the shock pad, and the lower extreme fixedly connected with briquetting of shock pad.

Preferably, the lower extreme fixedly connected with buffer block of briquetting, the lower extreme of buffer block is provided with down the joint block, and the dashpot has been seted up to the upper end of lower joint block, and buffer block swing joint is at the inner chamber of dashpot.

Preferably, the shape of the buffer block is trapezoidal, and the diameter of the upper end of the buffer block is larger than that of the buffer groove.

Preferably, the lower connecting block is a member made of rubber.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model provides a PCB through-hole is electroplated and is used copper adding device, the one end fixedly connected with threaded rod of adjusting disk, the surface threaded connection of threaded rod has first splint and second splint, the spout has been seted up to the one end of constant head tank, first splint and second splint all with spout swing joint, the inboard of first splint and second splint all is provided with the spacing groove, first splint and second splint are the reverse-thread structure, and all run through the surface of threaded rod, when copper facing work, at first rotate the adjusting disk, drive the threaded rod and rotate, because first splint and second splint are the reverse-thread structure, so rotate at the threaded rod and drive first splint and second splint to move along the spout, draw close each other, make first splint and second splint press from both sides tight PCB, block PCB into the spacing groove simultaneously, even when the workstation produces great vibrations, the position of PCB on the workstation is difficult for taking place just to move, the copper plating uniformity of the PCB is guaranteed.

2. The utility model provides a PCB through-hole is electroplated and is used with adding copper device, the lower extreme overlap joint of constant head tank has the rubber pad, the lower extreme laminating of rubber pad has the shock pad, the lower extreme fixedly connected with briquetting of shock pad, the lower extreme fixedly connected with buffer block of briquetting, the lower extreme of buffer block is provided with down the piecing, the buffer slot has been seted up to the upper end of down the piecing, buffer block swing joint is in the inner chamber of buffer slot, the shape of buffer block is trapezoidal, its upper end diameter is greater than the diameter of buffer slot, down the piecing is the component that rubber material made, when the workstation produces vibrations, firstly, the vibrations power can give the rubber pad power down through the constant head tank, can preliminarily weaken the vibrations power through the cooperation use of rubber pad and shock pad, in this moment, vibrations power can drive the briquetting and push down the buffer block, make the buffer block move in the buffer slot, because the shape of buffer block is trapezoidal, the diameter of the upper end of the buffer block is larger than that of the buffer groove, so that the deeper the buffer block moves, the larger the buffer force is, the vibration force is counteracted, and the practicability is good.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the positioning groove structure of the present invention;

FIG. 3 is a schematic structural view of the clamping mechanism of the present invention;

fig. 4 is a schematic view of the internal structure of the workbench of the present invention.

In the figure: 1. connecting blocks; 2. processing the main body; 3. a work table; 4. positioning a groove; 5. a clamping mechanism; 51. an adjusting disk; 52. a threaded rod; 53. a first splint; 54. a second splint; 55. a chute; 56. a limiting groove; 6. a rubber pad; 7. a shock pad; 8. briquetting; 9. a buffer block; 10. a lower connecting block; 11. a buffer tank.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, a copper adding device for electroplating a through hole of a Printed Circuit Board (PCB) comprises a processing main body 2 movably connected to the upper end of a connecting block 1, and a workbench 3 mounted at the lower end of the connecting block 1, wherein a positioning groove 4 is formed in the upper end of the workbench 3, a clamping mechanism 5 is arranged in an inner cavity of the positioning groove 4, the clamping mechanism 5 comprises a regulating disc 51, the regulating disc 51 is movably connected to one end of the workbench 3, a threaded rod 52 is fixedly connected to one end of the regulating disc 51, a first clamping plate 53 and a second clamping plate 54 are connected to the outer surface of the threaded rod 52 through threads, a sliding groove 55 is formed in one end of the positioning groove 4, and the first clamping plate 53 and the second clamping plate 54 are movably connected to the sliding groove 55.

The inboard of first splint 53 and second splint 54 all is provided with spacing groove 56, first splint 53 and second splint 54 are the reverse-thread structure, and all run through in the surface of threaded rod 52, at the copper facing during operation, at first rotate adjustment disk 51, it rotates to drive threaded rod 52, because of first splint 53 and second splint 54 are the reverse-thread structure, the event rotates at threaded rod 52 and drives first splint 53 and second splint 54 and remove along spout 55, draw close each other, make first splint 53 and second splint 54 press from both sides tight PCB, simultaneously with PCB card advance spacing groove 56, even when workstation 3 produces great vibrations, the difficult emergence of PCB just moves on the workstation 3, it is even to have ensured that PCB copper facing is even.

Referring to fig. 4, a rubber pad 6 is lapped on the lower end of a positioning groove 4, a shock pad 7 is attached to the lower end of the rubber pad 6, a pressing block 8 is fixedly connected to the lower end of the shock pad 7, a buffer block 9 is fixedly connected to the lower end of the pressing block 8, a lower connection block 10 is arranged at the lower end of the buffer block 9, a buffer groove 11 is formed in the upper end of the lower connection block 10, the buffer block 9 is movably connected to the inner cavity of the buffer groove 11, the buffer block 9 is trapezoidal, the diameter of the upper end of the buffer block 9 is larger than that of the buffer groove 11, the lower connection block 10 is a component made of rubber, when a worktable 3 generates shock, firstly, the rubber pad 6 is given a downward force by the vibration force through the positioning groove 4, the vibration force can be primarily weakened by matching the rubber pad 6 and the shock pad 7, meanwhile, the vibration force drives the pressing block 8 to press the buffer block 9 down, so that the buffer block 9 moves in the buffer groove 11, and the shape of the buffer block 9 is trapezoidal, the diameter of the upper end of the shock absorber is larger than that of the buffer groove 11, so that the deeper the buffer block 9 moves, the greater the buffer force is, the shock force is counteracted, and the practicability is good.

The working principle is as follows: during the copper plating operation, firstly, the adjusting disc 51 is rotated to drive the threaded rod 52 to rotate, and because the first clamping plate 53 and the second clamping plate 54 are of the reverse-thread structure, the threaded rod 52 rotates to drive the first clamping plate 53 and the second clamping plate 54 to move along the sliding groove 55 and to be close to each other, so that the first clamping plate 53 and the second clamping plate 54 clamp the PCB, and simultaneously, the PCB is clamped into the stopper groove 56, when the worktable 3 vibrates, firstly, the vibration force can give downward force to the rubber pad 6 through the positioning groove 4, the vibration force can be primarily weakened through the matching use of the rubber pad 6 and the shock pad 7, at the same time, the vibration force will drive the pressing block 8 to press the buffer block 9, so that the buffer block 9 moves in the buffer slot 11, because the shape of the buffer block 9 is trapezoidal, the diameter of the upper end is larger than that of the buffer groove 11, so the deeper the buffer block 9 moves, the larger the buffer force thereof, thereby counteracting the vibration force.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The utility model provides a PCB through-hole is electroplated with adding copper device, includes the processing main part (2) of swing joint in connecting block (1) upper end to and install workstation (3) at connecting block (1) lower extreme, its characterized in that: the upper end of the workbench (3) is provided with a positioning groove (4), and the inner cavity of the positioning groove (4) is provided with a clamping mechanism (5);

clamping mechanism (5) are including adjusting disk (51), and adjusting disk (51) swing joint is in the one end of workstation (3), and one end fixedly connected with threaded rod (52) of adjusting disk (51), the surface threaded connection of threaded rod (52) have first splint (53) and second splint (54), and spout (55) have been seted up to the one end of constant head tank (4), and first splint (53) and second splint (54) all with spout (55) swing joint.

2. The copper adding device for electroplating the PCB through hole according to claim 1, wherein the copper adding device comprises: the inner sides of the first clamping plate (53) and the second clamping plate (54) are both provided with limiting grooves (56).

3. The copper adding device for electroplating the PCB through hole according to claim 2, wherein: the first clamping plate (53) and the second clamping plate (54) are of reverse thread structures and penetrate through the outer surface of the threaded rod (52).

4. The copper adding device for electroplating the PCB through hole according to claim 1, wherein the copper adding device comprises: the lower extreme overlap joint of constant head tank (4) has rubber pad (6), and the lower extreme laminating of rubber pad (6) has shock pad (7), and the lower extreme fixedly connected with briquetting (8) of shock pad (7).

5. The copper adding device for electroplating the PCB through hole according to claim 4, wherein the copper adding device comprises: the lower extreme fixedly connected with buffer block (9) of briquetting (8), the lower extreme of buffer block (9) is provided with down connects piece (10), and buffer slot (11) have been seted up to the upper end of connecting piece (10) down, and buffer block (9) swing joint is in the inner chamber of buffer slot (11).

6. The copper adding device for electroplating the PCB through hole according to claim 5, wherein the copper adding device comprises: the buffer block (9) is trapezoidal, and the diameter of the upper end of the buffer block is larger than that of the buffer groove (11).

7. The copper adding device for electroplating the PCB through hole according to claim 6, wherein: the lower connecting block (10) is a component made of rubber.

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