CN215187576U

CN215187576U - Hot-pressing formation charging and discharging PCB

Info

Publication number: CN215187576U
Application number: CN202121483909.9U
Authority: CN
Inventors: 不公告发明人
Original assignee: Guangdong Lyric Robot Automation Co Ltd
Current assignee: Guangdong Lyric Robot Automation Co Ltd
Priority date: 2021-06-30
Filing date: 2021-06-30
Publication date: 2021-12-14
Anticipated expiration: 2031-06-30

Abstract

The application discloses a hot-pressing formation charging and discharging PCB, and relates to the technical field of PCBs; comprises a plate body; the plate body comprises a first surface layer and a second surface layer which are oppositely arranged; the plate body is provided with at least one pair of wiring holes; the first surface layer is provided with a positive electrode contact area and a negative electrode contact area, a plurality of salient points capable of forming electrical contact are formed on the positive electrode contact area and the negative electrode contact area, and gaps are formed among the salient points; the technical scheme provided by the application solves one of the technical problems that the existing PCB is low in charging and discharging overload capacity, small in contact area between the external lead and the wiring position, easy to short circuit and the like.

Description

Hot-pressing formation charging and discharging PCB

Technical Field

The application relates to the technical field of PCB boards, in particular to a hot-pressing formation charging and discharging PCB.

Background

The thermal compression formation charging and discharging PCB is mainly applied to charging and discharging of the soft package battery in the thermal compression formation of the soft package battery, and the main parameters of the thermal compression formation charging and discharging PCB comprise the maximum current-carrying capacity and charging and discharging voltage detection in the charging and discharging process; the existing thermal compression molding charging and discharging PCB has the following problems:

firstly, the battery can generate the condition of current overload during charging and discharging, and because the contact between the lug and the planar copper foil can generate a large amount of heat during overload and is difficult to dissipate heat, the overload capacity of the PCB contacted by the planar copper foil is low;

secondly, the positive and negative connection wires of the conventional PCB for charging and discharging are generally welded at the welding position reserved on the surface of the PCB, high heat is generated when the current is high, and the problem of poor contact is caused by the connection mode;

thirdly, the copper foil of the conventional PCB has the problem of voltage reduction under the condition of large current;

fourth, the conventional PCB positive and negative copper foils are respectively located at the uppermost layer and the lowermost layer of the board, which is easy to cause short circuit when the back insulating coating is damaged.

SUMMERY OF THE UTILITY MODEL

This application aim at provides a hot briquetting becomes charge-discharge PCB board, adopts the technical scheme that this application provided to solve one of current PCB charge-discharge overload capacity low, external wire and junction area of contact little, the easy short circuit scheduling technical problem of circuit board.

In order to solve one of the above technical problems, the present application provides a thermal compression molding charging and discharging PCB, including a board body; the plate body comprises a first surface layer and a second surface layer which are oppositely arranged;

the plate body is provided with at least one pair of wiring holes;

the first surface layer is provided with a positive electrode contact area and a negative electrode contact area, a plurality of salient points capable of forming electrical contact are formed on the positive electrode contact area and the negative electrode contact area, and gaps are formed among the salient points;

in the implementation process, the positive contact area and the negative contact area on the PCB can be used for the compression joint of the lugs and form circuit conduction, and the generated heat is dissipated through gaps among the salient points in the compression joint process, so that the efficient heat dissipation in the compression joint process can be ensured; the anode contact area and the cathode contact area improve the maximum current-carrying capacity and the heat dissipation efficiency under the condition that the contact area between the anode contact area and the pole lug is not influenced, so that the overload capacity of the PCB is improved.

Preferably, the salient points are cubic;

in the implementation process, the salient points are in a cubic shape, namely in a heat dissipation small square grid form, and the dense heat dissipation small square grid forms a plane, so that the phenomenon that the loss is caused by overlarge tab indentation of the tab when the tab is in compression joint can be avoided, and the tab is protected to a certain extent.

Preferably, the wiring holes comprise two pairs, namely a first wiring hole and a second wiring hole;

the first wiring hole comprises a positive wiring hole and a negative wiring hole;

the second wiring hole comprises a V-wiring hole and a V + wiring hole;

in the implementation process, the PCB provided by the application can adopt four-wire wiring, wherein a V + wiring hole and a V-wiring hole are used for measuring the voltage of an electrode lug when a battery is charged and discharged, and a positive wiring hole and a negative wiring hole are used for a current channel when the battery is charged and discharged; by adopting the method, the problem of voltage drop caused by the resistance of the copper foil under the condition of large current can be solved.

Preferably, the wiring hole penetrates through the board body;

in the realization process, the PCB wiring hole penetrating through the arrangement is adopted, the contact area of the external lead and the internal lead of the PCB is increased, and therefore the problem of poor contact when the current is large is solved.

Preferably, at least one end of the plate body is formed with a slope;

in the implementation process, the inclined plane formed at the end part of the board body enables the PCB not to be easily damaged to other products during installation, and if the damage to the battery cell can be avoided.

Preferably, the top end of the inclined plane is a rounded corner;

in the implementation process, the top end of the inclined plane is a fillet, so that the safety of the PCB in use is further improved, and the risk of damage to other objects in the process of installing or using the PCB is reduced.

Preferably, the plate body is L-shaped;

in the implementation process, the L-shaped design of the PCB is more beneficial to the actual installation of the PCB, and the convenience of the installation of the PCB is improved.

Preferably, the positive electrode contact region and the negative electrode contact region are arranged at intervals along the length direction of one side of the L-shaped plate body;

in the implementation process, the positive contact area and the negative contact area are regularly arranged, so that actual use is facilitated, and the use convenience of the PCB is further improved.

Preferably, the plate body is provided with a positive copper foil and a negative copper foil;

the positive copper foil is arranged on the first surface layer, and the negative copper foil is arranged between the first surface layer and the second surface layer;

in the realization process, the PCB provided by the application uses the anode copper foil to be positioned on the upper layer of the board body, and the cathode copper foil is positioned on the middle layer of the board body, so that the problem of short circuit caused by the damage of the back insulating layer can be solved.

Preferably, a plurality of mounting through holes are formed in the outer edge of the plate body in a penetrating manner;

in the implementation process, the mounting holes are formed in the outer edge of the board body, so that the mounting stability is guaranteed, meanwhile, effective areas can be reserved for other parts as far as possible, and the space utilization rate of the PCB is maximized.

Compared with the prior art, the beneficial effect of this application lies in: this application can produce a large amount of heats and be difficult to radiating problem when transshipping to battery tab and the conventional planar copper foil contact of formation PCB board, has add the design of heat dissipation square, makes tab produce radiating clearance but guarantee simultaneously with the good contact of tab in the crimping in-process, the biggest current-carrying capacity when not influencing the contact to PCB's overload capacity has been improved.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.

FIG. 1 is a schematic diagram of the overall structure of one embodiment of the present application;

FIG. 2 is a schematic structural diagram of a first facing according to an embodiment of the present application;

FIG. 3 is a schematic side view of an embodiment of the present application;

wherein: 10. a plate body; 11. a first facing; 12. a second facing; 21. a negative electrode contact region; 22. a positive electrode contact region; 30. a wiring hole; 31. a first wiring hole; 311. a positive wiring hole; 312. a negative wiring hole; 32. a second wiring hole; 321. v + wiring holes; 322. v-wiring holes; 40. a bevel; 50. and installing the through hole.

Detailed Description

In the following description, numerous implementation details are set forth in order to provide a thorough understanding of the present invention. It should be understood, however, that these implementation details should not be used to limit the application. That is, in some embodiments of the present application, such practical details are not necessary. In addition, some conventional structures and components are shown in simplified schematic form in the drawings.

It should be noted that all the directional indications such as up, down, left, right, front and rear … … in the embodiment of the present application are only used to explain the relative positional relationship, movement, etc. between the components in a specific posture as shown in the drawings, and if the specific posture is changed, the directional indication is changed accordingly.

In addition, the descriptions related to "first", "second", etc. in this application are for descriptive purposes only, not specifically referring to the order or sequence, nor are they intended to limit the application, but merely to distinguish components or operations described in the same technical terms, and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present application.

For further understanding of the contents, features and functions of the present invention, the following embodiments are exemplified in conjunction with the accompanying drawings and the following detailed description:

examples

The thermal compression formation charging and discharging PCB is mainly applied to charging and discharging of the soft package battery in the thermal compression formation of the soft package battery, and the main parameters of the thermal compression formation charging and discharging PCB comprise the maximum current-carrying capacity and charging and discharging voltage detection in the charging and discharging process; the existing thermal compression formation charging and discharging PCB has some problems, such as the condition that the current is overloaded when a battery is charged and discharged, and a large amount of heat is generated and heat is not easy to dissipate when a lug is in contact with a planar copper foil during overload;

in order to solve the above technical problem, the present embodiment provides the following technical solutions:

referring to fig. 1-3, the present embodiment provides a thermal compression molding charging/discharging PCB, including a board body 10; the plate body 10 comprises a first facing 11 and a second facing 12 which are oppositely arranged;

specifically, at least one pair of wiring holes 30 is formed on the board body 10;

further, the first surface layer 11 is provided with an anode contact region 22 and a cathode contact region 21, a plurality of bumps capable of forming electrical contact are formed on the anode contact region 22 and the cathode contact region 21, and gaps are formed between the plurality of bumps;

in the scheme, the positive contact area 22 and the negative contact area 21 on the PCB provided by the application can be used for the compression joint of the tabs and the circuit conduction is formed, and in the compression joint process, the generated heat is dissipated through gaps among the salient points, so that the high-efficiency heat dissipation in the compression joint process can be ensured; under the condition that the contact area between the positive contact area 22 and the pole lug is not influenced, the maximum current-carrying capacity is improved, the heat dissipation efficiency is improved, and the overload capacity of the PCB is improved.

Specifically, the salient points are cubic; the salient points are in a cubic shape, namely in a form of small heat dissipation grids, and the dense small heat dissipation grids form a plane, so that the loss caused by overlarge tab indentation on the tab can be avoided, and the tab is protected to a certain extent.

The copper foil of the conventional PCB has the problem of voltage reduction under the condition of large current; in order to solve the technical problem, the present embodiment provides the following technical solutions:

specifically, the wiring holes 30 include two pairs, which are a first wiring hole 31 and a second wiring hole 32;

wherein the first wiring hole 31 includes a positive wiring hole 311 and a negative wiring hole 312; the second wiring hole 32 includes a V-wiring hole 322 and a V + wiring hole 321;

in the above scheme, the PCB provided in this embodiment may adopt four-wire connection lines, where the V + connection hole 321 and the V-connection hole 322 are used to measure the voltage of the battery tab during charging and discharging of the battery, and the positive connection hole 311 and the negative connection hole 312 are used to pass the current during charging and discharging; the method can eliminate the problem of voltage drop caused by the resistance of the copper foil under the condition of large current;

the positive and negative connection wires for charging and discharging of the conventional PCB are generally welded at the welding position reserved on the surface of the PCB, high heat is generated when the current is high, and the problem of poor contact is caused by the connection mode; in order to solve the technical problem, the present embodiment provides the following technical solutions:

specifically, the wiring hole 30 penetrates through the board body 10;

in the above scheme, the PCB wiring hole 30 which is arranged in a penetrating mode is adopted, the contact area between the external lead and the internal lead of the PCB is increased, and therefore the problem of temperature rise caused by contact resistance when current is too large is solved.

It should be noted that the penetrating board 10 in the present embodiment refers to penetrating along the thickness direction of the PCB.

Specifically, at least one end of the plate body 10 is formed with a slope 40;

further, the top end of the inclined plane 40 is a rounded angle;

in the above scheme, the inclined plane 40 formed at the end of the board body 10 makes the PCB not easily damage other products when being mounted, for example, the battery cell can be prevented from being damaged; the top end of the inclined plane 40 is rounded, so that the safety of the PCB in use is further improved, and the risk of damage to other objects in the process of installing or using the PCB is reduced. In addition, when still preventing that anchor clamps are put into to electric core, the PCB board influences the battery utmost point ear motion, and then makes the problem of battery utmost point ear bending short circuit to make the difficult short circuit of battery utmost point ear.

Specifically, the plate body 10 is L-shaped; the design of PCB board L type more is favorable to its actual installation, promotes the convenience of PCB board installation.

Further, the positive contact region 22 and the negative contact region 21 are arranged at intervals along the length direction of one side of the L-shaped plate body 10; the regular arrangement of the anode contact area 22 and the cathode contact area 21 is beneficial to practical use, and the convenience of use of the PCB is further improved.

It should be noted that the length direction refers to a long side direction of the PCB;

the anode copper foil and the cathode copper foil of the conventional PCB are respectively positioned on the uppermost layer and the lowermost layer of the PCB, so that the short circuit problem is easily caused when the back insulating coating is damaged; in order to solve the technical problem, the present embodiment provides the following technical solutions:

specifically, a positive copper foil and a negative copper foil are arranged on the board body 10; the positive copper foil is arranged on the first surface layer 11, and the negative copper foil is arranged between the first surface layer 11 and the second surface layer 12;

in the above scheme, the PCB provided in this embodiment uses the positive copper foil located on the upper layer of the board body 10, and the negative copper foil located in the middle layer of the board body 10, so as to solve the short circuit problem caused by the damage of the back insulating layer;

specifically, a plurality of mounting through holes 50 are formed in the outer edge of the plate body 10 in a penetrating manner;

in the above scheme, the mounting hole is arranged on the outer edge of the board body 10, so that the mounting stability is ensured, and meanwhile, the effective area can be reserved for other parts as much as possible, so that the space utilization rate of the PCB is maximized.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

The above description is only for the preferred embodiment of the present application and should not be taken as limiting the present application in any way, and all simple modifications, equivalent changes and modifications made to the above embodiment according to the technical spirit of the present application are intended to be included within the scope of the present application.

Claims

1. The utility model provides a hot briquetting charges and discharges PCB board which characterized in that: comprises a plate body (10); the plate body (10) comprises a first surface layer (11) and a second surface layer (12) which are oppositely arranged;

at least one pair of wiring holes (30) is formed in the plate body (10);

the first surface layer (11) is provided with an anode contact area (22) and a cathode contact area (21), a plurality of salient points capable of forming electrical contact are formed on the anode contact area (22) and the cathode contact area (21), and gaps are formed among the plurality of salient points.

2. The thermally compression-molded charge and discharge PCB of claim 1, wherein: the salient points are cubic.

3. The thermally compression-molded charge and discharge PCB of claim 1, wherein: the wiring holes (30) comprise two pairs, namely a first wiring hole (31) and a second wiring hole (32);

the first wiring hole (31) comprises a positive wiring hole (311) and a negative wiring hole (312);

the second wiring hole (32) includes a V-wiring hole (322) and a V + wiring hole (321).

4. The thermally compression-molded charge and discharge PCB of claim 1, wherein: the wiring hole (30) penetrates through the plate body (10).

5. The thermally compression-molded charge and discharge PCB of claim 1, wherein: at least one end of the plate body (10) is provided with a bevel (40).

6. The thermally compression-molded charge and discharge PCB of claim 5, wherein: the top end of the inclined plane (40) is a rounded angle.

7. The thermally compression-molded charge and discharge PCB of claim 1, wherein: the plate body (10) is L-shaped.

8. The thermally compression-molded charge and discharge PCB of claim 7, wherein: the positive electrode contact area (22) and the negative electrode contact area (21) are arranged at intervals along the length direction of one side of the L-shaped plate body (10).

9. The thermally compression-molded charge and discharge PCB of claim 1, wherein: the plate body (10) is provided with a positive copper foil and a negative copper foil;

the positive copper foil is arranged on the first surface layer (11), and the negative copper foil is arranged between the first surface layer (11) and the second surface layer (12).

10. The thermocompression formed charge and discharge PCB of any one of claims 1 to 9, wherein: a plurality of mounting through holes (50) are formed on the outer edge of the plate body (10) in a penetrating manner.