CN215184851U

CN215184851U - Substrate-to-substrate connector and connector assembly

Info

Publication number: CN215184851U
Application number: CN202120752754.8U
Authority: CN
Inventors: 大坂纯士; 横山阳平; 松永章宏
Original assignee: Japan Aviation Electronics Industry Ltd
Current assignee: Japan Aviation Electronics Industry Ltd
Priority date: 2020-05-13
Filing date: 2021-04-13
Publication date: 2021-12-14
Anticipated expiration: 2031-04-13
Also published as: CN113675679A

Abstract

A board-to-board connector, a connector assembly, a cantilever spring (110D) is located in a slot (110C) of a housing (110) and has a free end (110E) and a fixed end (110F) fixed to the housing (110). The cantilever spring (110D) extends in the height direction of the housing (110). A fixed end (110F) of the cantilever spring (110D) is located in the vicinity of a portion (110B) that can be attached to the substrate, and a free end (110E) of the cantilever spring (110D) is located away from the portion (110B).

Description

Substrate-to-substrate connector and connector assembly

Technical Field

The present invention relates to a substrate-to-substrate connector for parallel connection of two substrates, and a connector assembly in which the substrate-to-substrate connector and the substrate-to-substrate connector as a mating portion of the substrate-to-substrate connector are engaged with each other, and more particularly, to a substrate-to-substrate connector and a connector assembly in which emi (electromagnetic interference) is reduced.

Background

To connect two substrates, two substrate-to-substrate connectors are typically used. The first substrate-to-substrate connector is fixed on one surface of the first substrate, and the second substrate-to-substrate connector is fixed on one surface of the second substrate. In the case of parallel connection, the first board-to-board connector and the second board-to-board connector are fitted to each other in a state where one surface of the first board and one surface of the second board face each other in parallel. The first board and the second board are electrically connected to each other by a connector assembly in which the first board-to-board connector and the second board-to-board connector are fitted to each other.

As a prior art of such a connector assembly, fig. 1 shows two substrate-to-substrate connectors disclosed in patent document 1 (japanese patent application laid-open No. 2017-33654) (in patent document 1, one substrate-to-substrate connector is referred to as a first electrical connector 10, and the other substrate-to-substrate connector is referred to as a second electrical connector 20). Fig. 1 is a copy of fig. 27 of patent document 1.

As shown in fig. 1, the housing of the first electrical connector 10 has contact pieces 12i as cantilever springs. In a state where the first electrical connector 10 and the second electrical connector 20 are fitted to each other, the contact piece 12i is in contact with an inner wall surface of the housing of the second electrical connector 20. By this contact, the first electrical connector 10 and the second electrical connector 20 are electrically connected to each other. The housing of the first electrical connector 10 engages the ground pad of one substrate and the housing of the second electrical connector 20 engages the ground pad of the other substrate.

As shown in fig. 1, in general, in consideration of the fitting of two board-to-board connectors, a board-to-board connector has a cantilever spring whose free end is located in the vicinity of a board on which the board-to-board connector is mounted, and whose fixed end faces the board-to-board connector as a mating portion of the board-to-board connector in a state where the board-to-board connector and the board-to-board connector as the mating portion face each other.

In recent years, electronic devices such as high-performance portable communication devices capable of processing a large amount of digital information such as high-quality images and videos at high speed have become widespread. In order to process a large amount of digital information at high speed, a high frequency signal is used inside an electronic device. In such electronic devices, a signal transmission circuit and a plurality of small electronic components are generally mounted on a substrate at high density. Therefore, it is desired to reduce in-system Electromagnetic interference emi (Electromagnetic interference) in which Electromagnetic waves generated from electronic components or signal transmission circuits cause a failure of other electronic parts and the like existing inside the same electronic apparatus.

However, "conductor conduction" in which an electromagnetic wave propagates through a signal transmission circuit or the like on a substrate and "space conduction" in which an electromagnetic wave propagates through space are known as the transmission of a radiated electromagnetic wave. In the case of a board-to-board connector as an electronic component, it is important to block spatial conduction of electromagnetic waves from the inside of the board-to-board connector by a conductive housing electrically connected to a ground pad of a board.

SUMMERY OF THE UTILITY MODEL

In view of the above background, the present invention provides a board-to-board connector having a housing that effectively blocks spatial conduction of electromagnetic waves from inside the board-to-board connector, and a connector assembly including the board-to-board connector.

The technical matters described in this section are not intended to be an indication of the possibility of restricting the invention described in the claims explicitly or implicitly, and furthermore, not an indication of the possibility of allowing persons other than the person who obtains the benefit of the invention (for example, the applicant and the claimant) to perform such restrictions, but are described only for the purpose of facilitating understanding of the gist of the invention. The outline of the present invention from other points of view can be understood from the scope of claims at the time of application of the patent application.

In short, the substrate of the present invention has a cantilever spring to the conductive housing of the substrate connector, the cantilever spring extending in a direction opposite to the extending direction of the cantilever spring employed in the prior art.

More specifically, the cantilever spring is located in a slit of the conductive shell and has a fixed end fixed to the conductive shell and a free end. The cantilever spring extends in the height direction of the conductive housing. The fixed end of the cantilever spring is located in the vicinity of the board on which the board-to-board connector is mounted, and the free end of the cantilever spring faces the board-to-board connector as a mating portion in a state where the board-to-board connector and the board-to-board connector as the mating portion of the board-to-board connector face each other.

According to the utility model discloses, realize EMI's reduction.

Drawings

Fig. 1 is fig. 27 of patent document 1.

Fig. 2 is a perspective view of the first board-to-board connector when the first board-to-board connector is viewed obliquely from above.

Fig. 3 is a perspective view of the first board-to-board connector when the first board-to-board connector is viewed obliquely from below.

Fig. 4 is a perspective view of a first insulator of a first substrate-to-substrate connector;

fig. 5 is a perspective view of a first housing of the first substrate-to-substrate connector.

Fig. 6 is a perspective view of the second board-to-board connector when the second board-to-board connector is viewed obliquely from above.

Fig. 7 is a perspective view of the second board-to-board connector when the second board-to-board connector is viewed obliquely from below.

Fig. 8 is a perspective view of a second insulator of a second substrate-to-substrate connector.

Fig. 9 is a perspective view of a second housing of the second substrate-to-substrate connector.

Fig. 10 is a diagram for explaining the structure of the connector assembly of the embodiment.

Fig. 11A is a diagram for explaining the grounding performance of the connector assembly of the embodiment.

Fig. 11B is a diagram for explaining the grounding performance of the connector assembly of the embodiment.

Fig. 12A is a diagram for explaining the grounding performance of the connector assembly of the conventional art.

Fig. 12B is a diagram for explaining the grounding performance of the connector assembly of the conventional art.

Fig. 13 is a diagram for explaining EMI of the connector assembly of the embodiment.

Description of the reference numerals

1: first substrate

2: second substrate

100: first substrate-to-substrate connector

110: first shell

110A: first side wall part

110B: the first part

110C: slit

110D: cantilever spring

110E: free end

110F: fixed end

110G: center part

111: metal component

111 a: first plate part

111 b: second plate part

111 c: hook

111 d: support piece

111 e: convex part

111 g: claw

130: first insulator

131: bottom part

131 a: center plate part

131 b: side plate part

132: side wall part

132 a: concave part

132 b: concave part

150: first contact

150 a: one end of

150 b: the other end of the tube

150 c: one end of

150 d: the other end of the tube

170: conductor member

170 a: rod-shaped part

170 b: wall part

170 c: end part

200: second substrate-to-substrate connector

210: second shell

210A: second side wall part

210B: the second part

210 b: bottom part

210b 1: flat plate part

210b 2: upright part

210b 21: inverted U-shaped part

210b 22: bridge section

210b 23: foot part

210b 24: claw

210b 25: claw

210 e: convex part

230: second insulator

230 a: trough

230 b: concave part

230 c: slit

230 d: bridge section

250: second contact

250 a: u-shaped part

250b, and (3): l-shaped part

250c, and (3): u-shaped part

250 d: foot part

500: connector assembly

Detailed Description

Referring to fig. 2 to 13, the first board-to-board connector 100 according to the embodiment and the connector assembly 500 according to the embodiment will be described. The connector assembly 500 includes: a first board-to-board connector 100 that can be mounted on the first board 1, and a second board-to-board connector 200 that can be mounted on the second board 2 and can be fitted to the first board-to-board connector 100 (see fig. 10).

(first substrate to substrate connector)

The first substrate-to-substrate connector 100 shown in fig. 2 and 3 includes: a first case 110 having a frame structure and having conductivity; a first insulator 130 having an electrical insulating property; 8 first contacts 150 having conductivity; and 2 conductor members 170.

(first insulator, first contact, conductor member)

The first insulator 130 shown in fig. 4 is a one-piece (one-piece) insulating member including: a flat H-shaped bottom portion 131, and L-shaped side wall portions 132 erected at 4 corners of the bottom portion 131. The 4 corners of the bottom portion 131 where the side wall portions 132 stand correspond to the 4 corners when the bottom portion 131 is assumed to be rectangular. That is, 2 side wall portions 132 are located on one of the 2 side plate portions 131b of the bottom portion 131 sandwiching the central plate portion 131a of the bottom portion 131, and the remaining 2 side wall portions 132 are located on the other side plate portion 131 b. The 4 side wall portions 132 extend in the same direction (Z direction shown in fig. 4) from the bottom portion 131.

The side wall portion 132 has a recessed portion 132a on the inner side of the side wall portion 132 of the central plate portion 131a of the H-shaped bottom portion 131 when viewed from the front, for each of the 4 side wall portions 132. The recess 132a has an opening on the upper surface of the first insulator 130. The "up" and "down" in the description are "up" and "down" along the paper surface in the height direction of the first insulator 130 shown in fig. 4 (i.e., the Z direction shown in fig. 4). For each of the 4 sidewall parts 132, the sidewall part 132 has 2 recessed parts 132b on the outer side of the sidewall part 132. The 2 recesses 132b have openings on the upper surface of the first insulator 130, respectively.

6L-shaped first contacts 150 are attached to the central plate portion 131a of the H-shaped bottom portion 131, and 1L-shaped first contact 150 is attached to each of the two side plate portions 131b of the H-shaped bottom portion 131. The 6 first contacts 150 mounted on the central plate portion 131a form 2 parallel contact columns having the same number of first contacts 150. The 2 contact arrays are located in the vicinity of both edges of the central plate portion 131a, and the longitudinal direction of the contact arrays is parallel to the direction in which both edges of the central plate portion 131a extend (i.e., the Y direction). A straight line connecting the 2 first contacts 150 mounted on the side plate portion 131b is parallel to the contact array and passes between the 2 contact arrays.

For each of the 6 first contacts 150 mounted on the center plate portion 131a, one end 150a of the first contact 150 protrudes from the bottom portion 131 in a direction in which the side wall portion 132 stands up, and the other end 150b of the contact 150 protrudes from the center plate portion 131a to the outside of the center plate portion 131a in a direction parallel to the bottom portion 131 and perpendicular to the longitudinal direction of the contact row.

For each of the 2 first contacts 150 mounted on the side plate portion 131b, one end 150c of the first contact 150 protrudes from the bottom portion 131 in a direction in which the side wall portion 132 stands up, and the other end 150d of the first contact 150 protrudes from the side plate portion 131b to the outside of the side plate portion 131b in a direction parallel to the bottom portion 131 and parallel to the longitudinal direction of the contact array.

In the present embodiment, the 2 first contacts 150 attached to the side plate portion 131b are contacts for high-frequency current (high-speed transmission), and the 6 first contacts 150 attached to the center plate portion 131a are contacts for low-frequency current (low-speed transmission). The frequency of the high-frequency current is, for example, several hundred MHz or more.

1 conductor member 170 is attached to each of the 2 side plate portions 131b of the bottom portion 131. The conductor member 170 is located in the vicinity of the boundary between the central plate portion 131a and the side plate portion 131 b. The monolithic conductor member 170 is made of metal and includes: an elongated rod-shaped part 170a, and 2 wall parts 170b extending perpendicularly in the same direction from the rod-shaped part 170 a.

The wall portion 170b protrudes from the bottom portion 131 in a direction in which the side wall portion 132 stands, and both end portions 170c of the rod-like portion 170a extending in a direction perpendicular to the longitudinal direction of the contact row slightly protrude from the side plate portion 131b to the outside of the side plate portion 131b in a direction parallel to the bottom portion 131. One wall portion 170b of one conductor member 170 and one wall portion 170b of the other conductor member 170 are located on an imaginary extension line of one contact row, and the other wall portion 170b of the one conductor member 170 and the other wall portion 170b of the other conductor member 170 are located on an imaginary extension line of the other contact row.

(first case)

The first case 110 mounted on the first insulator 130 shown in fig. 4 has a frame structure, and the first insulator 130 is located inside the first case 110 (refer to fig. 2). The first case 110 has a first sidewall portion 110A along the first insulator 130. The first side wall 110A of the first case 110 has a first portion 110B that can be attached to the first substrate 1. The first side wall portion 110A of the first housing 110 has a slit 110C. The first side wall portion 110A of the first housing 110 has a cantilever spring 110D, the cantilever spring 110D being located at the slit 110C and having a free end 110E and a fixed end 110F fixed to the first side wall portion 110A of the first housing 110. The cantilever spring 110D extends in the height direction of the first housing 110. The fixed end 110F of the cantilever spring 110D is close to the first portion 110B of the first housing 110, and the free end 110E of the cantilever spring 110D is far from the first portion 110B of the first housing 110.

Hereinafter, the first housing 110 having such features will be described in detail. In this embodiment, the first case 110 shown in fig. 5 is composed of 2 metal members 111. The 2 metal parts 111 have the same structure.

The one-piece metal member 111 has a staple (staple) like appearance, and includes: a first plate portion 111a in the form of an elongated rectangular plate, and 2 second plate portions 111b in the form of elongated rectangular plates. The 2 second plate portions 111b extend in the same direction (i.e., the Y direction shown in fig. 5) from the vicinity of both ends of the first plate portion 111a in the longitudinal direction (i.e., the X direction shown in fig. 5). The upper end portions of the first plate portions 111a and the upper end portions of the 2 second plate portions 111b are bent 90 degrees toward the inside of the metal member 111. The "upper" and "lower" in the description are "upper" and "lower" in terms of the paper surface in the height direction of the metal member 111 shown in fig. 5 (i.e., the Z direction shown in fig. 5).

A right-angled triangular support (bridge) 111d extends from one end in the longitudinal direction of the upper end portion of the first plate portion 111a to one end in the longitudinal direction of the upper end portion of a second plate portion 111 b. The other right-angled triangular support 111d extends from the other end in the longitudinal direction of the upper end portion of the first plate portion 111a to one end in the longitudinal direction of the upper end portion of the other second plate portion 111 b. The 2 rectangular plate-shaped hooks 111c extend downward from the vicinity of both ends in the longitudinal direction of the upper end of the first plate portion 111 a. The hook 111c has a claw 111g protruding in a direction perpendicular to the extending direction of the hook 111 c. The lower end portion of the second plate portion 111b has a U-shaped notch 111b 1.

The first plate portion 111a has slits 110C and cantilever springs 110D at both ends of the first plate portion 111a in the longitudinal direction. A part of the slit 110C of the first plate portion 111a doubles as a gap between the first plate portion 111a and the second plate portion 111b generated by the bending processing of the metal member 111. A tongue-shaped cantilever spring 110D is located inside the slot 110C, having a free end 110E and a fixed end 110F. The cantilever spring 110D extends in the height direction (i.e., Z direction) of the first plate portion 111a, and a fixed end 110F of the cantilever spring 110D is fixed to the first plate portion 111 a. The fixed end 110F of the cantilever spring 110D is located near the lower end of the first plate portion 111a, and the free end 110E of the cantilever spring 110D is located near the upper end of the first plate portion 111 a.

Similarly, the second plate portion 111b has a slit 110C and a cantilever spring 110D at a portion of the second plate portion 111b located near the first plate portion 111 a. A tongue-shaped cantilever spring 110D is located inside the slot 110C, having a free end 110E and a fixed end 110F. The cantilever spring 110D extends in the height direction (i.e., Z direction) of the second plate portion 111b, and a fixed end 110F of the cantilever spring 110D is fixed to the second plate portion 111 b. The fixed end 110F of the cantilever spring 110D is located near the lower end of the second plate portion 111b, and the free end 110E of the cantilever spring 110D is located near the upper end of the second plate portion 111 b.

The first plate portion 111a has an elongated semi-cylindrical protruding portion 111e protruding outward of the first plate portion 111 a. The convex portion 111e of the first plate portion 111a extends in a direction perpendicular to the height direction of the first plate portion 111 a. Both ends of the convex portion 111e of the first plate portion 111a are slightly separated from the cantilever spring 110D. Similarly, the second plate portion 111b has an elongated semi-cylindrical protruding portion 111e protruding outward of the second plate portion 111 b. The convex portion 111e of the second plate portion 111b extends in a direction perpendicular to the height direction of the second plate portion 111 b. One end of the convex portion 111e of the second plate portion 111b is slightly separated from the cantilever spring 110D.

One metal member 111 is mounted on 2 side wall portions 132 of one side plate portion 131b of the first insulator 130, and the other metal member 111 is mounted on 2 side wall portions 132 of the other side plate portion 131b of the first insulator 130. At this time, the hook 111c having the claw 111g is pressed into the recess 132a of the side wall 132. As a result, the 2 metal members 111 are mounted on the first insulator 130 in a state where the front ends of the 2 second plate portions 111b of one metal member 111 and the front ends of the 2 second plate portions 111b of the other metal member 111 face each other. The 2 metal members 111 in this state constitute the first housing 110. The end 170c of the rod-like portion 170a of the conductor member 170 is located in the U-shaped notch 111b1 of the second plate portion 111 b.

In a state where the first case 110 is mounted to the first insulator 130, the first plate portion 111a and the second plate portion 111b extend along the outside of the first insulator 130. That is, the first plate portion 111a and the second plate portion 111b correspond to the first side wall portion 110A. The lower end of the first plate portion 111a and the lower end of the 2 second plate portions 111B (except for the U-shaped notch 111B 1) are portions that can be attached to the first substrate 1, and correspond to the first portion 110B. Accordingly, the fixed end 110F of the cantilever spring 110D is close to the first portion 110B of the first housing 110, and the free end 110E of the cantilever spring 110D is far from the first portion 110B of the first housing 110.

Each cantilever spring 110D has a curved shape bulging toward the outside of the first housing 110. The center portion 110G of the cantilever spring 110D between the free end 110E and the fixed end 110F is located outside the first side wall portion 110A. The free end 110E of the cantilever spring 110D is not located outside the first side wall portion 110A of the first housing 110. Therefore, when an external force in the height direction (i.e., Z direction) of the first housing 110 is applied to the cantilever spring 110D, the cantilever spring 110D can be tilted toward the inside of the first housing 110 with the fixed end 110F as a fulcrum. When the cantilever spring 110D is inclined according to the external force, the free end 110E of the cantilever spring 110D enters the recess 132b of the side wall portion 132. In other words, the operation of the cantilever spring 110D is not hindered by the presence of the recess 132b of the side wall portion 132.

In general, from the viewpoint of blocking spatial conduction of electromagnetic waves, the slit of the conductive case is preferably located as far as possible from the contact for high-frequency current. However, as is apparent from this embodiment, the slit 110C and the cantilever spring 110D may be located closer to the high-frequency contact (i.e., the 2 first contacts 150 attached to the side plate portion 131 b) than the low-frequency contact (i.e., the 6 first contacts 150 attached to the center plate portion 131 a). That is, design restrictions on the positions of the slits and the cantilever springs are less than those of the prior art.

The first substrate-to-substrate connector 100 is mounted on one face of the first substrate 1. One surface of the first substrate 1 has a ground pad and a signal line. The other ends 150b, 150d of the first contact 150 are in contact with the signal lines of the first substrate 1. The rod-shaped portion 170a of the conductor member 170 and the first portion 110B of the first case 110 are in contact with the ground pad of the first substrate 1. Typically, the first substrate-to-substrate connector 100 is mounted on the first substrate 1 using solder.

(second substrate to substrate connector)

The second substrate-to-substrate connector 200 shown in fig. 6 and 7 includes: a second case 210 having a frame structure and having conductivity; a second insulator 230 having electrical insulation; 8 second contacts 250 having conductivity.

(second insulator, second contact)

The second insulator 230 shown in fig. 8 is a single-piece insulating member having a substantially rectangular parallelepiped appearance. The second insulator 230 has 2 grooves 230a extending in parallel to the longitudinal direction (i.e., the Y direction shown in fig. 8) of the second insulator 230 at the central portion of the second insulator 230. Along one slot 230a, 3 second contacts 250 are mounted, and along the other slot 230a, 3 second contacts 250 are mounted. The 6 second contacts 250 each have a shape in which a strip-shaped metal plate is bent, and have: a U-shaped portion 250a, and an L-shaped portion 250b extending from one end of the U-shaped portion 250 a. The U-shaped portion 250a of the second contact 250 is positioned in the groove 230a of the second insulator 230. The U-shaped portion 250a opens upward. The "up" and "down" in the description are along the "up" and "down" of the paper surface in the height direction (i.e., Z direction) of the second insulator 230 shown in fig. 8. An end portion of the second contact 250 (i.e., an end portion of the L-shaped portion 250 b) is located at a lower end of the sidewall in the length direction of the second insulator 230.

The second insulator 230 has 2 recesses 230b at both ends of the second insulator 230 in the longitudinal direction. The remaining 2 second contacts 250 are mounted in the 2 recesses 230 b. The 2 second contacts 250 each have a shape in which a metal plate is bent, and have: a U-shaped portion 250c, and a leg portion 250d extending from the bottom of the U-shaped portion 250 c. The U-shaped portion 250c opens upward. An end portion of the second contact 250 (i.e., an end portion of the leg portion 250 d) is located at a lower end of the sidewall in the width direction (i.e., the X direction) of the second insulator 230.

The second insulator 230 has slits 230c extending in the width direction of the second insulator 230 between the first recess 230b where the second contact 250 is located and the groove 230a where the 6 second contacts 250 are located, and between the second recess 230b where the second contact 250 is located and the groove 230a where the 6 second contacts 250 are located. That is, the second insulator 230 has 2 slits 230 c.

The second insulator 230 has a bridge portion 230d connecting a central portion of the second insulator 230 and an end portion of the second insulator 230 in the longitudinal direction. The slit 230c is located between 2 bridge portions 230 d.

(second case)

The one-piece second case 210 shown in fig. 9 has a bottom portion 210B and a rectangular frame-shaped second side wall portion 210A, and the second side wall portion 210A has a second portion 210B attachable to the second substrate 2. The second housing 210 is made of metal. The bottom portion 210b has 4 flat plate portions 210b1 and 2 upright portions 210b 2. The flat plate portion 210b1 is located at a corner of the second side wall portion 210A. The upright portion 210b2 extends from one to the other of two flat plate portions 210b1 adjacent in the width direction of the second case 210 (i.e., the X direction shown in fig. 9). Each standing portion 210b2 extends in the width direction of the second housing 210, and stands vertically with respect to the bottom portion 210 b.

Each upright portion 210b2 has: 2 inverted U-shaped portions 210b21, 1 bridge portion 210b22, and 2 leg portions 210b 23. The inverted U-shaped portion 210b21 extends vertically from the flat plate portion 210b1 toward the top of the second case 210, and further folds vertically back toward the bottom of the second case 210. The "up" and "down" in the description are along the "up" and "down" of the paper surface in the height direction (i.e., Z direction) of the second housing 210 shown in fig. 9. The bridge portion 210b22 extends from one inverted U-shaped portion 210b21 to the other inverted U-shaped portion 210b 21. The 2 leg portions 210b23 extend from the center of the bridge portion 210b22 to above the second case 210. The leg portion 210b23 has a claw 210b24 protruding in the width direction of the second housing 210 at the front end of the leg portion 210b 23. The inverted U-shaped portion 210b21 has a claw 210b25 protruding inward of the inverted U-shaped portion 210b 21.

Each side of the second side wall portion 210A has an elongated semi-cylindrical projection 210e projecting outward of the second side wall portion 210A. The convex portion 210e extends in a direction perpendicular to the height direction of the second side wall portion 210A.

The second housing 210 is mounted on the second insulator 230, and as a result, the second insulator 230 is positioned inside the second housing 210 (see fig. 6). At this time, the 2 upright portions 210b2 of the second case 210 are received in the 2 slits 230c of the second insulator 230. The bridge portion 230d of the second insulator 230 is pressed between the inverted U-shaped portions 210b21 having the claws 210b 25. The second sidewall portion 210A of the second case 210 surrounds the outside of the second insulator 230. The lower end portion of the second side wall portion 210A of the second case 210 corresponds to a second portion 210B that can be attached to the second substrate 2.

The second substrate-to-substrate connector 200 is mounted on one face of the second substrate 2. One surface of the second substrate 2 has a ground pad and a signal line. The end of the L-shaped portion 250b of the 6 second contacts 250 and the end of the leg portion 250d of the 2 second contacts 250 are in contact with the signal line of the second substrate 2. The second portion 210B of the second case 210 and the bridge portion 210B22 of the second case 210 contact the ground pad of the second substrate 2. Typically, the second substrate-to-substrate connector 200 is mounted on the second substrate 2 using solder.

(connector assembly)

The first board-to-board connector 100 fixed to one surface of the first board 1 and the second board-to-board connector 200 fixed to one surface of the second board 2 are fitted to each other in a state where the one surface of the first board 1 and the one surface of the second board 2 face each other in parallel (see fig. 10). The first board-to-board connector 100 and the second board-to-board connector 200 fitted to each other constitute a connector assembly 500. The parallel connection of the first substrate 1 and the second substrate 2 is achieved by the connector assembly 500, and the first substrate 1 and the second substrate 2 are electrically connected to each other. In the connector assembly 500, the first housing 110 of the first substrate-to-substrate connector 100 is located inside the second housing 210 of the second substrate-to-substrate connector 200.

In the connector assembly 500, one ends 150a of 6 first contacts 150 forming a contact column in the first insulator 130 are embedded in U-shaped portions 250a of 6 second contacts 250 located in slots of the second insulator 230. Further, in the connector assembly 500, one end 150c of the remaining 2 first contacts 150 of the first insulator 130 is embedded in the U-shaped portion 250c of the 2 second contacts 250 located at both ends of the second insulator 230.

In the connector assembly 500, the wall portion 170b of the conductor member 170 mounted on the first insulator 130 is embedded between the inverted U-shaped portion 210b21 and the foot portion 210b23 in the upright portion 210b2 of the second housing 210. The combination of the conductor member 170 mounted on the first insulator 130 and the upright portion 210b2 of the second housing 210 functions as a shield that electromagnetically isolates the low frequency contacts from the high frequency contacts.

In the process of fitting the first board-to-board connector 100 and the second board-to-board connector 200 to each other, the convex portion 111e of the first housing 110 goes over the convex portion 210e of the second housing 210. In the connector assembly 500, the convex portion 111e of the first housing 110 and the convex portion 210e of the second housing 210 contact each other. Thereby, the gap between the first housing 110 and the second housing 210 is reduced, so the shielding performance of the connector assembly 500 is improved.

Further, in the connector assembly 500, the cantilever springs 110D of the first board-to-board connector 100 are in contact with the second sidewall portion 210A of the second housing 210 of the second board-to-board connector 200. As described above, when an external force in the height direction of the first housing 110 is applied to the cantilever spring 110D, the cantilever spring 110D can be tilted toward the inside of the first housing 110 with the fixed end 110F as a fulcrum. Therefore, when the first board-to-board connector 100 is fitted into the second board-to-board connector 200, the cantilever springs 110D do not buckle even if the second housing 210 collides with the cantilever springs 110D of the first housing 110.

According to the above-described embodiment, the distance from the first portion 110B of the first board-to-board connector 100 to the second portion 210B of the second board-to-board connector 200 is sufficiently short compared to the distance in the related art. As in the prior art, when the cantilever spring extends in the direction opposite to the extending direction of the cantilever spring 110D employed in the above-described embodiment (see fig. 12B), the shortest path from the first portion 110B of the first board-to-board connector 100 to the second portion 210B of the second board-to-board connector 200 has a zigzag shape with a fold back as shown by thick solid lines in fig. 12A and 12B. The path indicated by the thick dashed line in fig. 12A is the same as the path indicated by the thick solid line in fig. 12B. According to the above embodiment, the shortest path from the first portion 110B of the first board-to-board connector 100 to the second portion 210B of the second board-to-board connector 200 is in a step shape without being folded back, as shown by thick solid lines in fig. 11A and 11B. Therefore, the cantilever spring 110D of the embodiment exerts good grounding performance. That is, a reduction in EMI is achieved in the connector assembly 500.

Fig. 13 is a graph showing EMI of the connector assembly 500 according to the embodiment and each of the first comparative example and the second comparative example. The vertical axis of the graph represents the radiation electric field intensity (unit: dB muV/m), and the horizontal axis represents the frequency (unit: GHz). The first comparative example has the same configuration as the connector assembly 500 except that the cantilever spring extends in the direction opposite to the extending direction of the cantilever spring 110D employed in the above-described embodiment. The second comparative example has the same structure as the connector assembly 500 except that it does not have the cantilever spring 110D employed in the above embodiment. The solid line in the graph is the radiation electric field strength of the first comparative example, the broken line is the radiation electric field strength of the second comparative example, and the two-dot chain line is the radiation electric field strength of the connector assembly 500. As can be seen from a comparison of the connector assembly 500 with the first comparative example, EMI of the connector assembly 500 is greatly improved by employing the cantilever spring 110D extending in a direction opposite to the extending direction of the cantilever spring employed in the related art. In addition, as is apparent from a comparison of the connector assembly 500 with the second comparative example, the combination of the gap reducing structure based on the contact of the convex portions 111e of the first housing 110 and the convex portions 210e of the second housing 210 and the cantilever springs 110D greatly improves the EMI of the connector assembly 500.

(appendix)

While the present invention has been described with reference to exemplary embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the present invention. Further, many modifications may be made to adapt a particular system, device or component thereof to the teachings of the present invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed for carrying out this invention, but that the invention will include all embodiments falling within the scope of the appended claims.

The use of the terms "first", "second", etc. do not denote any order or importance, but rather the terms "first", "second", etc. are used to distinguish one element from another. The terms used in the present specification are terms for describing the embodiments, and are not intended to limit the present invention. The terms "comprises" and/or "comprising," when used in this specification and/or the appended claims, specify the presence of stated features, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and/or groups thereof. All combinations of one or more of the elements of the associated list are included if there is such a term "and/or". In the claims and the specification, unless otherwise specified, "connected", "joined", or "connected" or a synonym thereof, and all forms of the words do not necessarily negate the presence of one or more intermediate elements between two of, for example, "connected" or "joined" or "connected" to each other. In the claims and specification, if there is any such term as "any", it is to be understood that the term represents a general term or symbol unless otherwise specified

The same meaning of terms. For example, an expression of "about an arbitrary X" has an association with "offAll X "or" with respect to each X "have the same meaning.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. Further, terms and the like defined in commonly used dictionaries should be interpreted as having the same meaning as that in the context of the related art and the present disclosure, and the terms are not to be interpreted ideally or excessively formally unless explicitly defined.

It should be understood that many techniques and steps are disclosed in the description of the invention. These may each have individual advantages, or may each be used in combination with one or more, or depending on the circumstances, all of the other disclosed skills. Therefore, to avoid becoming complicated, not all possible combinations of individual skills or steps are described in this specification. Nevertheless, the specification and claims should be understood and read as such a combination is entirely within the scope of the invention and the claims.

The corresponding structures, materials, acts, and equivalents of all functional elements in combination with means or steps in the claims below, if any, include structures, materials, or acts for performing the functions in combination with other elements.

The embodiments of the present invention have been described above, but the present invention is not limited to these embodiments. Various changes and modifications can be made without departing from the scope of the present invention. The embodiments were chosen and described in order to explain the principles of the invention and its practical application. The present invention is applicable to various embodiments with various modifications and variations, and various modifications and variations are determined according to the intended use. All such modifications and variations are intended to be included herein within the scope of this disclosure as defined by the appended claims, and the same protection is afforded thereto, when interpreted in accordance with the breadth to which they are fairly, legally, and equitably entitled.

Claims

1. A substrate-to-substrate connector mountable on a substrate, comprising:

a case having a frame structure and having conductivity;

an insulator having an electrical insulating property;

at least one contact having an electrical conductivity,

the at least one contact is mounted on the insulator,

the housing is mounted on the insulator and,

the insulator is located inside the housing,

the housing has a sidewall portion along the insulator,

the side wall portion of the housing has a portion capable of being mounted on the substrate,

the side wall portion of the housing has a slit,

the side wall portion of the housing has a cantilever spring located at the slit and having a fixed end fixed to the side wall portion of the housing and a free end,

the cantilever spring extends in a height direction of the housing,

the fixed end of the cantilever spring is close to the portion of the housing, and the free end of the cantilever spring is away from the portion of the housing.

2. The substrate-to-substrate connector of claim 1,

the cantilever spring has a curved shape bulging toward the outside of the housing,

a portion of the cantilever spring between the free end and the fixed end is located outside the side wall portion of the housing,

the free end of the cantilever spring is not located outside the sidewall portion of the housing.

3. The substrate-to-substrate connector of claim 1,

the side wall portion of the housing has a convex portion that protrudes toward the outside of the housing,

the convex portion extends in a direction perpendicular to a height direction of the housing.

4. The substrate-to-substrate connector of claim 2,

5. The substrate-to-substrate connector of claim 1,

the at least one contact comprises at least two contacts,

at least one of the at least two contacts is a high-frequency contact for high-frequency currents,

at least one of the at least two contacts other than the high frequency contact is a low frequency contact for low frequency currents,

the cantilever spring is closer to the high frequency contact than the low frequency contact.

6. The substrate-to-substrate connector of claim 2,

the at least one contact comprises at least two contacts,

7. The substrate-to-substrate connector of claim 3,

the at least one contact comprises at least two contacts,

8. The substrate-to-substrate connector of claim 4,

the at least one contact comprises at least two contacts,

9. A connector assembly, comprising:

a first substrate-to-substrate connector mountable on a first substrate;

a second board-to-board connector that can be mounted on a second board and that is fitted to the first board-to-board connector,

the first substrate-to-substrate connector includes:

a first case having a frame structure and having conductivity;

a first insulator having an electrical insulating property;

a first contact having an electrical conductivity is provided,

the first contact is mounted on the first insulator,

the first housing is mounted on the first insulator,

the first insulator is located inside the first housing,

the first housing has a first sidewall portion along the first insulator,

the first side wall portion of the first case has a first portion mountable on the first substrate,

the first side wall portion of the first housing has a slit,

the first side wall portion of the first housing has a cantilever spring which is located at the slit and has a fixed end fixed to the first side wall portion of the first housing and a free end,

the cantilever spring extends in a height direction of the first housing,

the fixed end of the cantilever spring is proximate to the first portion of the first housing, the free end of the cantilever spring is distal from the first portion of the first housing,

the second substrate-to-substrate connector includes:

a second housing having a frame structure and having conductivity;

a second insulator having an electrical insulating property;

a second contact having an electrical conductivity that is,

the second contact is mounted on the second insulator,

the second housing is mounted on the second insulator,

the second insulator is located inside the second housing,

the second housing has a second sidewall portion surrounding the second insulator,

the second side wall portion of the second case has a second portion mountable on the second substrate,

in the connector assembly in which the first board-to-board connector and the second board-to-board connector are fitted to each other, the first housing of the first board-to-board connector is located inside the second housing of the second board-to-board connector, and the cantilever spring of the first board-to-board connector is in contact with the second side wall of the second housing of the second board-to-board connector.