CN215166093U - Semiconductor refrigeration air water taking cup - Google Patents
Semiconductor refrigeration air water taking cup Download PDFInfo
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- CN215166093U CN215166093U CN202121464678.7U CN202121464678U CN215166093U CN 215166093 U CN215166093 U CN 215166093U CN 202121464678 U CN202121464678 U CN 202121464678U CN 215166093 U CN215166093 U CN 215166093U
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Abstract
The utility model discloses a semiconductor refrigeration air water intaking cup relates to air water intaking equipment. The utility model provides a cup is got to semiconductor refrigeration air, its characterized in that is equipped with the bowl cover at the top of cup, and the bowl cover top is equipped with the inlet port, has the fan under the inlet port, has the condensation net at the fan, is equipped with the semiconductor refrigeration piece under the condensation net, and the refrigeration face of semiconductor refrigeration piece is upwards, and the face that generates heat of semiconductor refrigeration piece is downwards, is equipped with bowl cover power input jack in the bowl cover outside, and bowl cover power input jack communicates with fan, semiconductor refrigeration piece, is equipped with the exhaust vent on the lateral wall of bowl cover lower part. The utility model discloses a semiconductor refrigeration air water intaking cup has adopted semiconductor refrigeration technique and semiconductor refrigeration material, has ingenious realized the refrigerated air water intaking of semiconductor, has small, light in weight, and pollution-free, the noise is little, and is power consumptive low, has especially adopted automatic control, successfully realizes the air water intaking of automation, maximize, has spreading value.
Description
Technical Field
The utility model relates to air water intaking equipment, more specifically involve a semiconductor refrigeration air water intaking cup.
Background
Semiconductor refrigeration, also known as electronic refrigeration or thermoelectric refrigeration, is a subject developed in the 50 s and located at the edge of refrigeration technology and semiconductor technology, and utilizes P-N junctions formed by special semiconductor materials to form thermocouple pairs to generate Peltier effect, namely a novel refrigeration method by direct current refrigeration, and compression refrigeration and absorption refrigeration which are called as world three major refrigeration modes.
As the name suggests, the air water taking device is a device for producing liquid water by taking air as a water source. A large amount of water molecules exist in the air, and the water molecules in the air can be condensed into water drops after encountering cold. The utility model discloses the people has applied for "a water dispenser of air water intaking", patent number ZL 201220285511.9 in 2012 6 month 18 days, the utility model discloses the people has applied for "a domestic multipurpose water dispenser" again in 2016 11 month 26 days, patent number ZL 201621277331.0, and the air water intaking theory of work of two kinds of water dispensers utilizes the refrigerant to circulate in compressor-condenser-choke valve-evaporimeter-compressor and flows, makes the evaporimeter become cold, and on the fan sent the evaporimeter with the air, the hydrone in the air met cold evaporimeter, and some hydrones will condense into the drop of water on the aluminium fin of evaporimeter. Although nearly ten thousand water dispensers for taking water from air are put on the market and have certain effect, the existing water dispenser for taking water from air has larger volume, larger noise, larger power consumption and large pollution of refrigerant, and the water dispenser for taking water from air can not be miniaturized. In order to research an air water taking device with a small volume, a semiconductor refrigeration air water taking cup needs to be developed.
Disclosure of Invention
The utility model aims at: a semiconductor refrigeration air water taking cup is provided.
The technical scheme of the utility model is that: the utility model provides a cup is got to semiconductor refrigeration air, its characterized in that is equipped with the bowl cover at the top of cup, and the bowl cover top is equipped with the inlet port, has the fan under the inlet port, has the condensation net at the fan, is equipped with the semiconductor refrigeration piece under the condensation net, and the refrigeration face of semiconductor refrigeration piece is upwards, and the face that generates heat of semiconductor refrigeration piece is downwards, is equipped with bowl cover power input jack in the bowl cover outside, and bowl cover power input jack communicates with fan, semiconductor refrigeration piece, is equipped with the exhaust vent on the lateral wall of bowl cover lower part.
The cup is characterized in that two semiconductor refrigeration sheets form an inverted V-shaped shape, 2-8 inverted V-shaped shapes are arranged in the cup cover, a gap is arranged between the two inverted V-shaped shapes, a semiconductor refrigeration sheet support is arranged in the cup cover and fixed on the semiconductor refrigeration sheet support, the air outlet is located below the heating surface of the semiconductor refrigeration sheet, the condensation net is a metal net, an automatic controller is arranged outside the cup cover, an air inlet hole temperature sensor and a humidity sensor are arranged on the air inlet hole, a condensation net temperature sensor is arranged at the lower opening of the condensation net, and the automatic controller, the fan, the semiconductor refrigeration sheet, the cup cover power input jack, the air inlet hole temperature sensor, the condensation net temperature sensor and the humidity sensor are connected through a wire.
The semiconductor refrigeration air water taking cup is characterized in that the bottom of the cup body is connected with the cup base, the cup base is provided with a cup base electric switch, a power line and a power output jack, and the cup body is provided with a cup handle.
Above-mentioned semiconductor refrigeration air gets drinking cup, its the top of bowl cover is equipped with the air filter, is equipped with the water filter screen at the oral area of cup, is equipped with water filter core in the water filter screen.
The semiconductor refrigeration air water taking cup is characterized in that the bottom of the cup body is connected with the cup base, the cup base is provided with a cup base electric switch, a power line and a power output jack, and the cup body is provided with a cup handle.
The semiconductor refrigeration piece is a heat transfer tool, when the semiconductor refrigeration piece is electrified, the refrigeration surface of the semiconductor refrigeration piece starts to refrigerate, the heating surface of the semiconductor refrigeration piece starts to radiate heat, the higher the power of the semiconductor refrigeration piece is, the lower the temperature of the refrigeration surface of the semiconductor refrigeration piece is, and when the power of the semiconductor refrigeration piece is reduced, the temperature of the refrigeration surface of the semiconductor refrigeration piece is increased.
The utility model discloses a theory of operation: the power supply is switched on, the semiconductor refrigerating sheet starts to work, the refrigerating surface of the semiconductor refrigerating sheet starts to refrigerate, the cold is conducted to the condensing net, the air passes through the condensing net, water molecules in the air are condensed into liquid water from gas state, and the water gradually falls into the cup body; the fan will adjust the flow of air promptly, will blow away the heat of semiconductor refrigeration piece heating surface again, and fan rotational speed is fast, and the temperature of condensation net risees, and fan rotational speed is slow, and the temperature of condensation net reduces.
The temperature of the air outside the cup cover is displayed by the temperature of the air inlet hole temperature sensor, the humidity of the air outside the cup cover is displayed by the humidity of the humidity sensor, and the temperature of the lower opening of the condensation net in the cup cover is displayed by the temperature of the condensation net temperature sensor.
The automatic controller is a controller made of circuit, it is by the air inlet temperature sensor, condensation network temperature sensor, humidity transducer, parameter value of input, calculate through the psychrometric chart calculator, regulate the rotational speed of the blower, or regulate the power of the semiconductor chilling plate, or regulate the rotational speed of the blower and power of the semiconductor chilling plate at the same time. The temperature value of the condensation net temperature sensor can reach the dew point temperature value expected by the enthalpy-humidity diagram through three adjustment modes.
The psychrometric chart is a chart showing the relationship between various parameters of air, and is like a dictionary, and can find other parameter values of air according to a certain parameter value of air, and particularly can find the dew point temperature of air according to the temperature and the humidity of the air. The enthalpy-humidity diagram calculator is a calculator which is specially used for calculating parameter values of the enthalpy-humidity diagram by combining software and hardware according to the principle of the enthalpy-humidity diagram. The dew point temperature is the temperature at which water vapor in the air becomes dew. For example, a dew point temperature is calculated by an psychrometric chart calculator, and when the temperature is 30 ℃ and the humidity is 90%, the dew point temperature is 28.16 ℃; when the temperature is 30 ℃ and the humidity is 80%, the dew point temperature is 26.16 ℃; when the temperature is 30 ℃ and the humidity is 70%, the dew point temperature is 23.93 ℃; when the temperature is 30 ℃ and the humidity is 60%, the dew point temperature is 21.40 ℃; when the temperature is 25 ℃ and the humidity is 60%, the dew point temperature is 16.72 ℃; when the temperature is 25 ℃ and the humidity is 70%, the dew point temperature is 19.16 ℃; when the temperature is 25 ℃ and the humidity is 80%, the dew point temperature is 21.32 ℃; when the temperature is 25 ℃ and the humidity is 90%, the dew point temperature is 23.25 ℃. An enthalpy-humidity diagram calculator is arranged in the automatic controller.
The fan adopts stepless speed change. The rotating speed of the fan is controlled by the automatic controller.
The condensation net can be made of aluminum alloy meshes, copper meshes or aluminum sheets or copper sheets, and the interval between the two aluminum sheets or the two copper sheets is preferably 1.5-2.5 mm. The condensing net can be coated with hydrophilic coating which is commercially available.
The automatic controller can perform matching of the temperature of the condensation net temperature sensor and the dew point temperature once in a timing mode, such as automatic matching once in 60 minutes, or automatic matching once in 30 minutes, or automatic matching once in 15 minutes. The real-time matching of the temperature of the condensation net temperature sensor and the dew point temperature enables the air to form the best effect of condensing into water. When the temperature of the condensation net temperature sensor is controlled within the range of the dew point temperature +/-2 ℃, the rotating speed of the fan is enabled to rotate at a constant speed, and the rotating speed is an empirical value obtained through a large number of tests. The matching relation between the temperature sensor of the condensation net and the rotating speed of the fan is an empirical value obtained through a large number of experiments. The automatic controller is provided with a switch.
The water filter is composed of a water filter screen and a water filter core, and the water filter core is preferably a PP cotton filter core.
The utility model discloses an its structure of semiconductor refrigeration air water intaking cup also can be applied to in its similar semiconductor refrigeration air water intaking ware.
The cup base is a universal electric heating base, a power cord is connected with an external power supply, and an electric switch of the cup base controls an electric heating plate in the cup body. The power output jack can be connected with the power input jack of the cup cover by a plug wire.
The utility model has the advantages that: the utility model discloses a semiconductor refrigeration air water intaking cup has adopted semiconductor refrigeration technique and semiconductor refrigeration material, has ingenious realized the refrigerated air water intaking of semiconductor, has small, light in weight, and pollution-free, the noise is little, and is power consumptive low, has especially adopted automatic control, successfully realizes the air water intaking of automation, maximize, has spreading value.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
FIG. 2 is a control schematic of the automatic controller;
the labels in the figure are: the cup comprises a cup cover 1, an air filter screen 2, an air inlet hole 3, a fan 4, a semiconductor refrigerating sheet 5, a condensing screen 6, an air outlet hole 7, a water filter screen 8, a water filter element 9, a cup body 10, a cup base 11, a cup base electric switch 12, a power cord 13, a power output jack 14, a cup cover power input jack 15, a cup handle 16, an air inlet hole temperature sensor 17, a condensing screen temperature sensor 18, an automatic controller 19, a humidity sensor 20 and a semiconductor refrigerating sheet support 21.
Detailed Description
The present invention will be further described with reference to the following examples.
Example 1
Referring to fig. 1, fig. 2, a cup is got to semiconductor refrigeration air, top at cup 10 is equipped with bowl cover 1, 1 top of bowl cover is equipped with inlet port 3, 3 have fan 4 at the inlet port, 4 have condensation net 6 at the fan, 6 have semiconductor refrigeration piece 5 of condensation net, the refrigeration face of semiconductor refrigeration piece 5 is upwards, the face that generates heat of semiconductor refrigeration piece 5 is downwards, 1 outside bowl cover power input jack 15 that is equipped with of bowl cover, 15 and fan 4 of bowl cover power input jack, 5 intercommunications of semiconductor refrigeration piece, be equipped with exhaust vent 7 on the lateral wall of 1 lower part of bowl cover.
Example 2
Referring to fig. 1, fig. 2, a cup is got to semiconductor refrigeration air, top at cup 10 is equipped with bowl cover 1, 1 top of bowl cover is equipped with inlet port 3, 3 have fan 4 at the inlet port, 4 have condensation net 6 at the fan, 6 have semiconductor refrigeration piece 5 of condensation net, the refrigeration face of semiconductor refrigeration piece 5 is upwards, the face that generates heat of semiconductor refrigeration piece 5 is downwards, 1 outside bowl cover power input jack 15 that is equipped with of bowl cover, 15 and fan 4 of bowl cover power input jack, 5 intercommunications of semiconductor refrigeration piece, be equipped with exhaust vent 7 on the lateral wall of 1 lower part of bowl cover. Two pieces of the semiconductor refrigerating sheet 5 form an inverted V-shaped shape, 2-8 inverted V-shaped shapes are arranged in the cup cover 1, a gap is arranged between the two inverted V-shaped shapes, a semiconductor refrigerating sheet support 21 is arranged in the cup cover 1, the semiconductor refrigerating sheet 5 is fixed on the semiconductor refrigerating sheet support 21, the air outlet 7 is positioned below a heating surface of the semiconductor refrigerating sheet 5, the condensing net 6 is a metal net, an automatic controller 19 is arranged outside the cup cover 1, an air inlet hole temperature sensor 17 and a humidity sensor 20 are arranged on the air inlet hole 3, a condensing net temperature sensor 18 is arranged at the lower opening of the condensing net 6, and the automatic controller 19, the fan 4, the semiconductor refrigerating sheet 5, the cup cover power supply input jack 15, the air inlet hole temperature sensor 17, the condensing net temperature sensor 18 and the humidity sensor 20 are connected through wires.
Example 3
Referring to fig. 1, fig. 2, a cup is got to semiconductor refrigeration air, top at cup 10 is equipped with bowl cover 1, 1 top of bowl cover is equipped with inlet port 3, 3 have fan 4 at the inlet port, 4 have condensation net 6 at the fan, 6 have semiconductor refrigeration piece 5 of condensation net, the refrigeration face of semiconductor refrigeration piece 5 is upwards, the face that generates heat of semiconductor refrigeration piece 5 is downwards, 1 outside bowl cover power input jack 15 that is equipped with of bowl cover, 15 and fan 4 of bowl cover power input jack, 5 intercommunications of semiconductor refrigeration piece, be equipped with exhaust vent 7 on the lateral wall of 1 lower part of bowl cover. The bottom of the cup body 10 is connected with a cup base 11, a cup base electric switch 12, a power cord 13 and a power output jack 14 are arranged on the cup base 11, and a cup handle 16 is arranged on the cup body 10.
Example 4
Referring to fig. 1, fig. 2, a cup is got to semiconductor refrigeration air, top at cup 10 is equipped with bowl cover 1, 1 top of bowl cover is equipped with inlet port 3, 3 have fan 4 at the inlet port, 4 have condensation net 6 at the fan, 6 have semiconductor refrigeration piece 5 of condensation net, the refrigeration face of semiconductor refrigeration piece 5 is upwards, the face that generates heat of semiconductor refrigeration piece 5 is downwards, 1 outside bowl cover power input jack 15 that is equipped with of bowl cover, 15 and fan 4 of bowl cover power input jack, 5 intercommunications of semiconductor refrigeration piece, be equipped with exhaust vent 7 on the lateral wall of 1 lower part of bowl cover. Two pieces of the semiconductor refrigerating sheet 5 form an inverted V-shaped shape, 2-8 inverted V-shaped shapes are arranged in the cup cover 1, a gap is arranged between the two inverted V-shaped shapes, a semiconductor refrigerating sheet support 21 is arranged in the cup cover 1, the semiconductor refrigerating sheet 5 is fixed on the semiconductor refrigerating sheet support 21, the air outlet 7 is positioned below a heating surface of the semiconductor refrigerating sheet 5, the condensing net 6 is a metal net, an automatic controller 19 is arranged outside the cup cover 1, an air inlet hole temperature sensor 17 and a humidity sensor 20 are arranged on the air inlet hole 3, a condensing net temperature sensor 18 is arranged at the lower opening of the condensing net 6, and the automatic controller 19, the fan 4, the semiconductor refrigerating sheet 5, the cup cover power supply input jack 15, the air inlet hole temperature sensor 17, the condensing net temperature sensor 18 and the humidity sensor 20 are connected through wires. The bottom of the cup body 10 is connected with a cup base 11, a cup base electric switch 12, a power cord 13 and a power output jack 14 are arranged on the cup base 11, and a cup handle 16 is arranged on the cup body 10.
Example 5
Referring to fig. 1, fig. 2, a cup is got to semiconductor refrigeration air, top at cup 10 is equipped with bowl cover 1, 1 top of bowl cover is equipped with inlet port 3, 3 have fan 4 at the inlet port, 4 have condensation net 6 at the fan, 6 have semiconductor refrigeration piece 5 of condensation net, the refrigeration face of semiconductor refrigeration piece 5 is upwards, the face that generates heat of semiconductor refrigeration piece 5 is downwards, 1 outside bowl cover power input jack 15 that is equipped with of bowl cover, 15 and fan 4 of bowl cover power input jack, 5 intercommunications of semiconductor refrigeration piece, be equipped with exhaust vent 7 on the lateral wall of 1 lower part of bowl cover. The top of the cup cover 1 is provided with an air filter screen 2, the mouth of the cup body 10 is provided with a water filter screen 8, and a water filter core 9 is arranged in the water filter screen 8.
Example 6
Referring to fig. 1, fig. 2, a cup is got to semiconductor refrigeration air, top at cup 10 is equipped with bowl cover 1, 1 top of bowl cover is equipped with inlet port 3, 3 have fan 4 at the inlet port, 4 have condensation net 6 at the fan, 6 have semiconductor refrigeration piece 5 of condensation net, the refrigeration face of semiconductor refrigeration piece 5 is upwards, the face that generates heat of semiconductor refrigeration piece 5 is downwards, 1 outside bowl cover power input jack 15 that is equipped with of bowl cover, 15 and fan 4 of bowl cover power input jack, 5 intercommunications of semiconductor refrigeration piece, be equipped with exhaust vent 7 on the lateral wall of 1 lower part of bowl cover. Two pieces of the semiconductor refrigerating sheet 5 form an inverted V-shaped shape, 2-8 inverted V-shaped shapes are arranged in the cup cover 1, a gap is arranged between the two inverted V-shaped shapes, a semiconductor refrigerating sheet support 21 is arranged in the cup cover 1, the semiconductor refrigerating sheet 5 is fixed on the semiconductor refrigerating sheet support 21, the air outlet 7 is positioned below a heating surface of the semiconductor refrigerating sheet 5, the condensing net 6 is a metal net, an automatic controller 19 is arranged outside the cup cover 1, an air inlet hole temperature sensor 17 and a humidity sensor 20 are arranged on the air inlet hole 3, a condensing net temperature sensor 18 is arranged at the lower opening of the condensing net 6, and the automatic controller 19, the fan 4, the semiconductor refrigerating sheet 5, the cup cover power supply input jack 15, the air inlet hole temperature sensor 17, the condensing net temperature sensor 18 and the humidity sensor 20 are connected through wires. The top of the cup cover 1 is provided with an air filter screen 2, the mouth of the cup body 10 is provided with a water filter screen 8, and a water filter core 9 is arranged in the water filter screen 8.
Example 7
Referring to fig. 1, fig. 2, a cup is got to semiconductor refrigeration air, top at cup 10 is equipped with bowl cover 1, 1 top of bowl cover is equipped with inlet port 3, 3 have fan 4 at the inlet port, 4 have condensation net 6 at the fan, 6 have semiconductor refrigeration piece 5 of condensation net, the refrigeration face of semiconductor refrigeration piece 5 is upwards, the face that generates heat of semiconductor refrigeration piece 5 is downwards, 1 outside bowl cover power input jack 15 that is equipped with of bowl cover, 15 and fan 4 of bowl cover power input jack, 5 intercommunications of semiconductor refrigeration piece, be equipped with exhaust vent 7 on the lateral wall of 1 lower part of bowl cover. Two pieces of the semiconductor refrigerating sheet 5 form an inverted V-shaped shape, 2-8 inverted V-shaped shapes are arranged in the cup cover 1, a gap is arranged between the two inverted V-shaped shapes, a semiconductor refrigerating sheet support 21 is arranged in the cup cover 1, the semiconductor refrigerating sheet 5 is fixed on the semiconductor refrigerating sheet support 21, the air outlet 7 is positioned below a heating surface of the semiconductor refrigerating sheet 5, the condensing net 6 is a metal net, an automatic controller 19 is arranged outside the cup cover 1, an air inlet hole temperature sensor 17 and a humidity sensor 20 are arranged on the air inlet hole 3, a condensing net temperature sensor 18 is arranged at the lower opening of the condensing net 6, and the automatic controller 19, the fan 4, the semiconductor refrigerating sheet 5, the cup cover power supply input jack 15, the air inlet hole temperature sensor 17, the condensing net temperature sensor 18 and the humidity sensor 20 are connected through wires. The top of the cup cover 1 is provided with an air filter screen 2, the mouth of the cup body 10 is provided with a water filter screen 8, and a water filter core 9 is arranged in the water filter screen 8. The bottom of the cup body 10 is connected with a cup base 11, a cup base electric switch 12, a power cord 13 and a power output jack 14 are arranged on the cup base 11, and a cup handle 16 is arranged on the cup body 10.
The semiconductor refrigerating piece 5 is a heat transfer tool, when the semiconductor refrigerating piece 5 is electrified, the refrigerating surface of the semiconductor refrigerating piece 5 starts to refrigerate, the heating surface of the semiconductor refrigerating piece 5 starts to radiate heat, the higher the power of the semiconductor refrigerating piece 5 is, the lower the temperature of the refrigerating surface of the semiconductor refrigerating piece 5 is, and when the power of the semiconductor refrigerating piece 5 is reduced, the temperature of the refrigerating surface of the semiconductor refrigerating piece 5 is increased. The model of the semiconductor refrigerating sheet 7 is TCL 12708. The temperature of the air outside the cup cover 1 is displayed by the temperature of the air inlet hole temperature sensor 17, the humidity of the air outside the cup cover 1 is displayed by the humidity of the humidity sensor 20, and the temperature of the lower opening of the condensation net 6 in the cup cover 1 is displayed by the temperature of the condensation net temperature sensor 18. The automatic controller 19 is a controller made of a circuit, and is calculated by the air inlet temperature sensor 17, the condensation net temperature sensor 18, the humidity sensor 20 and the input parameter values through the enthalpy-humidity diagram calculator to adjust the rotating speed of the fan 4, or adjust the current intensity of the semiconductor refrigerating sheet 5, or adjust the rotating speed of the fan 4 and the current intensity of the semiconductor refrigerating sheet 5 at the same time. Three adjustment modes can be realized, and the temperature value of the condensation net temperature sensor 18 can reach the dew point temperature value expected by the psychrometric chart. The psychrometric chart is a chart showing the relationship between various parameters of air, and is like a dictionary, and can find other parameter values of air according to a certain parameter value of air, and particularly can find the dew point temperature of air according to the temperature and the humidity of the air. The enthalpy-humidity diagram calculator is a calculator which is specially used for calculating parameter values of the enthalpy-humidity diagram by combining software and hardware according to the principle of the enthalpy-humidity diagram. The dew point temperature is the temperature at which water vapor in the air becomes dew. For example, a dew point temperature is calculated by an psychrometric chart calculator, and when the temperature is 30 ℃ and the humidity is 90%, the dew point temperature is 28.16 ℃; when the temperature is 30 ℃ and the humidity is 80%, the dew point temperature is 26.16 ℃; when the temperature is 30 ℃ and the humidity is 70%, the dew point temperature is 23.93 ℃; when the temperature is 30 ℃ and the humidity is 60%, the dew point temperature is 21.40 ℃; when the temperature is 25 ℃ and the humidity is 60%, the dew point temperature is 16.72 ℃; when the temperature is 25 ℃ and the humidity is 70%, the dew point temperature is 19.16 ℃; when the temperature is 25 ℃ and the humidity is 80%, the dew point temperature is 21.32 ℃; when the temperature is 25 ℃ and the humidity is 90%, the dew point temperature is 23.25 ℃. An psychrometric chart calculator is provided in the automatic controller 19. The fan 4 adopts stepless speed change. The rotational speed of the fan 4 is controlled by an automatic controller 19. The condensation net 6 can be made of aluminum alloy meshes, copper meshes or aluminum sheets or copper sheets, and the interval between the two aluminum sheets or the two copper sheets is preferably 1.5-2.5 mm. The condensing net 6 may be coated with a hydrophilic coating, which is commercially available. The automatic controller 19 can perform the matching of the temperature of the condensation net temperature sensor 18 and the dew point temperature once at regular time, such as automatically matching once in 60 minutes, or automatically matching once in 30 minutes, or automatically matching once in 15 minutes. The real-time matching of the temperature of the condensation net temperature sensor 18 and the dew point temperature enables the air to have the best effect of condensing into water. When the temperature of the condensation net temperature sensor 18 is controlled within the range of the dew point temperature +/-2 ℃, the rotating speed of the fan 4 is enabled to rotate at a constant speed, which is an empirical value obtained through a large number of tests. The matching relationship between the condensation net temperature sensor 18 and the rotation speed of the fan 4 is also an empirical value obtained through a large number of experiments. The automatic controller 19 is provided with a switch. The water filter screen 8 and the water filter core 9 form a water filter, and the water filter core 9 is preferably a PP cotton filter core. The cup holder 11 is a general electric heating holder, the power cord 13 is connected with an external power supply, and the electric switch 12 of the cup holder controls the electric heating plate in the cup body 10. The power supply output jack 14 can be connected with the cup cover power supply input jack 15 by a plug wire.
The working principle of the embodiment is as follows: when the power supply is switched on, the semiconductor refrigerating sheet 5 starts to work, the refrigerating surface of the semiconductor refrigerating sheet 5 starts to refrigerate, the cold is conducted to the condensing net 6, the air passes through the condensing net 6, water molecules in the air are condensed into liquid water from gas state, and the water gradually falls into the cup body 10; the fan 4 needs to adjust the flow of air and blow away the heat of the heating surface of the semiconductor refrigerating sheet 5, the rotating speed of the fan 4 is high, the temperature of the condensing net 6 is increased, the rotating speed of the fan 4 is low, and the temperature of the condensing net 6 is reduced. The semiconductor refrigeration air water taking cup can be applied to similar semiconductor refrigeration air water taking devices.
Claims (5)
1. The utility model provides a cup is got to semiconductor refrigeration air, a serial communication port, top at cup (10) is equipped with bowl cover (1), bowl cover (1) top is equipped with inlet port (3), be equipped with fan (4) under inlet port (3), be equipped with condensation net (6) under fan (4), condensation net (6) have semiconductor refrigeration piece (5), the refrigeration face of semiconductor refrigeration piece (5) makes progress, the heating surface of semiconductor refrigeration piece (5) is downward, be equipped with bowl cover power input jack (15) in bowl cover (1) outside, bowl cover power input jack (15) and fan (4), semiconductor refrigeration piece (5) intercommunication, be equipped with exhaust vent (7) on the lateral wall of bowl cover (1) lower part.
2. The semiconductor refrigeration air water taking cup as claimed in claim 1, wherein the two semiconductor refrigeration sheets (5) form an inverted V shape, 2-8 inverted V shapes are arranged in the cup cover (1), a gap is arranged between the two inverted V shapes, a semiconductor refrigeration sheet support (21) is arranged in the cup cover (1), the semiconductor refrigeration sheets (5) are fixed on the semiconductor refrigeration sheet support (21), the air outlet (7) is positioned below the heating surface of the semiconductor refrigeration sheets (5), the condensation net (6) is a metal net, an automatic controller (19) is arranged outside the cup cover (1), an air inlet hole temperature sensor (17) and a humidity sensor (20) are arranged in the air inlet hole (3), a condensation net temperature sensor (18) is arranged at the lower opening of the condensation net (6), and the automatic controller (19) is driven by a lead wire, The fan (4), the semiconductor refrigerating sheet (5), the cup cover power input jack (15), the air inlet hole temperature sensor (17), the condensation net temperature sensor (18) and the humidity sensor (20) are connected.
3. The semiconductor refrigeration air water taking cup as claimed in claim 1 or 2, characterized in that the bottom of the cup body (10) is connected with a cup base (11), a cup base electric switch (12), a power cord (13) and a power output jack (14) are arranged on the cup base (11), and a cup handle (16) is arranged on the cup body (10).
4. The semiconductor refrigeration air water taking cup as claimed in claim 1 or 2, characterized in that the top of the cup cover (1) is provided with an air filter screen (2), the mouth of the cup body (10) is provided with a water filter screen (8), and the water filter screen (8) is internally provided with a water filter core (9).
5. The semiconductor refrigeration air water taking cup as claimed in claim 4, wherein the bottom of the cup body (10) is connected with a cup base (11), a cup base electric switch (12), a power cord (13) and a power output jack (14) are arranged on the cup base (11), and a cup handle (16) is arranged on the cup body (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121464678.7U CN215166093U (en) | 2021-06-30 | 2021-06-30 | Semiconductor refrigeration air water taking cup |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121464678.7U CN215166093U (en) | 2021-06-30 | 2021-06-30 | Semiconductor refrigeration air water taking cup |
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| Publication Number | Publication Date |
|---|---|
| CN215166093U true CN215166093U (en) | 2021-12-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121464678.7U Active CN215166093U (en) | 2021-06-30 | 2021-06-30 | Semiconductor refrigeration air water taking cup |
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| CN (1) | CN215166093U (en) |
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2021
- 2021-06-30 CN CN202121464678.7U patent/CN215166093U/en active Active
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