CN215121333U - Modular circuit board and electronic equipment - Google Patents
Modular circuit board and electronic equipment Download PDFInfo
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- CN215121333U CN215121333U CN202121614635.2U CN202121614635U CN215121333U CN 215121333 U CN215121333 U CN 215121333U CN 202121614635 U CN202121614635 U CN 202121614635U CN 215121333 U CN215121333 U CN 215121333U
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- 239000000758 substrate Substances 0.000 claims abstract description 107
- 238000004891 communication Methods 0.000 claims description 39
- 238000012423 maintenance Methods 0.000 abstract description 8
- 230000008859 change Effects 0.000 description 7
- 230000006978 adaptation Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004146 energy storage Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
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- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The utility model provides a modular circuit board and an electronic device, relating to the technical field of electronic circuits, wherein the modular circuit board comprises a main circuit substrate and a sub-circuit substrate; the main circuit module may be used to mount the main circuit module, and the sub circuit substrate is used to mount the sub circuit module; when the sub-circuit substrate is matched and connected with the main circuit substrate, the sub-circuit module is connected with the main circuit module, the circuit substrate is provided with a modularized circuit, so that the sub-circuit module can be easily replaced, the maintenance cost is reduced, when the sub-circuit module needs to be replaced, only the corresponding sub-circuit substrate needs to be replaced, the whole substrate does not need to be replaced, and the maintenance cost is reduced; meanwhile, the sub-circuit substrate and the main circuit substrate are fixed in a connection mode, so that the circuit board can be adapted to various different sub-circuit modules.
Description
Technical Field
The utility model relates to an electronic circuit field particularly, relates to a modularization circuit board and electronic equipment.
Background
Many devices are equipped with a wireless communication module, such as a WIFI module or a bluetooth module. The energy storage power supply also needs a wireless communication module to communicate if intelligent terminal control is realized. Conventional wireless communication modules are typically soldered directly to a circuit board, such as a display circuit board in a mobile power supply. Because wireless communication module all sets up on same piece base plate with other circuits, when needing to change original wireless communication module, need change whole display circuit board in step and lead to the cost higher, still need redesign circuit to match this wireless communication module sometimes, the maintenance cost of this kind of scheme is higher.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a modularization circuit board and electronic equipment to improve the higher problem of current equipment maintenance cost.
The utility model provides a technical scheme as follows:
in a first aspect, the present invention provides a modular circuit board for connecting a main circuit module and a sub-circuit module, the modular circuit board comprising a main circuit substrate and a sub-circuit substrate;
the main circuit substrate is used for arranging the main circuit module, a first pin group is arranged on the main circuit substrate, the main circuit module comprises a plurality of first connecting terminals, and the first connecting terminals are connected with the first pin group;
the sub-circuit substrate is used for arranging the sub-circuit module, a second pin group is arranged on the sub-circuit substrate, the sub-circuit module comprises a plurality of second connecting terminals, and the second connecting terminals are connected with the second pin group;
the second pin group is matched and connected with the first pin group to realize the connection of the sub-circuit module and the main circuit module.
In an alternative embodiment, the first pin group includes two pairs of transceiving data pins, a software reset signal output pin, a hardware reset signal output pin, a ground pin, and a power pin;
the second pin group corresponds to the first pin group and comprises two pairs of data receiving and transmitting pins, a software reset signal receiving pin, a hardware reset signal receiving pin, a grounding pin and a power supply pin;
and each pin of the second pin group is correspondingly connected with each pin of the first pin group one by one.
In an alternative embodiment, an area on the main circuit substrate corresponding to the sub circuit substrate is a hollow area; the area of the hollow-out area is smaller than that of the sub-circuit substrate.
In an alternative embodiment, one of the first lead group and the second lead group is a plug-in slot, and the other is a plug-in unit.
In an alternative embodiment, the area of the sub circuit substrate is smaller than the area of the main circuit substrate.
In an alternative embodiment, the sub-circuit module comprises a wireless communication module.
In a second aspect, the present invention provides an electronic device, comprising a main circuit module, a sub-circuit module and a modular circuit board as described in any of the previous embodiments, wherein the modular circuit board comprises a main circuit substrate and a sub-circuit substrate.
In an alternative embodiment, the sub-circuit module further comprises a plurality of third connection terminals for connecting with the wireless communication module.
In an optional embodiment, the sub-circuit substrate is further provided with a driving circuit, and the driving circuit is connected with the wireless communication module to realize adaptation and driving of the wireless communication module.
In an optional embodiment, a status indicator lamp is further disposed on the main circuit substrate, and the status indicator lamp is used for indicating a connection status of the main circuit module and the sub circuit module.
The utility model provides a modular circuit board and electronic equipment's beneficial effect is:
the utility model provides a modularization circuit board and electronic equipment, the modularization circuit board includes mainline base plate and sub-circuit base plate, main circuit module sets up on mainline base plate, main circuit module's first connecting terminal and mainline base plate's first pin group link, sub-circuit module sets up on sub-circuit base plate, sub-circuit module's second connecting terminal and sub-circuit base plate's second pin group link, thereby second pin group and first group pin join in marriage to be connected and realize sub-circuit module and main circuit module's being connected, through setting up modular sub-circuit module on from circuit base plate, can easily change, reduce the maintenance cost.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a modular circuit board provided in an embodiment of the present invention;
fig. 2 is a schematic view of a main circuit substrate according to an embodiment of the present invention;
fig. 3 is a schematic view of a sub-circuit substrate according to an embodiment of the present invention;
fig. 4 is the embodiment of the utility model provides a schematic diagram of WIFI module.
Icon: 100-a modular wiring board; 110-a main line substrate; 111-a first pin group; 120-main circuit module; 130-sub-circuit substrate; 131-a second pin group; 140-sub-circuit module.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, or orientations or positional relationships that are conventionally placed when the products of the present invention are used, or orientations or positional relationships that are conventionally understood by those skilled in the art, and are merely for convenience of description of the present invention and for simplicity of description, and do not indicate or imply that the equipment or components that are referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
With the development of technologies such as the internet of things, most of devices can realize remote interconnection at present, and therefore wireless communication modules, such as WIFI modules or bluetooth modules, are required to be configured in the devices. The energy storage power supply also needs a wireless communication module to communicate if intelligent terminal control is realized. Conventional wireless communication modules are typically soldered directly to a circuit board, such as a display circuit board in a mobile power supply. Because the output pins of different wireless communication modules and the corresponding driving circuits are arranged differently, when the original wireless communication module needs to be replaced, the whole display circuit board needs to be replaced synchronously, and the circuit needs to be redesigned to match the wireless communication module. This solution is costly to maintain and is not compatible with different types of wireless communication modules.
In view of this, the utility model provides a novel modularization circuit board to reduce current equipment maintenance and repair's cost, improve the compatibility to different wireless communication modules.
Referring to fig. 1, fig. 1 shows a modular circuit board 100 provided in the present embodiment, in which the modular circuit board 100 provided in the present embodiment includes a main circuit substrate 110 and a sub circuit substrate 130, and the main circuit module 120 and the sub circuit module 140 are connected through the main circuit substrate 110 and the sub circuit substrate 130.
The main circuit board 110 is used for installing the main circuit module 120, and the sub circuit board 130 is used for installing the sub circuit module 140. The sub-circuit module 140 may be a circuit module for implementing a specific function, for example, the sub-circuit module 140 may be a module for implementing a communication function, and the sub-circuit module 140 may include a wireless communication module, such as a WIFI module, a bluetooth module, a GPRS module, and the like. Alternatively, a module for implementing a specific function, such as a wireless communication module, may be connected to the sub-circuit module 140, and further connected to the main circuit module 120 through the sub-circuit module 140.
The main circuit module 120 is disposed on the main circuit substrate 110, the sub circuit module 140 is disposed on the sub circuit substrate 130, and when the sub circuit substrate 130 is assembled with the main circuit substrate 110, the sub circuit module 140 is connected to the main circuit module 120.
In the modular circuit board 100 provided by this embodiment, the independent sub-circuit module 140 is disposed on the sub-circuit substrate 130, so that once some functional modules are failed or damaged, the sub-circuit substrate 130 can be directly replaced without replacing the whole circuit board, thereby reducing the maintenance cost. On the other hand, different sub-circuit modules 140 may be disposed on the sub-circuit substrate 130, so that the compatibility of the whole system with different sub-circuit modules 140 may be increased.
In order to reduce the overall cost, in an alternative embodiment, the sub circuit substrate 130 may be connected to the main circuit substrate 110 through a specific connection manner, for example, a first pin group 111 is disposed on the main circuit substrate 110, and the main circuit module 120 includes a plurality of first connection terminals (not shown) connected to the first pin group 111; that is, the plurality of connection terminals of the main circuit module are present as the first pin group 111 on the main circuit substrate 110, and in a possible embodiment, the first connection terminals are connected to the first pin group 111 by printing, soldering, or the like, and the connection between the sub circuit module 140 and the main circuit module 120 can be achieved by simply connecting the corresponding connection terminals of the sub circuit module 140 to the first pin group 111.
For example, the sub-circuit module 140 is disposed on the sub-circuit substrate 130, the sub-circuit substrate 130 is disposed with a second pin group 131, the second pin group 131 corresponds to the first pin group 111, and the sub-circuit module 140 includes a plurality of second connection terminals (not shown), and the second connection terminals are connected to the second pin group 131; when the second pin group 131 of the sub-circuit substrate 130 is connected to the first pin group 111 of the main circuit substrate 110, the sub-circuit module 140 is connected to the main circuit module 120.
In some possible embodiments, the first pin group 111 includes two pairs of transceiving data pins, a software reset signal output pin, a hardware reset signal output pin, a ground pin, and a power pin. The two pairs of data transceiving pins are used for transmitting and receiving data to and from the sub-circuit module 140, each pair of data transceiving pins includes a data transmitting pin and a data receiving pin, and the data transmitting pin is used for outputting data or signals of the main circuit module 120 to the sub-circuit module 140; the data receiving pin is used for receiving data or signals transmitted by the sub-circuit module 140; the software reset signal output pin is used for outputting a software control signal for resetting the sub-circuit module 140 to the sub-circuit module 140, namely a reset signal sent by a control unit in the main circuit module 120; the hardware reset signal output pin is used for outputting a reset hardware control signal to the sub-circuit module 140, for example, a hardware reset signal generated by pressing a reset key by a user, and the power pin is used for supplying power to the sub-circuit module 140.
Corresponding to the first pin group 111, the second pin group 131 also includes two pairs of data receiving and transmitting pins, a software reset signal receiving pin, a hardware reset signal receiving pin, a ground pin, and a power pin, and functions of the pins correspond to functions of the pins of the first pin group 111, and this embodiment will not be described in detail.
The second lead group 131 and the first lead group 111 can be connected in a matching manner in many ways, for example, the first lead group 111 and the second lead group 131 are connected in a conventional manner (as shown in fig. 1), that is, by welding, in some other possible embodiments, one of the first lead group 111 and the second lead group 131 is a socket, and the other is a connector, and the two can be connected by plugging.
It should be noted that the second pin group 131 is matched with the first pin group 111, so as to ensure the fit connection of the sub circuit substrate 130 and the main circuit substrate 110, and the number of the first pin group 111 and the second pin group 131 should be ensured to be not less than the number of pins required for realizing the connection of the main circuit module 120 and the sub circuit module 140.
The sub circuit module 140 is disposed on the sub circuit substrate 130, and in an alternative embodiment, the area of the sub circuit substrate 130 is smaller than that of the main circuit substrate 110, thereby reducing the cost of replacing the sub circuit module 140 or the sub circuit substrate 130.
In some possible implementations, the sub-circuit module 140 itself may include a corresponding functional module, such as a wireless communication module, and in other possible implementations, the sub-circuit module 140 does not include a functional module such as a wireless communication module, but is connected to the corresponding functional module through a reserved connection terminal, for example, the sub-circuit module 140 includes a plurality of third connection terminals, a third pin group is disposed on the sub-circuit substrate 130 corresponding to the third connection terminals, and the wireless communication module is connected through the third connection terminals — the third pin group.
In addition, since some of the sub-circuit modules 140 need corresponding peripheral circuits, such as a driving circuit, to cooperate with each other to implement their functions, in some possible embodiments, the sub-circuit substrate 130 needs to carry the sub-circuit module 140, and also needs a driving circuit (not shown) carrying the sub-circuit module 140, taking a wireless communication module as an example, the driving circuit is connected to the wireless communication module to implement the function of wireless communication.
A specific connection manner of the sub circuit board 130 and the main circuit board 110 provided in this embodiment is described below by taking a wireless communication module as an example.
In some possible embodiments, as shown in fig. 2, the first pin group 111 on the main circuit substrate 110 includes 8 pins, and correspondingly, as shown in fig. 3, the second pin group 131 on the sub circuit substrate 130 also includes 8 pins, and then the connection terminals of the main circuit module 120 are connected to the connection terminals corresponding to the wireless communication module through the connection between the second pin group 131 and the first pin group 111.
In the present embodiment, the 8 pins of the first pin group 111 on the main circuit substrate 110 are fixed, and the relative positions and arrangement between the pins are fixed. Therefore, the sub-circuit substrate 130 needs to be laid out and routed according to the main circuit substrate 110 and the positions of the pins on the wireless communication modules, so as to achieve the purpose of adapting to different wireless communication modules, and the sub-circuit substrate 130 is further provided with a peripheral circuit for adapting to the wireless communication modules.
In other embodiments, the sub-circuit substrate 130 may also perform a wiring design according to the specific function of the sub-circuit module 140 to be carried, and compared with the conventional device that needs to redesign the whole circuit board, the modular circuit board 100 provided in this embodiment only needs to redesign or replace a part of the circuit board, that is, the sub-circuit substrate 130, so that the overall cost of the system can be reduced.
Fig. 3 is a schematic view of the sub-circuit substrate 130 provided in this embodiment, for example, the sub-circuit module 140 carried by the sub-circuit substrate 130 is a WIFI module, and fig. 4 shows a schematic view of the WIFI module provided in this embodiment, and corresponding to the WIFI module, two pairs of data signal receiving and transmitting pins are provided on the sub-circuit substrate 130 (corresponding pins are also provided on the main circuit substrate 110 and are connected thereto in a one-to-one correspondence), where WIFI-RX1-PD is used to receive a data signal output by the main circuit module 120 on the main circuit substrate 110, WIFI-TX1-PD is used to transmit the data signal output by the WIFI module to the main circuit module 120 on the main circuit substrate 110, and WIFI-RX0-PD and wiififi-TX 0-PD are another pair of data signal receiving and transmitting pins. The WIFI RST pin is configured to receive a software reset signal (that is, sent by the control module on the main line substrate 110) for resetting the WIFI module, and WIFI RESET is configured to receive a hardware reset signal for resetting the WIFI module, where the control signal may be generally transmitted to the WIFI module by a user operating a mechanical key directly. GND represents the ground pin and 3V3-IoT represents the power pin.
Usually, the area of the sub-circuit substrate 130 needs to be larger than that of the WIFI module, and a certain area needs to be reserved to arrange a driving circuit, and the driving circuit is used for adapting and driving the WIFI module.
In a possible embodiment, the main circuit substrate 110 is hollowed out at a position corresponding to the sub circuit substrate 130 to form a hollowed-out area, the area of the hollowed-out area is smaller than the area of the sub circuit substrate 130, and when the sub circuit substrate 130 is connected to the main circuit substrate 110 in a matching manner, the hollowed-out area disposed on the main circuit substrate 110 can be used to better ventilate and dissipate heat of the sub circuit substrate 130 and peripheral circuits such as the sub circuit module 140 and the driving circuit disposed on the sub circuit substrate 130.
The positions of the 8 pins on the main circuit board 110 may be respectively disposed on different sides of the sub circuit board 130, or may be disposed on the same side. In this embodiment, the power pin, the ground pin, and the RESET pin are disposed on one side, and the other pins are disposed on the opposite side.
Based on the modular circuit board 100 provided in the foregoing embodiment, the present invention further provides an electronic device (not shown), which includes a main circuit module, a sub-circuit module and the modular circuit board provided in the foregoing embodiment. The modularized circuit board comprises a main circuit substrate and a sub-circuit substrate, wherein the main circuit module is arranged on the main circuit substrate, the sub-circuit module is arranged on the sub-circuit substrate, and when the sub-circuit substrate is matched and connected with the main circuit substrate, the sub-circuit module is connected with the main circuit module.
In a possible implementation manner, the sub-circuit module further includes a plurality of third connection terminals, the third connection terminals are used for being connected with the wireless communication module, and a driving circuit is further disposed on the sub-circuit substrate and connected with the wireless communication module to achieve adaptation and driving of the wireless communication module.
In a possible implementation manner, a status indicator lamp is further disposed on the main circuit substrate, and the status indicator lamp is used for indicating a connection status of the main circuit module and the sub-circuit module. When the sub-circuit substrate is matched and connected with the main circuit substrate and the sub-circuit module is in a connection state with the main circuit module, the state indicating lamp can give out light indication.
To sum up, the utility model provides a modular circuit board and an electronic device, wherein the modular circuit board comprises a main circuit substrate and a sub circuit substrate; the main circuit base plate is used for setting up the main circuit module, the sub-circuit base plate is used for setting up the sub-circuit module, realize being connected of sub-circuit module and main circuit module when the sub-circuit base plate is connected with the main circuit base plate, this application can set up each sub-circuit modularization on the sub-circuit base plate, and is easy to change, and the maintenance cost is reduced, only need to change the sub-circuit base plate when needing to change the sub-circuit module, need not change whole base plate, and the sub-circuit base plate is fixed with the connected mode of main circuit base plate simultaneously, can the multiple different sub-circuit module of adaptation like this.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A modular circuit board is characterized in that the modular circuit board is used for realizing the connection of a main circuit module and a sub-circuit module, and comprises a main circuit substrate and a sub-circuit substrate;
the main circuit substrate is used for arranging the main circuit module, a first pin group is arranged on the main circuit substrate, the main circuit module comprises a plurality of first connecting terminals, and the first connecting terminals are connected with the first pin group;
the sub-circuit substrate is used for arranging the sub-circuit module, a second pin group is arranged on the sub-circuit substrate, the sub-circuit module comprises a plurality of second connecting terminals, and the second connecting terminals are connected with the second pin group;
the second pin group is matched and connected with the first pin group to realize the connection of the sub-circuit module and the main circuit module.
2. The modular wiring board of claim 1, wherein the first set of pins comprises two pairs of transceiving data pins, a software reset signal output pin, a hardware reset signal output pin, a ground pin, and a power pin;
the second pin group corresponds to the first pin group and comprises two pairs of data receiving and transmitting pins, a software reset signal receiving pin, a hardware reset signal receiving pin, a grounding pin and a power supply pin;
and each pin of the second pin group is correspondingly connected with each pin of the first pin group one by one.
3. The modular wiring board of claim 1, wherein the area of the main circuit substrate corresponding to the sub circuit substrate is a hollowed-out area; the area of the hollow-out area is smaller than that of the sub-circuit substrate.
4. The modular wiring board of claim 1, wherein one of the first pin set and the second pin set is a socket and the other is a connector.
5. The modular wiring board of claim 1, wherein the area of the sub-circuit substrate is smaller than the area of the main circuit substrate.
6. The modular wiring board of claim 1, wherein the sub-circuit module comprises a wireless communication module.
7. An electronic device, characterized in that the electronic device comprises a main circuit module, a sub-circuit module and a modular wiring board according to any one of claims 1 to 6; the modular circuit board comprises a main circuit substrate and a sub-circuit substrate.
8. The electronic device of claim 7, wherein the sub-circuit module further comprises a plurality of third connection terminals configured to connect with a wireless communication module.
9. The electronic device according to claim 8, wherein a driving circuit is further disposed on the sub-circuit substrate, and the driving circuit is connected to the wireless communication module to adapt to and drive the wireless communication module.
10. The electronic device according to claim 7, wherein a status indicator lamp is further disposed on the main circuit substrate, and the status indicator lamp is used to indicate a connection status of the main circuit module and the sub circuit module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121614635.2U CN215121333U (en) | 2021-07-15 | 2021-07-15 | Modular circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121614635.2U CN215121333U (en) | 2021-07-15 | 2021-07-15 | Modular circuit board and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215121333U true CN215121333U (en) | 2021-12-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121614635.2U Active CN215121333U (en) | 2021-07-15 | 2021-07-15 | Modular circuit board and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215121333U (en) |
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2021
- 2021-07-15 CN CN202121614635.2U patent/CN215121333U/en active Active
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Address after: 518000, 1st Floor, Building E, Jiehe Industrial City, Shuitian Community, Shiyan Street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Zhenghao Innovation Technology Co.,Ltd. Address before: 518100 A202, fangzheng science and Technology Industrial Park, north of Songbai highway, Longteng community, Shiyan street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Zhenghao Innovation Technology Co.,Ltd. |
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Address after: 518000 Factory Building 401, Runheng Industrial Plant 1, Fuyuan Road, Zhancheng Community, Fuhai Street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Zhenghao Innovation Technology Co.,Ltd. Country or region after: China Address before: 518000, 1st Floor, Building E, Jiehe Industrial City, Shuitian Community, Shiyan Street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Zhenghao Innovation Technology Co.,Ltd. Country or region before: China |