CN215121329U - Three-layer control circuit board structure - Google Patents
Three-layer control circuit board structure Download PDFInfo
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- CN215121329U CN215121329U CN202120620225.2U CN202120620225U CN215121329U CN 215121329 U CN215121329 U CN 215121329U CN 202120620225 U CN202120620225 U CN 202120620225U CN 215121329 U CN215121329 U CN 215121329U
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Abstract
The utility model discloses a three laminar control circuit board structures, including a display panel, a middle level power strip and a bottom power strip that from top to bottom superpose in proper order and set up, wherein, this display panel is as an organic whole with middle level power strip electric property grafting, and this middle level power strip is as an organic whole with bottom power strip electric property grafting. The utility model provides a three laminar control circuit board structures, whole area is little, and occupation space is few, does benefit to on installing the shell of corresponding equipment, then does benefit to equipment to miniaturized development, when being applied to the line controller on, need not to increase the shell size of line controller, can satisfy the requirement that line controller miniaturization, and shell size have been injectd.
Description
Technical Field
The utility model relates to a circuit board field especially relates to a three laminar control circuit board structures.
Background
With the gradual miniaturization of electronic equipment, the occupied space for installing the electronic equipment can be reduced, and the area of an internal circuit board is necessarily smaller so as to meet the size of the miniaturized electronic equipment.
For example, generally, a wired controller installed on a wall body is limited in the size of an outer shell and cannot be changed, only a double-sided PCB with a small area can be installed inside the wired controller, and all components of a schematic diagram cannot be installed on the double-sided PCB with the small area, so that the area of the double-sided PCB is inevitably increased, and the size of the outer shell of the wired controller is inevitably increased. Therefore, the demand for downsizing the line controller and for the limited size of the housing cannot be satisfied.
SUMMERY OF THE UTILITY MODEL
To the above-mentioned not enough, the utility model aims to provide a three laminar control circuit board structure, whole area is little, and occupation space is few, does benefit to on installing the shell of corresponding equipment, then does benefit to equipment to miniaturized development, when being applied to the line controller on, need not to increase the shell size of line controller, can satisfy the requirement that line controller miniaturization, and shell size have been injectd.
The utility model discloses a reach the technical scheme that above-mentioned purpose adopted and be:
a three-layer control circuit board structure is characterized by comprising a display board, a middle-layer power board and a bottom-layer power board which are sequentially stacked from top to bottom, wherein the display board and the middle-layer power board are electrically connected into a whole in an inserting mode, and the middle-layer power board and the bottom-layer power board are electrically connected into a whole in an inserting mode.
As a further improvement of the utility model, the middle-layer power supply board and the bottom power supply board are electrically connected with each other through a first pin header and a second pin header into a whole.
As a further improvement of the present invention, a power carrier communication circuit and a middle-layer voltage-reducing circuit are disposed on the middle-layer power board, and the bottom-layer power board inputs 220V voltage to the power carrier communication circuit through the first pin header group, and performs communication between the power carrier communication circuit and the terminal device; the bottom power panel inputs 12V voltage to the middle-layer voltage reduction circuit through the second pin header group, and the middle-layer voltage reduction circuit reduces the 12V voltage into 5V voltage.
As a further improvement of the utility model, be provided with a bottom step-down circuit on the bottom power strip, this bottom step-down circuit is 12V voltage with the 220V voltage step-down of input.
As a further improvement of the present invention, the first pin array comprises a first pin array and a first female pin array, one of the first pin array and the first female pin array is disposed on the surface of the bottom power board close to the middle power board and electrically connected to the live wire and the zero wire; the other one is arranged on the surface of the middle layer power supply board close to the bottom layer power supply board and is electrically connected to the power carrier communication circuit.
As a further improvement of the present invention, the second pin header group comprises a second pin header and a second pin header, one of the second pin header and the second pin header is disposed on the surface of the bottom power board close to the middle power board and electrically connected to the bottom voltage-reducing circuit; the other one is arranged on the surface of the middle layer power supply board close to the bottom layer power supply board and is electrically connected to the middle layer voltage reduction circuit.
As a further improvement of the utility model, the display panel and the middle power panel are electrically connected into a whole through a third pin group.
As a further improvement, the utility model is provided with a main control chip circuit on the display panel, the middle level power strip through the third row needle group to main control chip circuit input 5V voltage, and carry out serial communication with the main control chip circuit.
As a further improvement of the present invention, the third pin header group includes a third pin header and a third pin header, one of the third pin header and the third pin header is disposed on the surface of the middle power board close to the display panel and electrically connected to the power line carrier communication circuit and the middle voltage step-down circuit; the other one is arranged on the surface of the display panel close to the middle layer power supply board and is electrically connected to the main control chip circuit.
As a further improvement of the utility model, a digital screen display driving circuit, a touch key control circuit and a buzzer circuit are also arranged on the display panel.
The utility model has the advantages that: through with the vertical electrical property grafting of display panel, middle level power strip and bottom power strip three together, realize the electrical property intercommunication and the serial ports communication between 3 boards to constitute three-layer three-dimensional circuit board structure, can obviously reduce the width of whole circuit board structure, reduce the area of whole circuit board structure promptly, do benefit to on installing the shell of corresponding equipment with whole circuit board structure, reduce occupation space, do benefit to equipment to miniaturized development. For example, when the three-layer three-dimensional circuit board structure of the present embodiment is applied to a wire controller, the requirements of miniaturization of the wire controller and limitation of the size of the housing can be satisfied without increasing the size of the housing of the wire controller.
The above is an overview of the technical solution of the present invention, and the present invention is further explained with reference to the accompanying drawings and the detailed description.
Drawings
FIG. 1 is a sectional view of the overall structure of the present invention;
fig. 2 is a schematic diagram of a power line carrier communication circuit according to the present invention;
fig. 3 is a schematic diagram of a medium voltage conversion module according to the present invention;
fig. 4 is a schematic diagram of the middle level shift module of the present invention;
fig. 5 is a schematic diagram of the bottom voltage reduction circuit of the present invention;
fig. 6 is a schematic diagram of a first row of needles or a first row of nuts in a first row of needle sets according to the present invention;
FIG. 7 is a schematic diagram of a second row of needles or a second row of nuts in a second row of needle sets according to the present invention;
fig. 8 is a schematic diagram of a circuit of a main control chip of the present invention;
FIG. 9 is a schematic diagram of a third row of needles or a third row of nuts in a third row of needle sets according to the present invention;
FIG. 10 is a schematic diagram of a nixie tube according to the present invention;
fig. 11 is a schematic diagram of a digital screen driving circuit of the present invention;
fig. 12 is a schematic diagram of a touch key control circuit according to the present invention;
fig. 13 is a schematic diagram of the buzzer circuit of the present invention.
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the intended purpose, the following detailed description of the embodiments of the present invention is provided in conjunction with the accompanying drawings and preferred embodiments.
Referring to fig. 1, an embodiment of the present invention provides a three-layer control circuit board structure, which includes a display panel 1, a middle power panel 2 and a bottom power panel 3 stacked in sequence from top to bottom, wherein the display panel 1 and the middle power panel 2 are electrically connected to each other in an inserting manner, and the middle power panel 2 and the bottom power panel 3 are electrically connected to each other in an inserting manner. Through with display panel 1, middle level power strip 2 and 3 three vertical electrical property pegs graft together of bottom power strip, realize the electrical property intercommunication and the serial ports communication between 3 boards to constitute three-layer three-dimensional circuit board structure, can obviously reduce the width of whole circuit board structure, reduce the area of whole circuit board structure promptly, do benefit to on installing the shell of corresponding equipment with whole circuit board structure, reduce occupation space, do benefit to equipment to miniaturized development. For example, when the three-layer three-dimensional circuit board structure of the present embodiment is applied to a wire controller, the requirements of miniaturization of the wire controller and limitation of the size of the housing can be satisfied without increasing the size of the housing of the wire controller.
For the electrical connection manner between the middle power board 2 and the bottom power board 3, in this embodiment, the middle power board 2 and the bottom power board 3 are electrically connected to each other through a first pin header group 4 and a second pin header group 5.
In this embodiment, a power carrier communication circuit and a middle-layer voltage-reducing circuit are disposed on the middle-layer power board 2, and the bottom-layer power board 3 inputs 220V voltage to the power carrier communication circuit through the first pin header group 4, and performs communication between the power carrier communication circuit and the terminal device; the bottom power panel 3 inputs 12V voltage to the middle-layer voltage reduction circuit through the second pin header 5, and the middle-layer voltage reduction circuit reduces the 12V voltage into 5V voltage.
Specifically, as shown in fig. 2, which is a schematic diagram of a power carrier communication circuit, the IC1 is a power carrier module, and the power carrier module can implement communication with a power grid and an external terminal device. T1 is a coupling transformer, which functions to convert between strong and weak currents. Specifically, 220V voltage input to the power carrier communication circuit by the bottom power panel 3 through the first pin header group 4 is converted from 220V strong current to weak current by the coupling transformer, and then power is supplied to the power carrier module; otherwise, the weak current communication signal output by the power carrier module is converted into a strong current communication signal, and then the strong current communication signal is used for controlling the external terminal equipment. Therefore, the coupling transformer plays a role in isolation, can effectively prevent each component in the circuit from being burnt out, and ensures the safety of the circuit.
Specifically, as shown in fig. 3 and 4, the middle-layer voltage-reducing circuit is a schematic diagram of the middle-layer voltage-reducing circuit, and the middle-layer voltage-reducing circuit mainly includes a voltage conversion module and a level conversion module, and is configured to reduce the 12V voltage input to the middle-layer voltage-reducing circuit by the bottom power board 3 through the second pin header group 5 to a 5V voltage.
In this embodiment, a bottom voltage-reducing circuit is disposed on the bottom power board 3, specifically, as shown in fig. 5, which is a schematic diagram of the bottom voltage-reducing circuit, the bottom voltage-reducing circuit reduces an input 220V voltage to a 12V voltage, so that the bottom power board 3 inputs the 12V voltage to the middle voltage-reducing circuit through the second pin array 5.
As for the arrangement mode of the first pin row group 4 between the middle layer power supply board 2 and the bottom layer power supply board 3, specifically, the first pin row group 4 comprises a first pin row and a first pin row, and one of the first pin row and the first pin row is arranged on the surface of the bottom layer power supply board 3 close to the middle layer power supply board 2 and is electrically connected to the live wire and the zero wire; the other is arranged on the surface of the middle power supply board 2 close to the bottom power supply board 3 and is electrically connected to the power carrier communication circuit.
Specifically, as shown in fig. 6, a schematic diagram of a first row of needles or a first row of nuts of the first row of needle group 4 is shown, that is, the schematic diagram of the first row of needles and the first row of nuts are the same as that of fig. 6. As shown in fig. 5 and 6, the first row of pins or the first row of nuts disposed on the bottom power board 3 are connected to the live line L end and the neutral line N end of the bottom step-down circuit; as shown in fig. 2 and fig. 6, the first row of pins or the first row of bus bars disposed on the middle layer power board 2 are connected to the live line L end and the zero line N end of the power carrier communication circuit.
When the power carrier communication circuit is specifically installed and connected, the middle-layer power panel 2 and the bottom-layer power panel 3 can be electrically connected by oppositely inserting the first row of pins and the first row of nuts, so that 220V voltage is input to the power carrier communication circuit of the middle-layer power panel 2 by the bottom voltage reduction circuit of the bottom-layer power panel 3, and communication between a power carrier module in the power carrier communication circuit and terminal equipment is carried out.
As for the arrangement manner of the second pin header group 5 between the middle layer power supply board 2 and the bottom layer power supply board 3, specifically, the second pin header group 5 includes a second pin header and a second mother header, one of the second pin header and the second mother header is arranged on the surface of the bottom layer power supply board 3 close to the middle layer power supply board 2 and is electrically connected to the bottom layer step-down circuit; the other is arranged on the surface of the middle layer power supply board 2 close to the bottom layer power supply board 3 and is electrically connected to the middle layer voltage reduction circuit.
Specifically, as shown in fig. 7, a schematic diagram of a second row of needles or a second row of mother needles of the second row of needle group 5 is shown, that is, the schematic diagram of the second row of needles and the second row of mother needles are the same as those shown in fig. 7. As shown in fig. 5 and 7, the second pin or the second bus disposed on the bottom power board 3 is connected to the output terminal of the bottom voltage-dropping circuit; as shown in fig. 3 and 7, the second row of pins or the second row of bus bars disposed on the middle power board 2 are connected to the input end of the voltage conversion module of the middle voltage-reducing circuit.
When the power supply board is installed and connected specifically, the second row pins and the second row bus bar are inserted, so that the middle-layer power supply board 2 and the bottom-layer power supply board 3 can be electrically connected, and therefore the bottom-layer voltage reduction circuit of the bottom-layer power supply board 3 inputs 12V voltage to the middle-layer voltage reduction circuit of the middle-layer power supply board 2.
For the electrical connection manner between the display panel 1 and the middle power panel 2, the display panel 1 and the middle power panel 2 are electrically connected together by a third pin header 6.
In this embodiment, a main control chip circuit is disposed on the display panel 1, specifically, as shown in fig. 8, which is a schematic diagram of the main control chip circuit, and the IC2 is a main chip. The middle-layer power panel 2 inputs 5V voltage to the main chip of the main control chip circuit through the third pin header 6 and carries out serial port communication with the main chip of the main control chip circuit, so that data of the power carrier module is transmitted to the main chip for processing.
As for the arrangement manner of the third pin header group 6 between the display panel 1 and the middle power supply panel 2, specifically, the third pin header group 6 includes a third pin header and a third mother header, one of the third pin header and the third mother header is arranged on the surface of the middle power supply panel 2 close to the display panel 1 and is electrically connected to the power carrier communication circuit and the middle voltage step-down circuit; the other is disposed on the surface of the display panel 1 near the middle layer power panel 2 and electrically connected to the main control chip circuit.
Specifically, as shown in fig. 9, a schematic diagram of a third row of needles or a third row of mother needles of the third row of needles 6 is shown, that is, the schematic diagram of the third row of needles and the third row of mother needles are the same as that of fig. 9. As shown in fig. 2, 4 and 9, the third row of pins or the third row of bus bars disposed on the middle layer power panel 2 are respectively connected to the RST pin of the power carrier module in the power carrier communication circuit and the MCU-TXD and MCU-RXD ends of the level shifter module in the middle layer voltage-reducing circuit; as shown in fig. 8 and 9, the third row of pins or the third row of bus disposed on the display panel 1 is connected to the TX pin, the RX pin and the RST pin of the main control chip in the main control chip circuit.
When the display panel is specifically installed and connected, the display panel 1 and the middle power supply board 2 can be electrically connected by oppositely inserting the third row pins and the third row bus, so that the middle voltage reduction circuit on the middle power supply board 2 inputs 5V voltage to the main chip of the main control chip circuit on the display panel 1 and performs serial port communication with the main chip of the main control chip circuit.
In this embodiment, a digital screen display driving circuit, a touch key control circuit and a buzzer circuit are further disposed on the display panel 1. As shown in fig. 10 and fig. 11, which are schematic diagrams of a digital screen display driving circuit, the IC3 is an LED display driving chip for driving the brightness display of the nixie tube, and a plurality of resistors on the periphery are used for adjusting the brightness of the nixie tube. As shown in fig. 12, the schematic diagram of a touch key control circuit is used to control a touch key. As shown in fig. 13, is a schematic diagram of a buzzer circuit for driving a buzzer.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that other structures obtained by adopting the same or similar technical features as the above embodiments of the present invention are all within the protection scope of the present invention.
Claims (10)
1. A three-layer control circuit board structure is characterized by comprising a display board, a middle-layer power board and a bottom-layer power board which are sequentially stacked from top to bottom, wherein the display board and the middle-layer power board are electrically connected into a whole in an inserting mode, and the middle-layer power board and the bottom-layer power board are electrically connected into a whole in an inserting mode.
2. The structure of a three-layer control circuit board according to claim 1, wherein the middle power board and the bottom power board are electrically connected to each other through a first pin array and a second pin array.
3. The three-layer control circuit board structure of claim 2, wherein a power carrier communication circuit and a middle voltage-reducing circuit are disposed on the middle power board, and the bottom power board inputs 220V voltage to the power carrier communication circuit through the first pin array and performs communication between the power carrier communication circuit and the terminal device; the bottom power panel inputs 12V voltage to the middle-layer voltage reduction circuit through the second pin header group, and the middle-layer voltage reduction circuit reduces the 12V voltage into 5V voltage.
4. The three-layer control circuit board structure of claim 3, wherein a bottom voltage-reducing circuit is disposed on the bottom power board, and the bottom voltage-reducing circuit reduces the input 220V voltage to 12V voltage.
5. The three-layer control circuit board structure of claim 3, wherein the first pin array comprises a first pin array and a first female pin array, one of the first pin array and the first female pin array is disposed on the surface of the bottom power board close to the middle power board and electrically connected to the live wire and the neutral wire; the other one is arranged on the surface of the middle layer power supply board close to the bottom layer power supply board and is electrically connected to the power carrier communication circuit.
6. The three-layer control circuit board structure of claim 4, wherein the second pin array comprises a second pin array and a second mother array, one of the second pin array and the second mother array is disposed on the surface of the bottom power board close to the middle power board and electrically connected to the bottom voltage-dropping circuit; the other one is arranged on the surface of the middle layer power supply board close to the bottom layer power supply board and is electrically connected to the middle layer voltage reduction circuit.
7. The structure of a three-layer control circuit board according to claim 3, wherein the display board and the middle power board are electrically connected to each other through a third pin array.
8. The three-layer control circuit board structure of claim 7, wherein a main control chip circuit is disposed on the display board, and the middle layer power board inputs 5V voltage to the main control chip circuit through the third pin array and performs serial communication with the main control chip circuit.
9. The structure of a three-layer control circuit board according to claim 8, wherein the third pin array comprises a third pin array and a third mother board, one of the third pin array and the third mother board is disposed on the surface of the middle power board close to the display panel and electrically connected to the power carrier communication circuit and the middle voltage dropping circuit; the other one is arranged on the surface of the display panel close to the middle layer power supply board and is electrically connected to the main control chip circuit.
10. The three-layer control circuit board structure of claim 8, wherein a digital screen display driving circuit, a touch key control circuit and a buzzer circuit are further disposed on the display panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120620225.2U CN215121329U (en) | 2021-03-26 | 2021-03-26 | Three-layer control circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120620225.2U CN215121329U (en) | 2021-03-26 | 2021-03-26 | Three-layer control circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215121329U true CN215121329U (en) | 2021-12-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120620225.2U Active CN215121329U (en) | 2021-03-26 | 2021-03-26 | Three-layer control circuit board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215121329U (en) |
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2021
- 2021-03-26 CN CN202120620225.2U patent/CN215121329U/en active Active
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