CN215118873U

CN215118873U - Chip packaging box structure

Info

Publication number: CN215118873U
Application number: CN202121438413.XU
Authority: CN
Inventors: 龚有高
Original assignee: Suzhou Shateka Casting Co ltd
Current assignee: Suzhou Shateka Foundry Co.,Ltd.
Priority date: 2021-06-28
Filing date: 2021-06-28
Publication date: 2021-12-10
Anticipated expiration: 2031-06-28

Abstract

The utility model discloses a chip packaging box structure belongs to chip package technical field, and it includes box body and lid, install the backup pad in the box body, be connected with the positioning seat in the backup pad, the chip place in the positioning seat, the chip all laminates everywhere with the positioning seat lateral wall, a plurality of constant head tanks have been seted up in the backup pad, the positioning seat bottom is provided with a plurality of connecting pieces, the twice of connecting piece, every are no less than to the quantity of constant head tank the connecting piece corresponds pegs graft in one in the spread groove, be connected for dismantling between constant head tank and the connecting piece. The utility model discloses but have one set of packaging box adaptation multiple chip to effective reduction in production cost's effect.

Description

Chip packaging box structure

Technical Field

The utility model relates to a chip package technical field, in particular to chip packaging box structure.

Background

The package for mounting a semiconductor integrated circuit chip plays a role in mounting, fixing, sealing, protecting the chip and enhancing the electrothermal property, and the package plays an important role in a CPU and other LSI integrated circuits. The current chinese patent that publication number is CN211376621U discloses a Lowk chip packaging mechanism, including encapsulation box and encapsulation lid, equidistant fixedly connected with a plurality of first springs, a plurality of on the inner diapire of encapsulation box the top fixed mounting of first spring has the support box, and supports the box and set up for no top cap, support the chip main part that the inside of box set up, the top of chip main part is provided with the location arch, the encapsulation lid is detachable with the encapsulation box and is connected, the bottom interval of encapsulation lid is provided with the vertical second spring of a plurality of, the lower extreme of second spring is fixed with the briquetting, the bottom surface of briquetting is supported and is pressed the top surface at chip main part.

The above prior art has the following problems: the supporting box is fixedly arranged in the packaging box through the first spring, when the size of a chip to be packaged changes, the packaging box with other sizes needs to be replaced, the cost is increased, and the problem needs to be solved urgently.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art exists, the utility model aims to provide a chip packaging box structure has one set of packaging box multiple chip of adaptation to effective reduction in production cost's effect.

The utility model provides a chip packaging box structure, includes box body and lid, install the backup pad in the box body, be connected with the positioning seat in the backup pad, the chip place in the positioning seat, the chip all laminate everywhere with the positioning seat lateral wall everywhere, a plurality of constant head tanks have been seted up in the backup pad, the positioning seat bottom is provided with a plurality of connecting pieces, the twice of connecting piece is no less than to the quantity of constant head tank, every the connecting piece correspond peg graft in one in the constant head tank, be connected for dismantling between constant head tank and the connecting piece.

The utility model discloses further set up to: the positioning seat comprises a first seat body, a second seat body and a third seat body, the lengths and the widths of the first seat body, the second seat body and the third seat body are different, the connecting piece comprises a first connecting column, a second connecting column and a third connecting column, the first connecting column is arranged on the bottom wall of the first seat body, the second connecting column is arranged on the bottom wall of the second seat body, and the third connecting column is arranged on the bottom wall of the third seat body;

the positioning groove comprises a first groove body, a second groove body and a third groove body, each first connecting column is correspondingly inserted into one first groove body, each second connecting column is correspondingly inserted into one second groove body, and each third connecting column is correspondingly inserted into one third groove body.

The utility model discloses further set up to: the supporting plate is connected with the bottom wall of the box body through the shock absorption seat, the shock absorption seat is arranged to be an elastic piece, a cavity is formed inside the shock absorption seat, and the side wall of the shock absorption seat is provided with a folding portion.

The utility model discloses further set up to: the upper side and the lower side of the shock absorption seat are both connected with mounting plates, and the mounting plates are connected with the box body and the supporting plate through bolts.

The utility model discloses further set up to: the shock absorption seat is arranged to be a rubber piece, the cover body is connected with a pressing plate through a spring, and the pressing plate is attached to the upper surface of the chip.

The utility model discloses further set up to: the cover body is provided with a plurality of buckles at the joint of the cover body and the box body, and a plurality of friction reducing pads are arranged at the contact part of the positioning seat and the chip.

When the positioning seat is used, positioning seats with different sizes are installed on the supporting plate according to requirements, each first connecting column is inserted into one first groove body when the first seat body is installed on the supporting plate, each second connecting column is inserted into one second groove body when the second seat body is installed on the supporting plate, each third connecting column is inserted into one third groove body when the third seat body is installed on the supporting plate, and the chips with adaptive shapes are placed in the first seat body, the second seat body or the third seat body. Then with the lid lock on the box body, fixed through the buckle, set up to the shock attenuation seat and the spring of rubber spare have better buffering effect when can carry out good location to the chip, be difficult for damaging the chip.

To sum up, the utility model discloses following beneficial effect has:

1. the positioning seat detachably connected to the supporting plate can be replaced according to different sizes of the chip, so that more packaging requirements are met;

2. through the design of the cavity formed in the positioning seat and the rubber material, the chip can be effectively buffered;

3. through the antifriction pad of connecting on the positioning seat, can further reduce the risk of chip surface fish tail.

Drawings

Fig. 1 is a schematic structural diagram for embodying the whole of the present invention;

fig. 2 is a schematic view of the present invention for embodying the supporting plate;

fig. 3 is an enlarged view of a portion a in fig. 1.

In the figure, 1, a box body; 11. a support plate; 12. positioning a groove; 121. a first tank body; 122. a second tank body; 123. a third tank body; 2. a cover body; 21. buckling; 22. a spring; 23. pressing a plate; 3. positioning seats; 31. a connecting member; 32. a friction reducing pad; 33. a bolt; 34. a shock absorbing seat; 341. a cavity; 342. a folding part; 343. mounting a plate; 4. and (3) a chip.

Detailed Description

The present invention will be described in detail with reference to the attached drawings, and other advantages and effects of the present invention can be easily understood by those skilled in the art from the disclosure of the present specification. In the present specification, the terms "upper", "lower", "left", "right", "middle", and the like are used for the sake of clarity, and are not intended to limit the scope of the present invention, and changes or adjustments of the relative relationship thereof are also regarded as the scope of the present invention without substantial changes in the technical content.

Example (b):

as shown in fig. 1 to fig. 3, for the utility model discloses a 4 encapsulation box structures on chip that design in, including box body 1 and lid 2, install backup pad 11 in the box body 1, be connected with positioning seat 3 in the backup pad 11, chip 4 is placed in positioning seat 3, chip 4 all laminates everywhere with 3 lateral walls of positioning seat everywhere, has seted up a plurality of constant head tanks 12 in the

backup pad

11, 3 bottoms of positioning seat are provided with a plurality of connecting pieces 31, the twice of connecting piece 31 is no less than to the quantity of constant head tank 12, every connecting piece 31 corresponds pegs graft in a constant head tank 12, be connected for dismantling between constant head tank 12 and the connecting piece 31.

As shown in fig. 2, the positioning seat 3 includes a first seat body, a second seat body and a third seat body, the lengths and widths of the first seat body, the second seat body and the third seat body are different, the connecting member 31 includes a first connecting column, a second connecting column and a third connecting column, the first connecting column is installed on the bottom wall of the first seat body, the second connecting column is installed on the bottom wall of the second seat body, and the third connecting column is installed on the bottom wall of the third seat body; the positioning slot 12 includes a first slot 121, a second slot 122 and a third slot 123, each first connecting column is correspondingly inserted into one first slot 121, each second connecting column is correspondingly inserted into one second slot 122, and each third connecting column is correspondingly inserted into one third slot 123.

As shown in fig. 1 to 3, the supporting plate 11 is connected to the bottom wall of the box body 1 through a damper seat 34, the damper seat 34 is an elastic member and has a cavity 341 formed therein, and a folding portion 342 is formed on a side wall of the damper seat 34. The upper side and the lower side of the shock absorption seat 34 are both connected with a mounting plate 343, and the mounting plate 343 is connected with the box body 1 and the support plate 11 through bolts 33. The shock absorption seat 34 is made of rubber, the cover 2 is connected with a pressing plate 23 through a spring 22, and the pressing plate 23 is attached to the upper surface of the chip 4. The cover body 2 is provided with a plurality of buckles 21 at the connection part with the box body 1, and a plurality of friction reducing pads 32 are arranged at the contact part with the chip 4 on the positioning seat 3.

The implementation principle of the above embodiment is as follows: when the positioning seat is used, the positioning seats 3 with different sizes are installed on the supporting plate 11 according to requirements, when the first seat body is installed on the supporting plate 11, each first connecting column is inserted into one first groove body 121, when the second seat body is installed on the supporting plate 11, each second connecting column is inserted into one second groove body 122, when the third seat body is installed on the supporting plate 11, each third connecting column is inserted into one third groove body 123, and the chips 4 with adaptive shapes are placed in the first seat body, the second seat body or the third seat body. Then with lid 2 lock on box body 1, fixed through buckle 21, set up to the cushion socket 34 and the spring 22 of rubber spare and can carry out better buffering effect when well fixing a position to chip 4, difficult damage chip 4.

The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications to the present embodiment without inventive contribution as required after reading the present specification, but all of them are protected by patent laws within the scope of the claims of the present invention.

Claims

1. A chip packaging box structure is characterized in that: including box body (1) and lid (2), install backup pad (11) in box body (1), be connected with positioning seat (3) on backup pad (11), chip (4) place in positioning seat (3), chip (4) all laminate everywhere with positioning seat (3) lateral wall, a plurality of constant head tanks (12) have been seted up on backup pad (11), positioning seat (3) bottom is provided with a plurality of connecting pieces (31), the twice of connecting piece (31) are no less than to the quantity of constant head tank (12), every connecting piece (31) correspond to peg graft in one in constant head tank (12), be connected for dismantling between constant head tank (12) and connecting piece (31).

2. The chip packaging box structure according to claim 1, wherein: the positioning seat (3) comprises a first seat body, a second seat body and a third seat body, the lengths and the widths of the first seat body, the second seat body and the third seat body are different, the connecting piece (31) comprises a first connecting column, a second connecting column and a third connecting column, the first connecting column is installed on the bottom wall of the first seat body, the second connecting column is installed on the bottom wall of the second seat body, and the third connecting column is installed on the bottom wall of the third seat body;

the positioning groove (12) comprises a first groove body (121), a second groove body (122) and a third groove body (123), each first connecting column is correspondingly inserted into one first groove body (121), each second connecting column is correspondingly inserted into one second groove body (122), and each third connecting column is correspondingly inserted into one third groove body (123).

3. A chip package box structure according to claim 2, wherein: the supporting plate (11) is connected with the bottom wall of the box body (1) through the shock absorption seat (34), the shock absorption seat (34) is arranged to be an elastic piece, a cavity (341) is formed inside the shock absorption seat, and a folding portion (342) is formed on the side wall of the shock absorption seat (34).

4. A chip package box structure according to claim 3, wherein: both sides all are connected with mounting panel (343) about shock attenuation seat (34), all link to each other through bolt (33) between mounting panel (343) and box body (1) and backup pad (11).

5. The chip packaging box structure according to claim 4, wherein: the shock absorption seat (34) is arranged to be a rubber piece, the cover body (2) is connected with a pressing plate (23) through a spring (22), and the pressing plate (23) is attached to the upper surface of the chip (4).

6. The chip packaging box structure according to claim 1, wherein: the cover body (2) is provided with a plurality of buckles (21) at the connection part with the box body (1), and a plurality of friction reducing pads (32) are arranged at the contact part with the chip (4) on the positioning seat (3).