CN215095710U - Wire control device ultrasonic welding mould - Google Patents
Wire control device ultrasonic welding mould Download PDFInfo
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- CN215095710U CN215095710U CN202121203820.2U CN202121203820U CN215095710U CN 215095710 U CN215095710 U CN 215095710U CN 202121203820 U CN202121203820 U CN 202121203820U CN 215095710 U CN215095710 U CN 215095710U
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- control device
- accommodating groove
- wire control
- wire
- storage tank
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Abstract
The utility model provides a drive-by-wire device ultrasonic bonding mould, including movable mould and cover half, seted up first storage tank on the movable mould, seted up the second storage tank on the cover half, first storage tank and second holding flute profile becomes the die cavity, and the shell setting of die cavity laminating drive-by-wire device, first trough has been seted up at the both ends that correspond first storage tank to the movable mould, and the second trough has been seted up at the both ends that correspond the second storage tank to the cover half, and first trough becomes line channel with second trough. The first accommodating groove and the second accommodating groove comprise: the wire control device comprises an arc surface attached to the outer side surface of the wire control device and two vertical surfaces which are respectively positioned at two ends of the arc surface and are vertical to the horizontal plane. The vertical surfaces are positioned at two sides of the routing channel. Therefore, when the ultrasonic welding is carried out, the upper shell and the lower shell of the line control device can be stressed uniformly, stress concentration can not be caused, bright prints can be prevented, the wiring channel is utilized, wires on the earphone line control device can be accommodated, and the wires are prevented from influencing connection of the upper shell and the lower shell.
Description
[ technical field ] A method for producing a semiconductor device
The utility model belongs to the technical field of the technique of mould and specifically relates to a drive-by-wire device ultrasonic bonding mould is related to.
[ background of the invention ]
As is well known, the battery assembly process and the casing of the drive-by-wire device of the sports bluetooth headset generally assemble the upper and lower casings together by means of ultrasonic or dispensing, and generally, when ultrasonic welding is adopted, the upper and lower casings are assembled together by matching with a mold. However, the ultrasonic mold of the existing Bluetooth headset wire control device has the advantages that the four end pins of the groove for placing the headset wire control device are right-angled with the bottom surface, when the wire control device is placed in the groove and welded through ultrasonic waves, the four end pins of the headset shell are suspended at the right-angled position, so that the stress of the shell is uneven, the stress is concentrated in the middle of the shell, the stress of the four end pins of the shell is small or is not stressed, bright prints appear, and the appearance surface of a product can be influenced by the bright prints to cause poor appearance.
Accordingly, the prior art is in need of improvement and development.
[ Utility model ] content
An object of the utility model is to provide a drive-by-wire device ultrasonic bonding mould for solve current casing and produce bright seal easily and cause the bad problem of casing outward appearance when utilizing ultrasonic die ultrasonic bonding.
The technical scheme of the utility model as follows: the ultrasonic welding die for the wire control device comprises a movable die and a fixed die, wherein a first accommodating groove is formed in the movable die, a second accommodating groove is formed in the fixed die, the first accommodating groove and the second accommodating groove form a cavity for accommodating the wire control device, the cavity is arranged in a manner of being attached to the shell of the wire control device, first wiring grooves are formed in the two ends, corresponding to the first accommodating groove, of the movable die, second wiring grooves are formed in the two ends, corresponding to the second accommodating groove, of the fixed die, and wiring channels for accommodating wires are formed by the first wiring grooves and the second wiring grooves;
the first accommodating groove and the second accommodating groove comprise: the wire control device comprises an arc surface attached to the outer side surface of the wire control device and two vertical surfaces which are respectively positioned at two ends of the arc surface and are vertical to a horizontal plane; the vertical surfaces are positioned on two sides of the routing channel.
Furthermore, a third accommodating groove is formed in the cavity at a position corresponding to a key on the wire control device.
Furthermore, the third accommodating groove is located on the arc surface, and the third accommodating groove is connected with the arc surface through an arc chamfer.
The beneficial effects of the utility model reside in that: compared with the prior art, the utility model discloses a die cavity inside wall laminating drive-by-wire dress design can be when ultrasonic bonding, under high frequency vibrations and pressure effect for the upper and lower shell atress of drive-by-wire device is even, can not produce stress concentration, prevents to produce bright seal. And utilize the line passageway of walking, can accomodate the wire rod on the earphone drive-by-wire device, prevent that the wire rod from influencing the connection of upper and lower casing.
[ description of the drawings ]
Fig. 1 is a perspective view of the present invention.
Fig. 2 is a structural diagram of the movable mold of the present invention.
Fig. 3 is a structural diagram of the fixed mold of the utility model.
Fig. 4 is a state reference diagram of the fixed mold cooperating with the wire control device.
[ detailed description ] embodiments
The present invention will be further described with reference to the accompanying drawings and embodiments.
Referring to fig. 1-4, an ultrasonic welding mold for a wire control device 30 according to an embodiment of the present invention is shown.
The ultrasonic welding mold for the wire control device 30 comprises a movable mold 10 and a fixed mold 20, wherein a first accommodating groove 11 is formed in the movable mold 10, a second accommodating groove 21 is formed in the fixed mold 20, a cavity (not shown) for accommodating the wire control device 30 is formed by the first accommodating groove 11 and the second accommodating groove 21, the cavity is attached to the shell of the wire control device 30, a first wiring groove 12 is formed in two ends, corresponding to the first accommodating groove 11, of the movable mold 10, a second wiring groove 22 is formed in two ends, corresponding to the second accommodating groove 21, of the fixed mold 20, and wiring channels (not shown) for accommodating wires are formed by the first wiring groove 12 and the second wiring groove 22.
The utility model discloses a drive-by-wire device 30 is placed to the die cavity to the inside wall laminating drive-by-wire dress design of die cavity, and then when drive-by-wire device 30 arranges the die cavity in, the lateral surface of drive-by-wire device 30 can laminate completely with the die cavity side, and with this, when will the utility model discloses when ultrasonic bonding mould cooperation ultrasonic welding machine used, can let the inside wall of drive-by-wire device upper and lower casing laminating first storage tank 11, second storage tank 21 respectively completely. And then during ultrasonic bonding, under high frequency vibrations and pressure effect for the atress of upper and lower casing is even, can not let upper and lower casing produce stress concentration promptly, can solve current casing and produce the problem that the bright seal is easy to produce when utilizing ultrasonic wave mould ultrasonic bonding and cause the casing outward appearance bad. And the wire on the earphone wire control device 30 can be accommodated by utilizing the wire routing channel, so that the earphone wire is prevented from influencing the connection of the upper shell and the lower shell.
Specifically, in order to attach the cavity to the housing of the drive-by-wire device 30, the first receiving groove 11 and the second receiving groove 21 include: an arc surface 111 attached to the outer side surface of the wire control device 30, and two vertical surfaces 112 respectively located at two ends of the arc surface 111 and perpendicular to the horizontal plane. The vertical surfaces 112 are located at two sides of the wire channel, and the vertical surfaces 112 correspond to vertical side walls of wires at two ends of the wire control device 30.
In one embodiment, in order to make the cavity cooperate with the drive-by-wire device 30 having the key, the cavity is provided with a third receiving groove 23 at a position corresponding to the key on the drive-by-wire device 30. Specifically, the third accommodating groove 23 is located on the arc surface 111, and the third accommodating groove 23 and the arc surface 111 are excessively connected through an arc chamfer, so that the influence on the attractiveness due to the fact that the linear control device 30 is scratched by a right-angled tip is prevented.
The above embodiments of the present invention are only described, and it should be noted that, for those skilled in the art, modifications can be made without departing from the inventive concept, but these all fall into the protection scope of the present invention.
Claims (3)
1. The ultrasonic welding die for the wire control device is characterized by comprising a movable die and a fixed die, wherein a first accommodating groove is formed in the movable die, a second accommodating groove is formed in the fixed die, the first accommodating groove and the second accommodating groove form a cavity for accommodating the wire control device, the cavity is arranged by being attached to an outer shell of the wire control device, first wiring grooves are formed in two ends of the movable die corresponding to the first accommodating groove, second wiring grooves are formed in two ends of the fixed die corresponding to the second accommodating groove, and wiring channels for accommodating wires are formed by the first wiring grooves and the second wiring grooves;
the first accommodating groove and the second accommodating groove comprise: the wire control device comprises an arc surface attached to the outer side surface of the wire control device and two vertical surfaces which are respectively positioned at two ends of the arc surface and are vertical to a horizontal plane; the vertical surfaces are positioned on two sides of the routing channel.
2. The ultrasonic welding mold for the wire control device according to claim 1, wherein the cavity is provided with a third accommodating groove at a position corresponding to a key on the wire control device.
3. The ultrasonic welding die for the wire control device according to claim 2, wherein the third accommodating groove is located on a circular arc surface, and the third accommodating groove is connected with the circular arc surface through a circular arc chamfer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121203820.2U CN215095710U (en) | 2021-05-31 | 2021-05-31 | Wire control device ultrasonic welding mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121203820.2U CN215095710U (en) | 2021-05-31 | 2021-05-31 | Wire control device ultrasonic welding mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215095710U true CN215095710U (en) | 2021-12-10 |
Family
ID=79302561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121203820.2U Active CN215095710U (en) | 2021-05-31 | 2021-05-31 | Wire control device ultrasonic welding mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215095710U (en) |
-
2021
- 2021-05-31 CN CN202121203820.2U patent/CN215095710U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 523000 Room 501, Building 3, No. 388, Bihu Avenue, Fenggang Town, Dongguan City, Guangdong Province Patentee after: Guangdong Huaguan Zhilian Technology Co.,Ltd. Address before: 518000 Room 101, No.46 Xinhe Road, shangmugu community, Pinghu street, Longgang District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Huaguan Zhilian Technology Co.,Ltd. |