CN215039741U

CN215039741U - High-precision forming die with outer rubber coating structure for mobile phone backlight shell

Info

Publication number: CN215039741U
Application number: CN202023175326.8U
Authority: CN
Inventors: 李天增; 吕军
Original assignee: Dongguan Juwei Electronic Technology Co ltd
Current assignee: Dongguan Juwei Electronic Technology Co ltd
Priority date: 2020-12-25
Filing date: 2020-12-25
Publication date: 2021-12-07
Anticipated expiration: 2030-12-25

Abstract

A high-precision forming die for a mobile phone backlight shell with an outer glue-wrapping structure comprises an upper die, a lower die, an auxiliary forming module and a first driving mechanism, wherein the first driving mechanism is connected with the upper die; the upper die comprises an upper die plate, the bottom of the upper die plate is provided with a forming bulge, the middle part of the forming bulge is provided with an accommodating groove, the upper die is also provided with a glue inlet, and the glue inlet extends into the forming bulge and is communicated with the accommodating groove; the lower die comprises a lower die plate, an accommodating groove is formed in the upper end face of the lower die plate, the notch of the accommodating groove is aligned with the forming protrusion in the vertical direction, the auxiliary forming module comprises a second driving mechanism and an ejector rod, and the second driving mechanism drives the ejector rod to move in the vertical direction, so that the upper end of the ejector rod can penetrate through the backlight hole. The uppermost end of the ejector rod is provided with a guide groove, and the two sides of the top of the ejector rod are provided with communicating holes which extend to the outer side surface of the ejector rod. The utility model discloses effectively solve the light leak problem of board in a poor light, the practicality is strong.

Description

High-precision forming die with outer rubber coating structure for mobile phone backlight shell

Technical Field

The utility model relates to a forming die especially relates to a high-precision forming die of cell-phone shell in a poor light with outer glued structure of package.

Background

With the development of society, the electronic products are updated as fast as the dragon, and the requirements of people on mobile phones are higher and higher. The front camera is also the standard configuration of the mobile phone, and the requirements of consumers on the definition and pixels of the camera are higher and higher; the outstanding self-timer capability is also an important breakthrough for further occupying the market.

The backlight device is an important part in the field of mobile phone screen manufacturing, the backlight device comprises a backlight shell and a backlight source arranged in the backlight shell through a glue layer, a front camera hole of the backlight shell is provided, in the traditional mobile phone structure, no glue is coated outside the wall of the camera hole, a certain area of black needs to be coated at the round hole of a film material used in backlight assembly, and the light leakage phenomenon at the position is reduced.

SUMMERY OF THE UTILITY MODEL

Therefore, it is necessary to provide a high-precision molding die for a mobile phone backlight shell with an outer adhesive coating structure for overcoming the defects in the prior art.

A high-precision molding die for a mobile phone backlight shell with an outer coating structure is used for molding the outer coating of a backlight hole on the backlight shell and comprises an upper die, a lower die, an auxiliary molding module and a first driving mechanism, wherein the first driving mechanism is connected with the upper die;

the upper die comprises an upper die plate, the bottom of the upper die plate is provided with a forming bulge, the middle part of the forming bulge is provided with a containing groove, the upper die is also provided with a glue inlet, and the glue inlet extends into the forming bulge and is communicated with the containing groove;

the lower mould includes the lower bolster, and the up end of lower bolster is equipped with the accepting groove, and the notch of this accepting groove aligns each other with the shaping arch in vertical direction, and during the compound die, the shaping arch of going up the mould stretches into in the accepting groove, the telescopic hole has still been seted up to the lower mould, the telescopic hole communicates each other with the accepting groove in vertical direction.

The auxiliary forming module comprises a second driving mechanism and an ejector rod, the second driving mechanism is connected with the ejector rod, the ejector rod penetrates through the telescopic hole, the second driving mechanism drives the ejector rod to move in the vertical direction, the ejector rod extends into the containing groove or contracts into the telescopic hole from the containing groove, and therefore the upper end of the ejector rod can penetrate through the backlight hole and is tightly attached to the inner side wall of the backlight hole. The uppermost end of the ejector rod is provided with a guide groove, and the two sides of the top of the ejector rod are provided with communicating holes which extend to the outer side surface of the ejector rod.

Furthermore, notches are formed in the edge positions of two sides of the forming protrusion.

Furthermore, the shape of the upper end of the ejector rod is conical, and the shape of the upper end of the ejector rod is smaller than the inner space of the backlight hole.

Further, the notch of the leading-in groove is larger than the bottom opening of the glue inlet.

The utility model discloses cell-phone shell high-precision forming die that is shaded from sun with outer glued structure's beneficial effect lies in: through set up the storage tank at last mould, the both sides at ejector pin top are equipped with intercommunicating pore and lead-in groove, the intercommunicating pore extends to the lateral surface of ejector pin, and during the compound die, the ejector pin upper end passes the back light hole and laminates mutually with the cell wall of storage tank, it is linked together with the lead-in groove to advance gluey mouthful bottom, the shaping is protruding, ejector pin and shell in a poor light surround into an injection moulding space, and the processing of outer packing is glued on the completion board in a poor light, effectively solves the light leak problem of board in a poor light, and the practicality is strong, has stronger popularization meaning.

Drawings

Country 1 is a schematic structural diagram of a backlight panel.

Fig. 2 is a cross-sectional view of the backlight hole of the backlight panel after encapsulation.

Fig. 3 is a schematic structural view of a backlight plate when being processed on a mold.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments.

As shown in fig. 1 to 3, the utility model provides a high-precision forming die of cell-phone shell in a poor light with outer package glue structure for the outer package glue 13 of hole 11 is shaded on shaping shell in a poor light 10, shell in a poor light 10 is inwards punched a hole, with the shaping hole in a poor light 11, hole in a poor light 11 is the toper setting, and the peripheral of hole in a poor light 11 forms the pore wall 12 that links into an organic whole with shell in a poor light 10 main part, and shell in a poor light 10 both sides are upwards buckled and are extended, form kink 14.

The high-precision forming die for the mobile phone backlight shell with the outer rubber coating structure comprises an upper die 20, a lower die 30, an auxiliary forming module and a first driving mechanism, wherein the first driving mechanism is connected with the upper die 20, and the upper die 20, the lower die 30 and the auxiliary forming module are matched with each other to form the outer rubber coating 13.

Go up mould 20 and include cope match-plate pattern 21, the bottom of cope match-plate pattern 21 is equipped with shaping arch 23, the middle part of shaping arch 23 is equipped with storage tank 24 to go up mould 20 and still be equipped with into jiao kou 22, it extends to in the shaping arch 23 and is linked together with storage tank 24 to advance jiao kou 22, the protruding 23 both sides edge position of shaping is equipped with notch 231.

The lower die 30 includes a lower die plate 31, an upper end surface of the lower die plate 31 is provided with a receiving groove 32, a notch of the receiving groove 32 is aligned with the forming protrusion 23 in the vertical direction, and the forming protrusion 23 of the upper die 20 extends into the receiving groove 32 during die assembly. The lower die 30 is further provided with a telescopic hole 33, and the telescopic hole 33 is communicated with the accommodating groove 32 in the vertical direction.

The auxiliary forming module comprises a second driving mechanism and a push rod 40, the second driving mechanism is connected with the push rod 40, the push rod 40 penetrates through the telescopic hole 33, the second driving mechanism drives the push rod 40 to move in the vertical direction, the push rod 40 extends into the accommodating groove 32 or contracts into the telescopic hole 33 from the accommodating groove 32, the appearance of the upper end of the push rod 40 is in a conical shape, the appearance of the upper end of the push rod 40 is slightly smaller than the inner space of the backlight hole 11, and therefore the upper end of the push rod 40 can penetrate through the backlight hole 11 and is tightly attached to the inner side wall of the backlight hole 11. The uppermost end of the ejector rod 40 is provided with an introduction groove 41, the notch of the introduction groove 41 is larger than the bottom opening of the glue inlet 22, the two sides of the top of the ejector rod 40 are provided with communicating holes 42, and the communicating holes 42 extend to the outer side surface of the ejector rod 40.

When the outer rubber coating 13 is formed, the backlight shell 10 is placed in the accommodating groove 32 of the lower die 30, the first driving mechanism drives the upper die 20 to move downwards, so that the upper die 20 and the lower die 30 are assembled, the forming protrusion 23 is tightly attached to the inner side surface of the backlight shell 10, the bending part 14 of the backlight shell 10 is clamped into the notch 231, the hole wall 12 of the backlight hole 11 of the backlight shell 10 extends into the accommodating groove 24, the second driving mechanism drives the ejector rod 40 to move upwards, the upper end of the ejector rod 40 penetrates through the backlight hole 11 and is attached to the groove wall of the accommodating groove 24, the bottom of the rubber inlet 22 is communicated with the guide groove 41, and the forming protrusion 23, the ejector rod 40 and the backlight shell 10 are combined to form an injection molding space. And (3) performing injection molding through the glue inlet 22, wherein the material enters the guide groove 41 from the glue inlet 22 and is injected into the injection molding space from the communicating hole 42, so that the outer coating glue 13 is coated on the periphery of the hole wall 12 of the backlight hole 11. After the processing is finished, the first driving mechanism drives the upper die 20 to be opened upwards, the second driving mechanism drives the ejector rod 40 to be separated from the containing groove 32, the backlight shell 10 is taken out, and the water gap is cut off.

The utility model discloses cell-phone shell high-precision forming die that is shaded from sun with outer glued structure's beneficial effect lies in: through set up storage tank 24 at last mould 20, the both sides at ejector pin 40 top are equipped with intercommunicating pore 42 and lead-in groove 41, intercommunicating pore 42 extends to the lateral surface of ejector pin 40, and during the compound die, ejector pin 40 upper end passes backlight hole 11 and laminates mutually with the cell wall of storage tank 24, it is linked together with lead-in groove 41 to advance gluey mouthful 22 bottom, shaping arch 23, ejector pin 40 and backlight shell 10 surround into an injection moulding space, accomplishes the processing of outer packing rubber plate 13 on the board that is shaded, effectively solves the light leak problem of board that is shaded, and the practicality is strong, has stronger popularization meaning.

The above-described embodiments only represent one embodiment of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the invention. It should be noted that, for those skilled in the art, many variations and modifications can be made without departing from the spirit of the invention, and these are within the scope of the invention. Therefore, the protection scope of the utility model patent should be subject to the appended claims.

Claims

1. A high-precision molding die of a mobile phone backlight shell with an outer encapsulation structure is used for molding the outer encapsulation of a backlight hole on the backlight shell and is characterized by comprising an upper die, a lower die, an auxiliary molding module and a first driving mechanism, wherein the first driving mechanism is connected with the upper die;

the lower die comprises a lower die plate, an accommodating groove is formed in the upper end face of the lower die plate, a notch of the accommodating groove is aligned with the forming protrusion in the vertical direction, the forming protrusion of the upper die extends into the accommodating groove during die assembly, and a telescopic hole is formed in the lower die and is communicated with the accommodating groove in the vertical direction;

the auxiliary forming module comprises a second driving mechanism and an ejector rod, the second driving mechanism is connected with the ejector rod, the ejector rod penetrates through the telescopic hole, the second driving mechanism drives the ejector rod to move in the vertical direction, the ejector rod extends into the containing groove or contracts into the telescopic hole from the containing groove, so that the upper end of the ejector rod can penetrate through the backlight hole and is tightly attached to the inner side wall of the backlight hole, the leading-in groove is formed in the uppermost end of the ejector rod, communicating holes are formed in the two sides of the top of the ejector rod, and the communicating holes extend to the outer side face of the ejector rod.

2. The high-precision molding die for the mobile phone backlight shell with the outer glue-coating structure as claimed in claim 1, wherein: notches are arranged at the edge positions of two sides of the forming bulge.

3. The high-precision molding die for the mobile phone backlight shell with the outer glue-coating structure as claimed in claim 1, wherein: the shape of the upper end of the ejector rod is conical, and the shape of the upper end of the ejector rod is smaller than the inner space of the backlight hole.

4. The high-precision molding die for the mobile phone backlight shell with the outer glue-coating structure as claimed in claim 1, wherein: the notch of the leading-in groove is larger than the bottom opening of the glue inlet.