CN215030803U - Improved piezoelectric wafer type ultrasonic transducer - Google Patents

Improved piezoelectric wafer type ultrasonic transducer Download PDF

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Publication number
CN215030803U
CN215030803U CN202022894385.4U CN202022894385U CN215030803U CN 215030803 U CN215030803 U CN 215030803U CN 202022894385 U CN202022894385 U CN 202022894385U CN 215030803 U CN215030803 U CN 215030803U
Authority
CN
China
Prior art keywords
metal casing
shell
ultrasonic transducer
fixedly connected
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN202022894385.4U
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Chinese (zh)
Inventor
杨全虎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Oukeluo Electronic Technology Co ltd
Original Assignee
Suzhou Oukeluo Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Oukeluo Electronic Technology Co ltd filed Critical Suzhou Oukeluo Electronic Technology Co ltd
Priority to CN202022894385.4U priority Critical patent/CN215030803U/en
Application granted granted Critical
Publication of CN215030803U publication Critical patent/CN215030803U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a modified piezoelectric wafer formula ultrasonic transducer, including metal casing and protective housing, fixed mounting has the retaining ring in the middle of the inside of metal casing, the inside upper end fixed position that is located the retaining ring of metal casing installs the wiring board, the inside lower extreme fixedly connected with cable of metal casing, the upper end fixedly connected with of wiring board leads electrical pillar, the position packing that the inside of metal casing is located the top of wiring board has the sound-absorbing layer, the inside upper end fixed mounting of metal casing has the piezoelectric patches, the surface covering of piezoelectric patches has conductive adhesive layer, the surface coating of metal casing has the protective housing, the upper end fixed mounting of protective housing has the mounting panel, the lower extreme fixedly connected with connecting sleeve of mounting panel, the through-hole has been seted up to the middle surface of mounting panel. The utility model discloses the security when can improve the transducer and use to can make things convenient for the installation of transducer to use, have the practicality.

Description

Improved piezoelectric wafer type ultrasonic transducer
Technical Field
The utility model relates to a transducer technical field especially relates to a modified piezoelectric wafer formula ultrasonic transducer.
Background
The function of the piezoelectric wafer type ultrasonic transducer is to convert the input electric power into mechanical power (i.e. ultrasonic wave) and transmit the mechanical power, and a small part of the power is consumed by the piezoelectric wafer type ultrasonic transducer. The ultrasonic transducer has wide application, and is divided into industry, agriculture, transportation, life, medical treatment, military and the like according to the application industry.
The existing piezoelectric wafer type ultrasonic transducer has certain defects when in use, the transducer is not high in safety when in use, the transducer is easily damaged, and the transducer is inconvenient to install and disassemble when in use, so that certain influence is brought to the use process, and therefore, the improved piezoelectric wafer type ultrasonic transducer is provided.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing an improved piezoelectric wafer type ultrasonic transducer.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
an improved piezoelectric wafer type ultrasonic transducer comprises a metal shell and a protective shell, wherein a check ring is fixedly arranged in the middle of the interior of the metal shell, a wiring board is fixedly arranged at the upper end of the retainer ring in the metal shell, a cable is fixedly connected at the lower end in the metal shell, the upper end of the wiring board is fixedly connected with a conductive column, a sound absorption layer is filled in the metal shell at the position above the wiring board, the upper end of the interior of the metal shell is fixedly provided with a piezoelectric patch, the outer surface of the piezoelectric patch is covered with a conductive adhesive layer, the outer surface of the metal shell is wrapped with a protective shell, the upper end of the protective shell is fixedly provided with an installation plate, the lower end of the mounting plate is fixedly connected with a connecting sleeve, the outer surface of the middle of the mounting plate is provided with a through hole, locating holes are formed in the outer surfaces of the two sides of the connecting sleeve, and elastic clamping pieces are fixedly mounted on the two sides of the upper end of the protective shell.
Preferably, the elastic clamping piece is an inverted V-shaped structure, one end of the elastic clamping piece is located inside the protective shell and fixedly connected with the protective shell, and the other end of the elastic clamping piece is located inside the positioning hole.
Preferably, a wire is fixedly connected between the cable and the wiring board, and the sound absorption layer is made of a sound absorption material.
Preferably, the upper end of the metal shell penetrates through the through hole and is located the same plane with the upper surface of the mounting plate, and mounting holes are formed in the peripheral outer surface of the mounting plate.
Preferably, the number of the positioning holes and the number of the elastic clamping pieces are two, and the connecting sleeve is of a cylindrical structure.
Preferably, the protective housing comprises a first housing, a second housing and a buffer layer, the buffer layer is filled between the first housing and the second housing, and the buffer layer is made of rubber.
Compared with the prior art, the beneficial effects of the utility model are that:
1. in the utility model, the protective shell is wrapped outside the metal shell of the main body of the transducer, so that the protective shell can effectively play a role in protection, the transducer is prevented from being damaged due to collision in the use process, and the service life of the transducer can be greatly prolonged;
2. in the utility model, the mounting plate, the connecting sleeve, the positioning hole and the elastic clamping piece are arranged, so that the transducer can be conveniently mounted and dismounted, the transducer can be conveniently maintained and repaired when in use, and the use effect of the transducer is improved;
to sum up, the utility model discloses security when can improving the transducer and use to can make things convenient for the installation of transducer to use, have the practicality.
Drawings
Fig. 1 is a schematic diagram of an internal structure of a metal shell of an improved piezoelectric wafer type ultrasonic transducer according to the present invention;
fig. 2 is a schematic diagram of an overall structure of an improved piezoelectric wafer type ultrasonic transducer according to the present invention;
fig. 3 is a schematic view of a connection structure between a mounting plate and a protective casing of an improved piezoelectric wafer type ultrasonic transducer according to the present invention;
fig. 4 is a schematic structural diagram of a protective shell of an improved piezoelectric wafer type ultrasonic transducer according to the present invention.
In the figure: 1. a metal shell; 2. a retainer ring; 3. a wiring board; 4. a cable; 5. a wire; 6. a conductive post; 7. a sound absorbing layer; 8. a piezoelectric sheet; 9. a conductive adhesive layer; 10. a protective shell; 11. mounting a plate; 12. a connecting sleeve; 13. a through hole; 14. positioning holes; 15. an elastic clip; 16. a first housing; 17. a second housing; 18. a buffer layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
The first embodiment is as follows:
referring to fig. 1-3, an improved piezoelectric wafer type ultrasonic transducer comprises a metal shell 1 and a protective shell 10, wherein a retainer ring 2 is fixedly installed in the middle of the inside of the metal shell 1, a wiring board 3 is fixedly installed in the upper end of the retainer ring 2 in the inside of the metal shell 1, a cable 4 is fixedly connected to the lower end of the inside of the metal shell 1, a conductive post 6 is fixedly connected to the upper end of the wiring board 3, a sound absorption layer 7 is filled in the position above the wiring board 3 in the inside of the metal shell 1, a piezoelectric sheet 8 is fixedly installed at the upper end of the inside of the metal shell 1, a conductive adhesive layer 9 covers the outer surface of the piezoelectric sheet 8, the protective shell 10 wraps the outer surface of the metal shell 1, an installation plate 11 is fixedly installed at the upper end of the protective shell 10, a connection sleeve 12 is fixedly connected to the lower end of the installation plate 11, a through hole 13 is formed in the outer surface of the middle of the installation plate 11, and positioning holes 14 are formed in the outer surfaces of both sides of the connection sleeve 12, elastic clamping pieces 15 are fixedly arranged on both sides of the upper end of the protective shell 10.
Wherein, elastic clamping piece 15 is the type of falling V structure, and elastic clamping piece 15's one end is located the inside and the protective housing 10 fixed connection of protective housing 10, and elastic clamping piece 15's the other end is located the inside position of locating hole 14.
Wherein, fixedly connected with wire 5 between cable 4 and the wiring board 3, the material of sound-absorbing layer 7 is sound-absorbing material.
Wherein, the upper end of metal casing 1 runs through-hole 13 and is located the coplanar with the upper surface of mounting panel 11, and the mounting hole has all been seted up to the surface all around of mounting panel 11.
Wherein, the number of the positioning holes 14 and the elastic clips 15 is two, and the connecting sleeve 12 is a cylindrical structure.
Example two:
referring to fig. 1-4, an improved piezoelectric wafer type ultrasonic transducer comprises a metal shell 1 and a protective shell 10, wherein a retainer ring 2 is fixedly installed in the middle of the inside of the metal shell 1, a wiring board 3 is fixedly installed in the upper end of the retainer ring 2 in the inside of the metal shell 1, a cable 4 is fixedly connected to the lower end of the inside of the metal shell 1, a conductive post 6 is fixedly connected to the upper end of the wiring board 3, a sound absorption layer 7 is filled in the position above the wiring board 3 in the inside of the metal shell 1, a piezoelectric sheet 8 is fixedly installed at the upper end of the inside of the metal shell 1, a conductive adhesive layer 9 covers the outer surface of the piezoelectric sheet 8, the protective shell 10 wraps the outer surface of the metal shell 1, an installation plate 11 is fixedly installed at the upper end of the protective shell 10, a connection sleeve 12 is fixedly connected to the lower end of the installation plate 11, a through hole 13 is formed in the outer surface of the middle of the installation plate 11, and positioning holes 14 are formed in the outer surfaces of both sides of the connection sleeve 12, elastic clamping pieces 15 are fixedly arranged on both sides of the upper end of the protective shell 10.
Wherein, elastic clamping piece 15 is the type of falling V structure, and elastic clamping piece 15's one end is located the inside and the protective housing 10 fixed connection of protective housing 10, and elastic clamping piece 15's the other end is located the inside position of locating hole 14.
Wherein, fixedly connected with wire 5 between cable 4 and the wiring board 3, the material of sound-absorbing layer 7 is sound-absorbing material.
Wherein, the upper end of metal casing 1 runs through-hole 13 and is located the coplanar with the upper surface of mounting panel 11, and the mounting hole has all been seted up to the surface all around of mounting panel 11.
Wherein, the number of the positioning holes 14 and the elastic clips 15 is two, and the connecting sleeve 12 is a cylindrical structure.
The protective shell 10 is composed of a first shell 16, a second shell 17 and a buffer layer 18, the buffer layer 18 is filled between the first shell 16 and the second shell 17, and the buffer layer 18 is made of rubber.
The working principle is as follows: when in use, the protective shell 10 is sleeved on the outer surface of the metal shell 1, the retainer ring 2, the wiring board 3, the cable 4, the wire 5, the conductive post 6, the sound absorption layer 7, the piezoelectric sheet 8 and the conductive adhesive layer 9 in the metal shell 1 form a transducer main body, the transducer main body is the prior art, the protective shell 10 consists of a first shell 16 and a second shell 17, and a buffer layer 18 is filled between the two shells, so that the transducer can be effectively protected, and the transducer is prevented from being damaged in use, during installation, the mounting plate 11 is firstly installed and fixed through screws, then the transducer is inserted into the connecting sleeve 12 at the lower end of the mounting plate 11 through the protective shell 10, so that the elastic clamping sheets 15 on the protective shell 10 are clamped in the positioning holes 14, and the transducer is fixed, only the elastic clamping sheets 15 are extruded into the positioning holes 14 during disassembly, and then the transducer main body and the protective shell 10 are pulled out, the use of the transducer is facilitated.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims (6)

1. The utility model provides a modified piezoelectric wafer formula ultrasonic transducer, includes metal casing (1) and protective housing (10), its characterized in that, fixed mounting has retaining ring (2) in the middle of the inside of metal casing (1), the inside upper end position fixed mounting that is located retaining ring (2) of metal casing (1) has wiring board (3), the inside lower extreme fixedly connected with cable (4) of metal casing (1), the upper end fixedly connected with of wiring board (3) leads electrical pillar (6), the position that the inside of metal casing (1) is located the top of wiring board (3) is filled there is acoustic absorber (7), the inside upper end fixed mounting of metal casing (1) has piezoelectric patches (8), the surface of piezoelectric patches (8) covers there is conductive adhesive layer (9), the surface parcel of metal casing (1) has protective housing (10), the upper end fixed mounting of protective housing (10) has mounting panel (11), the lower extreme fixedly connected with connecting sleeve (12) of mounting panel (11), through-hole (13) have been seted up to the middle surface of mounting panel (11), locating hole (14) have all been seted up to the both sides surface of connecting sleeve (12), the equal fixed mounting in upper end both sides of protective housing (10) has elasticity clamping piece (15).
2. The improved piezoelectric wafer type ultrasonic transducer according to claim 1, wherein the elastic clamping piece (15) is of an inverted V-shaped structure, one end of the elastic clamping piece (15) is located inside the protective shell (10) and fixedly connected with the protective shell (10), and the other end of the elastic clamping piece (15) is located inside the positioning hole (14).
3. An improved piezoelectric wafer type ultrasonic transducer according to claim 1, wherein a wire (5) is fixedly connected between the cable (4) and the wiring board (3), and the sound absorption layer (7) is made of a sound absorption material.
4. The improved piezoelectric wafer type ultrasonic transducer according to claim 1, wherein the upper end through hole (13) of the metal shell (1) and the upper surface of the mounting plate (11) are located on the same plane, and the peripheral outer surface of the mounting plate (11) is provided with mounting holes.
5. The improved piezoelectric wafer type ultrasonic transducer according to claim 1, wherein the number of the positioning holes (14) and the number of the elastic clips (15) are two, and the connecting sleeve (12) is of a cylindrical structure.
6. The improved piezoelectric wafer type ultrasonic transducer according to claim 1, wherein the protective shell (10) is composed of a first shell (16), a second shell (17) and a buffer layer (18), the buffer layer (18) is filled between the first shell (16) and the second shell (17), and the buffer layer (18) is made of rubber.
CN202022894385.4U 2020-12-07 2020-12-07 Improved piezoelectric wafer type ultrasonic transducer Expired - Fee Related CN215030803U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022894385.4U CN215030803U (en) 2020-12-07 2020-12-07 Improved piezoelectric wafer type ultrasonic transducer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022894385.4U CN215030803U (en) 2020-12-07 2020-12-07 Improved piezoelectric wafer type ultrasonic transducer

Publications (1)

Publication Number Publication Date
CN215030803U true CN215030803U (en) 2021-12-07

Family

ID=79214173

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022894385.4U Expired - Fee Related CN215030803U (en) 2020-12-07 2020-12-07 Improved piezoelectric wafer type ultrasonic transducer

Country Status (1)

Country Link
CN (1) CN215030803U (en)

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20211207