CN215030525U - Device is paintd to computer hardware CPU board heat dissipation glue - Google Patents

Device is paintd to computer hardware CPU board heat dissipation glue Download PDF

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Publication number
CN215030525U
CN215030525U CN202120633463.7U CN202120633463U CN215030525U CN 215030525 U CN215030525 U CN 215030525U CN 202120633463 U CN202120633463 U CN 202120633463U CN 215030525 U CN215030525 U CN 215030525U
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CN
China
Prior art keywords
fixedly connected
cpu board
heat dissipation
bottom end
computer hardware
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN202120633463.7U
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Chinese (zh)
Inventor
杨蓓
侯中熙
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Wuchang University of Technology
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Wuchang University of Technology
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Filing date
Publication date
Application filed by Wuchang University of Technology filed Critical Wuchang University of Technology
Priority to CN202120633463.7U priority Critical patent/CN215030525U/en
Application granted granted Critical
Publication of CN215030525U publication Critical patent/CN215030525U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a computer hardware CPU board heat dissipation glue smearing device, in particular to the technical field of computers, which comprises an operation table, wherein the top end of the operation table is fixedly connected with a vertical fixed plate, one side of the vertical fixed plate is provided with a hydraulic cylinder, the output end of the hydraulic cylinder is fixedly connected with a mounting plate, the bottom end of the mounting plate is fixedly connected with two fixed cylinders, and the inside of each fixed cylinder is provided with a buffer mechanism; buffer gear includes the spring, the spring setting is in the inside of solid fixed cylinder, the first base of top fixedly connected with of spring, the bottom fixedly connected with second base of spring, the top of first base and the interior wall connection of solid fixed cylinder. The utility model has the advantages of simple and reasonable structural design, be favorable to protecting the CPU board body on the one hand, avoid hard power to destroy the CPU board body, on the other hand makes to paint the heat dissipation and glues more evenly, paints the dynamics moderate, is favorable to improving the effect and the efficiency of paining.

Description

Device is paintd to computer hardware CPU board heat dissipation glue
Technical Field
The utility model relates to a computer technology field, more specifically say, the utility model relates to a device is paintd to computer hardware CPU board heat dissipation glue.
Background
A computer is composed of a hardware system and a software system, and a computer without any software installed is called a bare computer. The hardware functions are to input and store programs and data, and to execute the programs to process the data into a usable form. From the appearance, the microcomputer is composed of a main case and external devices, a CPU is used as the operation and control core of a computer system and is the final execution unit for information processing and program operation, and the CPU has been greatly developed in terms of logic structure, operation efficiency and function extension since its generation.
In the production process of the CPU board, the CPU board is usually required to be coated with heat dissipation glue, so a coating device is used for coating, the prior art generally adopts a roller for rolling coating, the roller is pushed by electric power or strength, but the CPU board is easily damaged by overlarge pushing force.
SUMMERY OF THE UTILITY MODEL
In order to overcome prior art's above-mentioned defect, the embodiment of the utility model provides a device is paintd to computer hardware CPU board heat dissipation glue, through having set up buffer gear, is favorable to protecting the CPU board body on the one hand, avoids hard power to destroy the CPU board body, and on the other hand makes to paint the heat dissipation glue more even, paints the dynamics moderate, is favorable to improving the effect and the efficiency of paining to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a computer hardware CPU board heat dissipation glue smearing device comprises an operation table, wherein a vertical fixing plate is fixedly connected to the top end of the operation table, a hydraulic cylinder is mounted on one side of the vertical fixing plate, an output end of the hydraulic cylinder is fixedly connected with a mounting plate, two fixing cylinders are fixedly connected to the bottom end of the mounting plate, and a buffer mechanism is arranged inside each fixing cylinder;
the buffer mechanism comprises a spring, the spring is arranged inside a fixed cylinder, the top end of the spring is fixedly connected with a first base, the bottom end of the spring is fixedly connected with a second base, the top end of the first base is connected with the inner wall of the fixed cylinder, the bottom end of the second base is fixedly connected with a movable disc, the bottom end of the movable disc is fixedly connected with a connecting rod, the output end of the connecting rod penetrates through the outside of the fixed cylinder and is fixedly connected with an installation rod, the bottom end of the installation rod is fixedly connected with two supporting rods, a rotating shaft is fixedly connected between the two supporting rods, the outside of the rotating shaft is rotatably connected with a roller, the inside of the installation rod is provided with a transverse pipe, the bottom end of the transverse pipe is communicated with a plurality of uniformly distributed spray pipes, the top end of the operating platform is provided with a CPU board body, and the joint of the fixed cylinder and the connecting rod is provided with a stabilizing sleeve, the outer wall of the movable disc is provided with a plurality of balls, and the balls are in contact with the inner wall of the fixed cylinder.
In a preferred embodiment, a top plate is fixedly connected to one side of the vertical fixing plate, and the top plate is made of stainless steel.
In a preferred embodiment, the bottom end of the top plate is provided with a slide rail, and a slide block is slidably connected to the outside of the slide rail.
In a preferred embodiment, a bottom end of the sliding block is fixedly connected with a vertical rod, and a bottom end of the vertical rod is connected with a mounting plate.
In a preferred embodiment, a material conveying tank is arranged at the top end of the operating platform, a first connecting pipe is arranged on one side of the material conveying tank, a second connecting pipe is connected to one end of the transverse pipe, and a hose is connected between the first connecting pipe and the second connecting pipe.
In a preferred embodiment, a top end of the material conveying box is provided with a material feeding port, and one side of the vertical fixing plate is provided with a motor.
In a preferred embodiment, a stirring rod is arranged inside the material conveying box, a plurality of stirring blades are arranged on the outer wall of the rotating shaft, and the output end of the motor is connected with one end of the stirring rod.
The utility model discloses a technological effect and advantage:
1. through arranging the buffer mechanism, the CPU board body is placed on the operation table, the hydraulic cylinder is controlled to stretch and retract to drive the mounting plate to move, the material conveying box provides heat dissipation glue, the heat dissipation glue is input into the transverse inlet pipe from the hose and is finally sprayed onto the roller from the plurality of spray pipes, when the roller is in contact with the CPU board body, the roller extrudes the CPU board body, the connecting rod extrudes the spring, the spring is slowly compressed, and the buffering effect is achieved, the roller rotates on the rotating shaft, so that the roller evenly coats the heat dissipation glue on the CPU board body, and the roller slowly extrudes the CPU board body, on one hand, the CPU board body is favorably protected, the CPU board body is prevented from being damaged by hard force, on the other hand, the heat dissipation glue is more evenly coated, the coating force is moderate, the coating effect and the coating efficiency are favorably improved, the ball synchronously rolls in the fixed cylinder, the arrangement of the ball and the movable disc is favorable for improving the stability of the buffer mechanism, the stable sleeve is beneficial to limiting the connecting rod, the sliding block synchronously moves on the sliding rail, the mounting plate is more stable during movement, and the smearing effect is improved;
2. first base and second base have been set up through the both ends at the spring for the spring is connected more firmly in fixed cylinder, makes the spring more stable, feeds in raw material through the charge door, carries the heat dissipation through first connecting pipe, second connecting pipe and hose and glues, drives puddler and stirring vane through the motor and rotates, is favorable to gluing the stirring with the heat dissipation, improves the result of use that the heat dissipation was glued.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic side view of the mounting plate of the present invention.
Fig. 3 is a schematic structural view of the delivery box of the present invention.
Fig. 4 is a schematic structural diagram of a position a in fig. 2 according to the present invention.
The reference signs are: 1. an operation table; 2. a vertical fixing plate; 3. a hydraulic cylinder; 4. mounting a plate; 5. a fixed cylinder; 6. a spring; 7. a first base; 8. a second base; 9. moving the disc; 10. a connecting rod; 11. mounting a rod; 12. a strut; 13. a rotating shaft; 14. a drum; 15. a transverse tube; 16. a nozzle; 17. a CPU board body; 18. a stabilizing sleeve; 19. a ball bearing; 20. a top plate; 21. a slide rail; 22. a slider; 23. a vertical rod; 24. a material conveying box; 25. a first connecting pipe; 26. a second connecting pipe; 27. a hose; 28. a feed inlet; 29. a motor; 30. a stirring rod; 31. a stirring blade.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The device for smearing the heat dissipation glue on the CPU board of the computer hardware comprises an operation table 1, wherein the top end of the operation table 1 is fixedly connected with a vertical fixing plate 2, one side of the vertical fixing plate 2 is provided with a hydraulic cylinder 3, the output end of the hydraulic cylinder 3 is fixedly connected with an installation plate 4, the bottom end of the installation plate 4 is fixedly connected with two fixing cylinders 5, and a buffer mechanism is arranged inside the fixing cylinders 5;
the buffer mechanism comprises a spring 6, the spring 6 is arranged inside a fixed cylinder 5, the top end of the spring 6 is fixedly connected with a first base 7, the bottom end of the spring 6 is fixedly connected with a second base 8, the top end of the first base 7 is connected with the inner wall of the fixed cylinder 5, the bottom end of the second base 8 is fixedly connected with a movable disc 9, the bottom end of the movable disc 9 is fixedly connected with a connecting rod 10, the output end of the connecting rod 10 penetrates through the outside of the fixed cylinder 5 and is fixedly connected with an installation rod 11, the bottom end of the installation rod 11 is fixedly connected with two supporting rods 12, a rotating shaft 13 is fixedly connected between the two supporting rods 12, the outside of the rotating shaft 13 is rotatably connected with a roller 14, the inside of the installation rod 11 is provided with a transverse pipe 15, the bottom end of the transverse pipe 15 is communicated with a plurality of uniformly distributed spray pipes 16, the top end of the operating platform 1 is provided with a CPU board body 17, the joint of the fixed cylinder 5 and the connecting rod 10 is provided with a stable sleeve 18, the outer wall of the moving disk 9 is provided with a plurality of balls 19, and the balls 19 are in contact with the inner wall of the fixed cylinder 5.
As shown in fig. 4, a top plate 20 is fixedly connected to one side of the vertical fixing plate 2, and the top plate 20 is made of stainless steel material to facilitate installation of the slide rail 21.
As shown in fig. 1, the bottom end of the top plate 20 is provided with a slide rail 21, the outside of the slide rail 21 is slidably connected with a slide block 22, and the slide block 22 moves on the slide rail 21 synchronously, so that the mounting plate 4 is more stable when moving, and the smearing effect is improved.
As shown in fig. 1, a vertical rod 23 is fixedly connected to the bottom end of the slider 22, the bottom end of the vertical rod 23 is connected to the mounting plate 4, and the vertical rod 23 facilitates the connection between the slider 22 and the mounting plate 4.
As shown in fig. 2, a material delivery box 24 is disposed at the top end of the console 1, a first connecting pipe 25 is disposed at one side of the material delivery box 24, a second connecting pipe 26 is connected to one end of the horizontal pipe 15, a hose 27 is connected between the first connecting pipe 25 and the second connecting pipe 26, a material feeding port 28 is disposed at the top end of the material delivery box 24, a motor 29 is disposed at one side of the vertical fixing plate 2, material is fed through the material feeding port 28, and heat dissipation glue is conveyed through the first connecting pipe 25, the second connecting pipe 26 and the hose 27.
As shown in the attached drawing 2, a stirring rod 30 is arranged inside the material conveying box 24, a plurality of stirring blades 31 are arranged on the outer wall of the rotating shaft, the output end of the motor 29 is connected with one end of the stirring rod 30, the stirring rod 30 and the stirring blades 31 are driven to rotate through the motor 29, the heat dissipation glue is stirred uniformly, and the use effect of the heat dissipation glue is improved.
The utility model discloses the theory of operation: firstly, the CPU board body 17 is placed on the operation table 1, the hydraulic cylinder 3 is controlled to stretch and retract to drive the mounting plate 4 to move, the material conveying box 24 provides heat dissipation glue, the heat dissipation glue is input into the transverse inlet pipe 15 from the hose 27 and is finally sprayed onto the roller 14 from the plurality of spray pipes 16, when the roller 14 is in contact with the CPU board body 17, the roller 14 extrudes the CPU board body 17, the connecting rod 10 extrudes the spring 6, the spring 6 is slowly compressed, and the buffering effect is achieved, the roller 14 rotates on the rotating shaft 13, so that the roller 14 evenly coats the heat dissipation glue on the CPU board body 17, and the roller 14 slowly extrudes the CPU board body 17, on one hand, the CPU board body 17 is favorably protected, the CPU board body 17 is prevented from being damaged by hard force, on the other hand, the heat dissipation glue is more evenly coated, the coating force is moderate, the coating effect and efficiency are favorably improved, the arrangement of the first base 7 and the second base 8 is favorable for keeping the spring 6 stable, ball 19 rolls in the fixed cylinder 5 in step, and ball 19 and removal disc 9 be provided with and do benefit to the stability that improves buffer gear, and stable cover 18 is favorable to carrying on spacingly to connecting rod 10, and slider 22 synchronous motion on slide rail 21 is favorable to mounting panel 4 more stable when removing, improves the effect of paining.
The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;
secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to the common design, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;
and finally: the above description is only for the preferred embodiment of the present invention and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (7)

1. The utility model provides a device is paintd to computer hardware CPU board heat dissipation glue, includes operation panel (1), its characterized in that: the top end of the operating platform (1) is fixedly connected with a vertical fixing plate (2), one side of the vertical fixing plate (2) is provided with a hydraulic cylinder (3), the output end of the hydraulic cylinder (3) is fixedly connected with an installation plate (4), the bottom end of the installation plate (4) is fixedly connected with two fixed cylinders (5), and a buffer mechanism is arranged inside the fixed cylinders (5);
the buffer mechanism comprises a spring (6), the spring (6) is arranged inside a fixed cylinder (5), the top end of the spring (6) is fixedly connected with a first base (7), the bottom end of the spring (6) is fixedly connected with a second base (8), the top end of the first base (7) is connected with the inner wall of the fixed cylinder (5), the bottom end of the second base (8) is fixedly connected with a movable disc (9), the bottom end of the movable disc (9) is fixedly connected with a connecting rod (10), the output end of the connecting rod (10) penetrates through the outside of the fixed cylinder (5) and is fixedly connected with a mounting rod (11), the bottom end of the mounting rod (11) is fixedly connected with two supporting rods (12), a rotating shaft (13) is fixedly connected between the two supporting rods (12), and the outside of the rotating shaft (13) is rotatably connected with a roller (14), the utility model discloses a fixing device for the automobile seat, including installation pole (11), the inside of installation pole (11) is provided with violently pipe (15), the bottom intercommunication of violently pipe (15) has a plurality of evenly distributed's spray tube (16), the top of operation panel (1) is provided with CPU board body (17), the junction of solid fixed cylinder (5) and connecting rod (10) is provided with stabilizing sleeve (18), a plurality of balls (19) are installed to the outer wall of removal disc (9), ball (19) contact with the inner wall of solid fixed cylinder (5).
2. The device for applying the heat dissipation glue to the CPU board of the computer hardware as claimed in claim 1, wherein: one side of the vertical fixing plate (2) is fixedly connected with a top plate (20), and the top plate (20) is made of stainless steel materials.
3. The device for applying the heat dissipation glue to the CPU board of the computer hardware as claimed in claim 2, wherein: the bottom end of the top plate (20) is provided with a slide rail (21), and the outside of the slide rail (21) is connected with a slide block (22) in a sliding manner.
4. The device for applying the heat dissipation glue to the CPU board of the computer hardware as claimed in claim 3, wherein: the bottom end of the sliding block (22) is fixedly connected with a vertical rod (23), and the bottom end of the vertical rod (23) is connected with the mounting plate (4).
5. The device for applying the heat dissipation glue to the CPU board of the computer hardware as claimed in claim 1, wherein: the top of operation panel (1) is provided with defeated workbin (24), one side of defeated workbin (24) is provided with first connecting pipe (25), the one end of violently managing (15) is connected with second connecting pipe (26), be connected with hose (27) between first connecting pipe (25) and second connecting pipe (26).
6. The device for applying the heat dissipation glue to the CPU board of the computer hardware as claimed in claim 5, wherein: the top of defeated workbin (24) is provided with charge door (28), one side of vertical fixed plate (2) is provided with motor (29).
7. The device for applying the heat dissipation glue to the CPU board of the computer hardware as claimed in claim 5, wherein: the inside of defeated workbin (24) is provided with puddler (30), the outer wall of pivot is provided with a plurality of stirring vane (31), the output of motor (29) is connected with the one end of puddler (30).
CN202120633463.7U 2021-03-29 2021-03-29 Device is paintd to computer hardware CPU board heat dissipation glue Expired - Fee Related CN215030525U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120633463.7U CN215030525U (en) 2021-03-29 2021-03-29 Device is paintd to computer hardware CPU board heat dissipation glue

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120633463.7U CN215030525U (en) 2021-03-29 2021-03-29 Device is paintd to computer hardware CPU board heat dissipation glue

Publications (1)

Publication Number Publication Date
CN215030525U true CN215030525U (en) 2021-12-07

Family

ID=79151789

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202120633463.7U Expired - Fee Related CN215030525U (en) 2021-03-29 2021-03-29 Device is paintd to computer hardware CPU board heat dissipation glue

Country Status (1)

Country Link
CN (1) CN215030525U (en)

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CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20211207