CN215008211U

CN215008211U - Quick detachable semiconductor triode

Info

Publication number: CN215008211U
Application number: CN202120538351.3U
Authority: CN
Inventors: 王雪姬
Original assignee: Shenzhen Zhongzheng Microelectronics Technology Co ltd
Current assignee: Shenzhen Zhongzheng Microelectronics Technology Co ltd
Priority date: 2021-03-15
Filing date: 2021-03-15
Publication date: 2021-12-03
Anticipated expiration: 2031-03-15

Abstract

The utility model discloses a quick-dismantling semiconductor triode, which comprises a triode body and three pins connected with the bottom of the triode body, the quick-dismantling semiconductor triode also comprises a spring, two steel balls, a sleeve, a damping rubber ring, a vertical rod and a cross rod, the bottom of the pin is provided with a hole groove along the axial direction, the side wall of the pin is provided with two through holes communicated with the hole groove, the vertical rod is vertically fixed at the bottom of the hole groove, the cross rod is transversely fixed at the bottom of the vertical rod, the spring is positioned in the hole groove and sleeved on the cross rod, two ends of the spring extend to the two through holes, the two steel balls are fixed at two ends of the spring, the outer ends of the spring extend out of the through holes, the sleeve is sleeved on the pin and positioned above the steel balls, and the damping rubber ring is arranged between the sleeve and the pin. The utility model discloses when dismantling, the steel ball is compressed to the internal shrinkage, makes to participate in and breaks away from the circuit board, realizes the quick dismantlement of triode.

Description

Quick detachable semiconductor triode

Technical Field

The utility model relates to a semiconductor triode technical field, concretely relates to dismantle formula semiconductor triode fast.

Background

Semiconductor triodes are widely used as important electronic components on circuit boards. The prior semiconductor triode is installed by inserting three pins into jacks of a circuit board and then welding the three pins in time. Although the semiconductor triode meets the use requirement to a certain extent, the disadvantages of the semiconductor triode are as follows: the disassembly is inconvenient, and the replacement of elements is influenced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art not enough, provide a quick dismantlement formula semiconductor triode.

The technical scheme of the utility model as follows:

the utility model provides a quick dismantlement formula semiconductor triode, includes the triode body and connects three of the bottom of triode body is participated in, quick dismantlement formula semiconductor triode still includes spring, two steel balls, sleeve, damping rubber ring, montant and horizontal pole, the bottom of participating in upwards opens along its axial has the hole groove, the lateral wall of participating in open have two with the through-hole of hole groove intercommunication, the montant is vertical to be fixed the bottom of hole groove, the horizontal pole is transversely fixed the bottom of montant, the spring is located the hole inslot and overlaps on the horizontal pole, its both ends stretch to two the through-hole, two the steel ball is fixed the both ends of spring, its outer end stretch out the through-hole, the muffjoint is in participate in and be located the top of steel ball, the damping rubber ring arrange in the sleeve with participate in between the foot.

Preferably, the quick release semiconductor triode further comprises a connection pin, the top of the connection pin is fixed at the bottom of the triode body, and the bottom of the connection pin is fixed at the top of the pin.

Preferably, the top of the pin is provided with a jack along the axial direction, and the bottom of the connecting pin is embedded into the jack.

Preferably, the two through holes are symmetrical along the axial center of the pin.

Preferably, the damping rubber ring is fixedly sleeved on the pin and positioned above the steel balls.

Compared with the prior art, the beneficial effects of the utility model reside in that: the utility model discloses passing through spring protrusion through-hole and combining the sleeve with two steel balls and participating in the whole and fixing on the circuit board, realizing the quick installation of triode, during the dismantlement, seizing whole semiconductor triode and upwards pulling out, the steel ball is compressed to the enstrophe, makes to participate in and breaks away from the circuit board, realizes the quick dismantlement of triode.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic view of the overall structure of the rapidly detachable semiconductor triode of the present invention;

fig. 2 is a schematic structural view of the pin of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In order to explain the technical solution of the present invention, the following description is made by using specific examples.

Example 1

As shown in fig. 1 and fig. 2, the rapidly detachable semiconductor triode of this embodiment includes a triode body 1 and three pins 2 connected to the bottom of the triode body 1, the rapidly detachable semiconductor triode further includes a spring 3, two steel balls 4, a sleeve 5, a damping rubber ring 6, a vertical rod 7 and a cross rod 8, the bottom of the pin 2 is provided with a hole groove 9 along the axial direction thereof, the side wall of the pin 2 is provided with two through holes 10 communicated with the hole groove 9, the vertical rod 7 is vertically fixed at the bottom of the hole groove 9, the cross rod 8 is horizontally fixed at the bottom of the vertical rod 7, the spring 3 is located in the hole groove 9 and sleeved on the cross rod 8, two ends thereof extend to the two through holes 10, the two steel balls 4 are fixed at two ends of the spring 3, the outer end thereof extends out of the through holes 10, the sleeve 5 is sleeved on the pin 2 and located above the steel balls 4, the damping rubber ring 6 is arranged between the sleeve 5 and the pin 2. The two through holes 10 are symmetrical along the axis of the pin 2, so that the pin 2 is convenient to fix. The damping rubber ring 6 is fixedly sleeved on the pin 2 and positioned above the steel ball 4, so that the sleeve 5 can be conveniently moved downwards and fixed. The damping rubber ring 6 can effectively prevent the sleeve 5 from freely sliding relative to the pin 2. When the semiconductor triode of the embodiment is installed, the pin 2 is inserted into the mounting hole of the circuit board, the steel ball 4 is extruded by the side wall of the mounting hole and retracts when contacting the upper surface of the circuit board until the pin extends down to the mounting hole, the steel ball 4 extends outwards under the action of the spring 3 and abuts against the bottom of the circuit board, meanwhile, the sleeve 5 slides down to press the top of the circuit board, and the steel ball 4 and the sleeve 5 clamp the circuit board to fix the whole pin on the circuit board; when the pin 2 is dismounted, the steel ball 4 is pressed and compressed until the pin leaves the mounting hole, and the steel ball 4 is reset under the action of the spring 3, so that the quick dismounting is completed.

In this embodiment, the quick detach type semiconductor transistor further includes a connection pin 11, wherein the top of the connection pin 11 is fixed to the bottom of the transistor body 1, and the bottom of the connection pin 11 is fixed to the top of the pin 2. The top of the pin 2 is provided with a jack 12 along the axial direction, and the bottom of the connecting pin 11 is embedded into the jack 12, so that the triode can be conveniently replaced.

The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. The utility model provides a quick dismantlement formula semiconductor triode, includes the triode body and connects three of being in the bottom of triode body is participated in its characterized in that: quick dismantlement formula semiconductor triode still includes spring, two steel balls, sleeve, damping rubber ring, montant and horizontal pole, upward open the bottom of participating in along its axial has the hole groove, the lateral wall of participating in open have two with the through-hole of hole groove intercommunication, the montant is vertical to be fixed the bottom of hole groove, the horizontal pole is horizontal to be fixed the bottom of montant, the spring is located the hole inslot and overlaps on the horizontal pole, its both ends stretch to two the through-hole, two the steel ball is fixed the both ends of spring, its outer end stretch out the through-hole, the muffjoint is in participate in on and be located the top of steel ball, the damping rubber ring arrange in the sleeve with participate in between.

2. The rapidly disassembled semiconductor transistor according to claim 1, wherein: the quick detachable semiconductor triode further comprises a connecting pin, wherein the top of the connecting pin is fixed at the bottom of the triode body, and the bottom of the connecting pin is fixed at the top of the base pin.

3. The rapidly disassembled semiconductor transistor according to claim 2, wherein: the top of the plug pin is provided with a jack upwards along the axial direction, and the bottom of the connecting pin is embedded into the jack.

4. The rapidly disassembled semiconductor transistor according to any one of claims 1 to 3, wherein: the two through holes are symmetrical along the axis of the pin.

5. The rapidly disassembled semiconductor transistor according to any one of claims 1 to 3, wherein: the damping rubber ring is fixedly sleeved on the pin and positioned above the steel balls.