CN215005852U - Light source conversion chip packaging mechanism board for laser radar - Google Patents
Light source conversion chip packaging mechanism board for laser radar Download PDFInfo
- Publication number
- CN215005852U CN215005852U CN202121060751.4U CN202121060751U CN215005852U CN 215005852 U CN215005852 U CN 215005852U CN 202121060751 U CN202121060751 U CN 202121060751U CN 215005852 U CN215005852 U CN 215005852U
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- Prior art keywords
- light source
- type frame
- laser radar
- frame
- conversion chip
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- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 23
- 230000007246 mechanism Effects 0.000 title claims abstract description 17
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 16
- 239000002184 metal Substances 0.000 claims abstract description 17
- 238000004659 sterilization and disinfection Methods 0.000 claims abstract description 17
- 239000007921 spray Substances 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 4
- 239000000428 dust Substances 0.000 abstract description 6
- 238000005538 encapsulation Methods 0.000 abstract description 5
- 239000007788 liquid Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 230000009467 reduction Effects 0.000 abstract description 3
- 210000001503 joint Anatomy 0.000 abstract description 2
- 238000012858 packaging process Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 238000004021 metal welding Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
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- Apparatus For Disinfection Or Sterilisation (AREA)
Abstract
The utility model provides a light source conversion chip packaging mechanism board for laser radar relates to encapsulation equipment technical field, the utility model discloses, include: the bottom plate, the top of bottom plate fixed mounting has L type frame A, a workbench, the metal frame, support frame and L type frame B respectively, after position and encapsulation shell butt joint, height-adjusting, the disconnection electromagnetic plate, make the whole encapsulation process of device, from the transportation operation all not with the contact of people's hand, the pollution of bringing the dust into when fingerprint and people remove is reduced, the in-process of the artifical encapsulation of current device has been solved, the influence of fingerprint and external dust, can lead to the problem of the performance reduction of chip, the height of fly leaf is adjusted to the rotation threaded rod, make the brush of bottom put into the conveyer belt surface to disinfection liquid evenly, make the device in time disinfect to conveying equipment, prevent the pollution of later stage work to the chip, the problem that current device can not in time carry out disinfection treatment to conveyer has been solved.
Description
Technical Field
The utility model relates to a packaging equipment technical field especially relates to a light source conversion chip packaging mechanism board for laser radar.
Background
The laser radar is a radar system that detects a characteristic amount such as a position and a velocity of a target by emitting a laser beam. The working principle is that a detection signal is transmitted to a target, then the received signal reflected from the target is compared with the transmitted signal, and after appropriate processing, relevant information of the target, such as target distance, azimuth, altitude, speed, attitude, even shape and other parameters, can be obtained, so that the targets of airplanes, missiles and the like are detected, tracked and identified.
The light source conversion chip packaging mechanism board for the existing laser radar adopts metal particles with high manufacturing cost at the chip access position, the clean environment required in the production process is high, the integrated operation capability of the existing device is low, the influence of fingerprints and external dust can lead to the performance reduction of the chip in the manual packaging process, and the existing device can not disinfect the conveying device in time.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the shortcoming that exists among the prior art, carry out contactless encapsulation through making the chip, prevent that the metal particle on the chip from suffering the pollution.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a light source conversion chip packaging mechanism board for laser radar comprises: the bottom plate, there are L type frame A, workstation, metal frame, support frame and L type frame B at the top of bottom plate fixed mounting respectively, the mounting groove has been seted up to one side that L type frame B was kept away from to the outer wall of workstation, the inner wall bottom fixed mounting of mounting groove has second electric telescopic handle, the output welding of second electric telescopic handle has the loading board, L type frame A's top center department is fixed to produce and is had first electric telescopic handle, first electric telescopic handle's output fixed mounting has the electromagnetic plate
Preferably, the motor is welded on the inner surface wall of the metal frame, and a first gear is fixedly mounted at the output end of the motor.
Preferably, a metal rod is movably inserted into one side of the outer wall of the support frame, a second gear is fixedly sleeved on the outer surface of the metal rod, and a conveyor belt is movably sleeved between the outer surfaces of the first gear and the second gear.
Preferably, a round hole is formed in the top of the L-shaped frame B, a disinfection spray gun is fixedly inserted into the inner surface wall of the round hole, and a spray head of the disinfection spray gun acts on the conveyor belt.
Preferably, the top of the L-shaped frame B is provided with a slide way, the inner surface wall of the slide way is movably provided with a movable plate, and the bottom of the movable plate is provided with a brush.
Preferably, one side that L type frame A was kept away from to the outer wall of L type frame B sets up threaded hole, the inside swivelling joint of threaded hole has the threaded rod, the one end that is close to the disinfection spray gun of threaded rod acts on one side that L type frame A was kept away from to the fly leaf.
Compared with the prior art, the utility model has the advantages and positive effects that,
1. in the utility model, in order to reduce the pollution generated by the chip in the packaging process, the device drives the first gear on the metal frame by starting the motor on the metal frame, drives the conveyor belt to rotate, drives the second gear on the supporting frame to rotate, further improves the stability of transportation, when the product is transported to be contacted with the workbench, the product slides to enter the top of the workbench, the second electric telescopic rod is started, the packaging shell on the bearing plate is lifted to be parallel to the workbench, the first electric telescopic rod on the L-shaped frame A is started to drive the electromagnetic plate, the generated magnetic force acts on the outer wall of the chip and is adsorbed on the electromagnetic plate, when the position is butted with the packaging shell, the height is adjusted, the electromagnetic plate is disconnected, the chip is placed in the packaging shell, the whole packaging process of the device is enabled to be not to be contacted with the human hand from the transportation to the operation, the pollution brought into dust when the fingerprint and the human move is reduced, the problem of the artifical in-process of encapsulating of current device, the influence of fingerprint and external dust can lead to the performance reduction of chip is solved.
2. The utility model discloses in, this device is through starting the disinfection spray gun on the L type frame B, and the shower nozzle part acts on the conveyer belt, and after the conveyer belt rotated, the height of fly leaf was adjusted to the rotation threaded rod, made the brush of bottom put into the conveyer belt surface to disinfection liquid uniformly, made the device in time disinfect to transfer apparatus, prevented that later stage from doing work to the pollution of chip, solved current device and can not in time carry out disinfection's problem to transfer apparatus.
Drawings
Fig. 1 is a perspective view of a front view structure of a light source conversion chip packaging mechanism board for a laser radar according to the present invention;
fig. 2 is a side view of a light source conversion chip packaging mechanism board for a laser radar according to the present invention;
fig. 3 is the utility model provides a light source conversion chip packaging mechanism board for laser radar A department structure enlargies stereogram in fig. 2.
Illustration of the drawings: 1. a base plate; 2. an L-shaped frame A; 3. a first electric telescopic rod; 4. an electromagnetic plate; 5. mounting grooves; 6. a second electric telescopic rod; 7. a carrier plate; 8. a work table; 9. a metal frame; 10. a motor; 11. a first gear; 12. a support frame; 13. a second gear; 14. a conveyor belt; 15. an L-shaped frame B; 16. sterilizing the spray gun; 17. a movable plate; 18. a threaded hole; 19. a threaded rod.
Detailed Description
In order to make the above objects, features and advantages of the present invention more clearly understood, the present invention will be further described with reference to the accompanying drawings and examples. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the present invention is not limited to the limitations of the specific embodiments of the present disclosure.
Embodiment 1, as shown in fig. 1-2, the utility model provides a light source conversion chip packaging mechanism board for laser radar, including: bottom plate 1, bottom plate 1's top fixed mounting respectively has L type frame A2, workstation 8, metal frame 9, support frame 12 and L type frame B15, L type frame B15's one side has been kept away from to workstation 8's outer wall has been seted up mounting groove 5, mounting groove 5's inner wall bottom fixed mounting has second electric telescopic handle 6, the output welding of second electric telescopic handle 6 has loading board 7, L type frame A2's fixed production in top center department has first electric telescopic handle 3, the output fixed mounting of first electric telescopic handle 3 has electromagnetic plate 4, the interior table wall welding of metal frame 9 has motor 10, motor 10's output fixed mounting has first gear 11.
The whole embodiment 1 achieves the effects that the device is firstly placed in an aseptic production environment and is connected with a finished product mechanism, the automation of the device is increased, the motor 10 on the metal frame 9 is started, the first gear 11 on the metal frame is electrically driven, the conveying belt 14 is driven to rotate, the second gear 13 on the supporting frame 12 is driven to rotate, the transportation stability is further improved, when a product is transported to be in contact with the workbench 8, the product slides into the top of the workbench 8, the second electric telescopic rod 6 is started, the packaging shell on the bearing plate 7 is lifted to be parallel to the workbench 8, the first electric telescopic rod 3 on the L-shaped frame A2 is started to drive the electromagnetic plate 4, the generated magnetic force acts on the outer wall of the chip to be adsorbed on the chip, when the position is in butt joint with the packaging shell, the height is adjusted, the electromagnetic plate 4 is disconnected, the chip is placed in the packaging shell, the whole packaging process of the device is enabled to be not in contact with the human hand from transportation to operation, the pollution of the fingerprints and dust brought by people during moving is reduced, a metal rod is movably inserted into one side of the outer wall of the support frame 12, a second gear 13 is fixedly sleeved on the outer surface of the metal rod, and a conveyor belt 14 is movably sleeved between the outer surfaces of the first gear 11 and the second gear 13.
The effect that its whole embodiment 2 reached is, when needing to carry out the disinfection to conveyer belt 14, starts disinfection spray gun 16 on the L type frame B15, and the shower nozzle part acts on conveyer belt 14, and after conveyer belt 14 rotated, the height of rotation threaded rod 19 regulation fly leaf 17 made the brush in bottom put into conveyer belt 14 surface evenly to the disinfection liquid, made the device can in time disinfect to conveying equipment, prevented that later stage worker from the pollution of chip.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in other forms, and any person skilled in the art may use the above-mentioned technical contents to change or modify the equivalent embodiment into equivalent changes and apply to other fields, but any simple modification, equivalent change and modification made to the above embodiments according to the technical matters of the present invention will still fall within the protection scope of the technical solution of the present invention.
Claims (6)
1. A light source conversion chip packaging mechanism board for laser radar comprises: bottom plate (1), its characterized in that: the top of bottom plate (1) is fixed mounting L type frame A (2), workstation (8), metal frame (9), support frame (12) and L type frame B (15) respectively, mounting groove (5) have been seted up to one side that L type frame B (15) were kept away from to the outer wall of workstation (8), the inner wall bottom fixed mounting of mounting groove (5) has second electric telescopic handle (6), the output welding of second electric telescopic handle (6) has loading board (7), the fixed production in top center department of L type frame A (2) has first electric telescopic handle (3), the output fixed mounting of first electric telescopic handle (3) has electromagnetic plate (4).
2. The light source conversion chip packaging mechanism board for the laser radar according to claim 1, wherein: the welding of the interior table wall of metal frame (9) has motor (10), the output fixed mounting of motor (10) has first gear (11).
3. The light source conversion chip packaging mechanism board for the laser radar according to claim 2, wherein: the metal rod is movably inserted into one side of the outer wall of the support frame (12), a second gear (13) is fixedly sleeved on the outer surface of the metal rod, and a conveyor belt (14) is movably sleeved between the outer surfaces of the first gear (11) and the second gear (13).
4. The light source conversion chip packaging mechanism board for the laser radar according to claim 3, wherein: the top of the L-shaped frame B (15) is provided with a round hole, the inner surface wall of the round hole is fixedly inserted with a disinfection spray gun (16), and a spray head of the disinfection spray gun (16) acts on the conveyor belt (14).
5. The light source conversion chip packaging mechanism board for the laser radar according to claim 1, wherein: the top of L type frame B (15) has seted up the slide, and the interior table wall of slide is poor to be equipped with fly leaf (17) movably, the bottom of fly leaf (17) is provided with the brush.
6. The light source conversion chip packaging mechanism board for the laser radar according to claim 5, wherein: threaded hole (18) are seted up to one side that L type frame A (2) were kept away from to the outer wall of L type frame B (15), the inside swivelling joint of threaded hole (18) has threaded rod (19), the one end that is close to disinfection spray gun (16) of threaded rod (19) acts on one side that L type frame A (2) were kept away from in fly leaf (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121060751.4U CN215005852U (en) | 2021-05-18 | 2021-05-18 | Light source conversion chip packaging mechanism board for laser radar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121060751.4U CN215005852U (en) | 2021-05-18 | 2021-05-18 | Light source conversion chip packaging mechanism board for laser radar |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215005852U true CN215005852U (en) | 2021-12-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121060751.4U Expired - Fee Related CN215005852U (en) | 2021-05-18 | 2021-05-18 | Light source conversion chip packaging mechanism board for laser radar |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215005852U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117647867A (en) * | 2023-12-04 | 2024-03-05 | 江苏浦丹光电技术有限公司 | Integrated optical waveguide chip packaging device with adjusting structure |
-
2021
- 2021-05-18 CN CN202121060751.4U patent/CN215005852U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117647867A (en) * | 2023-12-04 | 2024-03-05 | 江苏浦丹光电技术有限公司 | Integrated optical waveguide chip packaging device with adjusting structure |
| CN117647867B (en) * | 2023-12-04 | 2024-05-07 | 江苏浦丹光电技术有限公司 | Integrated optical waveguide chip packaging device with adjusting structure |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211203 |
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| CF01 | Termination of patent right due to non-payment of annual fee |