CN214987176U - Transfer device for semiconductor packaging - Google Patents
Transfer device for semiconductor packaging Download PDFInfo
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- CN214987176U CN214987176U CN202120489030.9U CN202120489030U CN214987176U CN 214987176 U CN214987176 U CN 214987176U CN 202120489030 U CN202120489030 U CN 202120489030U CN 214987176 U CN214987176 U CN 214987176U
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- box body
- placing
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Abstract
The utility model discloses a transfer device for semiconductor packaging, which comprises a box body and a sealing cover, wherein the side surface of the box body is opened, a plurality of layers of slide rails are arranged in the box body, a placing plate is arranged on each layer of slide rail in a sliding manner, and a plurality of placing grooves with various specifications are arranged in the placing plate; the sealing cover comprises a side plate, a plurality of cover plates are arranged on the side surface of the side plate, and the cover plates correspond to the placing plates on each layer one by one and are used for covering the placing plates; and the sealing cover and the box body are locked by a door lock. The utility model has reasonable design, compact structure and convenient use; place board and standing groove through the setting and be used for storing semiconductor package, the rethread apron carries out spacing fixed, ensures the leakproofness on the one hand, seals the shading to semiconductor package and handles, and on the other hand carries out spacing fixed to the semiconductor of depositing the dress, avoids the damage.
Description
Technical Field
The utility model relates to a semiconductor processing technology field, concretely relates to transfer device for semiconductor package.
Background
Semiconductor package is the process that will pass through the wafer of test and process according to product model and function demand and obtain independent chip, still need carry out a series of operations after the plastic envelope, and warehouse entry shipment at last, and semiconductor package often need pass through transfer device when going out of the warehouse after, but current transfer device for semiconductor package still has certain defect, just for example:
1. because the conductivity of the semiconductor is obviously changed when the semiconductor is stimulated by external light and heat, the existing transfer device for semiconductor packaging has poor sealing and constant temperature functions, cannot effectively ensure the original characteristics of the semiconductor during transfer, and has certain use defects;
2. the existing transfer device for semiconductor packaging is poor in stability and cannot effectively limit and fix the stored semiconductor.
Aiming at the problems, innovative design is urgently needed on the basis of the structure of the original transfer device.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a transfer device for semiconductor package.
In order to achieve the above object, the utility model adopts the following technical scheme: the utility model provides a transfer device for semiconductor package, includes box and sealed lid, its innovation point lies in: the side surface of the box body is opened, a plurality of layers of slide rails are arranged in the box body, a placing plate is arranged on each layer of slide rail in a sliding mode, and a plurality of placing grooves with various specifications are formed in the placing plates; the sealing cover comprises a side plate, a plurality of cover plates are arranged on the side surface of the side plate, and the cover plates correspond to the placing plates on each layer one by one and are used for covering the placing plates; and the sealing cover and the box body are locked by a door lock.
Furthermore, the top of the box body is provided with a handle, and the bottom of the box body is provided with a shockproof footing.
Further, a spongy cushion is arranged at the bottom of the cover plate.
Furthermore, the door lock includes two, and is located the upper and lower both ends of curb plate.
After the structure is adopted, the utility model discloses beneficial effect does:
the utility model has reasonable design, compact structure and convenient use; place board and standing groove through the setting and be used for storing semiconductor package, the rethread apron carries out spacing fixed, ensures the leakproofness on the one hand, seals the shading to semiconductor package and handles, and on the other hand carries out spacing fixed to the semiconductor of depositing the dress, avoids the damage.
Drawings
Fig. 1 is a schematic view of the split structure of the present invention.
Description of reference numerals:
the box body 1, the sealing cover 2, the side plates 21, the cover plate 22, the spongy cushion 23, the sliding rails 3, the placing plates 4, the placing grooves 5, the door lock 6, the lifting handle 7 and the shockproof bottom feet 8.
Detailed Description
The present invention will be further described with reference to the accompanying drawings.
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and the following detailed description. It should be understood that the detailed description and specific examples, while indicating the invention, are given by way of illustration only.
Referring to fig. 1, a transfer device for semiconductor packaging comprises a box body 1 and a sealing cover 2, wherein the side surface of the box body 1 is open, a plurality of layers of sliding rails 3 are arranged in the box body, a placing plate 4 is arranged on each layer of sliding rails 3 in a sliding manner, and a plurality of placing grooves 5 with various specifications are formed in the placing plate 4; the sealing cover 2 comprises a side plate 21, a plurality of cover plates 22 are arranged on the side surface of the side plate 21, and the cover plates 22 correspond to the placing plates 4 on each layer one by one and are used for covering the placing plates 4; the sealing cover 2 and the box body 1 are locked by a door lock 6. Specifically, to place board 4 and pull out the back, place semiconductor package in corresponding standing groove 5, then will place board 4 and push into box 1 in, again with sealed lid 2 insert the box for apron 22 covers on placing board 4, carries out spacing fixed to semiconductor package, ensures the leakproofness on the one hand, seals the shading to semiconductor package and handles, and on the other hand carries out spacing fixed to the semiconductor of depositing the dress, avoids the damage.
In this embodiment, the top of the box body 1 is provided with a handle 7, and the bottom thereof is provided with a shockproof footing 8. The handle 7 facilitates the transfer of the device; the shockproof bottom foot 8 has a certain shock absorption function.
In this embodiment, a sponge pad 23 is provided on the bottom of the cover plate 22. The sponge pad 23 can prevent damage to the semiconductor package.
In this embodiment, door lock 6 includes two, and is located the upper and lower both ends of curb plate, ensures to lock sealed lid 2, avoids sealed lid 2 pine to fall.
The above description is only for the purpose of illustrating the technical solutions of the present invention and not for the purpose of limiting the same, and other modifications or equivalent replacements made by those of ordinary skill in the art to the technical solutions of the present invention should be covered within the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solutions of the present invention.
Claims (4)
1. The utility model provides a transfer device for semiconductor package, includes box and sealed lid, its characterized in that: the side surface of the box body is opened, a plurality of layers of slide rails are arranged in the box body, a placing plate is arranged on each layer of slide rail in a sliding mode, and a plurality of placing grooves with various specifications are formed in the placing plates; the sealing cover comprises a side plate, a plurality of cover plates are arranged on the side surface of the side plate, and the cover plates correspond to the placing plates on each layer one by one and are used for covering the placing plates; and the sealing cover and the box body are locked by a door lock.
2. The transfer device for semiconductor packages according to claim 1, wherein: the top of the box body is provided with a handle, and the bottom of the box body is provided with a shockproof bottom foot.
3. The transfer device for semiconductor packages according to claim 1, wherein: the bottom of the cover plate is provided with a spongy cushion.
4. The transfer device for semiconductor packages according to claim 1, wherein: the door lock includes two, and is located the upper and lower both ends of curb plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120489030.9U CN214987176U (en) | 2021-03-07 | 2021-03-07 | Transfer device for semiconductor packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120489030.9U CN214987176U (en) | 2021-03-07 | 2021-03-07 | Transfer device for semiconductor packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214987176U true CN214987176U (en) | 2021-12-03 |
Family
ID=79155990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120489030.9U Active CN214987176U (en) | 2021-03-07 | 2021-03-07 | Transfer device for semiconductor packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214987176U (en) |
-
2021
- 2021-03-07 CN CN202120489030.9U patent/CN214987176U/en active Active
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