CN214977512U - Double-loop temperature-controllable mold cooling device - Google Patents
Double-loop temperature-controllable mold cooling device Download PDFInfo
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- CN214977512U CN214977512U CN202023083770.7U CN202023083770U CN214977512U CN 214977512 U CN214977512 U CN 214977512U CN 202023083770 U CN202023083770 U CN 202023083770U CN 214977512 U CN214977512 U CN 214977512U
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Abstract
The utility model relates to a water-cooling board, in particular to controllable temperature's of two return circuits mould cooling device. The device includes: a main body 1; the main body 1 is a cuboid structure, a water inlet of the A loop is arranged at a position on one side of the structure, which is close to the left side of the cooling area, and a water outlet of the A loop is arranged at a position on the other side of the structure, which is close to the right side of the cooling area; a water inlet of a loop B is arranged at the left side of one side face of the structure, which is close to the center of the cooling area; a water outlet of the loop A is arranged at the position, close to the center of the cooling area, on the right side of the other side surface of the structure; the loop A comprises a plurality of large S loops and a plurality of small S loops; the B loop comprises a plurality of large S loops and a plurality of small S loops; the big S loop penetrates through the whole cooling device along the width direction, the lower small S loop penetrates through the lower half cooling device along the width direction, and the upper small S loop penetrates through the upper half cooling device along the width direction.
Description
Technical Field
The utility model relates to a water-cooling board, in particular to controllable temperature's of two return circuits mould cooling device.
Background
The water-cooling heat dissipation technology receives more and more attention in the forging equipment field as more economic and effective scheme, and the water-cooling plate is used as the important component of a water-cooling heat dissipation system, so that the equipment can be prevented from being damaged due to high temperature of the die, particularly, in the isothermal forging process, the die temperature is high, the forging time is long, the temperature rise of the equipment is more severe, and the heat dissipation device for reducing the temperature of the equipment is particularly important.
Disclosure of Invention
The utility model aims at: the utility model provides a two return circuits controllable temperature's mould cooling device, its interior water route agrees with forging equipment structure to thereby increase the heat radiating area that increases of water route is changed to the increase pin, reinforcing cooling effect, and through the heat dissipation function adjustment import water velocity of flow, realize the cooling control to the mould.
For solving the technical problem, the technical proposal of the utility model is that:
a dual-circuit temperature-controllable mold cooling apparatus, comprising: a main body (1);
the main body 1 is a cuboid structure, a water inlet of the A loop is arranged at a position on one side of the structure, which is close to the left side of the cooling area, and a water outlet of the A loop is arranged at a position on the other side of the structure, which is close to the right side of the cooling area; a water inlet of a loop B is arranged at the left side of one side face of the structure, which is close to the center of the cooling area; a water outlet of the loop A is arranged at the position, close to the center of the cooling area, on the right side of the other side surface of the structure; the loop A comprises a plurality of large S loops and a plurality of small S loops; the B loop comprises a plurality of large S loops and a plurality of small S loops; the large S loop penetrates through the whole cooling device along the width direction, the lower small S loop penetrates through the lower half cooling device along the width direction, the upper small S loop penetrates through the upper half cooling device along the width direction, and the first large S loop of the A loop is communicated with a water inlet of the A loop; the last small S loop is communicated with the water outlet of the loop A; the first upper small S loop is communicated with a water inlet of the B loop; the last big S loop of the loop B is communicated with a water outlet of the loop B; the upper small S loop and the lower small S loop are positioned between the water inlet of the B loop and the water outlet of the A loop and are not communicated.
Furthermore, the number of the upper small S loops and the number of the lower small S loops are related to the horizontal component of the distance between the water inlet of the loop B and the water outlet of the loop A; the number of large S-circuits is related to the length of the entire cooling device.
Furthermore, a plurality of U-shaped left heat dissipation loops are arranged on the leftmost side of the first large S loop of the loop A; the left heat dissipation loop is communicated with the first large S loop, and a pin is arranged on the first large S loop between the inlet and the outlet of the left heat dissipation loop;
when the pin is closed, water entering from the water inlet of the loop A enters the loop A through the left heat dissipation loop; when the pin is opened, the water flow entering from the water inlet of the A loop directly enters the A loop.
Furthermore, a plurality of U-shaped right heat dissipation loops are arranged on the rightmost side of the last large S loop of the loop B; the right heat dissipation loop is communicated with the last large S loop, and a pin is arranged on the last large S loop between the inlet and the outlet of the right heat dissipation loop;
when the pin is closed, the water of the last large S loop flows out of the water outlet of the B loop through the heat dissipation loop; when the pin is opened, the water flow of the last big S loop flows out from the water outlet of the B loop.
Furthermore, oblong blocks 3 which are vertical to two sides of the water path are arranged on the side surface of the main body 1 and are connected by welding; the block 3 is used for blocking the turning positions of a large S loop, a small S loop, a left heat dissipation loop and a right heat dissipation loop.
Furthermore, the leftmost waterway of the first large S loop of the A loop and the leftmost waterway of the first upper small S loop of the B loop are higher than other waterways.
Furthermore, joints 4 are arranged on the water inlet and the water outlet.
Drawings
Fig. 1 is a structure diagram of the main board of the present invention. FIG. 1, main body; 2. a pin; 3. blocking; 4. and (4) a joint.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings in the embodiments of the present invention are combined below to clearly and completely describe the technical solutions in the embodiments of the present invention. It is to be understood that the embodiments described are only some of the embodiments of the present invention, and not all of them. Based on the embodiments in the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative work belong to the protection scope of the present invention.
The water cooling plate is provided with a water inlet and a water outlet, the water inlet and the water outlet are provided with connectors, the connectors are connected through threads and are sealed by rubber gaskets or connected through hot inlaying.
The first water route of intaking of water-cooling board is higher than other water routes 8 ~ 12mm, utilizes the gravity principle in order to reduce the water resistance.
The water route of water-cooling board is round hole shape structure, and the oral area is located the 1/3 department of mainboard height.
The water cooling plate is provided with long circular blocks perpendicular to two sides of the water channel, and one block is connected with the two water channels to form an S-shaped corner by welding or hot-insert connection.
The water cooling plate adopts a machining blind hole due to a straight water path dead zone formed by the bolt connection structure, the diameter of the straight water path dead zone is larger than the diameter of a water path by 4-6 mm, the straight water path dead zone is deeper than the diameter of the water path by 12-16 mm, a cylindrical pin with a matched diameter is welded or hot-embedded, the top of the straight water path dead zone is level with the water cooling plate main body, and a long circular block is arranged in a direction parallel to the water path, so that 21274is realized in the water path, and the heat dissipation area of a main plate is increased due to a shape structure.
The water-cooling plate needs the central machine to add because of equipment ejector pin device and is greater than 1 ~ 3mm through-hole of ejector pin diameter, and 4 sections annular blind holes are established at this position to establish 20 ~ 50mm clearance, the degree of depth is the same with the water route degree of depth, and machine adds the water route annular structure and accomplishes the back, and welding or hot inlaying match shape sprue, the external diameter is greater than 8 ~ 12mm of hole external diameter, and the internal diameter is less than 8 ~ 12mm outside the hole, and the sprue degree of depth is flat mutually with the water route up end.
The water cooling plate is square, and the side length is not less than the maximum side length of the die holder. Example dimensions are shown in table 1.
TABLE 1
| L(mm) | B(mm) | H(mm) |
| 950 | 950 | 120 |
| 1190 | 950 | 120 |
The cooling plate in this example had dimensions of 950 (L). times.950 (B). times.120 (H) mm, and was made of ZG45 steel plate.
In this embodiment, the water-cooling plate is provided with two AB loops, and the water-cooling plate is provided with 2 water inlets and 2 water outlets, and the inlet and the outlet are provided with connectors, are connected by threads, and are sealed by rubber gaskets. The water inlet waterway is 10mm higher than the rest waterways
The hole-shaped structure is 35mm away from the upper main board surface in diameter, long circular blocks are arranged on two sides perpendicular to the water paths and are connected in a welding mode, and one block is connected with the two water paths to form an S-shaped corner.
In the embodiment, the blind hole is machined in the dead zone position of the bolt of the water cooling plate, and the diameter of the blind hole
15mm deep in water way and welding diameter
The top of the cylindrical pin is parallel to the water cooling plate main body, and an oblong plugging block is arranged in the direction parallel to the water channel.
Ejector rod device center machining device of water cooling plate matching equipment in embodiment
The through hole is provided with 4 sections of annular blind holes, the L-direction gap is 50mm, the B-direction gap is 20mm, and the outer diameter
Inner diameter
The depth is the same as the depth of the water channel, and after the annular structure of the water channel is added, the matched-shape block and the outer diameter are welded
Inner diameter
The depth of the block is equal to the upper end surface of the water path.
In this embodiment, the cooling time t is 20min, and the inflow water flow rate λ is 5cm3S, mold temperature T0The contact area S of the cooling plate and the die is 90.25cm at 400 DEG C2The thermal conductivity k of the die material is 0.39, and the following formula is adopted: f (T) f (λ, T)0，S，k，t)；
And finally controlling the temperature T of the workbench to be 200 ℃.
In this embodiment, asbestos plates with a thickness of 950 × 950 × 10mm are added between the water cooling plate and the upper and lower molds.
The invention provides a double-loop temperature-controllable mold cooling device, which comprises: a main body 1;
the main body 1 is a cuboid structure, a water inlet of the A loop is arranged at a position on one side of the structure, which is close to the left side of the cooling area, and a water outlet of the A loop is arranged at a position on the other side of the structure, which is close to the right side of the cooling area; a water inlet of a loop B is arranged at the left side of one side face of the structure, which is close to the center of the cooling area; a water outlet of the loop A is arranged at the position, close to the center of the cooling area, on the right side of the other side surface of the structure; the loop A comprises a plurality of large S loops and a plurality of small S loops; the B loop comprises a plurality of large S loops and a plurality of small S loops; the large S loop penetrates through the whole cooling device along the width direction, the lower small S loop penetrates through the lower half cooling device along the width direction, the upper small S loop penetrates through the upper half cooling device along the width direction, and the first large S loop of the A loop is communicated with a water inlet of the A loop; the last small S loop is communicated with the water outlet of the loop A; the first upper small S loop is communicated with a water inlet of the B loop; the last big S loop of the loop B is communicated with a water outlet of the loop B; the upper small S loop and the lower small S loop are positioned between the water inlet of the B loop and the water outlet of the A loop and are not communicated.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solutions of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of various equivalent modifications or substitutions within the technical scope of the present invention, and these modifications or substitutions should be covered within the protection scope of the present invention.
Claims (7)
1. A dual-circuit temperature-controllable mold cooling device, comprising: a main body (1);
the main body (1) is of a cuboid structure, a water inlet of the A loop is arranged at a position, close to the left side of the cooling area, on one side of the structure, and a water outlet of the A loop is arranged at a position, close to the right side of the cooling area, on the other side of the structure; a water inlet of a loop B is arranged at the left side of one side face of the structure, which is close to the center of the cooling area; a water outlet of the loop A is arranged at the position, close to the center of the cooling area, on the right side of the other side surface of the structure; the loop A comprises a plurality of large S loops and a plurality of small S loops; the B loop comprises a plurality of large S loops and a plurality of small S loops; the large S loop penetrates through the whole cooling device along the width direction, the lower small S loop penetrates through the lower half cooling device along the width direction, the upper small S loop penetrates through the upper half cooling device along the width direction, and the first large S loop of the A loop is communicated with a water inlet of the A loop; the last small S loop is communicated with the water outlet of the loop A; the first upper small S loop is communicated with a water inlet of the B loop; the last big S loop of the loop B is communicated with a water outlet of the loop B; the upper small S loop and the lower small S loop are positioned between the water inlet of the B loop and the water outlet of the A loop and are not communicated.
2. The device of claim 1, wherein the number of upper small S-loops and the number of lower small S-loops are related to the horizontal component of the distance between the water inlet of the B-loop and the water outlet of the a-loop; the number of large S-circuits is related to the length of the entire cooling device.
3. The device of claim 1, wherein a plurality of U-shaped left heat dissipation loops are arranged on the leftmost side of the first large S loop of the A loop; the left heat dissipation loop is communicated with the first large S loop, and a pin is arranged on the first large S loop between the inlet and the outlet of the left heat dissipation loop;
when the pin is closed, water entering from the water inlet of the loop A enters the loop A through the left heat dissipation loop; when the pin is opened, the water flow entering from the water inlet of the A loop directly enters the A loop.
4. The device of claim 1, wherein the rightmost side of the last big S loop of the B loop is provided with a plurality of U-shaped right heat dissipation loops; the right heat dissipation loop is communicated with the last large S loop, and a pin is arranged on the last large S loop between the inlet and the outlet of the right heat dissipation loop;
when the pin is closed, the water of the last large S loop flows out of the water outlet of the B loop through the heat dissipation loop; when the pin is opened, the water flow of the last big S loop flows out from the water outlet of the B loop.
5. The device according to claim 1, characterized in that the lateral surface of the body (1) is provided with oblong blocks (3) perpendicular to the water path, connected by welding; the block (3) is used for blocking the turning positions of the large S loop, the small S loop, the left heat dissipation loop and the right heat dissipation loop.
6. The apparatus of claim 1 wherein the leftmost waterway of the first large S-circuit of the a-circuit and the leftmost waterway of the first upper small S-circuit of the B-circuit are both higher than the other waterways.
7. Device according to any of claims 1-6, characterized in that the water inlet and outlet are provided with fittings (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023083770.7U CN214977512U (en) | 2020-12-18 | 2020-12-18 | Double-loop temperature-controllable mold cooling device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023083770.7U CN214977512U (en) | 2020-12-18 | 2020-12-18 | Double-loop temperature-controllable mold cooling device |
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| CN214977512U true CN214977512U (en) | 2021-12-03 |
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| CN202023083770.7U Active CN214977512U (en) | 2020-12-18 | 2020-12-18 | Double-loop temperature-controllable mold cooling device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114564094A (en) * | 2022-02-28 | 2022-05-31 | 上海顺诠科技有限公司 | Server, water cooling assembly and water cooling plate assembly |
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2020
- 2020-12-18 CN CN202023083770.7U patent/CN214977512U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114564094A (en) * | 2022-02-28 | 2022-05-31 | 上海顺诠科技有限公司 | Server, water cooling assembly and water cooling plate assembly |
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