CN214960357U - Special-shaped binding pressure head for special-shaped driving chip - Google Patents

Special-shaped binding pressure head for special-shaped driving chip Download PDF

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CN214960357U
CN214960357U CN202121076663.3U CN202121076663U CN214960357U CN 214960357 U CN214960357 U CN 214960357U CN 202121076663 U CN202121076663 U CN 202121076663U CN 214960357 U CN214960357 U CN 214960357U
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special
shaped
terminal group
pressure head
substrate
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李航
章小和
郑瑞建
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Truly Opto Electronics Ltd
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Truly Opto Electronics Ltd
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Abstract

The utility model discloses a special-shaped binding pressure head for a special-shaped driving chip; the special-shaped driving chip comprises a substrate, a first terminal group positioned above the substrate and a second terminal group positioned below the substrate, wherein two ends of the first terminal group are downward inclined sections; the special-shaped binding pressure head is trapezoidal in shape; the trapezoid inclined edges of the special-shaped binding pressure head are respectively matched with the shapes of the downward inclined sections at the two ends of the first terminal group. This application not only is favorable to display device's narrow frame design, can also avoid the dysmorphism to bind the pressure head and press when pushing down and lead to the drive chip atress inequality to appear damaging in blank region department of drive chip, has improved and has bound the yield.

Description

Special-shaped binding pressure head for special-shaped driving chip
Technical Field
The utility model relates to a show technical field, especially relate to a pressure head dysmorphism is bound to pressure head dysmorphism and is bound pressure head for special-shaped driver chip's dysmorphism.
Background
In the field of display devices, consumers have increasingly demanded visual effects of display devices such as mobile phones, and for example, full-screen and high-screen occupation ratios have become major selling points of smart phones. In order to improve the screen ratio of the mobile phone, the lower frame of the mobile phone needs to be made smaller.
Under this background, it is considered by those skilled in the art how to reduce the width of the frame of the display panel occupied by the connection wires on the premise that the connection wires of the driving chip and the display panel meet the requirement of the wire distance. In addition, as the conventional bonding head and the driving chip are shown in fig. 1, those skilled in the art need to avoid the problem of product yield caused by poor process occurring in the production process after the driving chip is improved.
SUMMERY OF THE UTILITY MODEL
To prior art's not enough, this application provides a pressure head is bound to dysmorphism for special-shaped driver chip for bind special-shaped driver chip. The special-shaped driving chip is beneficial to the design of a narrow frame of a display device; through the utility model discloses a dysmorphism is tied up the pressure head and is bound special-shaped drive chip, can also keep away the dysmorphism and bind the pressure head and press when pushing down and lead to special-shaped drive chip atress inequality to appear damaging in special-shaped drive chip's blank area department, has improved and has bound the yield.
The special-shaped binding pressure head for the special-shaped driving chip comprises a substrate, a first terminal group and a second terminal group, wherein the first terminal group is located above the substrate, the second terminal group is located below the substrate, and two ends of the first terminal group are downward inclined sections; the special-shaped binding pressure head is trapezoidal in shape; the trapezoid inclined edges of the special-shaped binding pressure head are respectively matched with the shapes of the downward inclined sections at the two ends of the first terminal group.
As the improvement scheme of the special-shaped binding pressure head for the special-shaped driving chip, the substrate is of a rectangular structure.
As the improvement scheme of the special-shaped binding pressure head for the special-shaped driving chip, the substrate is of a trapezoidal structure, and the inclined edge of the substrate corresponds to the inclined section of the output terminal group.
As the improvement scheme that is used for dysmorphism driver chip's dysmorphism to bind the pressure head that this application provided, the trapezoidal hypotenuse that the pressure head was bound to the dysmorphism is parallel with the hypotenuse of base plate.
As the improvement scheme of the special-shaped binding pressure head for the special-shaped driving chip, the first terminal group is an output terminal group, and the second terminal group is an input terminal group.
As an improvement of the special-shaped binding pressure head for the special-shaped drive chip, the downward inclined sections at the two ends of the first terminal group at least comprise two terminals.
As the improvement scheme of the special-shaped binding pressure head for the special-shaped driving chip, the downward inclined sections at the two ends of the first terminal group are symmetrically designed.
As the improvement scheme of the special-shaped binding pressure head for the special-shaped driving chip, the output end groups are multiple groups.
As the improvement scheme of the special-shaped binding pressure head for the special-shaped driving chip, the second terminal group is linearly arranged and parallel to the long edge of the substrate.
As the improvement scheme of the special-shaped binding pressure head for the special-shaped driving chip, the downward inclined sections at the two ends of the first terminal group are parallel to the inclined edge of the substrate.
Compared with the prior art, the utility model discloses following beneficial effect has:
the utility model discloses a pressure head is bound to dysmorphism for bind dysmorphism driver chip. The special-shaped driving chip is in a special-shaped design, and the two ends of the first terminal group above the substrate are downward inclined sections, so that the frame width of the display panel required to be occupied by the connecting wiring can be reduced structurally, the occupied non-display area width of one side of the chip integration area of the display panel is reduced, and the narrow frame design of the display device is facilitated; the special-shaped binding pressure head is trapezoidal, and the trapezoidal inclined edge of the special-shaped binding pressure head is respectively matched with the downward inclined sections at the two ends of the first terminal group, so that when the special-shaped binding pressure head is pressed downwards, the special-shaped driving chip can be prevented from being damaged due to uneven stress at the blank area of the special-shaped driving chip; therefore, through the utility model discloses a dysmorphism is tied up the pressure head and is bound special-shaped driver chip, can improve and bind the yield.
Drawings
Fig. 1 is a schematic structural diagram of a conventional special-shaped drive chip and a special-shaped binding pressure head;
fig. 2 is a schematic structural diagram of a special-shaped driving chip according to an embodiment of the present application;
FIG. 3 is a schematic structural diagram of a special-shaped driver chip and a bonding indenter of the prior art according to an embodiment of the present application;
FIG. 4 is a schematic structural diagram of a profiled binding ram according to an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of a special-shaped driver chip and a special-shaped binding head according to an embodiment of the present application;
FIG. 6 is a schematic structural diagram of another special-shaped driver chip according to an embodiment of the present application;
fig. 7 is a schematic structural diagram of the special-shaped drive chip shown in fig. 6 and the special-shaped binding indenter of the present application.
The attached drawings are marked as follows:
the terminal comprises a substrate (10), a first terminal group (20), a second terminal group (30), a horizontal section (21), an inclined section (22), a binding pressure head (40'), a special-shaped binding pressure head (40), a trapezoid structure bevel edge (11) and a trapezoid bevel edge (41).
Detailed Description
In order to make the technical solution of the present invention better understood, the technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship indicated based on the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; may be mechanically coupled, may be electrically coupled or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
The technical solution of the present invention for binding the pressure head in the special shape of the special-shaped driver chip is further described in detail through the accompanying drawings and the embodiments.
Refer to fig. 2~7 and show, do the utility model provides a pair of pressure head (40) is bound to dysmorphism to and bind the corresponding dysmorphism driver chip of pressure head (40) with the dysmorphism.
The application provides a pressure head (40) is binded to dysmorphism for dysmorphism driver chip, dysmorphism driver chip includes base plate (10), and is located first terminal group (20) and the second terminal group (30) that are located base plate (10) below above base plate (10).
The special-shaped driving chip is shown in fig. 2, wherein the middle of the first terminal group (20) is a horizontal section (21), the two ends of the first terminal group are downward inclined sections (22), and the two ends of the first terminal group are sunken. Through the design of the downward inclined sections (22) at the two ends of the first terminal group (20), the corresponding connecting wires can be correspondingly adjusted, the connecting wires corresponding to the positions of the downward inclined sections (22) move downwards, the width of the frame of the display panel occupied by the connecting wires is reduced, the width of the non-display area on one side of the chip integration area of the display panel occupied is reduced, and the narrow frame design of the display device is facilitated.
However, as shown in fig. 2, after the first terminal set (20) is designed to be inclined downwards at two ends, blank regions appear in the upper left corner and the upper right corner of the special-shaped driving chip.
The existing binding ram (40') is shaped in a rectangular configuration, as shown in fig. 3. In the binding process, when the binding pressure head presses down, the special-shaped driving chip at the blank area is easy to be stressed uniformly and damaged easily.
In order to improve the problems, the special-shaped binding pressure head (40) is improved. As shown in fig. 4, the profiled binding ram (40) of the present embodiment is trapezoidal in shape. Unlike the binding indenter of the prior art, the profiled binding indenter (40) of the present application is designed with the upper left and right corners chamfered so that a beveled edge is created at a location corresponding to the downwardly inclined section (22) of the first terminal set (20); therefore, at least the upper part of the special-shaped binding pressure head (40) is trapezoidal in shape, and for the convenience of description, the special-shaped binding pressure head (40) is referred to as trapezoidal in shape. As will be appreciated by those skilled in the art, the profiled binding ram (40) is shaped like a trapezoid or is trapezoidal.
As shown in FIG. 5, which is a schematic diagram of the matching between the special-shaped binding pressure head (40) and the special-shaped driving chip, the trapezoidal inclined sides (41) of the special-shaped binding pressure head (40) are respectively matched with the shapes of the downward inclined sections (22) at the two ends of the first terminal group (20).
As one embodiment of the special-shaped driving chip, the substrate (10) of the special-shaped driving chip shown in fig. 2 and 5 is of a rectangular structure. As shown in FIG. 5, when the special-shaped binding pressure head (40) presses down, blank areas at the upper left corner and the upper right corner of the special-shaped driving chip are not stressed in the binding process.
The special-shaped binding pressure head (40) is trapezoidal, and the trapezoidal inclined edge (41) of the special-shaped binding pressure head (40) is respectively matched with the downward inclined sections (22) at the two ends of the first terminal group (20), so that when the special-shaped binding pressure head (40) is pressed down, the situation that the special-shaped driving chip is damaged due to uneven stress in the binding process due to the fact that the special-shaped driving chip is pressed at the blank area of the special-shaped driving chip can be avoided; therefore, through the utility model discloses a pressure head (40) are bound to dysmorphism drive chip to the dysmorphism, can improve and bind the yield.
In the present application, the first terminal group (20) is an output terminal group for transmitting the external signal to the display device. The second terminal group (30) is an input terminal group which is used for transmitting external signals and is usually connected with the FPC.
The special-shaped driving chip of the embodiment of the application comprises at least two terminals respectively arranged on the downward inclined sections (22) at two ends of the first terminal group (20). In practice, the downwardly inclined section (22) includes a plurality of terminals, the number of which is not limited to the number shown in fig. 2.
As a further preferred solution, the two downwardly inclined sections (22) at both ends of the first terminal group (20) are of symmetrical design.
In the embodiment of the present application, the output terminal groups may be a group or a plurality of groups. Preferably, the output terminal sets are multiple sets.
When the second terminal group (30) is an input terminal group, the second terminal group (30) is arranged in a straight line and is parallel to the long side of the substrate (10). The utility model provides a dysmorphism drive chip, the length of output terminal group is greater than the length of input terminal group.
As a modification of the special-shaped driving chip, in another embodiment, the substrate (10) of the special-shaped driving chip is in a trapezoidal structure. The special-shaped driving chip is designed to carry out corner cutting on blank areas at the upper left corner and the upper right corner, so that at least the upper part of the substrate (10) is in a trapezoidal shape. It will be understood by those skilled in the art that the substrate (10) having a trapezoidal configuration means that the substrate (10) is shaped like a trapezoid or is trapezoidal.
As shown in fig. 6, the upper portion of the substrate (10) is trapezoidal, and the oblique side (11) of the trapezoidal structure of the substrate (10) corresponds to the position of the oblique section (22) of the output terminal group. In this case, the profiled binding ram (40) as shown in fig. 4 is also suitable for the profiled drive chip; fig. 7 is a schematic diagram showing the matching of the profile binding ram (40) and the profile driving chip. Preferably, the trapezoidal inclined edge (41) of the special-shaped binding pressure head (40) is parallel to the trapezoidal structure inclined edge (11) of the substrate (10).
The trapezoidal structure inclined edge (11) of the substrate (10) corresponds to the inclined section (22) of the output terminal group in position, and the trapezoidal structure inclined edge (11) can be not parallel to the inclined section (22) of the output terminal group. As long as the damage of the special-shaped driving chip caused by uneven stress in the binding process can be avoided. But as a further preferable scheme, the downward inclined sections (22) at the two ends of the first terminal group (20) are parallel to the inclined side (11) of the trapezoidal structure of the substrate (10); this allows a more orderly arrangement of the connection tracks and a further space optimization.
Compared with the prior art, the utility model discloses following beneficial effect has:
the utility model discloses a pressure head is bound to dysmorphism for bind dysmorphism driver chip. The special-shaped driving chip is designed in a special shape, the two ends of the first terminal group above the substrate are downward inclined sections, and the width of a frame, which is required to occupy the display panel by connecting and routing, can be reduced structurally, so that the width of a non-display area on one side of a chip integration area of the display panel, which is occupied, is reduced, and the narrow frame design of the display device is facilitated. The special-shaped binding pressure head matched with the special-shaped driving chip is trapezoidal, and the trapezoidal inclined edge of the special-shaped binding pressure head is respectively matched with the downward inclined sections at the two ends of the first terminal group, so that when the special-shaped binding pressure head is pressed downwards, the damage of the special-shaped driving chip caused by uneven stress on the blank area of the special-shaped driving chip in the binding process can be avoided; therefore, through the utility model discloses a dysmorphism is tied up the pressure head and is bound special-shaped driver chip, can improve and bind the yield.
It is to be understood that the above-described embodiments are only some of the embodiments of the present application, and not all embodiments of the present application. This application is capable of embodiments in many different forms and is provided for the purpose of enabling a thorough understanding of the disclosure of the application. Although the present application has been described in detail with reference to the foregoing embodiments, it will be apparent to one skilled in the art that the present application may be practiced without modification or with equivalents of some of the features described in the foregoing embodiments. All equivalent structures made by using the contents of the specification and the drawings of the present application are directly or indirectly applied to other related technical fields and are within the protection scope of the present application.

Claims (10)

1. The special-shaped binding pressure head for the special-shaped driving chip is characterized in that the special-shaped driving chip comprises a substrate, a first terminal group positioned above the substrate and a second terminal group positioned below the substrate, wherein two ends of the first terminal group are downward inclined sections; the special-shaped binding pressure head is trapezoidal in shape; the trapezoid inclined edges of the special-shaped binding pressure head are respectively matched with the shapes of the downward inclined sections at the two ends of the first terminal group.
2. The profiled binding ram for a profiled drive chip as claimed in claim 1, wherein the base plate is of a rectangular configuration.
3. The profile binding indenter of claim 1 wherein the substrate has a trapezoidal configuration, the oblique side of the substrate corresponding to the oblique segment of the output terminal set.
4. The profile binding indenter of claim 3, wherein the hypotenuse of the profile binding indenter is parallel to the hypotenuse of the substrate.
5. The profile binding ram for a profile driver chip of claim 1, wherein the first terminal set is an output terminal set and the second terminal set is an input terminal set.
6. A profiled binding ram for a profiled drive chip according to claim 5, characterised in that the downwardly inclined sections at both ends of the first terminal group comprise at least two terminals.
7. The profiled binding ram for a profiled drive chip according to claim 5, characterized in that the downwardly inclined sections at both ends of the first terminal group are of symmetrical design.
8. The profile bonding indenter for a profile driver chip of claim 5, wherein the sets of output terminals are in multiple sets.
9. The profile bonding indenter for a profile driver chip of claim 5, wherein the second terminal set is linearly arranged and parallel to the long side of the substrate.
10. The profile binding ram for a profile driver chip of claim 1, wherein the downwardly inclined segments at the two ends of the first terminal group are parallel to the oblique edge of the substrate.
CN202121076663.3U 2021-05-19 2021-05-19 Special-shaped binding pressure head for special-shaped driving chip Active CN214960357U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121076663.3U CN214960357U (en) 2021-05-19 2021-05-19 Special-shaped binding pressure head for special-shaped driving chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121076663.3U CN214960357U (en) 2021-05-19 2021-05-19 Special-shaped binding pressure head for special-shaped driving chip

Publications (1)

Publication Number Publication Date
CN214960357U true CN214960357U (en) 2021-11-30

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Application Number Title Priority Date Filing Date
CN202121076663.3U Active CN214960357U (en) 2021-05-19 2021-05-19 Special-shaped binding pressure head for special-shaped driving chip

Country Status (1)

Country Link
CN (1) CN214960357U (en)

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