CN214960345U - Heat treatment device for roll-to-roll production process of flexible circuit board - Google Patents
Heat treatment device for roll-to-roll production process of flexible circuit board Download PDFInfo
- Publication number
- CN214960345U CN214960345U CN202120453358.5U CN202120453358U CN214960345U CN 214960345 U CN214960345 U CN 214960345U CN 202120453358 U CN202120453358 U CN 202120453358U CN 214960345 U CN214960345 U CN 214960345U
- Authority
- CN
- China
- Prior art keywords
- flexible circuit
- heat treatment
- roll
- circuit board
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model provides a heat treatment device for flexible circuit board roll-to-roll production technology, a serial communication port, include: the flexible circuit board curing device comprises transmission units (10) used for transmitting continuous cured flexible circuit boards (11), wherein the flexible circuit boards (11) comprise flexible base materials (110) connected between the transmission units (10) and conductive networks (112) which are arranged on the flexible base materials (110) in an interval and curing mode; the high-temperature heat treatment unit (13) is used for carrying out instant high-temperature heat treatment on the conductive network (112), and comprises a protective cover (130) and a xenon light source (132) arranged in the protective cover (130), wherein the instant temperature of the xenon light source (132) reaches 400-1000 ℃.
Description
Technical Field
The utility model relates to a heat treatment device for a roll-to-roll production process of a flexible circuit board.
Background
At present, with the rapid development of the electronic industry in recent years, the demand of electronic products such as membrane switches, flexible printed circuit boards, electromagnetic shields, potentiometers, radio frequency identification systems, solar cells and the like is rapidly increased, and the development and application of conductive silver paste as a key functional material for preparing such electronic components are also widely concerned by people. The low-temperature cured conductive silver paste is silver paste with lower curing temperature (between 100 ℃ and 200 ℃), and can be printed on materials such as PET/PI/coated paper/silk ribbon/water washing cloth with lower glass transition temperature and low cost. The silver paste for the flexible circuit board also belongs to low-temperature conductive silver paste, is environment-friendly conductive silver paste, and has the requirements of good adhesion with a flexible substrate, excellent conductivity, good printability, bending resistance, certain hardness and the like.
At present, most of flexible circuit boards in China are generally subjected to simple curing treatment, however, the conductivity of the cured flexible circuit boards is limited, and needs to be further improved.
SUMMERY OF THE UTILITY MODEL
The utility model provides a heat treatment device for flexible circuit board roll-to-roll production technology, which can effectively solve the problems.
The utility model discloses a realize like this:
a heat treatment apparatus for a roll-to-roll production process of a flexible circuit board, comprising:
the transmission unit is used for transmitting a continuous and cured flexible circuit board, and the flexible circuit board comprises flexible base materials connected between the transmission units and conductive networks which are arranged on the flexible base materials in a spaced and cured mode;
the high-temperature heat treatment unit is used for carrying out instant high-temperature heat treatment on the conductive network and comprises a protective cover and a xenon light source arranged in the protective cover, wherein the instant temperature of the xenon light source reaches 400-1000 ℃.
As a further improvement, the thermal processing apparatus further comprises a curing apparatus for curing the conductive silver paste printed on the flexible substrate, and the curing apparatus comprises a housing and a heating unit disposed in the housing.
As a further improvement, the conductive silver paste comprises a general formula of Ag-S- (C)2H4O)n-organic silver ion compounds of COH and silver nanopowders.
The utility model has the advantages that: by carrying out instantaneous high-temperature ultraviolet treatment on the conductive network, conductive particles in the conductive network can be instantaneously fused at high temperature, and part of organic metal compounds are decomposed, so that the conductivity of the conductive network can be improved by about 30-40%, and the performance of the flexible circuit board is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a heat treatment apparatus for a roll-to-roll production process of a flexible circuit board according to an embodiment of the present invention.
Fig. 2 is a flow chart of a method for preparing a novel silver paste used in a heat treatment device of a roll-to-roll production process of a flexible circuit board according to an embodiment of the present invention.
Fig. 3 is a structural diagram of a flexible antenna pattern processed by a heat treatment device for a roll-to-roll flexible circuit board production process according to an embodiment of the present invention.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1, an embodiment of the present invention provides a heat treatment apparatus for a roll-to-roll production process of a flexible circuit board, including:
the flexible circuit board assembly comprises a transmission unit 10, a first fixing unit and a second fixing unit, wherein the transmission unit 10 is used for transmitting a continuous and solidified flexible circuit board 11, the flexible circuit board 11 comprises flexible base materials 110 connected between the transmission unit 10 and conductive networks 112 which are arranged on the flexible base materials 110 in an interval and solidified mode;
the high temperature heat treatment unit 13 is configured to perform instantaneous high temperature heat treatment on the conductive network 112, and includes a protective cover 130 and a xenon light source 132 disposed in the protective cover 130, wherein an instantaneous temperature of the xenon light source 132 reaches 400 ℃ to 1000 ℃.
The driving unit 10 may be a roller, and the flexible substrate 110 is connected between the rollers and is conveyed by the rollers. The conductive network 112 may be formed by printing a conductive silver paste on the flexible substrate 110 base through a screen printing process. The material of the conductive silver paste is not limited. Preferably, the embodiment of the present invention provides a novel conductive silver paste, and the specific preparation method thereof is as follows:
referring to fig. 2, an embodiment of the present invention provides a method for preparing a novel silver paste for a roll-to-roll production process of a flexible circuit board, including the following steps:
s1, heating and dissolving cellulose methyl ether in petroleum ether to prepare a first solution with the concentration of 5-10 wt%, and dissolving the first solution with the general formula of Ag-S- (C)2H4O)n-dissolving organic silver ion compound of COH in propanol to form a second solution with a concentration of 30-35 wt%, wherein n is 2-4;
s2, adding silver nano powder into the first solution to form a first mixture with the total concentration of 65-70 wt%;
s3, mixing the second solution and the first mixture according to the volume ratio of 0.5-0.8: 1, and stirring at high speed to fully disperse to form silver gray slurry;
s4, adding petroleum ether into the silver gray slurry to prepare the novel silver paste with the viscosity of 15000-25000 cps at 25 ℃, the solid content of more than or equal to 75% and less than or equal to 85% at 150 ℃ and the sheet resistance of less than or equal to 12m omega/□/mil.
Example 1:
heating and dissolving cellulose methyl ether in petroleum ether to obtain a first solution with a concentration of 5 wt%, and adding Ag-S- (C)2H4O)2-COH is dissolved in propanol to form a second solution with a concentration of 30 wt%; adding silver nanopowder to said first solution to form a first mixture with a total concentration of 65 wt%; mixing the second solution with the first mixture according to the volume ratio of 0.5:1, and fully dispersing at high speed to form silver gray slurry; petroleum ether is added into the silver gray slurry to prepare a novel silver slurry with the viscosity of 18000cps at 25 ℃, the solid content of 75% at 150 ℃ and the sheet resistance of 12m omega/□/mil.
Example 2:
heating and dissolving cellulose methyl ether in petroleum ether to prepare a first solution with the concentration of 8 wt%, and adding Ag-S- (C)2H4O)2-COH is dissolved in propanol to form a second solution with a concentration of 32 wt%; adding silver nanopowder to said first solution to form a first mixture having a total concentration of 68 wt%; dissolving the second solution inMixing the liquid and the first mixture according to the volume ratio of 0.6:1, and fully dispersing the mixture at a high speed to form silver gray slurry; petroleum ether is added into the silver gray slurry to prepare a novel silver slurry with the viscosity of 18000cps at 25 ℃, the solid content of 78% at 150 ℃ and the sheet resistance of 10m omega/□/mil.
Example 3:
heating and dissolving cellulose methyl ether in petroleum ether to prepare a first solution with the concentration of 10 wt%, and adding Ag-S- (C)2H4O)2-COH is dissolved in propanol to form a second solution with a concentration of 35 wt%; adding silver nanopowder to said first solution to form a first mixture having a total concentration of 70 wt%; mixing the second solution with the first mixture according to the volume ratio of 0.8:1, and fully dispersing at high speed to form silver gray slurry; petroleum ether is added into the silver gray slurry to prepare a novel silver slurry with the viscosity of 18000cps at 25 ℃, the solid content of 82% at 150 ℃ and the sheet resistance of 12m omega/□/mil.
Comparative example 1:
heating and dissolving cellulose methyl ether in petroleum ether to prepare a first solution with the concentration of 8 wt%, and adding Ag-S- (C)2H4O)2-COH is dissolved in propanol to form a second solution with a concentration of 25 wt%; adding silver nanopowder to said first solution to form a first mixture having a total concentration of 68 wt%; mixing the second solution with the first mixture according to the volume ratio of 0.6:1, and fully dispersing at high speed to form silver gray slurry; petroleum ether is added into the silver gray slurry to prepare silver paste with viscosity of 18000cps at 25 ℃, solid content of about 76% at 150 ℃ and sheet resistance of about 14m omega/□/mil.
Comparative example 2:
heating and dissolving cellulose methyl ether in petroleum ether to prepare a first solution with the concentration of 8 wt%, and adding Ag-S- (C)2H4O)2-COH is dissolved in propanol to form a second solution with a concentration of 40 wt%; adding silver nanopowder to said first solution to form a first mixture having a total concentration of 68 wt%; mixing the second solution with the first solutionMixing the mixture according to the volume ratio of 0.6:1, and fully dispersing the mixture at a high speed to form silver gray slurry; petroleum ether is added into the silver gray slurry to prepare silver paste with viscosity of 18000cps at 25 ℃, solid content of 79% at 150 ℃ and sheet resistance of 13m omega/□/mil.
Comparative example 3:
heating and dissolving cellulose methyl ether in petroleum ether to prepare a first solution with the concentration of 3 wt%, and adding Ag-S- (C)2H4O)2-COH is dissolved in propanol to form a second solution with a concentration of 32 wt%; adding silver nanopowder to said first solution to form a first mixture having a total concentration of 68 wt%; mixing the second solution with the first mixture according to the volume ratio of 0.6:1, and fully dispersing at high speed to form silver gray slurry; petroleum ether is added into the silver gray slurry to prepare a novel silver slurry with the viscosity of 18000cps at 25 ℃, the solid content of 78% at 150 ℃ and the sheet resistance of 14m omega/□/mil.
Comparative example 4:
heating and dissolving cellulose methyl ether in petroleum ether to prepare a first solution with the concentration of 15 wt%, and adding Ag-S- (C)2H4O)2-COH is dissolved in propanol to form a second solution with a concentration of 32 wt%; adding silver nanopowder to said first solution to form a first mixture having a total concentration of 68 wt%; mixing the second solution with the first mixture according to the volume ratio of 0.6:1, and fully dispersing at high speed to form silver gray slurry; petroleum ether is added into the silver gray slurry to prepare a novel silver slurry with the viscosity of 18000cps at 25 ℃, the solid content of 78% at 150 ℃ and the sheet resistance of 15m omega/□/mil.
Test example:
the novel silver paste is printed on a coated paper by using screen printing equipment (the fineness of a scraper blade is 4th scratch: ≦ 3 microns, 50% point: ≦ 2 microns) to form a flexible antenna (a structure shown in figure 3), and after the novel silver paste is dried at 150 ℃ for 5 minutes, adhesion, hardness, bending resistance and electric conductivity tests are carried out, wherein the size of the flexible antenna is 10mm x 70mm, the thickness of the coated paper is 85 microns, and the thickness of the novel silver paste is 10 microns. In addition, the adhesion test was conducted primarily by the 3M600 tape test to confirm whether 100/100 did not significantly peel off; bending resistance test, mainly testing whether the formed circuit has any penetration or fracture after being bent for 10 times by 180 degrees; hardness test, mainly testing the pencil hardness; the data are as follows:
table 1 is a test data sheet
As can be seen from the above table, cellulose methyl ether and Ag-S- (C)2H4O)2Both an increase and a decrease in the content of-COH influence the adhesion and bending resistance and also the electrical conductivity.
After the novel silver paste is prepared, the novel silver paste is formed on coated paper through a screen printing process, is treated through a curing device 12, and is then treated through the high-temperature heat treatment unit 13.
Specifically, the curing device 12 includes a housing 120 and a heating unit 122 disposed in the housing 120. In this embodiment, the heating unit 122 heats the novel silver paste to about 180 ℃, and keeps the temperature for 5 to 20 seconds, so that the novel silver paste can be cured and molded.
The high-temperature heat treatment unit 13 can instantly fuse the conductive particles in the conductive network at high temperature, and decompose part of the organic metal compound, so that the conductivity of the conductive network can be improved by about 30-40%. Preferably, the instantaneous temperature of the xenon light source 132 is controlled to 600-700 ℃, and the instantaneous high temperature can enable the silver nano powder to be instantly fused and can also enable Ag-S- (C)2H4O)nThe COH is decomposed to generate nano-particle simple substance silver, and the nano-particle simple substance silver can be filled between silver nano-powders to be extractedCompactness and uniformity of the highly conductive layer. The time of the instant high-temperature heat treatment is in the millisecond level, and is about 10-100 milliseconds; it will be appreciated that an excessive amount of time may result in excessive burn-out of the flexible substrate.
The flexible circuit boards of examples 1 to 3 were subjected to a high-temperature heat treatment by the high-temperature heat treatment unit 13, and an electric conductivity test was performed, with the following test data:
table 2 is a test data sheet
Wherein, the conductivity is improved by: the ratio of the absolute value of the difference between the resistances before and after treatment to the conductivity before treatment. From the data, it can be seen that the conductivity can be improved by about 30-40% by performing the high-temperature heat treatment in the high-temperature heat treatment unit 13.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (2)
1. A heat treatment apparatus for a roll-to-roll production process of a flexible circuit board, comprising:
the flexible circuit board curing device comprises transmission units (10) used for transmitting continuous cured flexible circuit boards (11), wherein the flexible circuit boards (11) comprise flexible base materials (110) connected between the transmission units (10) and conductive networks (112) which are arranged on the flexible base materials (110) in an interval and curing mode;
the high-temperature heat treatment unit (13) is used for carrying out instant high-temperature heat treatment on the conductive network (112), and comprises a protective cover (130) and a xenon light source (132) arranged in the protective cover (130), wherein the instant temperature of the xenon light source (132) reaches 400-1000 ℃.
2. A heat treatment apparatus for a roll-to-roll production process of a flexible circuit board according to claim 1, characterized in that:
the curing device (12) is used for curing the conductive silver paste printed on the flexible substrate (110) and comprises a shell (120) and a heating unit (122) arranged in the shell (120).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120453358.5U CN214960345U (en) | 2021-03-02 | 2021-03-02 | Heat treatment device for roll-to-roll production process of flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120453358.5U CN214960345U (en) | 2021-03-02 | 2021-03-02 | Heat treatment device for roll-to-roll production process of flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214960345U true CN214960345U (en) | 2021-11-30 |
Family
ID=79117344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120453358.5U Active CN214960345U (en) | 2021-03-02 | 2021-03-02 | Heat treatment device for roll-to-roll production process of flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214960345U (en) |
-
2021
- 2021-03-02 CN CN202120453358.5U patent/CN214960345U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8070986B2 (en) | Silver paste for forming conductive layers | |
| CN104204114B (en) | The manufacture method of electroconductibility ink composition, conductive pattern and electroconductive circuit | |
| US8088307B2 (en) | Metal paste for forming a conductive layer | |
| CN101384425A (en) | Porous film and multilayer assembly using the same | |
| CN102666096A (en) | Laminated body comprising porous layer and functional laminate using same | |
| CN103571275B (en) | Conductive ink composition, the manufacture method of conductive pattern and electroconductive circuit | |
| CN112831290B (en) | Preparation method of flexible electromagnetic shielding adhesive tape | |
| CN108305704A (en) | A kind of graphene-based High-conductivity carbon slurry and preparation method thereof | |
| CN214960345U (en) | Heat treatment device for roll-to-roll production process of flexible circuit board | |
| CN108017957A (en) | A kind of preparation method of Graphene conductive ink applied to flexible circuit | |
| CN112839450B (en) | Heat treatment device for roll-to-roll production process of flexible circuit board | |
| CN102300415B (en) | Method for preparing uniformly-conductive silver wire used for printed electronics | |
| CN102794949B (en) | copper-clad plate | |
| CN113056088B (en) | High-performance flexible circuit board | |
| CN111560188B (en) | Nano-silver/graphene composite electromagnetic shielding ink and preparation method thereof | |
| CN110093596A (en) | A kind of preparation method of the extra thin copper foil of Automatic-falling | |
| CN109104851B (en) | Preparation method of electromagnetic shielding film | |
| CN102378479A (en) | Circuit board substrate and manufacturing method thereof | |
| CN113053583B (en) | Silver paste for roll-to-roll production process of flexible circuit board and preparation thereof | |
| CN110602888A (en) | Preparation method of aluminum-lined high-frequency substrate | |
| WO2014061949A1 (en) | Conductive paste printed circuit board having plating layer and method for manufacturing same | |
| CN113314251A (en) | High-temperature sintered silver paste special for RFID (radio frequency identification) of ceramic substrate and manufacturing method thereof | |
| CN103915684A (en) | Conductive circuit manufacturing method, mobile phone antenna manufacturing method and mobile phone antenna | |
| CN109608942A (en) | A kind of preparation method of carbon black base electric heating carbon slurry | |
| CN108055768B (en) | Preparation method of high-molecular conductive film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |