CN214959626U - Auxiliary radiator for mobile phone mainboard - Google Patents

Auxiliary radiator for mobile phone mainboard Download PDF

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Publication number
CN214959626U
CN214959626U CN202120806267.5U CN202120806267U CN214959626U CN 214959626 U CN214959626 U CN 214959626U CN 202120806267 U CN202120806267 U CN 202120806267U CN 214959626 U CN214959626 U CN 214959626U
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CN
China
Prior art keywords
mobile phone
recess
temperature sensor
hole
fan
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Expired - Fee Related
Application number
CN202120806267.5U
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Chinese (zh)
Inventor
刘方
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Yongying Electronics Co ltd
Original Assignee
Shenzhen Yongying Electronics Co ltd
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Publication date
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Priority to CN202120806267.5U priority Critical patent/CN214959626U/en
Application granted granted Critical
Publication of CN214959626U publication Critical patent/CN214959626U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a mobile phone motherboard auxiliary heat radiator, including cell phone case, electromagnetism piece, fan, singlechip and temperature sensor, cell phone case has seted up first through-hole and recess in the upper end, and the recess left side is arranged in to the first through-hole, the inside right side of recess is provided with the electromagnetism piece, and pastes in the left side of the electromagnetism piece and be equipped with the iron sheet, the iron sheet left side has linked firmly dust guard one end, and the dust guard other end passes recess and sliding connection in first through-hole, the cell phone case front end is inlayed and is had touch-control display screen, and the subsides of touch-control display screen rear end are equipped with mobile phone motherboard, mobile phone motherboard rear end links firmly fan, treater and places district, singlechip, temperature sensor, battery and place district and conducting strip. The utility model discloses be equipped with heat abstractor, be favorable to in time giving the mobile phone motherboard heat dissipation, prevent that the high temperature from burning out mobile phone motherboard, through dustproof function, be favorable to protecting through-hole one when not needing high-efficient heat dissipation, prevent that the dust from getting into the inside cell-phone function that influences of cell phone case.

Description

Auxiliary radiator for mobile phone mainboard
Technical Field
The utility model relates to a cell-phone technical field, more specifically relate to a mobile phone motherboard auxiliary heat radiator.
Background
The motherboard is also called a motherboard, a system board, a logic board, a motherboard, a backplane, etc., and is a central or main circuit board constituting a complex electronic system, such as an electronic computer. The most important constituent components on the motherboard are chipsets, which usually consist of a north bridge and a south bridge, and some are designed by a single chip microcomputer to enhance the performance of the chipsets. These chipsets provide a general platform for the motherboard to connect with different devices and control the communication between different devices.
The inconvenient continuous heat dissipation of current mobile phone motherboard auxiliary heat radiator, radiating efficiency is not high, and inconveniently prevents that the dust from getting into the louvre, consequently needs a mobile phone motherboard auxiliary heat radiator to solve above-mentioned problem urgently.
Disclosure of Invention
The utility model aims to provide a: in order to solve the inconvenient continuous heat dissipation of device during the sampling, the problem that radiating efficiency is not high and inconvenient dust that prevents gets into the louvre, the utility model provides a mobile phone motherboard assists radiator.
The utility model discloses a realize above-mentioned purpose and specifically adopt following technical scheme: the utility model provides a mobile phone motherboard auxiliary heat radiator, includes cell phone case, electromagnetism piece, fan, singlechip and temperature sensor, cell phone case upper end has been seted up through-hole one and recess, and through-hole one arranges the recess left side in, the inside right side of recess is provided with the electromagnetism piece, and pastes in the left of the electromagnetism piece and be equipped with the iron sheet, the iron sheet left side has linked firmly dust guard one end, and the dust guard other end passes recess and sliding connection in through-hole one, the cell phone case front end is inlayed and is had the touch-control display screen, and pastes and be equipped with mobile phone motherboard in the touch-control display screen rear end, mobile phone motherboard rear end links firmly fan, treater and places district, singlechip, temperature sensor, battery and place district and conducting strip.
Preferably, the electromagnetic sheet and the iron sheet are both arranged in a rectangular shape, and the area of the electromagnetic sheet is equal to that of the iron sheet.
Preferably, the iron sheet left side has linked firmly spring one end, and the spring other end links firmly on the inside left side of recess, the spring is provided with parallel two sets ofly, and two sets of springs arrange the dust guard both sides in.
Preferably, the fan and the processor placing area are arranged above the rear end of the mobile phone mainboard, and the fan is arranged on the left side of the processor placing area.
Preferably, the bottom end of the processor placing area is fixedly connected with a single chip microcomputer, and the single chip microcomputer is electrically connected with the electromagnetic sheet, the fan and the temperature sensor.
Preferably, the temperature sensor, the battery placing area and the heat conducting fins are arranged below the rear end of the mobile phone mainboard, the temperature sensor is arranged above the battery placing area and the heat conducting fins, and the heat conducting fins are arranged on two sides of the battery placing area.
Preferably, the heat conducting fins are arranged in two rows, three groups of heat conducting fins are arranged on each row, the heat conducting fins are inserted into the second through holes, and the second through holes are formed in the lower portion of the rear end of the mobile phone shell.
The utility model has the advantages as follows:
1. the utility model discloses a be equipped with heat abstractor, respond to mobile phone motherboard temperature through temperature sensor, accept temperature information through the singlechip to control fan heat dissipation and electromagnetic sheet circular telegram and produce magnetism, open through-hole one through recess, electromagnetic sheet, iron sheet and dust guard, last radiating for mobile phone motherboard through conducting strip and through-hole two, set up like this and be favorable to in time giving mobile phone motherboard heat dissipation, prevent that the mobile phone motherboard from being burnt out to the high temperature.
2. The utility model discloses a through dustproof function, make the electromagnetic sheet lose magnetism through singlechip and temperature sensor open circuit, cover through-hole one through iron sheet, dust guard and spring, set up like this and be favorable to protecting through-hole one when not needing high-efficient heat dissipation, prevent that the dust from getting into the inside cell-phone function that influences of cell phone case.
Drawings
FIG. 1 is a schematic front view of the structure of the present invention;
fig. 2 is a schematic rear sectional view of the structure of the present invention;
FIG. 3 is a right-side view of the structure of the present invention;
fig. 4 is a schematic top sectional view of the structure of the present invention.
Reference numerals: 1-mobile phone shell; 2, a first through hole; 3-a groove; 4-an electromagnetic sheet; 5-iron sheet; 6-dust guard; 7-a spring; 8-touch control display screen; 9-a mobile phone mainboard; 10-a fan; 11-a processor placement area; 12-a single chip microcomputer; 13-a temperature sensor; 14-a battery placement area; 15-heat conducting fins; 16-through hole two.
Detailed Description
Examples
Referring to fig. 1-4, in the embodiment of the present invention, an auxiliary radiator for a mobile phone motherboard comprises a mobile phone housing 1, an electromagnetic sheet 4, a fan 10, a single chip 12 and a temperature sensor 13, wherein the upper end of the mobile phone housing 1 is provided with a first through hole 2 and a groove 3, the first through hole 2 is disposed at the left side of the groove 3, the right side of the inside of the groove 3 is provided with the electromagnetic sheet 4, the left side of the electromagnetic sheet 4 is attached with an iron sheet 5, the electromagnetic sheet 4 and the iron sheet 5 are both arranged in a rectangular shape, the area of the electromagnetic sheet 4 is equal to the area of the iron sheet 5, which is beneficial for maximizing acting force and maintaining stability of connection, the left side of the iron sheet 5 is fixedly connected with one end of a dust-proof plate 6, the other end of the dust-proof plate 6 passes through the groove 3 and is slidably connected in the first through hole 2, the left side of the iron sheet 5 is fixedly connected with one end of a spring 7, the other end of the spring 7 is fixedly connected in the inside of the groove 3, the spring 7 is provided with two parallel groups, and two sets of springs 7 are arranged on two sides of the dust guard 6, so that the left acting force is provided for the iron sheet 5, and the dust guard 6 is convenient to recover to cover the first through hole 2.
The front end of a mobile phone shell 1 is embedded with a touch display screen 8, the rear end of the touch display screen 8 is attached with a mobile phone mainboard 9, the rear end of the mobile phone mainboard 9 is fixedly connected with a fan 10, a processor placing area 11, a singlechip 12, a temperature sensor 13, a battery placing area 14 and a heat conducting fin 15, the fan 10 and the processor placing area 11 are arranged above the rear end of the mobile phone mainboard 9, the fan 10 is arranged on the left side of the processor placing area 11 to facilitate the conversion of air inside and outside the mobile phone shell 1 and the heat dissipation of the mobile phone mainboard 9, the bottom end of the processor placing area 11 is fixedly connected with the singlechip 12, the singlechip 12 is electrically connected with an electromagnetic sheet 4, the fan 10 and the temperature sensor 13 to facilitate the control of each device and complete the heat dissipation function, the temperature sensor 13, the battery placing area 14 and the heat conducting fin 15 are arranged below the rear end of the mobile phone mainboard 9, and the temperature sensor 13 is arranged above the battery placing area 14 and the heat conducting fin 15, the heat conducting fins 15 are arranged on two sides of the battery placing area 14, so that the internal temperature of the mobile phone shell 1 can be sensed, heat dissipation is timely performed on the mobile phone mainboard 9, the two rows of heat conducting fins 15 are arranged, three groups of heat conducting fins 15 are arranged on each row, the heat conducting fins 15 are inserted into the two through holes 16, the two through holes 16 are formed in the lower portion of the rear end of the mobile phone shell 1, continuous heat dissipation for the mobile phone mainboard 9 is facilitated, and a stable heat dissipation effect is achieved.
The working principle is as follows: according to the attached drawings 1, 2, 3 and 4, when the temperature of the mobile phone mainboard is too high and needs to be dissipated, firstly, the heat on the mobile phone mainboard 9 is continuously discharged out of the mobile phone shell 1 through the heat conducting sheet 15 and the second through hole 16, the temperature of the mobile phone mainboard 9 in the mobile phone shell 1 is sensed through the temperature sensor 13, then the temperature sensor 13 transmits information to the single chip microcomputer 12, the single chip microcomputer 12 instructs the fan 10 to rotate and the electromagnetic sheet 4 to be electrified, the electromagnetic sheet 4 opens the first through hole 2 through the groove 3, the iron sheet 5 and the dustproof plate 6, and finally the fan 10 converts the air inside the mobile phone shell 1 through the first through hole 2, so that the temperature of the mobile phone mainboard 9 is reduced.
According to the attached drawings 1, 2, 3 and 4, when the temperature is not high and needs to be kept dustproof inside the mobile phone, firstly, the temperature of the mobile phone mainboard 9 in the mobile phone shell 1 is not high through the temperature sensor 13, then the temperature sensor 13 transmits information to the single chip microcomputer 12, the single chip microcomputer 12 instructs the electromagnetic sheet 4 to be powered off, finally, the iron sheet 5 receives the acting force of the spring 7 to the left, the iron sheet 5 drives the dustproof plate 6 to cover the first through hole 2, and therefore the first through hole 2 is closed to keep dustproof inside the mobile phone shell 1.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (7)

1. The utility model provides a mobile phone motherboard auxiliary heat radiator, includes cell phone case (1), electromagnetism piece (4), fan (10), singlechip (12) and temperature sensor (13), its characterized in that: cell phone case (1) upper end has been seted up through-hole (2) and recess (3), and recess (3) left side is arranged in through-hole (2), the inside right side of recess (3) is provided with electromagnetic sheet (4), and electromagnetic sheet (4) left side subsides are equipped with iron sheet (5), iron sheet (5) left side has linked firmly dust guard (6) one end, and dust guard (6) other end passes recess (3) and sliding connection in through-hole (2), cell phone case (1) front end is inlayed and is had touch-control display screen (8), and touch-control display screen (8) rear end subsides are equipped with mobile phone motherboard (9), mobile phone motherboard (9) rear end rigid coupling has fan (10), treater place district (11), singlechip (12), temperature sensor (13), battery and places district (14) and conducting strip (15).
2. The auxiliary heat sink for a main board of a mobile phone according to claim 1, wherein: the electromagnetic sheet (4) and the iron sheet (5) are both arranged in a rectangular shape, and the area of the electromagnetic sheet (4) is equal to that of the iron sheet (5).
3. The auxiliary heat sink for a main board of a mobile phone according to claim 1, wherein: the iron sheet (5) left side has linked firmly spring (7) one end, and the spring (7) other end links firmly on the inside left side of recess (3), spring (7) are provided with parallel two sets ofly, and dust guard (6) both sides are arranged in to two sets of spring (7).
4. The auxiliary heat sink for a main board of a mobile phone according to claim 1, wherein: the fan (10) and the processor placing area (11) are arranged above the rear end of the mobile phone mainboard (9), and the fan (10) is arranged on the left side of the processor placing area (11).
5. The auxiliary heat sink for a main board of a mobile phone according to claim 1, wherein: the bottom end of the processor placing area (11) is fixedly connected with a single chip microcomputer (12), and the single chip microcomputer (12) is electrically connected with the electromagnetic sheet (4), the fan (10) and the temperature sensor (13).
6. The auxiliary heat sink for a main board of a mobile phone according to claim 1, wherein: temperature sensor (13), battery are placed district (14) and conducting strip (15) and are set up in cell-phone mainboard (9) rear end below, and temperature sensor (13) are placed battery and are placed district (14) and conducting strip (15) top in, conducting strip (15) are placed battery and are placed district (14) both sides in.
7. The auxiliary heat sink for a main board of a mobile phone according to claim 1, wherein: the mobile phone is characterized in that the heat conducting fins (15) are arranged in two rows, three groups of heat conducting fins (15) are arranged in each row, the heat conducting fins (15) are inserted into the second through holes (16), and the second through holes (16) are formed in the lower portion of the rear end of the mobile phone shell (1).
CN202120806267.5U 2021-04-16 2021-04-16 Auxiliary radiator for mobile phone mainboard Expired - Fee Related CN214959626U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120806267.5U CN214959626U (en) 2021-04-16 2021-04-16 Auxiliary radiator for mobile phone mainboard

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120806267.5U CN214959626U (en) 2021-04-16 2021-04-16 Auxiliary radiator for mobile phone mainboard

Publications (1)

Publication Number Publication Date
CN214959626U true CN214959626U (en) 2021-11-30

Family

ID=79043253

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202120806267.5U Expired - Fee Related CN214959626U (en) 2021-04-16 2021-04-16 Auxiliary radiator for mobile phone mainboard

Country Status (1)

Country Link
CN (1) CN214959626U (en)

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20211130

CF01 Termination of patent right due to non-payment of annual fee