CN214956847U

CN214956847U - Novel semiconductor chip

Info

Publication number: CN214956847U
Application number: CN202121671003.XU
Authority: CN
Inventors: 吴西锋
Original assignee: Zhejiang Boxing Electronics Co ltd
Current assignee: Zhejiang Boxing Electronics Co ltd
Priority date: 2021-07-22
Filing date: 2021-07-22
Publication date: 2021-11-30
Anticipated expiration: 2031-07-22

Abstract

The utility model discloses a novel semiconductor chip, which comprises a chip, wherein the bottom of the chip is bonded with a water tank through first heat-conducting silicone grease, the left bottom of the water tank is provided with a micro water pump, the inner wall of the micro water pump is fixedly connected with a water pipe, the water pipe is transversely arranged in a U shape, both ends of the water pipe are fixedly connected with the water tank, the bottom of the water pipe is bonded with a heat dissipation base through second heat-conducting silicone grease, the heat dissipation base is circular in shape, the outer wall of one side of the heat dissipation base away from the second heat-conducting silicone grease is fixedly connected with a plurality of groups of radiating fins distributed in an annular shape, the radiating fins are arc-shaped, a diversion trench is arranged between every two radiating fins, because fan blades are arranged in the trench and the trench is communicated with the diversion trench, under the blowing of the fan blades, the heat in the radiating fins is blown outwards through the diversion trench, the heat which is not dissipated in time in the water pipe is ensured to be subjected to secondary heat dissipation treatment, the quick heat dissipation of effectual chip, convenient to use.

Description

Novel semiconductor chip

Technical Field

The utility model relates to a semiconductor chip field specifically is a novel semiconductor chip.

Background

A semiconductor chip: etching and wiring are performed on the semiconductor wafer to obtain a semiconductor device capable of realizing a certain function. Not only silicon chips, but also gallium arsenide (gallium arsenide is toxic, so some inferior circuit boards do not decompose it), germanium and other semiconductor materials are commonly included. Semiconductors are also in the trend of automobiles.

The existing semiconductor chip is updated along with the chip, the great temperature increase caused by the operation speed is increased, the self heat is accumulated, the chip is easily damaged, the use is influenced, meanwhile, the chip is cooled, a heat dissipation mechanism needs heat conduction silicone grease to be used for heat conduction and fixation, the contact area is reduced, the heat conduction effect is influenced, the chip and the heat dissipation mechanism can deviate after being used for a long time, the heat dissipation effect is reduced, and the use is influenced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a novel semiconductor chip to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

a novel semiconductor chip comprises a chip, wherein a water tank is bonded to the bottom of the chip through first heat-conducting silicone grease, a miniature water pump is arranged at the bottom of the left side of the water tank, a water pipe is fixedly connected to the inner wall of the miniature water pump and transversely arranged in a U shape, two ends of the water pipe are fixedly connected with the water tank, a heat dissipation base is bonded to the bottom of the water pipe through second heat-conducting silicone grease, the heat dissipation base is circular in shape, a plurality of groups of heat dissipation fins distributed in an annular shape are fixedly connected to the outer wall of one side, away from the second heat-conducting silicone grease, of the heat dissipation base, a flow guide groove is formed between every two heat dissipation fins, a notch is formed in the central part of each heat dissipation fin, the notch is circular in shape and communicated with the flow guide groove, fan blades are arranged in the notch, and a rotating shaft is fixedly connected to the inner wall of each fan blade, the one end that the notch was kept away from to the pivot is equipped with the motor, and the drive end and the pivot fixed connection of motor.

As a further aspect of the present invention: the bottom of chip is equipped with the support, and the shape of support is the U-shaped, the inside outer wall of support is equipped with the loop bar of symmetric distribution, and is two sets of the equal threaded connection of inner wall of loop bar has the screw rod, and is two sets of one side and water tank fixed connection that the screw rod is close to each other.

As a further aspect of the present invention: the top of first heat conduction silicone grease is seted up the recess that the multiunit equidistance distributes, the inner wall and the first heat conduction silicone grease of recess bond mutually.

As a further aspect of the present invention: the inside bottom fixedly connected with telescopic link of support, and the other end and the motor fixed connection of telescopic link, the outer wall of telescopic link cup joint with motor fixed connection's spring, and the other end and the support fixed connection of spring.

As a further aspect of the present invention: the bottom of the chip is fixedly connected with symmetrically distributed insulating ceramic pads, and one sides of the two groups of insulating ceramic pads, which are far away from the chip, are fixedly connected with the support.

Compared with the prior art, the beneficial effects of the utility model are that:

when the water tank is used, the first heat-conducting silicone grease enters the groove through the groove arranged on the upper surface of the water tank when the first heat-conducting silicone grease is filled between the water tank and the chip, the contact area between the water tank and the first heat-conducting silicone grease is effectively increased, the heat dissipation effect is promoted, the firmness between the water tank and the chip is improved, the two ends of the loop bar are abutted to the supports through the threaded connection of the screw rods and the loop bar which are arranged on the two sides of the water tank, the water tank is effectively supported and fixed in an auxiliary mode, the chip is bonded with the water tank for a long time, the deviation phenomenon is avoided, when the chip works, the micro water pump and the motor are started, the chip generates a large amount of heat, and the first heat-conducting silicone grease has heat conducting property, so that the heat generated by the chip is transmitted to the surface of the water tank through the first heat-conducting silicone grease, and the water tank is made of a copper material and has heat absorption capacity, function through miniature pump, make the water in the water tank get into the water pipe, and the water in the water pipe circulates with the unlimited flow of water tank, take away the heat, waste heat in the water pipe carries out the heat transmission to the heat dissipation base through bottom second heat conduction silicone grease simultaneously, make the fin collect the heat, and through the drive of motor, drive the rotation of flabellum, can make the motor take place to shake during rotation, telescopic link and the spring that sets up respectively through the bottom, carry out shock-absorbing treatment to the motor, because the flabellum sets up in the notch, and the notch is linked together with the guiding gutter, under the blowing of flabellum, make the heat in the fin outwards blow off through the guiding gutter, the heat that has not in time effluvium in the water pipe has been guaranteed and has been dispelled the heat once more to handle, effectual quick heat dissipation to the chip, and convenient to use.

Drawings

Fig. 1 is a schematic structural diagram of a novel semiconductor chip.

Fig. 2 is a top view of a water tank in a novel semiconductor chip.

Fig. 3 is a bottom view of a heat spreader in a novel semiconductor chip.

In the figure: chip 1, micro-water pump 2, first heat conduction silicone grease 3, water tank 4, insulating ceramic pad 5, support 6, water pipe 7, second heat conduction silicone grease 8, heat dissipation base 9, fin 10, telescopic link 11, motor 12, spring 13, pivot 14, flabellum 15, notch 16, loop bar 17, screw rod 18, recess 19, guiding gutter 20.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 and 3, in an embodiment of the present invention, a novel semiconductor chip includes a chip 1, a water tank 4 is bonded to a bottom of the chip 1 through a first heat conductive silicone grease 3, a micro water pump 2 is disposed at a bottom of a left side of the water tank 4, a water pipe 7 is fixedly connected to an inner wall of the micro water pump 2, the water pipe 7 is arranged in a U-shaped transverse arrangement, two ends of the water pipe 7 are fixedly connected to the water tank 4, a heat dissipation base 9 is bonded to a bottom of the water pipe 7 through a second heat conductive silicone grease 8, the heat dissipation base 9 is circular, a plurality of sets of annularly distributed fins 10 are fixedly connected to an outer wall of the heat dissipation base 9 away from the second heat conductive silicone grease 8, the fins 10 are arc-shaped, a diversion trench 20 is disposed between every two fins 10, a central portion of the fin 10 is disposed with a 16, a notch of the notch 16 is disposed with the circular notch, the fin 16 is communicated with the diversion trench 20, the fan blade 15 is arranged in the notch 16, the rotating shaft 14 is fixedly connected to the inner wall of the fan blade 15, the motor 12 is arranged at one end, far away from the notch 16, of the rotating shaft 14, and the driving end of the motor 12 is fixedly connected with the rotating shaft 14.

Referring to fig. 1-3, in the embodiment of the present invention, the bottom of the chip 1 is provided with the support 6, the support 6 is U-shaped, the inner wall of the support 6 is provided with the symmetrically distributed loop bars 17, the inner walls of the two sets of loop bars 17 are all connected with the screws 18 by threads, and one side of the two sets of screws 18 close to each other is fixedly connected with the water tank 4.

Referring to fig. 2, in the embodiment of the present invention, a plurality of sets of grooves 19 are formed on the top of the first heat conductive silicone grease 3, and the inner walls of the grooves 19 are bonded to the first heat conductive silicone grease 3.

Referring to fig. 1, in the embodiment of the present invention, an expansion link 11 is fixedly connected to the inner bottom end of the bracket 6, the other end of the expansion link 11 is fixedly connected to the motor 12, a spring 13 fixedly connected to the motor 12 is sleeved on the outer wall of the expansion link 11, and the other end of the spring 13 is fixedly connected to the bracket 6.

Referring to fig. 1, in the embodiment of the present invention, the bottom of the chip 1 is fixedly connected with the insulating ceramic pads 5 that are symmetrically distributed, and one sides of the two groups of insulating ceramic pads 5 that are far away from the chip 1 are fixedly connected with the support 6.

The utility model discloses a theory of operation is: when the chip bonding device is used, the first heat-conducting silicone grease 3 enters the groove 19 through the groove 19 arranged on the upper surface of the water tank 4 when the first heat-conducting silicone grease 3 is filled between the water tank 4 and the chip 1, the contact area between the water tank 4 and the first heat-conducting silicone grease 3 is effectively increased, the heat dissipation effect is promoted, the firmness of the water tank 4 and the chip 1 is improved, the two ends of the loop bar 17 are abutted to the supports 6 through the threaded connection of the screw rods 18 arranged on the two sides of the water tank 4 and the loop bar 17, the water tank 4 is effectively supported and fixed in an auxiliary mode, the chip 1 and the water tank 4 are bonded for a long time, the deviation phenomenon cannot occur, when the chip 1 works, the micro water pump 2 and the motor 12 are started, the chip 1 generates a large amount of heat, and because the first heat-conducting silicone grease 3 has the heat conducting property, the heat generated by the chip 1 is transmitted to the surface of the water tank 4 through the first heat-conducting silicone grease 3, the water tank 4 is made of copper material and has heat absorption capacity, water in the water tank 4 enters the water pipe 7 through the operation of the micro water pump 2, the water in the water pipe 7 and the water tank 4 circulate in an infinite flow manner to take away heat, meanwhile, waste heat in the water pipe 7 is transferred to the heat dissipation base 9 through the second heat conduction silicone grease 8 at the bottom, so that the heat is collected by the heat dissipation fins 10, the fan blades 15 are driven to rotate through the motor 12, the motor 12 can shake during rotation, the motor 12 is subjected to shock absorption treatment through the telescopic rods 11 and the springs 13 which are respectively arranged at the bottom, because the fan blades 15 are arranged in the notches 16, and the notches 16 are communicated with the diversion trenches 20, under the blowing of the fan blades 15, the heat in the heat dissipation fins 10 is blown out through the diversion trenches 20, the situation that the heat which is not dissipated in time in the water pipe 7 is subjected to secondary heat dissipation treatment is ensured, and the chip 1 is effectively and rapidly dissipated, is convenient for use.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. A novel semiconductor chip, comprising a chip (1), characterized in that: the bottom of the chip (1) is bonded with a water tank (4) through a first heat-conducting silicone grease (3), the bottom of the left side of the water tank (4) is provided with a micro water pump (2), the inner wall of the micro water pump (2) is fixedly connected with a water pipe (7), the water pipe (7) is transversely arranged in a U shape, the two ends of the water pipe (7) are fixedly connected with the water tank (4), the bottom of the water pipe (7) is bonded with a heat dissipation base (9) through a second heat-conducting silicone grease (8), the heat dissipation base (9) is circular in shape, the outer wall of one side, away from the second heat-conducting silicone grease (8), of the heat dissipation base (9) is fixedly connected with a plurality of groups of heat dissipation fins (10) distributed in an annular shape, the heat dissipation fins (10) are arc-shaped, flow guide grooves (20) are formed between every two heat dissipation fins (10), and notches (16) are formed in the center positions of the heat dissipation fins (10), and the shape of notch (16) is circular, notch (16) is linked together with guiding gutter (20), be equipped with flabellum (15) in notch (16), the inner wall fixedly connected with pivot (14) of flabellum (15), the one end that notch (16) were kept away from in pivot (14) is equipped with motor (12), and the drive end and pivot (14) fixed connection of motor (12).

2. The novel semiconductor chip of claim 1, wherein: the bottom of chip (1) is equipped with support (6), and the shape of support (6) is the U-shaped, the inside outer wall of support (6) is equipped with the loop bar (17) of symmetric distribution, and is two sets of the equal threaded connection of inner wall of loop bar (17) has screw rod (18), and is two sets of one side and water tank (4) fixed connection that screw rod (18) are close to each other.

3. The novel semiconductor chip of claim 1, wherein: the top of first heat conduction silicone grease (3) is seted up recess (19) that the multiunit equidistance distributes, the inner wall and the first heat conduction silicone grease (3) of recess (19) bond mutually.

4. A novel semiconductor chip according to claim 2, wherein: the inside bottom fixedly connected with telescopic link (11) of support (6), and the other end and motor (12) fixed connection of telescopic link (11), the outer wall of telescopic link (11) cup joints spring (13) with motor (12) fixed connection, and the other end and support (6) fixed connection of spring (13).

5. The novel semiconductor chip of claim 1, wherein: the bottom of the chip (1) is fixedly connected with insulating ceramic pads (5) which are symmetrically distributed, and one sides of the insulating ceramic pads (5) far away from the chip (1) are fixedly connected with the support (6).