CN214954513U

CN214954513U - Photoetching device for manufacturing photoelectronic element

Info

Publication number: CN214954513U
Application number: CN202120914663.XU
Authority: CN
Inventors: 何玉兵
Original assignee: Jiangsu Michael Electronic Technology Co ltd
Current assignee: Jiangsu Michael Electronic Technology Co ltd
Priority date: 2021-04-29
Filing date: 2021-04-29
Publication date: 2021-11-30
Anticipated expiration: 2031-04-29

Abstract

The utility model discloses a photoetching device that optoelectronic element made, including body mechanism, tilting mechanism, adjustment mechanism, fixture and buffer gear, body mechanism includes the base, tilting mechanism including connect in the supporting plate group of base, install in supporting plate group's driving motor, locate upset support body between the supporting plate group and connect in the connecting axle of driving motor and upset support body simultaneously, adjustment mechanism place the electric motor of upset support body in including, connect in the lead screw of electric motor output shaft and connect in two sets of centre gripping subassemblies of lead screw. The utility model discloses in, through mutually supporting of tilting mechanism, adjustment mechanism and fixture for optoelectronic component is by the centre gripping back, and driving motor's work can make the upset support body overturn, thereby does benefit to after the optoelectronic component upset after the fixing and carries out photoetching work to the back, has avoided artifical upset efficiency slow and damage the problem of component.

Description

Photoetching device for manufacturing photoelectronic element

Technical Field

The utility model relates to a photoelectronic element production technical field specifically is a lithography apparatus that photoelectronic element made.

Background

Photolithography is a process of removing a specific portion of a thin film on the surface of a wafer through a series of production steps. The goal of lithographic production is to produce features that are dimensionally accurate and that are correctly positioned on the wafer surface and correctly associated with other components as required by the circuit design.

The existing photoelectronic element needs to be photoetched in the production and manufacturing process, but the existing photoetching device can only photoetch one surface of the photoelectronic element, and then when photoetching the back surface of the photoelectronic element, the photoetching is carried out again after manual turnover, so that the mode not only reduces the working efficiency of photoetching, but also has the problem that parts on the photoetching surface are damaged due to manual turnover.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art or the correlation technique.

Therefore, the utility model discloses the technical scheme who adopts does:

a photoetching device for manufacturing optoelectronic elements comprises a body mechanism, a turnover mechanism, an adjusting mechanism, a clamping mechanism and a buffer mechanism, wherein the body mechanism comprises a base, the turnover mechanism comprises a supporting plate group connected with the base, a driving motor arranged on the supporting plate group, a turnover frame body arranged between the supporting plate groups and a connecting shaft simultaneously connected with the driving motor and the turnover frame body, the adjusting mechanism comprises an electric motor arranged in the turnover frame body, a lead screw connected with an output shaft of the electric motor and two groups of clamping components connected with the lead screw, each clamping component comprises a convex block connected with the lead screw, an adjusting bolt arranged on the convex block, a lower pressing plate connected with the adjusting bolt and a vertical rod connected with the lead screw and inserted in the lower pressing plate in a penetrating way, the clamping mechanism comprises a stabilizing group arranged in the lower pressing plate and an adapting group arranged in the convex block, the stable group comprises a first spring arranged in the lower pressure plate and a pressing plate connected with the first spring and sliding on the lower pressure plate, the adaptive group comprises a second spring arranged in the convex block and a telescopic plate connected with the second spring, and the buffer mechanism is connected with the support plate group.

The present invention may be further configured in a preferred embodiment as: the buffer mechanism comprises a contraction box connected with the support plate group, a third spring arranged in the contraction box and a top plate connected with the third spring and sliding in the contraction box.

By adopting the technical scheme, the overturning frame body after overturning is convenient to buffer, so that the stability of the photoelectronic element after overturning is ensured.

The present invention may be further configured in a preferred embodiment as: the photoetching device manufactured by the photoelectronic element further comprises a limiting plate connected to the turnover frame body, and the limiting plate is arranged on one side far away from the buffer mechanism.

Through adopting above-mentioned technical scheme for the roof of contradicting makes its upset support body carry out steadily.

The present invention may be further configured in a preferred embodiment as: the body mechanism further comprises a gantry rail frame connected to the base and a photoetching machine sliding on the gantry rail frame.

By adopting the technical scheme, the photoetching machine can conveniently carry out photoetching on the optoelectronic element.

The present invention may be further configured in a preferred embodiment as: the adjusting mechanism further comprises a guide rod arranged in the turnover frame body, and the guide rod is inserted in the convex block.

Through adopting above-mentioned technical scheme, the guide arm is convenient for the removal of convex piece when the lead screw removes.

The present invention may be further configured in a preferred embodiment as: the adaptation group is equipped with a plurality of, the one end of expansion plate is equipped with the silica gel gasket.

By adopting the technical scheme, the clamping device is convenient to clamp the photoelectronic elements with different shapes.

The present invention may be further configured in a preferred embodiment as: the screw rod is provided with a positive thread section and a negative thread section which are symmetrical, and the two groups of clamping assemblies are symmetrically arranged on the positive thread section and the negative thread section of the screw rod.

Through adopting above-mentioned technical scheme, be convenient for two sets of centre gripping subassemblies and do relative or opposite movement to this reaches the purpose of adjusting according to the component size.

By adopting the technical scheme, the utility model discloses the beneficial effect who gains does:

1. the utility model discloses in, through mutually supporting of tilting mechanism, adjustment mechanism and fixture for optoelectronic component is by the centre gripping back, and driving motor's work can make the upset support body overturn, thereby does benefit to after the optoelectronic component upset after the fixing and carries out photoetching work to the back, has avoided artifical upset efficiency slow and damage the problem of component.

2. The utility model discloses in, through the design of fixture inner spring two and expansion plate for when the photoelectronic component of different shapes was by the centre gripping, rectangular element's centre gripping can be laminated on the expansion plate, and circular element's centre gripping can make a plurality of expansion plates be in non-uniform flexible, thereby can adapt to in circular element's corner, reach the utility model discloses to the purpose of different shapes component centre gripping, improve the utility model discloses a practicality.

Drawings

Fig. 1 is a schematic overall structure diagram of an embodiment of the present invention;

fig. 2 is a schematic structural view of an overturning frame body according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a right-view portion of an embodiment of the present invention;

fig. 4 is an enlarged schematic structural diagram of a position a according to an embodiment of the present invention;

fig. 5 is an enlarged schematic structural diagram of a position B according to an embodiment of the present invention.

Reference numerals:

100. a body mechanism; 110. a base; 120. a gantry rail frame; 130. a lithography machine;

200. a turnover mechanism; 210. a group of support plates; 220. a drive motor; 230. turning over the frame body; 240. a connecting shaft;

300. an adjustment mechanism; 310. an electric motor; 320. a screw rod; 330. a convex block; 340. adjusting the bolt; 350. a lower pressing plate; 360. a vertical rod; 370. a guide bar;

400. a clamping mechanism; 410. a first spring; 420. a pressing plate; 430. a second spring; 440. a retractable plate;

500. a buffer mechanism; 510. a shrink box; 520. a third spring; 530. a top plate;

600. and a limiting plate.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings. It should be noted that the embodiments and features of the embodiments of the present invention may be combined with each other without conflict.

It is to be understood that such description is merely exemplary and is not intended to limit the scope of the present invention.

Some embodiments of the present invention provide a lithographic apparatus for manufacturing optoelectronic devices, which is described below with reference to the accompanying drawings.

The first embodiment is as follows:

with reference to fig. 1-5, the present invention provides a photo-etching apparatus for manufacturing optoelectronic devices, including a body mechanism 100, a turnover mechanism 200, an adjusting mechanism 300, a clamping mechanism 400 and a buffering mechanism 500, wherein the body mechanism 100 includes a base 110, the body mechanism 100 further includes a gantry rail 120 connected to the base 110 and a photo-etching machine 130 sliding on the gantry rail 120, the photo-etching machine 130 is used for photo-etching optoelectronic devices, and the gantry rail 120 is beneficial to the intelligent movement of the photo-etching machine 130.

The turnover mechanism 200 includes a support plate group 210 connected to the base 110, a driving motor 220 installed on the support plate group 210, a turnover frame body 230 arranged between the support plate group 210 and a connecting shaft 240 connected to the driving motor 220 and the turnover frame body 230, an adjusting mechanism 300 includes an electric motor 310 arranged in the turnover frame body 230, a lead screw 320 connected to an output shaft of the electric motor 310 and two sets of clamping components connected to the lead screw 320, the clamping components include a convex block 330 connected to the lead screw 320, an adjusting bolt 340 installed on the convex block 330, a lower pressing plate 350 connected to the adjusting bolt 340 and a vertical rod 360 connected to the lead screw 320 and inserted in the lower pressing plate 350, the adjusting mechanism 300 further includes a guide rod 370 arranged in the turnover frame body 230, the guide rod 370 is inserted in the convex block 330, and the design function of the guide rod 370 is beneficial to the stable movement of the convex block 330.

The clamping mechanism 400 comprises a fixing group and an adapting group, the fixing group is arranged in the lower pressing plate 350, the adapting group is arranged in the convex block 330 and comprises a first spring 410 arranged in the lower pressing plate 350 and a pressing plate 420 connected to the first spring 410 and sliding on the lower pressing plate 350, the adapting group comprises a second spring 430 arranged in the convex block 330 and a telescopic plate 440 connected to the second spring 430, and the buffering mechanism 500 is connected to the supporting plate group 210.

The adaptation group is equipped with a plurality of, the one end of expansion plate 440 is equipped with the silica gel gasket, the effect of its design is that a plurality of adaptation groups can carry out the centre gripping to the photoelectronic element of different shapes, both sides can laminate on expansion plate 440 when the rectangle component is held, and when the circular component was held, a plurality of expansion plates 440 were in the flexible of non-unity, thereby can adapt to the corner in circular component, the silica gel gasket can be received the edge of electronic component and play the effect of extrusion shrink, especially to circular component, and then more stable when making photoelectronic element by the centre gripping.

The screw 320 is provided with a positive thread section and a negative thread section which are symmetrical, the two groups of clamping components are symmetrically arranged on the positive thread section and the negative thread section of the screw 320, and the design function is that when the screw 320 rotates, the two groups of clamping components can move oppositely or oppositely, so that the purpose of adjusting the clamping distance according to the size of the optoelectronic element is achieved.

Example two:

referring to fig. 1-2, based on the first embodiment, the buffering mechanism 500 includes a shrinking box 510 connected to the supporting plate set 210, a third spring 520 embedded in the shrinking box 510, and a top plate 530 connected to the third spring 520 and sliding in the shrinking box 510, and the top plate 530 is designed to slide in the shrinking box 510 when the top plate 530 is abutted by the position-limiting plate 600, so that the position-limiting plate 600 and the turnover frame body 230 can be buffered after being turned over by the design of the third spring 520, and the turned-over optoelectronic device is in a stable state, which is beneficial to the photolithography process of the photolithography machine 130.

The utility model provides a lithography apparatus that optoelectronic element made is still including connecting in the limiting plate 600 of upset support body 230, and limiting plate 600 locates the one side of keeping away from buffer gear 500, and the effect of its design is spacing after being convenient for upset support body 230 upset to make the optoelectronic element be in steady state after upset support body 230 upset, avoid the upset too much to lead to the unstable problem that influences the photoetching of component.

The utility model discloses a theory of operation and use flow: firstly, the convex block 330 is operated by using an external remote control device, after the convex block 330 is operated, the two groups of clamping components on the screw rod 320 are driven to move relatively or oppositely, thereby adjusting a distance corresponding to the size of the optoelectronic device, and then placing the optoelectronic devices of different shapes on the convex blocks 330 to be attached to one side of the expansion plate 440, then, the adjusting bolt 340 is manually screwed, so that the lower pressing plate 350 drives the stabilizing set to descend, and then the pressing plate 420 can abut against the top of the component and fix the component after descending, then, when the lithography machine 130 needs to perform backside lithography on the component after operation, the external controller is used to operate the driving motor 220, therefore, the driving motor 220 turns over the turning frame body 230 through the connecting shaft 240, and after the turning frame body 230 drives the limiting plate 600 to turn over, after the limiting plate 600 abuts against the top plate 530, the overturning frame 230 is buffered by the limiting plate, and then the purpose of stable photoetching after the photoelectronic element is overturned can be achieved.

In the present application, the term "plurality" means two or more unless expressly defined otherwise. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. The terms "mounted," "connected," "fixed," and the like are to be construed broadly, and for example, "connected" may be a fixed connection, a removable connection, or an integral connection; "coupled" may be direct or indirect through an intermediary. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

It will be understood that when an element is referred to as being "mounted to," "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

In the description of the present specification, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the claims and their equivalents.

Claims

1. A lithographic apparatus for optoelectronic device fabrication, comprising:

a body mechanism (100) comprising a base (110);

the turnover mechanism (200) comprises a supporting plate group (210) connected to the base (110), a driving motor (220) installed on the supporting plate group (210), a turnover frame body (230) arranged between the supporting plate groups (210) and a connecting shaft (240) connected to the driving motor (220) and the turnover frame body (230) at the same time;

the adjusting mechanism (300) comprises an electric motor (310) arranged in the turnover frame body (230), a screw rod (320) connected to an output shaft of the electric motor (310) and two groups of clamping assemblies connected to the screw rod (320);

the clamping assembly comprises a convex block (330) connected to the screw rod (320), an adjusting bolt (340) arranged on the convex block (330), a lower pressing plate (350) connected to the adjusting bolt (340), and a vertical rod (360) connected to the screw rod (320) and inserted in the lower pressing plate (350);

a clamping mechanism (400) comprising a stabilizing group internally disposed in the lower platen (350) and an adapting group internally disposed in the convex block (330);

the stabilizing group comprises a first spring (410) arranged in the lower pressure plate (350) and a pressing plate (420) connected to the first spring (410) and sliding on the lower pressure plate (350);

the adapting group comprises a second spring (430) arranged in the convex block (330) and a telescopic plate (440) connected to the second spring (430);

a cushioning mechanism (500), the cushioning mechanism (500) being connected to the set of buttress plates (210).

2. A lithographic apparatus in accordance with claim 1, wherein the buffer mechanism (500) comprises a contraction box (510) connected to the set of support plates (210), a spring three (520) built into the contraction box (510), and a top plate (530) connected to the spring three (520) and sliding in the contraction box (510).

3. An optoelectronic device according to claim 1, further comprising a position limiting plate (600) connected to the flip frame body (230), wherein the position limiting plate (600) is disposed on a side away from the buffer mechanism (500).

4. A lithographic apparatus for optoelectronic device manufacturing according to claim 1, wherein the body mechanism (100) further comprises a gantry (120) connected to the base (110) and a lithography machine (130) sliding on the gantry (120).

5. The lithography apparatus for manufacturing optoelectronic components according to claim 1, wherein the adjusting mechanism (300) further comprises a guide rod (370) embedded in the flip frame body (230), the guide rod (370) being inserted through the convex block (330).

6. A lithographic apparatus for optoelectronic device manufacturing according to claim 1, wherein said adapter group comprises a plurality of said adapter groups, and one end of said expansion plate (440) comprises a silicone gasket.

7. The lithography device for manufacturing optoelectronic components according to claim 1, wherein the screw (320) has symmetrical positive thread section and negative thread section, and the two sets of clamping assemblies are symmetrically arranged on the positive thread section and the negative thread section of the screw (320).