CN214954097U - Imaging system - Google Patents
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- CN214954097U CN214954097U CN202121513047.XU CN202121513047U CN214954097U CN 214954097 U CN214954097 U CN 214954097U CN 202121513047 U CN202121513047 U CN 202121513047U CN 214954097 U CN214954097 U CN 214954097U
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Abstract
The utility model discloses an imaging system, this imaging system's laser instrument is used for to being imaged object emission light, and first light path subassembly is arranged in surveying the first wave band light and the second wave band light in the reverberation of being imaged object to convert first wave band light into first electric signal, convert second wave band light into second electric signal, and second light path subassembly receives the reverberation and converts the reverberation into the third electric signal; the digital micro-mirror device is arranged to form a first light beam from the received reflected light and reflect the first light beam to the first light path component when in the first working position, and form a second light beam from the received reflected light and reflect the second light beam to the second light path component when in the second working position. The imaging system can realize three-dimensional imaging based on single-pixel sampling, and can perform imaging according to the distance between an imaged object and the imaging system.
Description
Technical Field
The utility model relates to an optics precision imaging technical field especially relates to an imaging system.
Background
In recent years, development has been accelerated domestically and abroad in three-dimensional imaging research for realizing confocal microscopy, in which development of an automatic driving technique is closely associated with an image sensor technique. Current vision sensors mainly include single-spectrum sensors, two-dimensional sensors, three-dimensional sensors and multi-dimensional sensors. In the existing three-dimensional vision sensor, image fusion is carried out by adopting two light rays with different wave bands, but the distance between an imaged object and the sensor cannot be measured, images with different sizes cannot be presented according to the distance between the imaged object and a vision imaging system, and the imaging effect is poor.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an imaging system can realize the three-dimensional formation of image based on the single pixel sampling by the formation of image object, and can be based on the distance far and near formation of image of being formed image object distance and deciding this imaging system, and imaging effect is good.
To achieve the purpose, the utility model adopts the following technical proposal:
an imaging system comprises a laser and a first optical path component, wherein the laser is used for emitting light to an imaged object, the first optical path component is used for detecting first waveband light and second waveband light in reflected light of the imaged object, converting the first waveband light into a first electric signal and converting the second waveband light into a second electric signal;
the imaging system further comprises:
a second optical path component for receiving the reflected light and converting the reflected light into a third electrical signal;
the lens assembly is positioned between the digital micro-mirror and the imaged object, and the reflected light irradiates the digital micro-mirror through the lens assembly;
the digital micromirror device having a first operating position and a second operating position, the digital micromirror device configured to: and when the light path module is in the first working position, the received reflected light forms a first light beam and is reflected to the first light path module, and when the light path module is in the second working position, the received reflected light forms a second light beam and is reflected to the second light path module.
Optionally, the first optical path component includes a half mirror, a first band detection component and a second band detection component, the digital micro-mirror can reflect the first light beam to the half mirror, the half mirror divides the first light beam into a third light beam and a fourth light beam, the first band detection component is configured to detect the first band light in the third light beam and convert the first band light into the first electrical signal, and the second band detection component is configured to detect the second band light in the fourth light beam and convert the second band light into the second electrical signal.
Optionally, the first band detection assembly includes a first condenser lens and a first band detector for detecting the first band of light in the third beam and converting the first band of light into the first electrical signal;
the second band detection assembly includes a second condenser lens and a second band detector, and the second band detector is configured to detect the second band light in the fourth light beam and convert the second band light into the second electrical signal.
Optionally, the first condenser and the second condenser are cylindrical mirrors.
Optionally, the first band detector is a visible ray detector, and the second band detector is a linear array short-wave infrared detector.
Optionally, the second optical path component includes a third light condensing mirror and a photodiode, the digital micro-mirror is capable of reflecting the second light beam to the third light condensing mirror, the third light condensing mirror is configured to focus and map the second light beam to the photodiode, and the photodiode is configured to convert the received optical signal into the third electrical signal.
Optionally, the imaging system further comprises a first reflector and a second reflector, the first light beam is reflected to the first light path component via the first reflector, and the second light beam is reflected to the second light path component via the second reflector.
Optionally, the first reflective mirror and the second reflective mirror are both distributed on a side of the digital micro-mirror device facing the lens assembly, and are axisymmetric with respect to a center normal of the digital micro-mirror device.
Optionally, the included angle between the first working position and the second working position is in a range of 40 ° ± σ, and σ is any positive integer degree in a range of 1 ° to 20 °.
Optionally, the imaging system further includes a convex lens, and the light emitted by the laser device can be irradiated to the imaged object in parallel after passing through the convex lens.
The utility model has the advantages that:
an object of the utility model is to provide an imaging system, this imaging system are through setting up the laser instrument, and the laser instrument can launch light to being imaged the object to make this imaging system also can be to being imaged the object formation of image in the environment of dark, specifically, the reverberation of being imaged the object reflection forms collimated light and shines to digital micro mirror device through the lens subassembly, and digital micro mirror device has first operating position and second operating position. When the digital micro-mirror device is located at a first working position, the digital micro-mirror device forms a first light beam by received reflected light and reflects the first light beam to a first light path component, the first light path component detects first waveband light and second waveband light in the reflected light of an imaged object, the first waveband light can be converted into a first electric signal, the second waveband light is converted into a second electric signal, the first electric signal and the second electric signal are processed, pixel-level fusion is carried out on the first waveband light and the second waveband light, and therefore pixel-level fusion dual-spectrum imaging is achieved on the imaged object. When the digital micro-mirror device reaches a second working position, the digital micro-mirror device forms a second light beam from the received reflected light and reflects the second light beam to a second light path component, the second light path component focuses the second light beam and converts the reflected light into a third electric signal through photoelectric conversion, and the third electric signal is processed, so that single-pixel imaging of an imaged object is realized, and the imaging system can realize three-dimensional imaging of the imaged object based on single-pixel sampling; meanwhile, the distance from the imaging system to the imaged object can be obtained by processing the third electric signal, so that the imaging system can enable the size of the double-spectrum imaged image to be different according to the difference of the distance from the imaged object to the imaging system. To sum up, the utility model discloses an imaging system has combined two kinds of means of two spectral imaging and single pixel formation of image, can obtain clear formation of image, can be again according to the distance adjustment formation of image size of being formed images the object apart from this imaging system, has promoted the formation of image effect.
Drawings
Fig. 1 is a schematic structural diagram of an imaging system according to an embodiment of the present invention.
In the figure:
1. a laser;
2. a digital micromirror device;
3. an objective lens;
41. a semi-transparent semi-reflective mirror; 42. a first condenser lens; 43. a first band detector; 44. a second condenser lens; 45. a second band detector; 46. a first reflective mirror;
51. a third condenser lens; 52. a photodiode; 53. a second reflective mirror;
6. a convex lens;
7. an information processor.
Detailed Description
In order to make the technical problem solved by the present invention, the technical solutions adopted by the present invention and the technical effects achieved by the present invention clearer, the following will be described in further detail with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by the skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The utility model provides an imaging system, as shown in figure 1, this imaging system includes laser instrument 1, first light path subassembly, second light path subassembly, digital micro mirror device 2 and lens subassembly, laser instrument 1 is used for to being imaged object emission light, first light path subassembly is arranged in surveying first wave band light and the second wave band light in the reverberation of being imaged object to can convert first wave band light into first electric signal, convert second wave band light into the second electric signal, second light path subassembly is used for receiving the reverberation and converts the reverberation into the third electric signal; the lens assembly is located between the digital micro-mirror device 2 and the imaged object, the reflected light irradiates to the digital micro-mirror device 2 through the lens assembly, the digital micro-mirror device 2 has a first working position and a second working position, the digital micro-mirror device 2 is configured to form the received reflected light into a first light beam and reflect to the first light path assembly when in the first working position, and form the received reflected light into a second light beam and reflect to the second light path assembly when in the second working position. Preferably, the lens assembly is an objective lens 3.
The imaging system is provided with the laser 1, and the laser 1 can emit light to an imaged object, so that the imaging system can image the imaged object in a dark environment. Specifically, the reflected light reflected by the imaged object passes through the lens assembly to form collimated light and irradiates the digital micro-mirror 2, and the digital micro-mirror 2 has a first working position and a second working position. When the digital micro-mirror device 2 is at the first working position, the digital micro-mirror device 2 forms a first light beam with the received reflected light and reflects the first light beam to the first light path component, the first light path component detects the first wave band light and the second wave band light in the reflected light of the imaged object, the first wave band light can be converted into a first electric signal, the second wave band light is converted into a second electric signal, the first electric signal and the second electric signal are processed, pixel level fusion is carried out on the first wave band light and the second wave band light, and therefore pixel level fusion dual-spectrum imaging is achieved on the imaged object. When the digital micro-mirror device 2 is at the second working position, the digital micro-mirror device 2 forms a second light beam from the received reflected light and reflects the second light beam to the second light path component, the second light path component focuses the second light beam and converts the reflected light into a third electric signal through photoelectric conversion, and the third electric signal is processed, so that single-pixel imaging of an imaged object is realized, and the imaging system can realize three-dimensional imaging of the imaged object based on single-pixel sampling; meanwhile, the distance from the imaging system to the imaged object can be obtained by processing the third electric signal, so that the imaging system can make the size of the double-spectrum image different according to the difference of the distance from the imaged object to the imaging system, and it can be understood that the closer the distance from the imaging system, the larger the image of the double-spectrum image, and the imaging effect is improved. To sum up, the utility model discloses an imaging system has combined two kinds of means of two spectral imaging and single pixel formation of image, can obtain clear formation of image, can be again according to the distance adjustment formation of image size of being formed images the object apart from this imaging system, has promoted the formation of image effect.
It is understood that, as shown in fig. 1, the lens assembly, the digital micromirror device 2 and the object to be imaged are located on the same straight line, so that the reflected light reflected by the object to be imaged can directly reach the center of the digital micromirror device 2 through the lens assembly, which can simplify the light path design step.
Wherein the imaging system further comprises an information processor 7. Information processor 7 can handle first signal of telecommunication and the second signal of telecommunication that first light path subassembly conversion obtained to the realization carries out pixel level to the first wave band light and the second wave band light that first light path subassembly detected and fuses, thereby the realization is to being imaged the dual-spectrum formation of image object, and can handle the third signal of telecommunication that second light path subassembly conversion obtained, confirm the distance of being imaged object to this imaging system through the third signal of telecommunication, also can make the size that the dual-spectrum was imaged different according to being imaged object to this imaging system's distance.
The imaging system is electrically connected to the controller and the display screen. It can be understood that the information processor 7, the laser 1 and the digital micro-mirror 2 of the imaging system are electrically connected with a controller of the system to which the information processor 7 is applied, the controller can control the laser 1 to emit light, can control the digital micro-mirror 2 to turn over and reach the first working position or the second working position, and can also control the information processor 7 to process the first electric signal, the second electric signal and the third electric signal, and the display screen can display a three-dimensional image formed by the imaging system. The imaging system can be applied to an automobile, and particularly, the imaging system is electrically connected to a controller and a display screen of the automobile, is controlled by the controller of the automobile to image, and displays a generated three-dimensional image on the display screen of the automobile so as to enable a driver to clearly know the surrounding environment of driving. In other embodiments, the imaging system may also be electrically connected to a PC. The three-dimensional image formed by the volume imaging system is displayed by the PC.
Alternatively, as shown in fig. 1, the first optical path component includes a half mirror 41, a first band detection component and a second band detection component, the digital micro-mirror 2 can reflect the first light beam to the half mirror 41, the half mirror 41 divides the first light beam into a third light beam and a fourth light beam, the first band detection component is configured to detect the first band light in the third light beam and convert the first band light into a first electrical signal, and the second band detection component is configured to detect the second band light in the fourth light beam and convert the second band light into a second electrical signal. Through setting up half transmitting and half reflecting mirror 41, half transmitting and half reflecting mirror 41 divides into the different third light beam of wave band and fourth light beam with first light beam, first wave band light in the third light beam is surveyed to first wave band detection subassembly and turns into first electric signal with the light signal that detects, second wave band light in the fourth light beam is surveyed to second wave band detection subassembly and turns into the second electric signal with the light signal that detects, rethread information processor 7 is handled first electric signal and second electric signal, fuse with the pixel level of the light to two kinds of different wave bands.
Optionally, as shown in fig. 1, the first band detection assembly includes a first condenser lens 42 and a first band detector 43, the first band detector 43 is configured to detect the first band light in the third light beam and convert the first band light into a first electrical signal; the second band detection assembly includes a second condenser lens 44 and a second band detector 45, and the second band detector 45 is configured to detect the second band light in the fourth light beam and convert the second band light into a second electrical signal. The first condenser lens 42 can focus the third light beam, the third light beam irradiates the first waveband detector 43 through the first condenser lens 42, the third light beam is accurately mapped to the first waveband detector 43, the first waveband detector 43 detects the first waveband light in the third light beam, and the detected light signal is converted into a first electric signal; the second condenser lens 44 can focus the fourth light beam, the fourth light beam passes through the second condenser lens 44 and irradiates to the second band detector 45, so that the fourth light beam is accurately mapped to the second band detector 45, the second band detector 45 detects the second band light in the fourth light beam, and the detected light signal is converted into a second electrical signal.
Alternatively, as shown in FIG. 1, the first and second collection mirrors 42, 44 are cylindrical mirrors. The first condenser lens 42 and the second condenser lens 44 are each used to focus parallel rays into a point source. By arranging the first condenser 42 and the second condenser 44 to be cylindrical mirrors, in particular, semi-cylindrical. Specifically, one surface of the first condenser lens 42 close to the half mirror 41 is a plane, and the other surface is an arc surface, so as to ensure that the third light beam is accurately focused and mapped to the first band detector 43, and one surface of the second condenser lens 44 close to the half mirror 41 is a plane, and the other surface is an arc surface, so as to ensure that the fourth light beam is accurately focused and mapped to the second band detector 45. The first condenser 42, the second condenser 44 and the half mirror 41 are arranged in a right angle.
Optionally, the first band detector 43 is a visible ray detector, and the second band detector 45 is a linear array short wave infrared detector. It will be appreciated that the first band detector 43 is for detecting visible light and the second band detector 45 is for detecting short wavelength infrared. The visible ray detector is used for detecting visible rays, and the linear array short-wave infrared detector is used for detecting short-wave infrared rays. Meanwhile, the linear array short wave infrared detector is relatively low in cost, the second condenser lens 44 in the semi-cylindrical shape is matched with the linear array short wave infrared detector to detect short wave infrared rays, the fourth light beam can be accurately focused and mapped to the short wave infrared detector, and compared with a short wave area array infrared detector, the imaging cost can be further saved. Of course, in other embodiments, the wavelength bands of the light beams collected by the first and second wavelength band detectors 43 and 45 can be set according to requirements.
Alternatively, as shown in fig. 1, the second optical path component comprises a third light condensing mirror 51 and a photodiode 52, the digital micro-mirror 2 can reflect the second light beam to the third light condensing mirror 51, the third light condensing mirror 51 is used for focusing and mapping the second light beam to the photodiode 52, and the photodiode 52 is used for converting the received optical signal into a third electrical signal. The third condenser lens 51 focuses and maps the second light beam to the photodiode 52, the photodiode 52 converts the second light beam into a third electric signal, and the third electric signal is processed by the information processor 7 to realize single-pixel imaging of the imaged object, so that the imaging system realizes three-dimensional imaging of the imaged object based on single-pixel sampling; meanwhile, the information processor 7 processes the third electrical signal to obtain the distance from the imaging system to the imaged object, so that the imaging system can make the size of the double-spectrum image different according to the difference of the distance from the imaged object to the imaging system.
Alternatively, the photodiode 52 is an avalanche photodiode. The avalanche photodiode has the characteristics of low noise and high photoelectric conversion speed, and can improve the speed of single-pixel imaging.
Alternatively, as shown in fig. 1, the third condenser 51 has an ellipsoidal shape. The third condenser lens 51 is used to focus the parallel rays into a point source.
Optionally, as shown in fig. 1, the imaging system further comprises a first reflective mirror 46 and a second reflective mirror 53, the first light beam is reflected to the first optical path assembly by the first reflective mirror 46, and the second light beam is reflected to the second optical path assembly by the second reflective mirror 53. Specifically, the first light beam sequentially passes through a first reflective mirror 46 and a half-mirror 41 to form a third light beam and a fourth light beam, the third light beam is focused by a first collecting mirror 42 and is mapped to a first band detector 43, the first band detector 43 detects visible light rays in the third light beam and is converted into a first electric signal, the fourth light beam is focused by a second collecting mirror 44 and is mapped to a second band detector 45, the second band detector 45 detects short-wave infrared rays and is converted into a second electric signal, and the first electric signal and the second electric signal are processed by an information processor 7 to realize pixel-level fusion of the visible light rays and the short-wave infrared rays; the second light beam is reflected to a third light condensing mirror 51 through a second reflecting mirror 53, the third light condensing mirror 51 focuses and maps the second light beam to a photodiode 52, the photodiode 52 performs photoelectric conversion on the second light beam and forms a third electric signal, and the third electric signal is processed through an information processor 7 to realize single-pixel imaging of an imaged object, so that the imaging system realizes three-dimensional imaging of the imaged object based on single-pixel sampling; meanwhile, the information processor 7 processes the third electrical signal to determine the distance from the imaging system to the imaged object, so that the imaging system can make the size of the dual-spectrum image different according to the difference of the distance from the imaged object to the imaging system.
Alternatively, as shown in fig. 1, the first reflective mirror 46 and the second reflective mirror 53 are both distributed on the side of the digital micro-mirror 2 facing the lens assembly and are axisymmetric with respect to the center normal of the digital micro-mirror 2. So configured, the first reflective mirror 46 and the second reflective mirror 53 are axisymmetric with respect to a center normal of the digital micro-mirror 2 to ensure that the first light beam reflected from the first reflective mirror 46 to the half mirror 41 is the same as the second light beam reflected from the second reflective mirror 53 to the third reflective mirror 51, so as to further improve the imaging effect of the imaging system.
Alternatively, both the first reflective mirror 46 and the second reflective mirror 53 are flat mirrors. The surface of the plane mirror is smooth, and the reflecting effect is good.
Optionally, the included angle between the first working position and the second working position ranges from 40 ° ± σ, and σ is any positive integer degree from 1 ° to 20 °. It can be understood that the included angle between the first working position and the second working position is the turning angle range of the digital micromirror device 2, and the included angle between the first working position and the second working position can be adjusted as required. The straight line formed by the lens assembly, the digital micro-mirror 2 and the object to be imaged is taken as a symmetry axis, and the reference position of the digital micro-mirror 2 is taken when the digital micro-mirror 2 is on the straight line, so as to further ensure that the first light beam reflected by the digital micro-mirror 2 to the first reflective mirror 46 is the same as the second light beam reflected to the second reflective mirror 53, and improve the imaging effect of the imaging system. In this embodiment, the angle between the reference position and the first operating position is 17 °, and the angle between the reference position and the second operating position is 17 °.
Optionally, as shown in fig. 1, the imaging system further includes a convex lens 6, and the light emitted by the laser 1 can be irradiated to the object to be imaged in parallel after passing through the convex lens 6. Since the light emitted by the laser 1 is dispersed, by providing the convex lens 6, the dispersed light emitted by the laser 1 is converted into collimated light by the convex lens 6 and is irradiated to the imaged object in parallel.
It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. An imaging system comprises a laser (1) and a first optical path component, wherein the laser (1) is used for emitting light to an imaged object, the first optical path component is used for detecting first waveband light and second waveband light in reflected light of the imaged object, converting the first waveband light into a first electric signal and converting the second waveband light into a second electric signal;
characterized in that the imaging system further comprises:
a second optical path component for receiving the reflected light and converting the reflected light into a third electrical signal;
a digital micro-mirror (2) and a lens assembly, wherein the lens assembly is positioned between the digital micro-mirror (2) and the imaged object, and the reflected light irradiates the digital micro-mirror (2) through the lens assembly;
the digital micromirror device (2) has a first operating position and a second operating position, the digital micromirror device (2) being arranged to: and when the light path module is in the first working position, the received reflected light forms a first light beam and is reflected to the first light path module, and when the light path module is in the second working position, the received reflected light forms a second light beam and is reflected to the second light path module.
2. The imaging system of claim 1, wherein the first optical path assembly comprises a half mirror (41), a first band detection assembly and a second band detection assembly, the digital micro-mirror (2) being capable of reflecting the first light beam to the half mirror (41), the half mirror (41) splitting the first light beam into a third light beam and a fourth light beam, the first band detection assembly being arranged to detect the first band of light in the third light beam and convert the first band of light into the first electrical signal, the second band detection assembly being arranged to detect the second band of light in the fourth light beam and convert the second band of light into the second electrical signal.
3. The imaging system of claim 2, wherein the first band detection assembly includes a first condenser lens (42) and a first band detector (43), the first band detector (43) being configured to detect the first band of wavelengths of light in the third beam and convert the first band of wavelengths of light to the first electrical signal;
the second band detection assembly includes a second condenser lens (44) and a second band detector (45), and the second band detector (45) is configured to detect the second band of light in the fourth beam and convert the second band of light into the second electrical signal.
4. The imaging system of claim 3, wherein the first condenser (42) and the second condenser (44) are cylindrical mirrors.
5. The imaging system according to claim 3, characterized in that the first band detector (43) is a visible ray detector and the second band detector (45) is a line short wave infrared detector.
6. The imaging system according to any of claims 1-5, wherein the second light path component comprises a third micromirror (51) and a photodiode (52), the digital micromirror (2) being capable of reflecting the second light beam to the third micromirror (51), the third micromirror (51) being configured to focus and map the second light beam to the photodiode (52), the photodiode (52) being configured to convert a received light signal into the third electrical signal.
7. The imaging system of any of claims 1-5, further comprising a first mirror (46) and a second mirror (53), the first light beam being reflected to the first optical path assembly via the first mirror (46), and the second light beam being reflected to the second optical path assembly via the second mirror (53).
8. The imaging system of claim 7, wherein the first reflective mirror (46) and the second reflective mirror (53) are both distributed on a side of the digital micromirror device (2) facing the lens assembly and are axisymmetric with respect to a center normal of the digital micromirror device (2).
9. The imaging system of any of claims 1-5, wherein the included angle between the first operating position and the second operating position ranges from 40 ° ± σ, σ being any positive integer in degrees from 1 ° to 20 °.
10. The imaging system according to any one of claims 1 to 5, characterized in that the imaging system further comprises a convex lens (6), and the light emitted by the laser (1) can be irradiated to the imaged object in parallel after passing through the convex lens (6).
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