CN214953783U

CN214953783U - Current resistance tester with accurate test

Info

Publication number: CN214953783U
Application number: CN202120743176.1U
Authority: CN
Inventors: 黄美红; 陈润芝; 王娇
Original assignee: Tianjin Huantong Testing Technology Co ltd
Current assignee: Tianjin Huantong Testing Technology Co ltd
Priority date: 2021-04-12
Filing date: 2021-04-12
Publication date: 2021-11-30
Anticipated expiration: 2031-04-12

Abstract

The application provides a current resistance tester of test accuracy belongs to resistance tester technical field. This test accurate current resistance tester includes resistance tester body and cooling subassembly, the cooling subassembly is including cooling the shell, the fan, refrigeration board and semiconductor refrigeration piece, at above-mentioned realization in-process, cool off a plurality of refrigeration boards through the semiconductor refrigeration piece earlier, the refrigerated gas that the fan absorbs can get into the inside of resistance tester body, and then cool off the inside cooling that cools down of resistance tester body, can be to the inside air conditioning that lets in of resistance tester body, can comparatively effectually cool off to resistance tester body inside, can make the temperature of the electrical components of resistance tester body inside lower, and then can reduce the influence of temperature to resistance tester body detection accuracy, can improve the accuracy that resistance tester body detected.

Description

Current resistance tester with accurate test

Technical Field

The application relates to the field of resistance testers, in particular to a current resistance tester capable of testing accurately.

Background

The current resistance tester is used for detecting the conductivity of an object, is widely applied to electrical safety, grounding engineering and transformers, and is needed to be used in handover, overhaul, change of tap switches and the like, and the detection accuracy is very important due to the fact that the conductivity is detected.

There are a large amount of electrical components in current resistance tester's inside, therefore current resistance tester has heat production at the during operation, and in relevant technique, it is simple only to set up the thermovent at current resistance tester's shell and dispel the heat, and radiating effect is relatively poor, can make the temperature of the inside electrical components of current resistance tester too high, and then can cause great influence to the accuracy that detects, has reduced current resistance tester's accuracy.

SUMMERY OF THE UTILITY MODEL

In order to make up for above not enough, the application provides a current resistance tester of test accuracy, and it is relatively poor to aim at improving radiating effect, can make the temperature of the inside electrical components of current resistance tester too high, and then can cause great influence to the accuracy of detecting, has reduced the problem of current resistance tester accuracy.

The embodiment of the application provides a current resistance tester with accurate test, which comprises a resistance tester body and a cooling assembly.

And one side of the resistance tester body is provided with an air outlet.

The cooling subassembly is including cooling shell, fan, refrigeration board and semiconductor refrigeration piece, the cooling shell connect in the outer wall of resistance tester body, the air inlet has been seted up to one side of cooling shell bottom, the refrigeration board is provided with a plurality of, a plurality of the plate body of refrigeration board all is located the inside of cooling shell, a plurality of one side of refrigeration board all fixed run through in one side of cooling shell, a plurality of refrigeration board align to grid, the heat-absorbing surface and a plurality of semiconductor refrigeration piece one side homogeneous phase of refrigeration board is connected, the fan with the outer wall of resistance tester body links to each other, the inlet scoop of fan with the top of cooling shell is linked together, the air outlet of fan with the inside of resistance tester body is linked together.

In the implementation process, when the resistance tester body works, the plurality of refrigerating plates are cooled by the semiconductor refrigerating sheet, so that the interior of the cooling shell can be cooled, then the cooled gas in the cooling shell is sucked by the fan, the cooled gas sucked by the fan can enter the interior of the resistance tester body, so that the interior of the resistance tester body is cooled, the gas in the resistance tester body can be discharged from the gas outlet, the external gas can enter the interior of the cooling shell from the gas inlet, the gas entering the interior of the cooling shell can be cooled by the plurality of refrigerating plates, cold air can be introduced into the interior of the resistance tester body, the interior of the resistance tester body can be effectively cooled, the temperature of electrical elements in the resistance tester body can be lowered, and the influence of the temperature on the detection accuracy of the resistance tester body can be reduced, the accuracy of resistance tester body detection can be improved.

In a specific embodiment, a first filter screen is arranged inside the air outlet, and a second filter screen is arranged inside the air inlet.

In the implementation process, the first filter screen is used for preventing external dust from entering the resistance tester body, and the second filter screen is used for preventing external dust from entering the cooling shell.

In a specific embodiment, the cooling shell is connected to the outer wall of the resistance tester body far away from the gas outlet side, and the bottom surface inside the cooling shell is obliquely arranged.

In the implementation process, the bottom surface inside the cooling shell is inclined to facilitate the water inside the cooling shell to be discharged from the air inlet.

In a specific implementation scheme, the plate body of a plurality of refrigeration plates is provided with a plurality of through holes, and the through holes are uniformly distributed.

In the implementation process, the plurality of through holes are arranged to increase the surface area of the refrigeration plate position and the surface area of the interior of the cooling shell. The effect of cooling the gas in the shell by the refrigerating plate can be further improved.

In a specific embodiment, a plurality of through holes on two adjacent refrigeration plate bodies are arranged in a one-to-one correspondence and staggered mode.

In the implementation process, the time that the gas inside the cooling shell is inside the cooling shell can be prolonged, and the effect of the gas inside the cooling shell can be further increased by the refrigerating plate.

In a specific implementation scheme, a cold guide plate is arranged on a heat absorption surface of the semiconductor refrigeration sheet, and one side of each of the refrigeration plates is connected with one surface of the cold guide plate.

In a specific implementation scheme, the outer wall cover of leading the cold drawing is equipped with and separates the heat exchanger, separate one side of heat exchanger with a lateral wall of cooling shell links to each other, the lamellar body of semiconductor refrigeration piece run through in separate the heat exchanger.

In the implementation process, the heat shield is used for insulating heat of the cold guide plate, and the influence of external heat on the cold guide plate can be reduced.

In a specific implementation scheme, the air outlet of the fan is communicated with an air outlet pipe, and one end of the air outlet pipe is fixedly penetrated through the side wall of the resistance tester body.

In a specific embodiment, the one end of tuber pipe is provided with the exhaust pipe, the exhaust pipe connect in the inner wall of resistance tester body, the air exit has been seted up to the body of exhaust pipe, the air exit has been seted up a plurality of, a plurality of the air exit align to grid.

In the implementation process, the plurality of air outlets are arranged to enable cold air sucked by the fan to enter the resistance tester body in a dispersed mode, and the cooling effect can be further improved.

In a specific implementation scheme, the cooling assembly further comprises a ventilation pipe, one end of the ventilation pipe is communicated with the air outlet pipe, and the other end of the ventilation pipe is located on one side of the heat absorption surface of the semiconductor refrigeration piece.

In the implementation process, the cold air sucked by the fan can be partially blown to the heat absorbing surface of the semiconductor refrigerating sheet through the ventilating pipe, so that the heat absorbing surface of the semiconductor refrigerating sheet can be cooled, and the refrigerating effect of the semiconductor refrigerating sheet can be increased.

Drawings

In order to more clearly explain the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that for those skilled in the art, other related drawings can be obtained from these drawings without inventive effort.

FIG. 1 is a schematic diagram of a current resistance tester for testing accuracy provided by an embodiment of the present application;

fig. 2 is a schematic structural diagram of a resistance tester body according to an embodiment of the present application;

fig. 3 is a schematic structural diagram of a cooling assembly according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of a part of a cooling shell, a cooling plate and a semiconductor cooling plate provided in an embodiment of the present application;

fig. 5 is a partial structural schematic diagram of a semiconductor cooling fin, a heat shield and a cold guide plate provided by the embodiment of the application.

In the figure: 100-resistance tester body; 111-a first filter; 200-a temperature reduction assembly; 210-a cooling shell; 212-a second filter; 220-a fan; 221-air outlet pipe; 222-an exhaust pipe; 2221-air outlet; 230-a refrigeration plate; 231-a through hole; 240-semiconductor refrigerating sheet; 241-a cold conducting plate; 2411-heat shield; 250-vent pipe.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

To make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.

Thus, the following detailed description of the embodiments of the present application, as presented in the figures, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and thus should not be considered limiting.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Referring to fig. 1, the present application provides a current resistance tester with accurate test, which includes a resistance tester body 100 and a cooling assembly 200.

Referring to fig. 1 and 2, an air outlet is formed at one side of the resistance tester body 100, air inside the resistance tester body 100 is discharged from the air outlet, a first filter screen 111 is disposed inside the air outlet, and the first filter screen 111 is used for preventing external dust from entering the resistance tester body 100.

Referring to fig. 1 to 5, the cooling assembly 200 includes a cooling shell 210, a fan 220, a cooling plate 230 and a semiconductor cooling plate 240, the cooling shell 210 is connected to an outer wall of the resistance tester body 100, an air inlet is formed in one side of the bottom of the cooling shell 210, external air can enter the cooling shell 210 from the air inlet, a second filter screen 212 is arranged inside the air inlet, the second filter screen 212 is used for preventing external dust from entering the cooling shell 210, the cooling shell 210 is connected to an outer wall of the resistance tester body 100 far from the air outlet, the cooling shell 210 is connected to the outer wall of the resistance tester body 100 by welding, a bottom surface inside the cooling shell 210 is inclined, and water inside the cooling shell 210 is conveniently discharged from the air inlet by the inclined bottom surface inside the cooling shell 210.

In this application, refrigeration board 230 is provided with a plurality of, the plate body of a plurality of refrigeration boards 230 all is located the inside of cooling shell 210, one side of a plurality of refrigeration boards 230 is all fixed to run through in one side of cooling shell 210, through-hole 231 has all been seted up to the plate body of a plurality of refrigeration boards 230, a plurality of through-hole 231 has all been seted up, a plurality of through-hole 231 evenly distributed, set up the inside surface area of a plurality of through-hole 231 multiplicable refrigeration board 230 position and cooling shell 210, the inside gaseous effect of cooling shell 210 of increase refrigeration board 230 that can be further, the crisscross setting each other of a plurality of through-hole 231 one-to-one on two adjacent refrigeration board 230 plate bodies, can prolong the inside gas of cooling shell 210 and be in the inside time of cooling shell 210, the inside gaseous effect of cooling shell 210 of increase refrigeration board 230 that can be further, a plurality of refrigeration boards 230 align to each other.

In this application, the heat absorption face of semiconductor refrigeration piece 240 is connected with one side homogeneous phase of a plurality of refrigeration boards 230, open semiconductor refrigeration piece 240 alright cool off a plurality of refrigeration boards 230, and then alright make refrigeration board 230 cool off the inside of cooling shell 210, the heat absorption face of semiconductor refrigeration piece 240 is provided with leads cold plate 241, one side of a plurality of refrigeration boards 230 all links to each other with the one side of leading cold plate 241, the outer wall cover of leading cold plate 241 is equipped with thermal-insulated cover 2411, one side of thermal-insulated cover 2411 links to each other with a lateral wall of cooling shell 210, the lamellar body of semiconductor refrigeration piece 240 runs through in thermal-insulated cover 2411, thermal-insulated cover 2411 is used for leading cold plate 241 to insulate against heat, can reduce the influence of external heat to leading cold plate 241.

In this application, fan 220 links to each other with the outer wall of resistance tester body 100, fan 220 links to each other through the welding with the outer wall of resistance tester body 100, the inlet scoop of fan 220 is linked together with the top of cooling shell 210, the air outlet of fan 220 is linked together with the inside of resistance tester body 100, the air outlet intercommunication of fan 220 has air-out pipe 221, the one end of air-out pipe 221 is fixed to run through in the lateral wall of resistance tester body 100, the one end of air-out pipe 221 is provided with exhaust pipe 222, exhaust pipe 222 connects in the inner wall of resistance tester body 100, air exit 2221 has been seted up to the body of exhaust pipe 222, a plurality of has been seted up to air exit 2221, a plurality of air exit 2221 align to grid, set up the entering resistance tester body 100 that a plurality of air exit 2221 can make the comparatively dispersed of cold wind that fan 220 absorbs, the effect of further increase cooling.

In this application, open semiconductor refrigeration piece 240 earlier and cool off leading cold plate 241, and then cool off a plurality of refrigeration boards 230, and then can cool off the inside of cooling shell 210, then open fan 220 and absorb the inside refrigerated gas of cooling shell 210, the refrigerated gas that fan 220 absorbs can get into exhaust pipe 222 through going out tuber pipe 221, then can get into the inside of resistance tester body 100 from a plurality of air exit 2221, and then cool off the inside of resistance tester body 100, and outside gas can get into inside of cooling shell 210 from the air inlet, the inside gas of getting into cooling shell 210 can be cooled off by a plurality of refrigeration boards 230, and the through-hole 231 that the refrigeration board 230 plate body was seted up can increase the area of gas and refrigeration board 230 contact, can further increase the gaseous effect of refrigeration board 230 cooling.

In this application, cooling subassembly 200 still includes ventilation pipe 250, and the one end and the play tuber pipe 221 of ventilation pipe 250 are linked together, and the other end of ventilation pipe 250 is located one side of semiconductor refrigeration piece 240 heat-absorbing surface, and the cold wind that fan 220 absorb has partly to blow to the heat-absorbing surface of semiconductor refrigeration piece 240 through ventilation pipe 250, can cool down the heat-absorbing surface of semiconductor refrigeration piece 240, multiplicable semiconductor refrigeration piece 240's refrigeration effect.

The working principle of the current resistance tester for testing accuracy is as follows: when the resistance tester body 100 works, the semiconductor cooling plate 240 is firstly opened to cool the cold guide plate 241, and then the plurality of cooling plates 230 are cooled, and then the interior of the cooling shell 210 is cooled, then the fan 220 is opened to absorb the cooled gas inside the cooling shell 210, the cooled gas absorbed by the fan 220 enters the exhaust pipe 222 through the exhaust pipe 221, and then enters the interior of the resistance tester body 100 through the plurality of exhaust ports 2221, and then the interior of the resistance tester body 100 is cooled, and the gas inside the resistance tester body 100 is exhausted from the exhaust port, and the external gas enters the interior of the cooling shell 210 through the air inlet, the gas entering the interior of the cooling shell 210 is cooled by the plurality of cooling plates 230, and cold air can be introduced into the interior of the resistance tester body 100, so that the interior of the resistance tester body 100 can be effectively cooled, the temperature of the electrical components inside the resistance tester body 100 can be lower, so that the influence of the temperature on the detection accuracy of the resistance tester body 100 can be reduced, and the detection accuracy of the resistance tester body 100 can be improved.

It should be noted that the specific model specifications of the resistance tester body 100, the fan 220 and the semiconductor chilling plate 240 need to be determined by type selection according to the actual specification of the device, and the specific type selection calculation method adopts the prior art, so detailed description is omitted.

The power supply of the resistance tester body 100, the fan 220 and the semiconductor chilling plate 240 and the principle thereof will be apparent to those skilled in the art and will not be described in detail herein.

The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A current resistance tester with accurate test is characterized by comprising

The resistance tester comprises a resistance tester body (100), wherein one side of the resistance tester body (100) is provided with an air outlet;

the temperature reduction assembly (200), the temperature reduction assembly (200) comprises a temperature reduction shell (210), a fan (220), a refrigeration plate (230) and semiconductor refrigeration plates (240), the temperature reduction shell (210) is connected to the outer wall of the resistance tester body (100), an air inlet is formed in one side of the bottom of the temperature reduction shell (210), the refrigeration plate (230) is provided with a plurality of refrigeration plates, plate bodies of the refrigeration plates (230) are located inside the temperature reduction shell (210), one sides of the refrigeration plates (230) are fixedly penetrated through one side of the temperature reduction shell (210), the refrigeration plates (230) are uniformly arranged, a heat absorption surface of each semiconductor refrigeration plate (240) is connected with one sides of the refrigeration plates (230), the fan (220) is connected with the outer wall of the resistance tester body (100), and an air suction opening of the fan (220) is communicated with the top of the temperature reduction shell (210), and an air outlet of the fan (220) is communicated with the interior of the resistance tester body (100).

2. The current resistance tester with accurate test according to claim 1, wherein the air outlet is internally provided with a first filter (111), and the air inlet is internally provided with a second filter (212).

3. The current resistance tester capable of testing the accuracy according to claim 1, wherein the cooling shell (210) is connected to the outer wall of the resistance tester body (100) on the side far away from the air outlet, and the bottom surface inside the cooling shell (210) is arranged in an inclined manner.

4. The current resistance tester for testing accuracy according to claim 1, wherein a plurality of through holes (231) are formed in the plate bodies of the plurality of refrigeration plates (230), a plurality of through holes (231) are formed in the through holes (231), and the plurality of through holes (231) are uniformly distributed.

5. The current resistance tester for testing accuracy according to claim 4, wherein a plurality of through holes (231) on two adjacent refrigeration plate bodies (230) are correspondingly arranged in a staggered manner.

6. The current resistance tester for testing accuracy according to claim 1, wherein the heat absorbing surface of the semiconductor chilling plate (240) is provided with a cold conducting plate (241), and one side of each of the chilling plates (230) is connected with one surface of the cold conducting plate (241).

7. The current resistance tester for testing accuracy according to claim 6, wherein the outer wall of the cold conducting plate (241) is sleeved with a heat insulating cover (2411), one side of the heat insulating cover (2411) is connected with one side wall of the cooling shell (210), and the sheet body of the semiconductor refrigeration sheet (240) penetrates through the heat insulating cover (2411).

8. The current resistance tester capable of testing accurately according to claim 1, wherein an air outlet of the fan (220) is communicated with an air outlet pipe (221), and one end of the air outlet pipe (221) is fixedly penetrated through a side wall of the resistance tester body (100).

9. The current resistance tester with accurate test according to claim 8, wherein one end of the air outlet pipe (221) is provided with an air outlet pipe (222), the air outlet pipe (222) is connected to the inner wall of the resistance tester body (100), the body of the air outlet pipe (222) is provided with an air outlet (2221), the air outlet (2221) is provided with a plurality of air outlets (2221) which are uniformly arranged.

10. The current resistance tester capable of testing the accuracy according to claim 8, wherein the cooling assembly (200) further comprises a ventilation pipe (250), one end of the ventilation pipe (250) is communicated with the air outlet pipe (221), and the other end of the ventilation pipe (250) is located on one side of the heat absorbing surface of the semiconductor refrigeration piece (240).