CN214925974U - Damaged silicon chip tool of loss prevention - Google Patents
Damaged silicon chip tool of loss prevention Download PDFInfo
- Publication number
- CN214925974U CN214925974U CN202120048248.0U CN202120048248U CN214925974U CN 214925974 U CN214925974 U CN 214925974U CN 202120048248 U CN202120048248 U CN 202120048248U CN 214925974 U CN214925974 U CN 214925974U
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- silicon chip
- tray
- tool
- fixed box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 51
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 51
- 239000010703 silicon Substances 0.000 title claims abstract description 51
- 230000002265 prevention Effects 0.000 title abstract description 10
- 238000007789 sealing Methods 0.000 claims abstract description 12
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 11
- 238000001125 extrusion Methods 0.000 claims description 6
- 239000011148 porous material Substances 0.000 abstract description 3
- 238000001179 sorption measurement Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a bad silicon chip tool of loss prevention relates to the silicon chip field. The damage-proof silicon wafer jig comprises a base, wherein the upper surface of the base is fixedly connected with a fixing column, the top end of the fixing column is fixedly connected with a tray, a through hole communicated with the inside of the tray is formed in the lower surface of the tray, the lower surface of the tray corresponds to a fixing box fixedly connected with the position of the through hole, a communicating hole communicated with the inside of the fixing box is formed in the bottom of the fixing box, and a connecting ring is fixedly connected to the bottom of the fixing box. This bad silicon chip tool of loss prevention through mutually supporting of silicone tube, go-between, through-hole, fixed box, intercommunicating pore, venthole, hinge, fly leaf and sealing plug, reaches and utilizes the negative pressure adsorption mode to fix a position the silicon chip, avoids traditional rigid location to appear the damage that the silicon chip brought, has solved current silicon chip tool and has adopted rigid location for the silicon chip edge produces the problem of damage easily.
Description
Technical Field
The utility model relates to a silicon chip technology field specifically is a bad silicon chip tool of loss prevention.
Background
The silicon chip is produced by slicing on the basis of the silicon rod, 16 ten thousand transistors can be integrated on the silicon chip with large grain size, which is another milestone of scientific and technical progress, and the silicon element with the content of 25.8 percent in the crust provides inexhaustible source for the production of monocrystalline silicon. Because silicon element is one of the most abundant elements in the earth crust, for a product which is destined to enter a large-scale market like a solar cell, the advantage of the reserve is also one of the reasons that silicon becomes a main material of photovoltaic, a jig is needed for positioning a silicon wafer in the processing process, so that the displacement is avoided, and the existing silicon wafer jig adopts rigid positioning, so that the edge of the silicon wafer is easy to damage.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a bad silicon chip tool of loss prevention has solved current silicon chip tool and has adopted rigid location for the silicon chip edge produces the problem of damage easily.
Technical scheme
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides a bad silicon chip tool of loss prevention, includes the base, the last fixed surface of base is connected with the fixed column, the top fixedly connected with tray of fixed column, the through-hole that is linked together with the tray inside is seted up to the lower surface of tray, the fixed box of fixed fixedly connected with of lower surface and corresponding through-hole of tray, the intercommunicating pore that communicates with the fixed box inside is seted up to the bottom of fixed box, the bottom fixedly connected with go-between of fixed box, the lower fixed surface of go-between is connected with the silicone tube, the venthole that communicates with the fixed box inside is seted up on the right side of fixed box, the right side fixedly connected with hinge of fixed box, the bottom fixedly connected with fly leaf of hinge.
Furthermore, the inner wall of the tray is fixedly connected with seven rubber rings, and the diameters of the seven rubber rings are different.
Furthermore, the left side fixedly connected with sealing plug of fly leaf, the surface of sealing plug and the inside joint of venthole.
Furthermore, the upper surface of the base is provided with a sliding groove, and the sliding block is connected to the inside of the sliding groove in a sliding manner.
Furthermore, the upper surface of the sliding block is fixedly connected with an extrusion plate, and the right side of the extrusion plate is in lap joint with the left side of the silicone tube.
Furthermore, a handle is fixedly connected to the left side of the extrusion plate.
The utility model provides a bad silicon chip tool of loss prevention. The method has the following beneficial effects:
1. this bad silicon chip tool of loss prevention through mutually supporting of silicone tube, go-between, through-hole, fixed box, intercommunicating pore, venthole, hinge, fly leaf and sealing plug, reaches and utilizes the negative pressure adsorption mode to fix a position the silicon chip, avoids traditional rigid location to appear the damage that the silicon chip brought, has solved current silicon chip tool and has adopted rigid location for the silicon chip edge produces the problem of damage easily.
2. This bad silicon chip tool of loss prevention through the cooperation of spout, slider and stripper plate, reaches and is convenient for extrude the inside air of silica gel pipe fast, increases negative pressure adsorption effect, through the setting of rubber circle, can carry out the silicon chip position according to the distance of rubber circle and silicon chip outer lane and confirm, conveniently knows the silicon chip and places whether be in the tray centre, and the rubber circle can also protect the silicon chip lower surface in addition, avoids appearing wearing and tearing.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged view of a portion A of FIG. 1;
fig. 3 is a schematic structural view of the tray and the rubber ring in fig. 1 according to the present invention.
The device comprises a base 1, a fixing column 2, a tray 3, a through hole 4, a fixing box 5, a communicating hole 6, a connecting ring 7, an extrusion plate 8, a handle 9, a sliding groove 10, a sliding block 11, a silicone tube 12, a rubber ring 13, an air outlet hole 14, a sealing plug 15, a movable plate 16 and a hinge 17.
Detailed Description
As shown in fig. 1-3, an embodiment of the present invention provides a damage-proof silicon wafer jig, which includes a base 1, a sliding groove 10 is formed on an upper surface of the base 1, a sliding block 11 is slidably connected inside the sliding groove 10, a fixing column 2 is fixedly connected to the upper surface of the base 1, a tray 3 is fixedly connected to a top end of the fixing column 2, a rubber ring 13 is fixedly connected to an inner wall of the tray 3, the rubber ring 13 has seven rubber rings with different diameters, a through hole 4 is formed on a lower surface of the tray 3 and is communicated with an inside of the tray 3, a fixing box 5 is fixedly connected to a position of the lower surface of the tray 3 corresponding to the through hole 4, a communication hole 6 is formed on a bottom of the fixing box 5 and is communicated with an inside of the fixing box 5, a connecting ring 7 is fixedly connected to a bottom of the fixing box 5, a silicone tube 12 is fixedly connected to a lower surface of the connecting ring 7, and an extrusion plate 8 is fixedly connected to an upper surface of the sliding block 11, the right side of stripper plate 8 and the left side overlap joint of silicone tube 12, the left side fixedly connected with handle 9 of stripper plate 8, the venthole 14 that is linked together with fixed box 5 inside is seted up on the right side of fixed box 5, the left side fixedly connected with sealing plug 15 of fly leaf 16, the surface of sealing plug 15 and the inside joint of venthole 14, the right side fixedly connected with hinge 17 of fixed box 5, the bottom fixedly connected with fly leaf 16 of hinge 17.
The working principle is as follows: placing a circular silicon wafer in a tray 3, determining the position of the silicon wafer according to rubber rings 13 with different sizes, when the edge of the outer ring of the silicon wafer is just positioned in one of the rubber rings 13 and the distance between the edge of the outer ring of the silicon wafer and the edge of the current rubber ring 13 is basically equal, the silicon wafer is positioned in the middle of the tray 3, slightly pressing the silicon wafer downwards, grasping two handles 9 to relatively quickly push the silicon wafer, so that two squeezing plates 8 squeeze a silicone tube 12, air in the silicone tube 12 enters a fixed box 5 through a communicating hole 6, the space of the fixed box 5 is limited, the air pressure in the fixed box 5 is increased, then the movable plate 16 is pushed away by the air, the sealing plug 15 is separated from the inside of the air outlet 14, finally the air is discharged through the air outlet 14, and when the air is basically emptied, the sealing plug 15 and the movable plate 16 return to the original position, then, the sealing plug 15 is pressed by hand to be firmly clamped into the air outlet 14, and at the moment, the inside of the fixing box 5 is in a negative pressure state, so that the lower surface of the silicon wafer in the tray 3 can be adsorbed and fixed.
Claims (6)
1. The utility model provides a prevent damaging silicon chip tool, includes base (1), its characterized in that: the upper surface of the base (1) is fixedly connected with a fixed column (2), the top end of the fixed column (2) is fixedly connected with a tray (3), the lower surface of the tray (3) is provided with a through hole (4) communicated with the inside of the tray (3), the lower surface of the tray (3) is fixedly connected with a fixed box (5) corresponding to the position of the through hole (4), the bottom of the fixed box (5) is provided with a communicating hole (6) communicated with the inside of the fixed box (5), the bottom of the fixed box (5) is fixedly connected with a connecting ring (7), the lower surface of the connecting ring (7) is fixedly connected with a silicone tube (12), the right side of the fixed box (5) is provided with an air outlet (14) communicated with the inside of the fixed box (5), the right side fixedly connected with hinge (17) of fixed box (5), the bottom fixedly connected with fly leaf (16) of hinge (17).
2. The tool for preventing the damaged silicon wafer according to claim 1, wherein: the inner wall of the tray (3) is fixedly connected with rubber rings (13), the rubber rings (13) are seven in total, and the diameters of the seven rubber rings (13) are different.
3. The tool for preventing the damaged silicon wafer according to claim 1, wherein: the left side of the movable plate (16) is fixedly connected with a sealing plug (15), and the surface of the sealing plug (15) is clamped with the inside of the air outlet hole (14).
4. The tool for preventing the damaged silicon wafer according to claim 1, wherein: the upper surface of the base (1) is provided with a sliding chute (10), and the inside of the sliding chute (10) is connected with a sliding block (11) in a sliding manner.
5. The tool for preventing the damaged silicon wafer as claimed in claim 4, wherein: the upper surface of slider (11) fixed connection has stripper plate (8), the right side of stripper plate (8) and the left side overlap joint of silicone tube (12).
6. The tool for preventing the damaged silicon wafer as claimed in claim 5, wherein: the left side of the extrusion plate (8) is fixedly connected with a handle (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120048248.0U CN214925974U (en) | 2021-01-08 | 2021-01-08 | Damaged silicon chip tool of loss prevention |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120048248.0U CN214925974U (en) | 2021-01-08 | 2021-01-08 | Damaged silicon chip tool of loss prevention |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214925974U true CN214925974U (en) | 2021-11-30 |
Family
ID=79122464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120048248.0U Expired - Fee Related CN214925974U (en) | 2021-01-08 | 2021-01-08 | Damaged silicon chip tool of loss prevention |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214925974U (en) |
-
2021
- 2021-01-08 CN CN202120048248.0U patent/CN214925974U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211130 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |