CN214898860U - Glass phased array antenna - Google Patents
Glass phased array antenna Download PDFInfo
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- CN214898860U CN214898860U CN202121580498.5U CN202121580498U CN214898860U CN 214898860 U CN214898860 U CN 214898860U CN 202121580498 U CN202121580498 U CN 202121580498U CN 214898860 U CN214898860 U CN 214898860U
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Abstract
The utility model relates to a glass phased array antenna, including the glass substrate, the front of glass substrate is provided with first metal level, and the back is provided with the second metal level, is provided with the metal through-hole of the first metal level of a plurality of switches-on and second metal level on the glass substrate, be provided with the solder mask on the second metal level, the radiating element of first metal level formation E shape. The glass substrate is adopted, the dielectric loss of the glass is very low, the performance characteristics of the glass can be fully embodied in high frequency, and the application range of the antenna is in the high frequency range of 30 GHz-40 GHz.
Description
Technical Field
The utility model belongs to the technical field of the antenna and specifically relates to a glass phased array antenna for radio frequency microwave.
Background
Currently, in the explosive development stage of wireless communication technology, an antenna is a research hotspot as a key component of a mobile terminal and a base station. Compared with the traditional antenna, the microstrip antenna has the advantages of small volume, simple structure, high efficiency, low cost and the like. The conventional antenna substrate is made of ceramic, organic resin and other media, the ceramic is expensive, wafer-level packaging cannot be achieved, and large-scale production is not facilitated.
The glass material is adopted to manufacture the antenna, so that the antenna has the following advantages: the glass is easy to produce and inspect due to the transparent appearance; the packaging can be carried out on a large scale, the batch production is facilitated, and the cost is reduced; the microwave performance is good, and the high-frequency performance of the antenna is favorably improved; the processing precision is high, the integration is easy, and simultaneously, the possibility is provided for the integration of multiple functions. With the development of the miniaturization and integration of glass-based antennas, glass antennas have been widely regarded and studied by people. For example, a dual-band antenna is implemented on a glass substrate, or a millimeter wave band antenna is implemented by using an ipd (integrated passive device) technology, and a broadband dual-polarized transparent stacked microstrip antenna is also proposed to promote integration with an optical device. The prior art has not found research into antennas for high frequencies where the operating frequency is specific.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a glass phased array antenna is provided, response frequency is injectd in high frequency 30 ~ 40GHz, and excellent performance.
The utility model provides a technical scheme that its technical problem adopted is: the glass phased-array antenna comprises a glass substrate, wherein a first metal layer is arranged on the front surface of the glass substrate, a second metal layer is arranged on the back surface of the glass substrate, a plurality of metal through holes for connecting the first metal layer and the second metal layer are formed in the glass substrate, a solder mask layer is arranged on the second metal layer, and the first metal layer forms an E-shaped radiating unit.
Further, the first metal layer is a gold layer.
Furthermore, the second metal layer is a single-layer titanium layer, a single-layer copper layer or a titanium copper layer, and the thickness of the second metal layer is 10 nm-300 nm.
Further, the glass substrate is a quartz glass plate or a high borosilicate glass plate.
Further, the thickness of the glass substrate is 100 to 500 μm.
Furthermore, the diameter of the metal through hole is 30-100 mu m.
Further, the solder mask layer is a PI glue layer.
Furthermore, the length of the radiation unit is 3.5-4 mm, and the width of the radiation unit is 1.8-2.2 mm.
Furthermore, the number of the radiation units is n m, wherein n is an integer greater than or equal to 2, m is an integer greater than or equal to 2, the radiation units are distributed in a matrix, and the distance between every two adjacent radiation units is 4-5 mm.
Furthermore, a PAD PAD is arranged on the back surface of the glass substrate and comprises a copper layer, a nickel layer and a gold layer which are sequentially arranged.
The utility model has the advantages that: the glass substrate is adopted, the dielectric loss of the glass is very low, the performance characteristics of the glass can be fully embodied in high frequency, and the application range of the antenna is in the high frequency range of 30 GHz-40 GHz.
Drawings
Fig. 1 is a perspective view of the present invention;
FIG. 2 is a schematic cross-sectional view of a substrate;
fig. 3 is a schematic layout of a 4 x 4 channel glass microstrip antenna;
fig. 4 is a schematic layout of an 8-by-8 channel glass microstrip antenna;
reference numerals: 11-a glass substrate; 12 — a first metal layer; 13 — a second metal layer; 14-metal vias; 15-a solder mask layer; 16-PAD.
Detailed Description
The present invention will be further explained with reference to the drawings and examples.
As shown in fig. 1 and 2, the glass phased-array antenna of the present invention includes a glass substrate 11, a first metal layer 12 is disposed on the front surface of the glass substrate 11, a second metal layer 13 is disposed on the back surface of the glass substrate 11, a plurality of metal through holes 14 for connecting the first metal layer 12 and the second metal layer 13 are disposed on the glass substrate 11, a solder mask layer 15 is disposed on the second metal layer 13, and the first metal layer 12 forms an E-shaped radiation unit.
The glass substrate 11 is made of a special glass material such as a quartz glass plate or a high borosilicate glass plate, and has a thickness of 100 to 500 μm. The glass material has very low dielectric loss, can fully embody the performance characteristics of the glass material in high frequency, and is particularly suitable for the response high frequency of 30 GHz-40 GHz.
The first metal layer 12 is preferably made of gold, and is characterized by oxidation resistance and excellent stability. In order to stably attach the first metal layer 12 to the glass substrate 11, a metal adhesion layer may be disposed between the first metal layer 12 and the glass substrate 11, the metal adhesion layer is made of a single layer of titanium, a single layer of copper, or a combination of a titanium layer and a copper layer, and the adhesion between Ti and the glass substrate 11 is good, so as to ensure stability. The total thickness of the metal adhesion layer and the first metal layer 12 is controlled to be 10 nm-300 nm. The first metal layer 12 forms an E-shaped radiation unit having dual-band antenna characteristics, and can improve directivity coefficient and reduce grating lobes after forming an antenna array.
The second metal layer 13 can be a single titanium layer, a single copper layer or a titanium copper layer, and the thickness of the titanium copper layer is 10nm to 300nm, namely the combination of the titanium layer and the copper layer. Ti has a good bonding force with the glass substrate 11 and can also be an intermediate layer between the gold layer and the glass substrate 11.
The metal through hole 14 is used for connecting the first metal layer 12 and the second metal layer 13, the metal through hole 14 can be obtained by processing a through hole on the glass substrate 11 and then filling the through hole with copper, the copper has excellent conductivity and is low in price, and the diameter of the metal through hole 14 is 30-100 microns.
The length of the radiation unit is 3.5-4 mm, and the width of the radiation unit is 1.8-2.2 mm. The radiation units can adopt a multi-channel layout, namely the number of the radiation units is n m, wherein n is an integer greater than or equal to 2, m is an integer greater than or equal to 2, the radiation units are distributed in a matrix mode, and the distance between every two adjacent radiation units 2 is 4-5 mm. Such as the 4 x 4 channel glass microstrip antenna layout shown in fig. 3 and the 8 x 8 channel glass microstrip antenna layout shown in fig. 4.
The back of the glass substrate 11 is provided with a PAD PAD16, and the PAD PAD16 comprises a copper layer, a nickel layer and a gold layer which are sequentially arranged. The PAD PAD16 can be obtained by exposure and development, the manufacture is simple and convenient, and the processes of CVD \ PECVD and the like are not needed. The gold layer is used as the bonding pad, the bonding force with tin is good, the stability is good, nickel is used as a barrier layer, the diffusion of tin can be effectively blocked, compared with the method of directly using copper as the bonding pad, the copper-based bonding pad has the advantages that the stability is good, and a Kendall cavity cannot be formed even if reflow soldering is carried out for multiple times. (KeKendall voiding is due to Cu and Cu3Mutual diffusion reaction of Sn to form Cu6Sn5Sn in the solder matrix is depleted, causing hole migration).
When receiving an antenna signal, the first metal layer 12 serves as an antenna signal receiving port. When transmitting signals, the signals are transmitted to the second metal layer 13 through the TR component, propagate in the metal through holes 14 of the glass substrate 1, and are transmitted to the first metal layer 12.
A metal feed network is constructed on the back of the glass substrate 11, the feed system and the packaged antenna are interconnected by utilizing BGA (ball grid array) planting beads, and radio-frequency signals are transmitted into the first metal 12 (namely, a radiation unit) through the metal through hole 14, namely, in a coaxial feed mode, so that the glass-based planar phased array antenna is obtained.
The utility model discloses a following process preparation of antenna accessible: firstly, a glass through hole is manufactured on a glass substrate 11 through laser drilling, then deep hole sputtering is carried out, electroplating is carried out, copper is electroplated into the glass through hole, the through hole is metalized, a metal through hole 14 is obtained, and copper on the surface of the glass substrate 11 is removed through grinding and polishing. And then two sides are divided, one side is used as the front side to manufacture a gold antenna emitting layer, namely the first metal layer 12, the other side is used as the back side to manufacture a titanium reflecting layer, namely the second metal layer 13, after the reflecting layer is manufactured, a copper-nickel-gold layer is manufactured by a chemical plating method to be used as a PAD PAD16, and the chemical plating has the advantages of low price and mature process. Then, a PI glue layer is formed, and the PAD16 is exposed and developed, so that the glass antenna is completed. Finally, when in application, the PAD PAD16 and the TR component are connected in a BGA ball-planting mode and can be used.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. Glass phased array antenna, its characterized in that: the radiating element comprises a glass substrate (11), wherein a first metal layer (12) is arranged on the front surface of the glass substrate (11), a second metal layer (13) is arranged on the back surface of the glass substrate (11), a plurality of metal through holes (14) which are communicated with the first metal layer (12) and the second metal layer (13) are formed in the glass substrate (11), a solder mask layer (15) is arranged on the second metal layer (13), and the first metal layer (12) forms an E-shaped radiating element.
2. The glass phased array antenna of claim 1, wherein: the first metal layer (12) is a gold layer.
3. The glass phased array antenna of claim 1, wherein: the second metal layer (13) is a single-layer titanium layer, a single-layer copper layer or a titanium copper layer, and the thickness of the second metal layer is 10 nm-300 nm.
4. The glass phased array antenna of claim 1, wherein: the glass substrate (11) is a quartz glass plate or a high borosilicate glass plate.
5. The glass phased array antenna of claim 1 or 4, wherein: the glass substrate (11) has a thickness of 100 to 500 μm.
6. The glass phased array antenna of claim 1, wherein: the diameter of the metal through hole (14) is 30-100 mu m.
7. The glass phased array antenna of claim 1, wherein: the solder mask layer (15) is a PI glue layer.
8. The glass phased array antenna of claim 1, wherein: the length of the radiation unit is 3.5-4 mm, and the width of the radiation unit is 1.8-2.2 mm.
9. The glass phased array antenna of claim 1, wherein: the number of the radiation units is n m, wherein n is an integer greater than or equal to 2, m is an integer greater than or equal to 2, the radiation units are distributed in a matrix mode, and the distance between every two adjacent radiation units is 4-5 mm.
10. The glass phased array antenna of claim 1, wherein: the back of the glass substrate (11) is provided with a PAD PAD (16), and the PAD PAD (16) comprises a copper layer, a nickel layer and a gold layer which are sequentially arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121580498.5U CN214898860U (en) | 2021-07-13 | 2021-07-13 | Glass phased array antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121580498.5U CN214898860U (en) | 2021-07-13 | 2021-07-13 | Glass phased array antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214898860U true CN214898860U (en) | 2021-11-26 |
Family
ID=78928207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121580498.5U Active CN214898860U (en) | 2021-07-13 | 2021-07-13 | Glass phased array antenna |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214898860U (en) |
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2021
- 2021-07-13 CN CN202121580498.5U patent/CN214898860U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221227 Address after: 611731 no.d136, innovation center, No.4, Xixin Avenue, high tech Zone, Chengdu City, Sichuan Province Patentee after: Chengdu Maike Technology Co.,Ltd. Address before: 610057 No. 0718, unit 2, building 1, No. 35, Taoyuan Street, Chenghua District, Chengdu, Sichuan Patentee before: Zhang Jihua |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230918 Address after: 523947 Room 103, Building 6, No.1 Xuefu Road, Songshan Lake Park, Dongguan City, Guangdong Province Patentee after: Triassic (Guangdong) Technology Co.,Ltd. Address before: 611731 no.d136, innovation center, No.4, Xixin Avenue, high tech Zone, Chengdu City, Sichuan Province Patentee before: Chengdu Maike Technology Co.,Ltd. |