CN214898418U

CN214898418U - Durable high-temperature-resistant power chip

Info

Publication number: CN214898418U
Application number: CN202121121329.5U
Authority: CN
Inventors: 薛小荣
Original assignee: Shenzhen Ruizuo Technology Co ltd
Current assignee: Shenzhen Ruizuo Technology Co ltd
Priority date: 2021-05-24
Filing date: 2021-05-24
Publication date: 2021-11-26
Anticipated expiration: 2031-05-24

Abstract

The utility model relates to a durable type high temperature resistance power chip, including the cooling system, the cooling system includes insulating layer, vent pipe, tuber pipe, conducting strip, heating panel and heat conduction silica gel piece, the inner wall fixed mounting of chip shell has the insulating layer, and the equal fixed mounting in both sides has the vent pipe about the chip shell, and the vent pipe is through the tuber pipe of its back fixed mounting and the left side fixed connection of conducting strip, the right side of conducting strip and the left side fixed connection of heating panel, and the top inner wall of chip shell and the equal fixed mounting in bottom inner wall have the heat conduction silica gel piece. This durable type high temperature resistant power chip through setting up the insulating layer, keeps apart power chip and the external source that generates heat that probably exists, dissipates the produced heat of chip main part through setting up the heating panel, through setting up heat conduction silica gel piece, with further conduction to the heating panel of the heat that the chip main part produced to reach many-sided heat dissipation from inside to outside, strengthened the high temperature resistance ability of chip main part.

Description

Durable high-temperature-resistant power chip

Technical Field

The utility model relates to a power chip technical field specifically is a durable type high temperature resistance power chip.

Background

The power supply chip is a chip which plays roles of conversion, distribution, detection and other electric energy management of electric energy in an electronic equipment system, and is mainly responsible for identifying the power supply amplitude of a CPU (central processing unit), generating corresponding short moment waves and pushing a rear-stage circuit to output power.

The existing power chip is high in integration degree and convenient to install, but the existing power chip is simple in structure mostly, the power chip can be gradually heated along with the increase of the service time in a circuit, the high-temperature resistant degree of the existing power chip is generally low, the damage and the deformation of important parts in the power chip are extremely easy to cause, and therefore the durable high-temperature resistant power chip is provided to solve the problem.

SUMMERY OF THE UTILITY MODEL

The utility model provides a not enough to prior art, the utility model provides a durable type high temperature resistance power chip possesses advantages such as high temperature resistant, has solved the most simple structure of current power chip, and power chip can heat up along with the increase of live time in the circuit gradually, and current power chip's high temperature resistant degree is generally lower, very easily arouses the problem of the damage and the deformation of the inside important part of power chip.

In order to achieve the above object, the utility model provides a following technical scheme: a durable high-temperature-resistant power chip comprises a chip shell, wherein an outer pin is fixedly installed at the bottom of the chip shell, a heat dissipation system is fixedly installed inside the chip shell, and a chip main body is fixedly installed inside the chip shell;

the cooling system comprises a heat insulation layer, a ventilation pipe opening, an air pipe, a heat conducting fin, a heating panel and a heat conducting silica gel sheet, wherein the heat insulation layer is fixedly arranged on the inner wall of the chip shell, the ventilation pipe opening is fixedly arranged on the left side and the right side of the chip shell, the air pipe opening is fixedly arranged on the back side of the ventilation pipe opening through the air pipe and the heat conducting fin, the right side of the heat conducting fin is fixedly connected with the left side of the heating panel, and the heat conducting silica gel sheet is fixedly arranged on the top inner wall and the bottom inner wall of the chip shell.

Further, the quantity of outer pin is four, and respectively two correspond each other about and, the top fixed mounting of chip shell has chip model signboard.

Further, the back of the heat insulation layer is fixedly installed on the inner wall of the chip shell, and the front of the heat insulation layer is fixedly installed with a lead plate.

Furthermore, the front faces of the left and right ventilating pipe orifices are fixedly provided with shutter air pipe orifices, and the air pipes penetrate through the chip shell from the back faces of the ventilating pipe orifices and extend to the inside of the chip shell.

Further, the quantity of heating panel is two, and two heating panels are fixed mounting respectively in the inside left and right sides of chip shell, and just control two heating panels and correspond each other, control two fixed mounting has the chip main part between the heating panel.

Further, the upper heat conduction silica gel sheet and the lower heat conduction silica gel sheet are fixedly connected with the top and the bottom of the chip main body, and the left side and the right side of the upper heat conduction silica gel sheet and the right side of the lower heat conduction silica gel sheet are fixedly connected with the left heat dissipation plate and the right heat dissipation plate.

Compared with the prior art, the technical scheme of the application has the following beneficial effects:

1. this durable type high temperature resistant power chip through setting up the insulating layer, keeps apart power chip and the external source that generates heat that probably exists, dissipates the produced heat of chip main part through setting up the heating panel, through setting up heat conduction silica gel piece, with further conduction to the heating panel of the heat that the chip main part produced to reach many-sided heat dissipation from inside to outside, strengthened the high temperature resistance ability of chip main part.

2. This durable type high temperature resistant power chip, through setting up the mouth of pipe that ventilates, the mouth of pipe that ventilates passes through tuber pipe and conducting strip fixed connection, thereby make the lower air of external temperature can get into the inside of chip shell through the mouth of pipe that ventilates, conducting strip and heating panel fixed connection, the temperature of heating panel has been reduced, also make the inside heat of chip shell can conduct to the outside of chip shell, power chip's high temperature resistant ability has further been strengthened, power chip's life has been strengthened.

Drawings

FIG. 1 is a schematic cross-sectional view of the present invention;

fig. 2 is a schematic top view of the present invention.

In the figure: 1 chip shell, 2 outer pins, 3 heat dissipation systems, 301 heat insulation layers, 302 ventilation pipe openings, 303 air pipes, 304 heat conduction sheets, 305 heat dissipation plates, 306 heat conduction silica gel sheets and 4 chip main bodies.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, a durable high-temperature-resistant power chip includes a chip housing 1, an outer pin 2 is fixedly mounted at the bottom of the chip housing 1, the outer pin 2 facilitates mounting of the power chip, a heat dissipation system 3 is fixedly mounted inside the chip housing 1, the heat dissipation system 3 provides heat dissipation for the power chip, the service life of the power chip is prolonged, and a chip main body 4 is fixedly mounted inside the chip housing 1;

the heat dissipation system 3 comprises a heat insulation layer 301, a vent pipe orifice 302, an air pipe 303, a heat conducting sheet 304, a heat dissipation plate 305 and a heat conducting silica gel sheet 306, the heat insulation layer 301 is fixedly installed on the inner wall of the chip shell 1, the heat insulation layer 301 isolates the outside and the inside of the power chip, heat conduction possibly generated by other adjacent components is avoided, the vent pipe orifices 302 are fixedly installed on the left side and the right side of the chip shell 1, the vent pipe orifices 302 are fixedly connected with the heat conducting sheet 304 through the air pipe 303 by arranging the vent pipe orifices 302, so that air with lower external temperature can enter the inside of the chip shell 1 through the vent pipe orifices, the heat conducting sheet 304 is fixedly connected with the heat dissipation plate 305, the temperature of the heat dissipation plate 305 is reduced, the heat inside of the chip shell 1 can be conducted to the outside of the chip shell 1, the high temperature resistance of the power chip is further enhanced, and the service life of the power chip is prolonged, the vent pipe mouth 302 is fixedly connected with the left side of the heat conducting strip 304 through the air pipe 303 fixedly installed on the back side of the vent pipe mouth, the heat conducting strip 304 is continuously cooled by the lower air outside, so that the purpose of cooling the heat dissipation plate 305 is achieved, the temperature of the chip main body 4 is further reduced, the right side of the heat conducting strip 304 is fixedly connected with the left side of the heat dissipation plate 305, the inner walls of the top and the bottom of the chip shell 1 are fixedly provided with heat conducting silica gel sheets 306, the heat conducting silica gel sheets 306 conduct the heat of the chip main body 4 and the heat dissipation plate 305 to the heat insulation layer 301, the heat insulation layer 301 further conducts the heat to the outside of the power chip, the power chip is isolated from a possibly existing heating source outside by arranging the heat insulation layer 301, the heat generated by the chip main body is dissipated by arranging the heat dissipation plate 305, and the heat generated by the chip main body is further conducted to the heat dissipation plate 305 by arranging the heat conducting silica gel sheets 306, thereby achieving heat dissipation from various sides from inside to outside and enhancing the high temperature resistance of the chip main body 4.

When in implementation, the method comprises the following steps:

1) firstly, all parts of a power supply chip are combined together;

2) then, mounting the power supply chip at a required position;

3) and finally, the heat dissipation system 3 of the power chip dissipates heat along with the work of the power chip.

To sum up, this durable type high temperature resistance power chip through setting up insulating layer 301, keeps apart power chip and the source that generates heat that the external world probably exists, dissipates the produced heat of chip main part 4 through setting up heating panel 305, through setting up heat conduction silica gel piece 306, with further conduction of the heat that chip main part 4 produced to heating panel 305 to reach many-sided heat dissipation from inside to outside, strengthened chip main part 4's high temperature resistance ability.

And, through setting up draught pipe mouth 302, draught pipe mouth 302 passes through tuber pipe 303 and conducting strip 304 fixed connection, thereby make the lower air of external temperature can get into the inside of chip package 1 through draught pipe mouth 302, conducting strip 304 and heating panel 305 fixed connection, the temperature of heating panel 305 has been reduced, also make the inside heat of chip package 1 can conduct the outside to chip package 1, power chip's high temperature resistant ability has further been strengthened, strengthen power chip's life, the most simple structure of current power chip has been solved, and power chip can heat up along with the increase of live time in the circuit gradually, current power chip's high temperature resistant degree is general lower, very easily arouse the problem of the inside important part's of power chip damage and deformation.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a durable type high temperature resistance power chip, includes chip shell (1), its characterized in that: an outer pin (2) is fixedly installed at the bottom of the chip shell (1), a heat dissipation system (3) is fixedly installed inside the chip shell (1), and a chip main body (4) is fixedly installed inside the chip shell (1);

cooling system (3) include insulating layer (301), draught tube mouth (302), tuber pipe (303), conducting strip (304), heating panel (305) and heat conduction silica gel piece (306), the inner wall fixed mounting of chip shell (1) has insulating layer (301), the equal fixed mounting in both sides has draught tube mouth (302) about chip shell (1), draught tube mouth (302) are through the left side fixed connection of its back fixed mounting's tuber pipe (303) and conducting strip (304), the right side of conducting strip (304) and the left side fixed connection of heating panel (305), the top inner wall and the equal fixed mounting in bottom of chip shell (1) have heat conduction silica gel piece (306).

2. The durable high temperature power chip as claimed in claim 1, wherein: the quantity of outer pin (2) is four, and respectively two correspond each other about and, the top fixed mounting of chip shell (1) has chip model signboard.

3. The durable high temperature power chip as claimed in claim 1, wherein: the back surface of the heat insulation layer (301) is fixedly arranged on the inner wall of the chip shell (1), and the front surface of the heat insulation layer (301) is fixedly provided with a lead plate.

4. The durable high temperature power chip as claimed in claim 1, wherein: the front surfaces of the left and right ventilating pipe orifices (302) are fixedly provided with a louver pipe orifice, and the air pipe (303) passes through the chip shell (1) from the back surface of the ventilating pipe orifice (302) and extends to the inside of the chip shell (1).

5. The durable high temperature power chip as claimed in claim 1, wherein: the number of heating panel (305) is two, and two heating panel (305) are fixed mounting respectively in the inside left and right sides of chip shell (1), and just control two heating panel (305) and correspond each other, control two fixed mounting has chip main part (4) between heating panel (305).

6. The durable high temperature power chip as claimed in claim 5, wherein: the upper heat conduction silica gel sheet and the lower heat conduction silica gel sheet (306) are fixedly connected with the top and the bottom of the chip main body (4), and the left side and the right side of the upper heat conduction silica gel sheet and the right side of the lower heat conduction silica gel sheet (306) are fixedly connected with the left heat dissipation plate and the right heat dissipation plate (305).