CN214898417U

CN214898417U - Novel semiconductor chip packaging structure

Info

Publication number: CN214898417U
Application number: CN202121021880.2U
Authority: CN
Inventors: 魏开鸿; 黄城洲
Original assignee: Shenzhen Cansheng Industry Development Co ltd
Current assignee: Shenzhen Cansheng Industry Development Co ltd
Priority date: 2021-05-13
Filing date: 2021-05-13
Publication date: 2021-11-26
Anticipated expiration: 2031-05-13

Abstract

The embodiment of the utility model discloses novel semiconductor chip packaging structure relates to semiconductor chip technical field. The utility model discloses a draw together the bottom plate, bottom plate upper surface swing joint has the heat dissipation box, the left and right sides face difference two installation pieces of fixedly connected with of heat dissipation box, four logical grooves have been seted up to the upper surface of bottom plate, the lower fixed surface of installation piece is connected with the fixture block, the sliding tray has been seted up to a side of fixture block, the first spring of fixedly connected with in the sliding tray, the one end fixedly connected with movable block of sliding tray is kept away from to first spring, two second springs of fixedly connected with are distinguished to the left and right sides face of bottom plate, the one end fixedly connected with push pedal of bottom plate is kept away from to the second spring, a fixed surface that the push pedal is close to the bottom plate is connected with the carriage release lever. The utility model discloses a press the push pedal and make the carriage release lever extrusion movable block, the movable block gets into the sliding tray in, removes the movable block to the restriction of fixture block, and then accomplishes the dismantlement to the heat dissipation box, and the maintenance personal of being convenient for maintains the semiconductor chip main part.

Description

Novel semiconductor chip packaging structure

Technical Field

The embodiment of the utility model provides a relate to semiconductor chip technical field, concretely relates to novel semiconductor chip packaging structure.

Background

The invention relates to a semiconductor chip, in particular to a semiconductor device which is etched and wired on a semiconductor wafer and can realize a certain function.

Traditional semiconductor chip generally is fixed through the welding, leads to the inconvenient dismantlement in later stage to change for the maintenance and cause the puzzlement, semiconductor chip's radiating effect is relatively poor simultaneously, the easy problem in the aspect of the performance that appears because overheated in the use.

Disclosure of Invention

Therefore, the embodiment of the utility model provides a novel semiconductor chip packaging structure, make the carriage release lever extrusion movable block through pressing the push pedal, the movable block gets into the sliding tray, remove the restriction of movable block to the fixture block, and then accomplish the dismantlement to the heat dissipation box, the maintenance personal of being convenient for maintains the semiconductor chip main part, first spring and the cooperation of second spring, make movable block and push pedal reset, be convenient for use next time, transmit heat absorption of semiconductor chip main part for heat radiation fins through the heat-conducting plate, distribute away the heat through heat radiation fins, the temperature is reduced, the life of extension semiconductor chip main part, with the problem among the prior art of solving.

In order to achieve the above object, the embodiments of the present invention provide the following technical solutions:

the utility model provides a novel semiconductor chip packaging structure, comprising a base plate, bottom plate upper surface swing joint has the heat dissipation box, two installation pieces of left and right sides face difference fixedly connected with of heat dissipation box, four logical grooves have been seted up to the upper surface of bottom plate, the lower fixed surface of installation piece is connected with the fixture block, the sliding tray has been seted up to a side of fixture block, the first spring of fixedly connected with in the sliding tray, the one end fixedly connected with movable block of sliding tray is kept away from to first spring, two second springs of left and right sides face difference fixedly connected with of bottom plate, the one end fixedly connected with push pedal of bottom plate is kept away from to the second spring, the push pedal is close to a surperficial fixedly connected with carriage release lever of bottom plate.

Furthermore, the left side surface and the right side surface of the bottom plate are respectively and fixedly connected with an auxiliary ring, and the moving block, the moving rod, the push plate, the second spring and the auxiliary ring are coaxially arranged.

Furthermore, the through groove and the mounting block are coaxially arranged, and the through groove is connected with the clamping block in a sliding mode.

Furthermore, an adhesive layer is laid on the lower surface inside the heat dissipation box, and the heat dissipation box is bonded with the semiconductor chip main body through the adhesive layer.

Furthermore, the heat dissipation box is fixedly connected with a heat conduction plate, and the upper surface of the heat conduction plate is fixedly provided with heat dissipation fins.

Further, the four mounting blocks are symmetrical left and right with respect to the bottom plate.

The utility model discloses an embodiment has following advantage:

1. the utility model discloses a press the push pedal and make the carriage release lever extrusion movable block, the movable block gets into the sliding tray in, removes the movable block to the restriction of fixture block, and then accomplishes the dismantlement to the heat dissipation box, and the maintenance personal of being convenient for maintains the semiconductor chip main part, first spring and second spring cooperation for the movable block resets with the push pedal, is convenient for use next time.

2. The utility model discloses an adhesive layer is fixed the semiconductor chip main part, the installation of being convenient for.

3. The utility model discloses a heat-conducting plate absorbs the heat transmission with the semiconductor chip main part and gives heat radiation fins, distributes away the heat through heat radiation fins, and the reduction in temperature prolongs the life of semiconductor chip main part.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.

Fig. 1 is a schematic view of an overall structure of a novel semiconductor chip package structure according to the present invention;

fig. 2 is a front view of a novel semiconductor chip package structure according to the present invention;

fig. 3 is a top view of a novel semiconductor chip package structure according to the present invention;

fig. 4 is a left side view of a novel semiconductor chip package structure according to the present invention;

fig. 5 is a schematic view of the cross-sectional structure a-a in fig. 4.

In the figure: 1. a base plate; 2. a heat dissipation box; 3. mounting blocks; 4. a through groove; 5. a clamping block; 6. a sliding groove; 7. a first spring; 8. a moving block; 9. a travel bar; 10. pushing the plate; 11. a second spring; 12. an auxiliary ring; 13. an adhesive layer; 14. a semiconductor chip body; 15. a heat conducting plate; 16. and heat dissipation fins.

Detailed Description

The present invention is described in terms of specific embodiments, and other advantages and benefits of the present invention will become apparent to those skilled in the art from the following disclosure. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1-5, the utility model provides a novel semiconductor chip packaging structure, comprising a base plate 1, bottom plate 1 upper surface swing joint has heat dissipation box 2, two installation pieces 3 of left and right sides face difference fixedly connected with of heat dissipation box 2, four logical grooves 4 have been seted up to the upper surface of bottom plate 1, the lower fixed surface of installation piece 3 is connected with fixture block 5, sliding tray 6 has been seted up to a side of fixture block 5, the first spring 7 of fixedly connected with in sliding tray 6, the one end fixedly connected with movable block 8 of sliding tray 6 is kept away from to first spring 7, two second springs 11 of fixedly connected with are distinguished to the left and right sides face of bottom plate 1, the one end fixedly connected with push pedal 10 of bottom plate 1 is kept away from to second spring 11, a fixed surface that push pedal 10 is close to bottom plate 1 is connected with carriage release lever 9.

The push plate 10 and the extrusion block 9 are arranged to have the following functions: make the movable rod 9 extrude the movable block 8 through pressing down the push pedal 10, in the movable block 8 got into the sliding tray 6, remove the restriction of movable block 8 to fixture block 5, and then the completion was to the dismantlement of heat dissipation box 2, the maintenance personal of being convenient for maintained semiconductor chip main part 14, first spring 7 and the cooperation of second spring 11 for movable block 8 and push pedal 10 reset, are convenient for use next time, for the above-mentioned effect of better explanation, to this concrete matter as follows:

the left side surface and the right side surface of the bottom plate 1 are respectively and fixedly connected with an auxiliary ring 12, and the moving block 8, the moving rod 9, the push plate 10, the second spring 11 and the auxiliary ring 12 are coaxially arranged.

The function of the auxiliary ring 12 is to: the auxiliary ring 12 limits the moving direction of the push plate 10, and the push plate 10 is ensured to run stably.

The through groove 4 and the mounting block 3 are coaxially arranged, and the through groove 4 is in sliding connection with the clamping block 5.

The fixture block 5 is arranged to function as: through fixture block 5 and the cooperation of movable block 8, be convenient for fix heat dissipation box 2.

An adhesive layer 13 is laid on the lower surface inside the heat dissipation box 2, and the heat dissipation box 2 is bonded with a semiconductor chip main body 14 through the adhesive layer 13.

The adhesive layer 13 is provided for the purpose of: the semiconductor chip main body 14 is fixed by the adhesive layer 13, and mounting is facilitated.

The heat dissipation box 2 is fixedly connected with a heat conduction plate 15, and the upper surface of the heat conduction plate 15 is fixedly provided with heat dissipation fins 16.

The function of the heat dissipation fins 16 is: the heat exchange is performed by the heat dissipation fins 16, so that the temperature is reduced, and the service life of the semiconductor chip main body 14 is prolonged.

The four mounting blocks 3 are bilaterally symmetrical with respect to the base plate 1.

The mounting block 3 is arranged to function as: the fixing effect is improved by the matching of a plurality of mounting blocks 3.

As shown in fig. 1 to 5, this embodiment is a method for using a novel semiconductor chip package structure: when the disassembly is carried out, the push plate 10 is pressed to enable the moving rod 9 to extrude the moving block 8, the moving block 8 enters the sliding groove 6, the limit of the moving block 8 on the clamping block 5 is removed, the heat dissipation box 2 can be upwards extracted, the disassembly of the heat dissipation box 2 can be further completed, a maintenance worker takes out the semiconductor chip main body 14 for maintenance, the first spring 7 is matched with the second spring 11, the moving block 8 and the push plate 10 are enabled to reset, the heat conduction plate 15 absorbs heat of the semiconductor chip main body 14 and transmits the heat to the heat dissipation fins 16 in the use process, the heat is dissipated out through the heat dissipation fins 16, the temperature is reduced, and the service life of the semiconductor chip main body 14 is prolonged.

Although the invention has been described in detail with respect to the general description and the specific embodiments, it will be apparent to those skilled in the art that modifications and improvements can be made based on the invention. Therefore, such modifications and improvements are intended to be within the scope of the invention as claimed.

Claims

1. A novel semiconductor chip packaging structure comprises a bottom plate (1) and is characterized in that, the heat dissipation device is characterized in that the upper surface of the base plate (1) is movably connected with a heat dissipation box (2), the left side surface and the right side surface of the heat dissipation box (2) are respectively fixedly connected with two installation blocks (3), the upper surface of the base plate (1) is provided with four through grooves (4), the lower surface of each installation block (3) is fixedly connected with a fixture block (5), one side surface of each fixture block (5) is provided with a sliding groove (6), a first spring (7) is fixedly connected with the sliding groove (6) in the sliding groove (6), one end of the first spring (7) is far away from a movable block (8) which is fixedly connected with the sliding groove (6), the left side surface and the right side surface of the base plate (1) are respectively fixedly connected with two second springs (11), one end of the second spring (11) is far away from a push plate (10) which is fixedly connected with the push plate (10), and the push plate (10) is close to a surface of the base plate (1) and is fixedly connected with a moving rod (9).

2. The novel semiconductor chip packaging structure according to claim 1, wherein the auxiliary ring (12) is fixedly connected to each of the left and right sides of the bottom plate (1), and the moving block (8), the moving rod (9), the push plate (10), the second spring (11) and the auxiliary ring (12) are coaxially arranged.

3. The novel semiconductor chip packaging structure according to claim 1, wherein the through groove (4) is coaxially arranged with the mounting block (3), and the through groove (4) is slidably connected with the clamping block (5).

4. The novel semiconductor chip packaging structure of claim 1, wherein an adhesive layer (13) is laid on the inner lower surface of the heat dissipation box (2), and the heat dissipation box (2) is bonded with the semiconductor chip main body (14) through the adhesive layer (13).

5. The novel semiconductor chip packaging structure of claim 1, wherein a heat conducting plate (15) is fixedly connected to the heat dissipation box (2), and a heat dissipation fin (16) is fixedly mounted on the upper surface of the heat conducting plate (15).

6. The novel semiconductor chip package structure according to claim 1, wherein the four mounting blocks (3) are bilaterally symmetric with respect to the base plate (1).