CN214898336U - Semiconductor hot plate adjusting device - Google Patents
Semiconductor hot plate adjusting device Download PDFInfo
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- CN214898336U CN214898336U CN202022941107.XU CN202022941107U CN214898336U CN 214898336 U CN214898336 U CN 214898336U CN 202022941107 U CN202022941107 U CN 202022941107U CN 214898336 U CN214898336 U CN 214898336U
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- hot plate
- mounting groove
- shell
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- plate body
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Abstract
The utility model provides a semiconductor hot plate adjusting device, includes shell and hot plate body, the shell top sets up the mounting groove, the hot plate body slides and sets up in the mounting groove, the mounting groove is located hot plate body bottom and sets up the backup pad, both sides set up the locating piece respectively around the backup pad bottom, both sides set up two sets of locating plates respectively around the mounting groove bottom, it sets up the hob to rotate between locating plate and the mounting groove lateral wall, the hob is kept away from mounting groove lateral wall one end and is set up first bevel gear, both sides rotate the transmission pole around the mounting groove bottom, through the setting of hob, work gear and connecting rod, can be convenient for control the bracing piece and carry out direction of height's regulation to be convenient for adjust the height of hot plate body.
Description
Technical Field
The utility model relates to a semiconductor hot plate technical field specifically is a semiconductor hot plate adjusting device.
Background
At present, in the production process of semiconductor wafers, the requirement on the surface of a hot plate is higher and higher, and when the temperature uniformity of the surface of the hot plate is tested on the plate body after normal production and assembly, the height of the hot plate is often required to be adjusted so as to meet the increasingly complex and precise process requirement. The height of the existing hot plate is not convenient enough, and the operation experience is not good.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Not enough to prior art, the utility model provides a semiconductor hot plate adjusting device.
(II) technical scheme
In order to achieve the above object, the utility model provides a following technical scheme: a semiconductor hot plate adjusting device comprises a shell and a hot plate body, wherein the top end of the shell is provided with a mounting groove, the hot plate body is arranged in the mounting groove in a sliding manner, the mounting groove is positioned at the bottom end of the hot plate body and is provided with a supporting plate, the front side and the rear side of the bottom end of the supporting plate are respectively provided with a positioning block, the front side and the rear side of the bottom end of the mounting groove are respectively provided with two groups of positioning plates, a screw rod is rotatably arranged between the positioning plates and the side wall of the mounting groove, one end of the screw rod, far away from the side wall of the mounting groove, is provided with a first bevel gear, the front side and the rear side of the bottom end of the mounting groove are provided with a transmission rod, the transmission rod is provided with a second bevel gear at a position corresponding to the first bevel gear, the first bevel gear is meshed with the second bevel gear, the mounting groove is positioned above the screw rod and is provided with a working gear, the working gear is meshed with the screw rod, the eccentric position of the working gear is hinged with a connecting rod, one end of the connecting rod, far away from the working gear, is hinged with the positioning block.
In order to facilitate the shock attenuation performance that promotes the shell, the utility model discloses the improvement has, the shell bottom sets up damping device, damping device includes fixed block, slide bar, slide pipe, bracing piece and damping spring, the fixed block top sets up the shock attenuation and puts the thing groove, the thing inslot level of shock attenuation sets up the slide bar, slide bar left and right sides suit slide pipe, the articulated bracing piece in slide pipe top, the bracing piece is kept away from slide pipe one side and is articulated with the shell bottom left and right sides respectively, damping spring suit is put thing groove lateral wall connection with the shock attenuation in slide bar left and right sides and damping spring one end, and the damping spring other end is connected with the slide pipe, and when the shell takes place vibrations, vibrations can transmit damping spring through the bracing piece, and damping spring reaches the absorbing effect through the energy absorption of deformation with vibrations.
In order to facilitate the operating power of control hot plate body, the utility model discloses the improvement has, the shell front end sets up the controller, controller and hot plate body electric connection.
In order to promote the heat-proof quality of shell and mounting groove, the utility model discloses the improvement has, the backup pad top sets up the asbestos gauge, the mounting groove lateral wall sets up the insulating layer.
For the convenience of preventing that the transfer bar from rotating by oneself under this pressure effect of hot plate, the utility model discloses the improvement has, the shell is stretched out to the transfer bar front end, the transfer bar front end sets up the control block, the control block lateral wall sets up the gag lever post, the shell front end is located the control block upper end and rotates and set up the gag lever post, the shell is located the gag lever post left side and sets up the lug.
(III) advantageous effects
Compared with the prior art, the utility model provides a semiconductor hot plate adjusting device possesses following beneficial effect:
this semiconductor hot plate adjusting device through the setting of hob, work gear and connecting rod, can be convenient for control the bracing piece and carry out the regulation of direction of height to be convenient for adjust the height of hot plate body, through damping device's setting, when the shell takes place vibrations, vibrations can transmit damping spring through the bracing piece, and damping spring reaches absorbing effect through the energy absorption that deformation will shake.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic top view of the present invention;
FIG. 3 is a front view of the present invention;
in the figure: 1. a housing; 2. a hot plate body; 3. mounting grooves; 4. a support plate; 5. positioning blocks; 6. positioning a plate; 7. a screw rod; 8. a first bevel gear; 9. a transfer lever; 10. a second bevel gear; 11. a working gear; 12. a connecting rod; 13. a fixed block; 14. a slide bar; 15. a slide pipe; 16. a support bar; 17. a damping spring; 18. a shock-absorbing storage groove; 19. a controller; 20. a control block; 21. a limiting rod; 22. a restraining bar; 23. and (4) a bump.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, a semiconductor hot plate adjusting device comprises a housing 1 and a hot plate body 2, wherein a mounting groove 3 is formed at the top end of the housing 1, the hot plate body 2 is slidably disposed in the mounting groove 3, a supporting plate 4 is disposed at the bottom end of the mounting groove 3 and is positioned at the bottom end of the hot plate body 2, positioning blocks 5 are respectively disposed at the front side and the rear side of the bottom end of the supporting plate 4, two sets of positioning plates 6 are respectively disposed at the front side and the rear side of the bottom end of the mounting groove 3, a screw 7 is rotatably disposed between the positioning plates 6 and the side wall of the mounting groove 3, a first bevel gear 8 is disposed at one end of the screw 7 away from the side wall of the mounting groove 3, transmission rods 9 are rotatably disposed at the front side and the rear side of the bottom end of the mounting groove 3, a second bevel gear 10 is disposed at a position corresponding to the first bevel gear 8, the first bevel gear 8 is engaged with the second bevel gear 10, a working gear 11 is disposed above the screw 7 in the mounting groove 3, the working gear 11 is meshed with the screw rod 7, the eccentric position of the working gear 11 is hinged with the connecting rod 12, and one end, far away from the working gear 11, of the connecting rod 12 is hinged with the positioning block 5.
1 bottom of shell sets up damping device, damping device includes fixed block 13, slide bar 14, slide pipe 15, bracing piece 16 and damping spring 17, 13 tops of fixed block set up the shock attenuation and put thing groove 18, the shock attenuation is put the level in thing groove 18 and is set up slide bar 14, slide bar 14 left and right sides suit slide pipe 15, the articulated bracing piece 16 in slide pipe 15 top, bracing piece 16 keeps away from slide pipe 15 one side and articulates with the 1 bottom left and right sides of shell respectively, damping spring 17 suit is put thing groove 18 lateral wall with the shock attenuation in slide bar 14 left and right sides and damping spring 17 one end and is connected, and the damping spring 17 other end is connected with slide pipe 15, and when shell 1 takes place vibrations, vibrations can transmit damping spring 17 through bracing piece 16, and damping spring 17 reaches the absorbing effect through the energy absorption of deformation with vibrations.
The front end of the shell 1 is provided with a controller 19, and the controller 19 is electrically connected with the hot plate body 2, so that the working power of the hot plate body 2 can be conveniently controlled.
The 4 tops of backup pad set up the asbestos gauge, the 3 lateral walls in mounting groove set up the insulating layer, can promote the heat-proof quality of shell 1 and mounting groove 3.
The casing 1 is stretched out to transfer lever 9 front end, transfer lever 9 front end sets up control block 20, the control block 20 lateral wall sets up gag lever post 21, 1 front end of casing is located the rotation of control block 20 upper end and sets up gag lever post 22, casing 1 is located the left side of gag lever post 22 and sets up lug 23, is convenient for prevent that transfer lever 9 from rotating by oneself under the effect of hot plate body 2 pressure.
In summary, when the semiconductor hot plate adjusting device is used, an operator rotates the control block 20 to drive the core of the transmission rod 9 to rotate, the spiral rod 7 is driven to rotate through conduction of the first bevel gear 8 and the second bevel gear 10, the working gear 11 is driven to rotate through engagement of the spiral rod 7 and the working gear 11, the connecting rod 12 is driven to shift the angle and move the bottom end of the connecting rod 12, the height of the supporting plate 4 is driven to be adjusted, the height of the hot plate body 2 is convenient to adjust, and then the processing power of the hot plate is controlled by the controller 19 to work.
The electrical components presented in the document are all electrically connected with an external master controller and 220V mains, and the master controller can be a conventional known device controlled by a computer or the like.
In the description herein, it is noted that relational terms such as first and second, and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A semiconductor hot plate adjusting device comprises a shell (1) and a hot plate body (2), and is characterized in that: the top end of the shell (1) is provided with a mounting groove (3), the hot plate body (2) is arranged in the mounting groove (3) in a sliding manner, the mounting groove (3) is positioned at the bottom end of the hot plate body (2) and is provided with a supporting plate (4), the front side and the rear side of the bottom end of the supporting plate (4) are respectively provided with a positioning block (5), the front side and the rear side of the bottom end of the mounting groove (3) are respectively provided with two groups of positioning plates (6), a screw rod (7) is rotatably arranged between the positioning plates (6) and the side wall of the mounting groove (3), one end of the screw rod (7) far away from the side wall of the mounting groove (3) is provided with a first bevel gear (8), the front side and the rear side of the bottom end of the mounting groove (3) are respectively provided with a transmission rod (9), the transmission rod (9) and the first bevel gear (8) are correspondingly provided with a second bevel gear (10), and the first bevel gear (8) is meshed with the second bevel gear (10), mounting groove (3) are located hob (7) top and set up work gear (11), work gear (11) and hob (7) mesh mutually, work gear (11) eccentric position hinge joint pole (12), work gear (11) one end is kept away from in connecting rod (12) and locating piece (5) are articulated.
2. A semiconductor hot plate conditioner as claimed in claim 1, wherein: shell (1) bottom sets up damping device, damping device includes fixed block (13), slide bar (14), slide tube (15), bracing piece (16) and damping spring (17), fixed block (13) top sets up the shock attenuation and puts thing groove (18), the shock attenuation is put the level and is set up slide bar (14) in thing groove (18), slide bar (14) left and right sides suit slide tube (15), slide tube (15) top articulates bracing piece (16), bracing piece (16) are kept away from slide tube (15) one side and are articulated with shell (1) bottom left and right sides respectively, damping spring (17) suit is put thing groove (18) lateral wall with the shock attenuation in slide bar (14) left and right sides and damping spring (17) one end and is connected, and the damping spring (17) other end is connected with slide tube (15).
3. A semiconductor hot plate conditioner as claimed in claim 1, wherein: the front end of the shell (1) is provided with a controller (19), and the controller (19) is electrically connected with the hot plate body (2).
4. A semiconductor hot plate conditioner as claimed in claim 1, wherein: and the top end of the supporting plate (4) is provided with an asbestos net.
5. A semiconductor hot plate conditioner as claimed in claim 1, wherein: and a heat insulation layer is arranged on the side wall of the mounting groove (3).
6. A semiconductor hot plate conditioner as claimed in claim 1, wherein: the shell (1) is stretched out to transmission pole (9) front end, transmission pole (9) front end sets up control block (20), control block (20) lateral wall sets up gag lever post (21), shell (1) front end is located control block (20) upper end and rotates and set up gag lever post (22), shell (1) is located gag lever post (22) left side and sets up lug (23).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022941107.XU CN214898336U (en) | 2020-12-10 | 2020-12-10 | Semiconductor hot plate adjusting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022941107.XU CN214898336U (en) | 2020-12-10 | 2020-12-10 | Semiconductor hot plate adjusting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214898336U true CN214898336U (en) | 2021-11-26 |
Family
ID=78904030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022941107.XU Active CN214898336U (en) | 2020-12-10 | 2020-12-10 | Semiconductor hot plate adjusting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214898336U (en) |
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2020
- 2020-12-10 CN CN202022941107.XU patent/CN214898336U/en active Active
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