CN214892266U - Semiconductor cleaning oven - Google Patents
Semiconductor cleaning oven Download PDFInfo
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- CN214892266U CN214892266U CN202121019780.6U CN202121019780U CN214892266U CN 214892266 U CN214892266 U CN 214892266U CN 202121019780 U CN202121019780 U CN 202121019780U CN 214892266 U CN214892266 U CN 214892266U
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- window
- box body
- oven
- top cover
- semiconductor cleaning
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Abstract
The utility model discloses a clean oven of semiconductor has: a box body; the side wall is arranged on the side surface of the box body; the door body is hinged on the front surface of the box body; the top cover is fixedly arranged on the upper surface of the box body; the window is arranged on the top cover; the shutter is rotatably installed on the window, the shutter can open or close the window, the cooling speed of the oven can be adjusted according to the characteristics of actual baked products, the safety of components is guaranteed, and the efficiency is greatly improved.
Description
Technical Field
The utility model belongs to the technical field of semiconductor and panel, especially, relate to a clean oven of semiconductor.
Background
In the semiconductor and panel cleaning industry, high temperature ovens are increasingly used because semiconductor devices and panel devices use various materials, such as stainless steel, titanium alloy, ceramic, etc., while the semiconductor, LCD and OLED manufacturing processes are various, the products deposited on the surface are complex, and the materials, such as ceramic, have a micro-porous structure, and the products on the surface slowly permeate into the interior of the ceramic, so that the products are difficult to completely remove by using general chemical soaking in the cleaning industry. The high-temperature oven is used for continuously baking some special parts at a certain temperature, and products on the surface are removed in a high-temperature oxidation, volatilization and other modes, so that the aim of completely removing or saving labor cost is fulfilled.
In the process of implementing the present invention, the inventor finds that the prior art has at least the following problems: the conventional high-temperature oven is designed according to the size and the quantity of products to be treated in actual needs, and is divided into a box type oven and a trap type oven according to the temperature required by baking operation and the designed internal support, heat insulation material and structure. No matter what kind, all be the box around is overall structure, the airtight design of during operation. The design is safe for baking the traditional ceramic part (the ceramic cannot bear temperature mutation in a high-temperature state and is easy to break), but the temperature reduction process is very slow, generally the temperature reduction from 1000 ℃ to 50 ℃ needs 48 hours, and the efficiency is very low.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a can be according to the product characteristics that actually toast is provided, adjust the cooling rate of oven, both guaranteed the security of part, improved the clean oven of semiconductor of efficiency again greatly.
In order to solve the technical problem, the utility model discloses the technical scheme who adopts is: a semiconductor cleaning oven, having:
a box body;
the side wall is arranged on the side surface of the box body;
the door body is hinged on the front surface of the box body;
the top cover is fixedly arranged on the upper surface of the box body;
the window is arranged on the top cover;
and the shutter is rotatably arranged on the window and can open or close the window.
And the linkage structure is also arranged and is connected with each fan blade of the shutter.
The area of the window accounts for 75% of the whole top cover; the louver has 10 fan blades.
The fan blades can rotate between 0 and 90 degrees.
One of the technical schemes has the following advantages or beneficial effects that the cooling speed of the oven can be adjusted according to the characteristics of the actual baked product, the safety of the parts is ensured, the efficiency is greatly improved, and the cooling in a fully opened state can be realized within 8 hours from 1000 ℃ to 50 ℃.
Drawings
Fig. 1 is a schematic structural diagram of a semiconductor cleaning oven provided in an embodiment of the present invention;
FIG. 2 is a schematic structural view of a top cover of the semiconductor cleaning oven of FIG. 1;
the labels in the above figures are: 1. door body, 2, lateral wall, 3, top cap, 31, lid, 32, window, 33, shutter, 34, linkage structure.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.
Referring to fig. 1-2, a semiconductor cleaning oven has:
a box body;
the side wall is arranged on the side surface of the box body;
the door body is hinged on the front surface of the box body;
the top cover is fixedly arranged on the upper surface of the box body;
the window is arranged on the top cover; and the shutter is rotatably arranged on the window and can open or close the window. The oven top cover is reformed to open a window, and a controllable shutter type top cover plate is added, so that the cooling speed can be effectively controlled.
And the linkage structure is also arranged and is connected with each fan blade of the shutter.
The oven after the top cap improves is opened the top window completely, and hot-air is direct to be discharged by the top, and the oven door is opened the entering of cooperation cold air, has formed smooth and easy circulation, has promoted the efficiency of cooling greatly.
A window is arranged on the top cover plate of the original oven, and the area of the window accounts for 75% of the whole top cover.
Divide into 10 subregion areas with the window region, 10 groups of shutter formula lamina tecti of corresponding preparation, the inside and outside material of lamina tecti is the same with the oven body respectively.
The louver type cover plate can rotate 90 degrees from the horizontal direction to the vertical direction, the oven can be completely sealed in the horizontal state, and the whole window can be opened in the vertical state, so that the internal air is exchanged with the outside.
The 10 groups of louver cover plates form a rotary linkage, a connecting rod mechanism is adopted to connect the rotating shafts of all the fan blades, a motor is arranged, the rotating shaft of the motor is connected with the rotating shaft of one fan blade, and the opening angle is synchronously controlled through the adjustment of the motor.
After the structure is adopted, the cooling speed of the oven can be adjusted according to the characteristics of actual baked products, the safety of parts is ensured, the efficiency is greatly improved, and the cooling in a completely opened state can be realized within 8 hours from 1000 ℃ to 50 ℃.
The present invention has been described above with reference to the accompanying drawings, and it is obvious that the present invention is not limited by the above-mentioned manner, and various insubstantial improvements can be made without modification to the method and technical solution of the present invention, or the present invention can be directly applied to other occasions without modification, all within the scope of the present invention.
Claims (4)
1. A semiconductor cleaning oven, comprising:
a box body;
the side wall is arranged on the side surface of the box body;
the door body is hinged on the front surface of the box body;
the top cover is fixedly arranged on the upper surface of the box body;
the window is arranged on the top cover;
and the shutter is rotatably arranged on the window and can open or close the window.
2. The semiconductor cleaning oven of claim 1, further comprising a linkage structure connecting the respective blades of the louver.
3. The semiconductor cleaning oven of claim 2, wherein the window area is 75% of the entire top cover; the louver has 10 fan blades.
4. The semiconductor cleaning oven of claim 3, wherein the fan blades are rotatable between 0 ° and 90 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121019780.6U CN214892266U (en) | 2021-05-13 | 2021-05-13 | Semiconductor cleaning oven |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121019780.6U CN214892266U (en) | 2021-05-13 | 2021-05-13 | Semiconductor cleaning oven |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214892266U true CN214892266U (en) | 2021-11-26 |
Family
ID=78890851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121019780.6U Active CN214892266U (en) | 2021-05-13 | 2021-05-13 | Semiconductor cleaning oven |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214892266U (en) |
-
2021
- 2021-05-13 CN CN202121019780.6U patent/CN214892266U/en active Active
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